DATACENTER

EARTHING

MISTAKES
(100’s of earth electrodes (plate/rod/pipe) all around the DC /
Large earth grid in soil (under the building) are the mistakes)

&
IMPROVEMENTS

MISTAKES mentioned in clause 3 of this document are making DC’s Unsafe,

Unreliable and Noncompliance to Rules and Regulations of India. They are also in
violation to ANSI/BICSI 607 standards of USA. Unfortunately, these mistakes are
followed in almost all DATACENTERS.

By S. Gopa Kumar
Member

BIS ETD 20 (NEC 2023, IS732, IS3043, IS/IEC 62305).

ETD 30 (Surge Arresters).
ETD 50 (LVDC).
NBC-2016 (electrical committee).

IEC TC64: MT 3, MT 12, MT40, MT 41, PT 60364-8-3, WG 43.

TC81: ahG 19, MT 3, MT 14, MT 21, WG 18.
SC 37 A: WG03 & WG05
Index
1 Introduction ........................................................................................................................................... 2
2 Legal Requirements and Reference: .................................................................................................... 2
3 Mistakes, Confusions and Erroneous practices. .................................................................................. 3
3.1 Wrong Method. ............................................................................................................................. 3
3.2 Touch Step Potentials and grid as per IEEE 80........................................................................... 3
3.3 Violation of ANSI/BICSI/TIA/NECA 607 Standards. .................................................................... 4
3.4 Erroneous practices ..................................................................................................................... 4
4 Regulations and Standards Safety and Performance Requirements ................................................... 4
4.1 Safety requirements ..................................................................................................................... 5
4.2 Performance requirements for EMC ............................................................................................ 5
4.3 TN-S System for Industrial and commercial establishments ....................................................... 6
4.4 TN-S system with additional fault return path through grid .......................................................... 7
4.5 Earthing symbols, Chassis earthing (5020) and its meaning ....................................................... 7
5 Correct Method ..................................................................................................................................... 8
5.1 Multiple Bonded earth electrodes. ............................................................................................... 8
5.2 Earthing at consumer premise explained in IS 3043:2018 .......................................................... 9
5.3 Earthing of LV DG and Mains change over fig 38 of IS 3043:2018 ............................................. 9
5.4 Combination of earthing of electrical system and LPS (IS/IEC 62305-4) .................................. 10
5.5 TN-S system in a consumer’s supply transformer, bonded to the structure (fig 32: IS 732) ..... 11
5.6 Example of equipotential bonding networks in structures (Fig 48, IS732) ................................. 12
5.7 CBN for the building and mesh-BN for IT equipment (fig18, ISO/IEC 30129) ........................... 13
5.8 Neutral earthing of Isolation transformer and UPS earthing. ..................................................... 13
6 Global earthing system for EHV/HV/LV and ELV application. ............................................................ 13
6.1 Global Earthing System ............................................................................................................. 13
6.2 Basic Purpose of earthing and earth fault protection (quotes from IS3043) .............................. 14
6.3 Recommendation in IS 3043 for Industrial and commercial application. ................................... 14
6.4 Conditions in a TN-S system with PME ..................................................................................... 15
6.5 Concrete-embedded foundation earth electrodes for Global Earthing System, and CBN......... 15
6.6 IEC standards (IEC 61000) conducted and radiated EMP. ....................................................... 16
7 GIS earth mat design as per IEEE80.................................................................................................. 16
7.1 Clause from IEEE 80: 10.7 Notes on grounding of GIS foundations ......................................... 16
7.2 Clause from IEEE 80: 14.6 Concrete-encased electrodes ........................................................ 16
8 ANSI/BICSI/TIA/NECA 607 & ISO/IEC 30129 Standards .................................................................. 17
8.1 Reference from 607 ................................................................................................................... 17
8.2 ISO/IEC 30129 as an alternate to ANSI/BICSI/TIA 607 for India .............................................. 17
9 Testing of installation: ......................................................................................................................... 18

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 EARTHING SYSTEM
DATA CENTER
1 Introduction
Earthing plays the major role in safety and reliability in any electrical system. A good earthing arrangement
ensures reliable and long life for the connected electrical installation. For electrical system including LV
and HV installations, the IEC 60364 (IS732 / NEC of India 2023) and IS/IEC 61936-1 laydown the
mandatory requirements. These IEC standards are followed globally.
Eg. in UK the IEC 60364 is adopted as BS7671 called wiring Regulations. Similarly in USA as NFPA 70 (NEC). In India the
IEC 60364 has been adopted as IS732 and NEC of India.

A good and reliable earthing arrangement is necessary to fulfil the following functions.

• Avoid electric shock by creating protective equipotential bonding.

• Limit touch and step potentials inside and outside the building during faulty conditions, including
lightning.

• Efficient automatic disconnections of supply during fault by reducing impedance of circuits.

• Thermal effects (e.g., fire due to short circuits) is avoided satisfying various requirements in the
standard.

• Temporary overvoltage (e.g., TOV in LV during a fault in HV system) is limited to less than the
tolerable limits.

• All functional requirements of electronics are fulfilled to the maximum.

• Protection against EMI for electronic systems.

2 Legal Requirements and Reference:

The CEA MEASURES RELATING TO SAFETY AND ELECTRIC SUPPLY REGULATIONS 2023, which
is The National Electrical Safety Regulations of the Government of India, made compliance to National
Electrical Code of India 2023 (NEC) and National Building Code of India (NBC) mandatory for all electrical
installations. Refer Regulations 14(2 &3) and Regulation 38 for more information.

Earthing system shall confirm the following standards as well.

1. NEC 2023(SP30) – National Electrical Code of India 2023. (Adopted from IEC 60364-all parts)

2. IS 732 - Code of practice for electrical wiring installations.

3. IS 3043 – Code of practice for earthing.

4. IS/IEC 62305: Lightning Protection (Code of practice)

5. IS/IEC 61936-1: Power installations exceeding 1 kV AC

Subject of the standard: Requirements for the design, the erection and verification of electrical power installations in
systems with nominal voltages exceeding 1 kV AC to provide safety and proper functioning for the use intended.

6. ISO 30129: Information technology – Telecommunications bonding networks for buildings and
other structures. (e.g., TIA/ANSI/BICSI 607 in USA)
Subject of the standard: Requirements and recommendations for the design and installation of connections (bonds)
between various electrically conductive elements in buildings and other structures, during their construction or
refurbishment, in which information technology (IT) and, more generally, telecommunications equipment is intended to be
installed in order to minimise the risk to the correct function of that equipment and interconnecting cabling from electrical

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 hazards, provide the telecommunications installation with a reliable signal reference – which may improve immunity from
EMI.

7. IEC 61000 (various): EMI/EMC.

8. ITU (various)

The below standards (sl. no 10 to 12) can be referred to but are not a legal obligation as the subjects are
already covered in the standards in sl. no 1 to 8 and in the National Regulation.

9. IEEE 1100: IEEE Recommended Practice for Powering and Grounding Electronic Equipment

10. IEEE 142: IEEE Recommended Practice for Grounding of Industrial and Commercial Power
Systems.

11. IEEE 80: IEEE Guide for Safety in AC Substation Grounding

3 Mistakes, Confusions and Erroneous practices.

The concept of two earth electrodes for Neutral and two earth electrodes for body (of DG and TR) and two
for each main panel, lifts, UPS, PDU are wrong. Making earthing as per the conventional method (such as
earth electrodes - two for neutral and two for body) is a violation of the national regulation and standards
referred to in sl. 1 to 8.

3.1 Wrong Method.

The concept of independent earth electrodes as shown in fig.1 & 2, is not only wrong but is the reason for
major electrical accidents. This wrong method also creates and accelerates EMI there by reduces the life
of electrical installation and connected equipment.

Fig 1 and 2: Wrong earthing methods explained in IEC standards.

3.2 Touch Step Potentials and grid as per IEEE 80.

Myth: Earth grid as per IEEE80 is required for Transformers feeding to LV system.
Note: Due to this misinterpretation, large grids are made under soil for 11000/433 V application considering expected fault current of
50/65 kA at LV.

Fact: IEEE 80 is a guide, which can be used as an alternate method for making earth grid in
EHV substations
(not GIS). Detailed information can be found in https://www.vidyutsuraksha.com/post/misuse-of-ieee80.
Note: Refer clause 7 for some explanations from IEEE80.

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3.3 Violation of ANSI/BICSI/TIA/NECA 607 Standards.

The “conventional earthing methods” followed in India is a violation of requirements in 607 standards.
Professionals working in datacentre ensure compliance to 607 standards, but the basic requirements as
explained in clause 8 is violated.

3.4 Erroneous practices

Myths in earthing: The words “earth” and “earthing” is understood as an electrode in soil. Other myths are
the derivations from this concept.

3.4.1 Separate earth pit

Myth: Standards and regulation recommend connection to two separate earth pit for transformer neutral,
transformer body, DG neutral, DG body, UPS neutral, UPS body, Panel body, elevator, each and every
electrical appliance. All earth electrodes under soil need interconnection under soil as a grid.

Fact:NO standards or regulations recommend the above. The subject of earthing is about achieving safety
during an earth fault by implementing various electrical safety rules. The most common rule is “protective
equipotential bonding and automatic disconnection of supply ”.

Making separate connections to earth pit from every equipment (as shown in fig 1 and 2) is not
only wrong practice, but the primary reason for electrical accidents and equipment failures.

3.4.2 Chemical earthing

Myth:Attractive names for earthing such as “Chemical earth, digital earth, pipe in pipe, plate in pipe, NCE
charge electrode, earth enhancing compound, chemical compound, granule backfill compound, carbon
earth, gel earthing electrode”. Some of them claim that they can absorb lightning, fault current and solve
major electrical problems. They are capable of providing an earth pit resistance close to 1 ohm in any soil.

Fact:Resistance of an earth electrode in soil does not have a role in a LV system (including neutral of the
source, UPS, electronics etc). The compounds used are fly ash, bentonite, carbon flakes, graphite, cement
etc. Except conductive cement, others seem to be creating corrosion problem to earth electrode in long
run.

3.4.3 Two for Neutral, Two for body

Myth: Neutral requires two separate and distinct connections to earth electrode in soil as per IE rule 1956.

Fact: The IE rule is replaced with CEA regulations. The new regulations
replaced the requirement of earthing
from definition onwards. Refer CEA MEASURES RELATING TO SAFETY AND ELECTRIC SUPPLY
REGULATIONS 2023. The recommendation of the regulations is explained in Sl., no 4 onwards.

3.4.4 ONE OHM resistance

Myth: Earth pit of ONE OHM is required for safety and operation of electronics.

Fact:Resistance of an earth electrode (such as a plate / rod / pipe) in soil does not influence a LV electrical
installation. No standards recommend a maximum value of 1 ohm for an earth electrode.

4 Regulations and Standards Safety and Performance Requirements

Every earthing system shall assure the following safety and performance as a mandatory requirement,
which is confirmed by verification recommended in the respective standards. There are some additional
requirements as well to comply the Indian standards (e.g. Double earthing of all major class 1 equipment).

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4.1 Safety requirements

1. Permissible Touch Voltage: Under circumstances such as a fault in HV system or in LV system at

the installation shall not be higher than the following limits.

a. Table 13: IS3043 (2018)

b. Fig 28: IS732 and Fig 12: IS/IEC 61936-1.

Fig 3: Permissible touch voltage UTp

2. Disconnection times: Fault disconnection times as per IS3043 / NEC / IS732 / IEC 61936.
3. TN-S system (separate protective conductor) with PME for the LV system (only for India).
4. Double earthing of all major class 1 equipment as per IS 3043 and the neutral of the source.
5. CBN (Common Bonding Network) as per ISO 30129 for the electronic system.
6. Global Earthing for EHV/HV/LV/ELV.
7. Temporary Over Voltage, limited to less than the tolerable limit as per table 5 of IS732.
8. Protective overvoltage control for the complete installation.
9. Integrated lightning protection system as per IS/IEC 62305.
10. Effective shielding against conducted and radiated EMP (at least protective concept 3 explained
in IEC 61000).

4.2 Performance requirements for EMC

EMI/EMC and the effects of EMP on electronics also shall be considered in a DATACENTER. Equipotential
bonding and shielding play major role in protecting the electronics from EMP.

An example is, where a Data Centre is co-sited with a high-voltage line or substation, effects of EMI shall
be reduced below the tolerable limit to safeguard from the loss of vital data due to EMI.

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