Birla Institute of Technology & Science, Pilani

Work Integrated Learning Programmes Division

M.Tech. Design Engineering
Digital Learning Handout

Course Title Introduction to MEMS

Course No(s) DE ZC415/MEL ZC415

Credit Units Enter the number of credit units associated with the course.
Credit units provides a measure of expected time engagement
required for learning in this course

Credit Model Unit split between Class Hours + Lab/Design/Fieldwork +

Student preparation

Course Author GEETA BHATT

Version No 01

Date 11 July,2016

Course Objectives

No

CO1 The course introduces the basic concepts in MEMS (Micro Electromechanical
Systems) with a view to address a class of students from science and engineering
disciplines.

CO2 The course also aims at giving the understanding of miniaturization of the devices
and effect of force on these devices.

CO3 The discussion on topics like MEMS design, Microfabrication, Microfluidics,

Microrobotics and Microsensors have been structured in the course plan.

CO4 The objective of the course is to equip the students from various aspects and with
basic knowledge of the area of MEMS.
Text Book(s)

T1 Tai-Ran Hsu, MEMS and Micro systems Design and Manufacture, Tata McGraw
Hill, 2002.

Reference Book(s) & other resources

R1 Nitaigour P. Mahalik, MEMS, Tata McGraw Hill, 2007

R2 Marc Madou, Fundamentals of Microfabrication, CRC Press, 2002.

R3 Stephen D. Senturia, Microsystem Design , Kluwer Academic Publishers, 2001

Learning Outcomes:

No Learning Outcomes

LO1 Acquire the working principles of various MEMS devices.

LO2 Relate the usefulness and applicability of different micromachining processes,

methods, and techniques.

LO3 Recognize the basic scaling laws and will deduce the effect of forces on the
object after scaling down in term of size.

LO4 Demonstrate the application of MEMS devices in medical science, military

application, automobile, aerospace, telecommunication etc.

Modular Content Structure

1. Overview of MEMS and Microsystems

1. Introduction Microelectromechanical (MEMS) System and Microsystems
2. MEMS and Micro-system Examples
3. History of Micro-fabrication
4. Microsystem and Microelectronics
5. The Multidisciplinary nature of Microsystem Design and Manufacture
6. Microsystem and Miniaturization
 7. Applications of Microsystems

2. Working Principles of Microsystems

1. Introduction and Objectives
2. Microsensors
1. Acoustic Wave Sensors
2. Biomedical Sensor and Biosensor
3. Chemical sensor
4. Pressure sensor
5. Thermal sensor
3. Microactuation
1. Actuation Using Thermal Forces
2. Actuation Using Shape-memory Alloys
3. Actuation Using Piezoelectric Crystals
4. Actuation Using Electrostatic Forces

3. MEMS and Microactuators

1. Microgripper
2. Micromotors
3. Microvalves
4. Micropumps
5. Microaccelerometer
6. Microfluidics

4. Engineering Science for Microsystem Design and Fabrication

1. Introduction
2. Atomic structure of Matter
3. Ions and Ionization
4. Intermolecular Forces
5. Doping of semiconductors
6. Diffusion Process
7. Plasma Physics
8. Electrochemistry

5. Engineering Mechanics for Microsystems

1. Need of Engineering Mechanics for MEMS and Microsystems
2. Static bending of thin plates
1. Bending of circular plates with edge fixed
2. Bending of rectangular plates with all edge fixed
3. Bending of square plates with all edge fixed
3. Thermomechanics
1. Thermal effects on Mechanical Strength of Materials
2. Creep Deformation
3. Thermal stresses
6. Fracture Mechanics
1. Introduction
2. Stress intensity factors
3. Fracture Toughness
4. Interfacial fracture Mechanics
 5. Mechanical vibrations
1. General formulation
2. Resonant Vibration
3. Microaccelerometer
4. Design theory of Accelerometer
5. Damping Coefficient

7. Scaling Laws
1. Introduction to scaling
2. Effect Scaling in Nature
3. Scaling in geometry
4. Scaling in rigid body dynamics
1. Scaling in dynamic forces
2. The Trimmer Force Scaling Vector
3. Scaling in Electrostatic Forces
4. Problems

8. Scaling Laws
1. Scaling in Electromagnetic Forces
2. Scaling in Electricity
3. Scaling in Fluid mechanics
4. Scaling in Heat transfer
1. Scaling in heat conduction
2. Scaling in heat conduction
5. Problems

9. Materials for MEMS and Microsystems

1. Introduction and Objectives
2. Substrate and wafer
3. Active substrate material
4. Silicon as a substrate material
(a) The ideal substrate for MEMS
(b) Single crystal Silicon and wafer
(c) Crystal structure
(d) The Miller Indices
(e) Mechanical Properties of Silicon
5. Methods for fabrication of Silicon wafer
(a) Czochralski (CZ) method
(b) Float Zone (FZ) Method
6. Problems

10. Materials for MEMS and Microsystems

1. Silicon compounds
(a) Silicon Dioxide
(b) Silicon Carbide
(c) Silicon nitride
(d) Polycrystalline Silicon
2. Silicon Piezoresistors
 3. Gallium Arsenide
4. Quartz
5. Piezoelectric Crystal
6. Polymers
(a) Polymers as Industrial Materials
(b) Polymers for MEMS and Microsystems
(c) Conductive Polymers
(d) The Langmuir-Blodgett (LB) Films
7. Problems

11. Micro-system Fabrication Processes-I

1. Introduction and Objectives
2. Photolithography
(a) Overview
(b) Photoresists and Applications
(c) Light sources
(d) Photoresist Development
(e) Photoresist Removal and Postbaking
3. Ion Implantation
4. Diffusion
5. Problem

12. Microsystem Fabrication Processes-I

1. Oxidation
(a) Thermal Oxidation
(b) Silicon Dioxide
(c) Thermal Oxidation Rates
(d) Oxide thickness by colour
2. Chemical Vapour Deposition
(a) Working Principle of CVD
(b) Chemical Reaction in CVD
(c) Rate of Deposition
(d) Enhanced CVD

13. Microsystem Fabrication Processes-I

1. Physical Vapour Deposition
(a) Evaporation
(b) Sputtering
2. Deposition by Epitaxy
3. Etching
1. Chemical Etching
2. Plasma Etching

14. Micro-system Fabrication Processes-II (Micro-manufacturing)

1. Introduction and Objectives
2. Classification of Micro-manufacturing process
(a) Bulk Micro-manufacturing
(b) Surface Micro-manufacturing
 3. Comparison between Micro-manufacturing Process
4. Bulk Micro-manufacturing process
(a) Overview of Etching
(b) Isotropic and Anisotropic Etching
(c) Wet Etchants
(d) Etch Stop
(e) Dry Etching
(f) Comparison of Wet versus Dry Etching

15. Micro-system Fabrication Processes-II (Micro-manufacturing)

1. Surface Micro-manufacturing
(a) General Description
(b) Process in General
(c) Mechanical Problems Associated with Surface Micro-manufacturing
2. The LIGA Process
(a) General Description of the LIGA Process
(b) Materials for Substrates and Photoresists
(c) Electroplating
(d) The SLIGA Process
3. Summary of Micro-manufacturing
(a) Bulk Micro-manufacturing
(b) Surface Micro-manufacturing
(c) The LIGA Process

16. Micro-system Packaging

1. Introduction and Objectives
2. Overview of Mechanical Packaging of Microelectronics
3. Microsystems packaging
4. Selection of packaging materials
 Part B: Learning Plan

Academic Term First Semester 2023-2024

Course Title Introduction To MEMS
Course No DE ZC415/ MEL ZC415
Lead Instructor GEETA BHATT

Contact Hour 1

Type Content Ref. Topic Title Study/HW Resource Reference

Pre CH T1- Chapter 1 Should have some basic Past Experience

knowledge of physics, chemistry,
mathematics, material science,
machine design etc

During T1- Chapter 1 1. Overview of the micro-system T1; R1: ch 1 and R2 : ch 1

CH and MEMS will be given.
2. The evolution of the micro-
fabrication process that led to
the production of micro-system
will be taught.
3. Applications of Microsystems

Post
CH

Contact Hour 2

Type Content Ref. Topic Title Study/HW Resource Reference

Pre CH T1- Chapter 2 Should know some basics of
physics and electronics
T1, Monika Chaudhary and Amita
Gupta “Micro-cantilever-based
Sensors” Defence Science Journal,
Vol. 59, No. 6, November 2009,
pp. 634-641

During T1- Chapter 2 1. Students will be introduced T1, R1, R2

CH with the working principles of
different micro-sensors and
 actuators.

Post T1-Chapter 2 Write a note on different

CH microsensor, actuator and their
application in real life
appliances.

Contact Hour 3

Type Content Ref. Topic Title Study/HW Resource

Reference

Pre CH T1- Chapter 2 Basic knowledge of different Chapter 2 (contact Hr.2)

micro-sensors and actuators. Internet

During T1- Chapter 2 1. Micro-gripper, T1; Study the different working

CH Micromotors, Microvalves, principles of the micro devices.
Micropumps, Microaccelerometer,
Microfluidics

Post CH T1- Chapter 2 Write an assignments on T1

application of micro-device in
different fields like automobile,
medicine, space etc.

Contact Hour 4

Type Content Ref. Topic Title Study/HW Resource

Reference

Pre CH T1- Chapter 3 Basic knowledge of different Internet and text book.
engineering sciences like material
science, electrical science,
mechanical engineering etc

During T1- Chapter 3 Introduction to basic sciences used T1; Familiarization of different
CH in MEMS, doping of the engineering sciences.
Discussion on basics of
semiconductors, diffusion process, Diffusion and ion implantation
use of electrochemistry in MEMS process;
SILICON VLSI
TECHNOLOGY
Fundamentals, Practice and
Models by James D Plummer

Post CH T1- Chapter 3 Assignment diffusion process and T1

ion implantation process
Contact Hour 5

Type Content Ref. Topic Title Study/HW Resource Reference

Pre CH T1- Chapter 4 Revising the basics of T1 mechanics of solid book, and
mechanics of solid Internet.

During T1- Chapter 4 Discuss the need of Engineering
CH Mechanics for MEMS and
Microsystems. Different topics
like bending of plates beam;
cantilever will be discussed in
the lecture.
T1 Problem and discussion on
bending on cantilever, which is one
of the most widely used element in
the MEMS.

Post CH T1- Chapter 4 Assignments on basic problems

related to the topic

Contact Hour 6

Type Content Ref. Topic Title Study/HW Resource Reference

Pre CH T1- Chapter 4 Revising the basics of T1 , mechanics of solid book, and
mechanics of solid and fracture Internet
mechanics

During T1- Chapter 4 Introduction to stress intensity T1 problems and application of

CH factors, fracture toughness this phenomena will be discussed
Interfacial fracture and vibration. in the lecture.

Post CH T1- Chapter 4 Assignments on basic problems

related to the topic

Contact Hour 7

Type Content Ref. Topic Title Study/HW Resource Reference

Pre CH T1- Chapter 6 Basics of mechanics T1 and Internet

During T1- Chapter 6 Effect of scaling of objects will T1. To support to discussion on
CH be discussed in the lecture. scaling some examples from nature
Trimmer’s matrix will be like elephant, ant, blue whale will
discussed in the lecture. be discussed.
William Trimmer“Grand in
Purpose Insignificant in Size”
Post CH T1- Chapter 6 Assignments on problems T1
related to the topic

Contact Hour 8

Type Content Ref. Topic Title Study/HW Resource Reference

Pre CH T1- Chapter 6 Basics knowledge of electrical, T1 and Internet

electronics, mechanical and
thermal science

During T1- Chapter 6 Scaling of electromagnetic, T1; Problems on said topics will be
CH electrostatic, heat transfer, fluid discussed during the lecture.
mechanics will be discussed.

Post CH T1- Chapter 6 Assignments on problems

related to the topic

Contact Hour 9

Type Content Ref. Topic Title Study/HW Resource Reference

Pre CH T1- Chapter 7 Fundamentals of Material T1 and Internet,

KURT E. PETERSEN, “Silicon as a
Mechanical Material” Proceedings of
the IEEE, Vol. 70, No. 5, May 1982

During T1- Chapter 7 Material plays very important T1 Properties of silicon and
CH role in MEMS. Silicon as a fabrication method for the wafers
will be discussed., class notes
MEMS material will be
introduced in the lecture.

Post CH T1- Chapter 7 Assignments on problems T1

related to the topic

Contact Hour 10

Type Content Ref. Topic Title Study/HW Resource Reference

Pre CH T1- Chapter 7 Fundamentals of Material T1 and Internet, KURT E.

PETERSEN, “Silicon as a Mechanical
Material” Proceedings of the IEEE,
Vol. 70, No. 5, May 1982
During T1- Chapter 7 Different MEMS materials, T1; different materials and their
CH which are used in the properties will be discussed.
fabrication of the MEMS
devices, will be discussed in the
lecture.

Post CH T1- Chapter 7 Assignments on problems T1

related to the topic

Contact Hour 11

Type Content Ref. Topic Title Study/HW Resource Reference

Pre CH T1- Chapter 8 Basics of fabrication process T1 and Internet

During T1- Chapter 8 Introduction to micro-fabrication T1; Problems on diffusion and ion
CH and Objectives of micro- implantation will be discussed.
fabrication process will be SILICON VLSI TECHNOLOGY
discussed. Fundamentals, Practice and Models
Photolithography, Photoresists by James D Plummer
and Applications Light sources,
Photoresist Development
Photoresist Removal and
Postbaking , Ion Implantation
Diffusion.

Post CH T1- Chapter 8 Assignments on problems

related to the topic

Contact Hour 12

Type Content Ref. Topic Title Study/HW Resource Reference

Pre CH T1- Chapter 8 Basics of micro-fabrication T1 and Internet

discussed in the previous
contact hour

During T1- Chapter 8 Wafer level processing. T1; Chemical vapor deposition and
CH Chemical and physical Physical vapor deposition
deposition methods. techniques will be discussed in the
Additive Process. lecture.;
 SILICON VLSI TECHNOLOGY
Fundamentals, Practice and Models
by James D Plummer;
R3

Post CH T1- Chapter 8 Assignment on Deal Grove

model and CVD method.

Contact Hour 13

Type Content Ref. Topic Title Study/HW Resource Reference

Pre CH T1- Chapter 8 Basics of micro-fabrication T1 and Internet

discussed in the previous
contact hour

During T1- Chapter 8 Wafer level processing and T1 different PVD process will be
CH focus will be on Physical vapor discussed in the lecture.
deposition method and etching
process.

Post CH T1- Chapter 8 Assignment on Physical vapour

deposition and etching process.

Contact Hour 14

Type Content Ref. Topic Title Study/HW Resource Reference

Pre CH T1- Chapter 9 Basics of micro manufacturing T1 and Internet

process

During T1- Chapter 9 Introduction micromanufacturing T1, comparision between surface

CH processes like bulk micro-
manufacturing and Surface
Micro-manufacturing process.
Overview of Etching
Isotropic and Anisotropic
Etching
Wet Etchants Etch Stop
Dry Etching
Comparison of Wet versus Dry
Etching
and bulk manufacturing process.
Bulk micro-manufacturing will be
discussed, different etchants and
etching processes will be taught.
SILICON VLSI TECHNOLOGY
Fundamentals, Practice and Models
by James D Plummer

Post CH T1- Chapter 9 Assignments related to the T1

above topic
Contact Hour 15

Type Content Ref. Topic Title Study/HW Resource Reference

Pre CH T1- Chapter 9 Basics of micro manufacturing Contact hr 15,T1 and Internet
process from contact hr 15

During T1- Chapter 9 Surface micro-manufacturing T1;

CH process and LIGA will be
discussed in detail.

Post CH T1- Chapter 9 Assignment on above topics T1

Contact Hour 16

Type Content Ref. Topic Title Study/HW Resource Reference

Pre CH T1- Chapter Functioning of the device T1 and Internet

11 fabricated.

During T1- Chapter Packaging is an important T1

CH 11 process for the micro device.
The device should perform the
intended function after
packaging.

Post CH T1- Chapter Assignments on Case studies T1 case study of any packaged
11 related to above topic device.
Evaluation Scheme
Legend: EC = Evaluation Component; AN = After Noon Session; FN = Fore Noon Session
Evaluation Name Type (Open Weight Duration Day, Date, Session,
Component (Quiz, Lab, Project, Mid- book, Closed Time
term exam, End semester book,
exam, etc.) Online, etc.)
EC - 1 Assignment Online 15% 2 Weeks September 1-10, 2023
Quiz Online 15% 2 Weeks October 1-10, 2023
Mid-Semester Test Closed Book 30% 2 hours Sunday, 24/09/2023
EC - 2
(Evening)
Comprehensive Exam Open Book 40% 2½ Sunday, 26/11/2023
EC - 3 hours (Evening)

Closed Book: No reference material of any kind will be permitted inside the exam hall.
Open Book: Use of any printed / written reference material (books and notebooks) will be
permitted inside the exam hall. Loose sheets Photocopies and Laser printouts of any material will
not be permitted. Computers of any kind will not be allowed inside the exam hall. Use of
calculators will be allowed in all exams. No exchange of any material will be allowed.

Note:
It shall be the responsibility of the individual student to be regular in maintaining the self-study
schedule as given in the course handout attend the online/on demand lectures as per details that
would be put up in the BITS eLearn (Taxila) website elearn.bits-pilani.ac.in and take all the
prescribed components of the evaluation such as Assignments/Quizzes Mid Semester and End
Semester Examination according to the Evaluation Scheme given in the respective Course Handout.
If the student is unable to appear for the Regular Examination due to genuine exigencies the student
must refer to the procedure for applying for Make-up Examination which will be available through
the Important Information link on the eLearn website on the date of the Regular Examination. The
Make-up Tests/Exams will be conducted only at selected exam centres on the dates to be
announced later.

Instructor in charge