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www.osram-os.

com
Produktdatenblatt | Version 1.1
LD MVSG
 

LD MVSG
Mini TOPLED ®
Small size high-flux LED for slim designs

Applications
——Cluster, Button Backlighting ——Transportation, Plane, Ship
——Electronic Equipment ——White Goods

Features:
——Package: white SMD package, colorless clear silicone resin
——Chip technology: UX:3
——Typ. Radiation: 120° (Lambertian emitter)
——Color: λdom = 460 nm (● deep blue)
——Corrosion Robustness Class: 3B
——ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)




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LD MVSG
 

Ordering Information
Type Radiant Intensity 1) Ordering Code
IF = 20 mA
Ie

LD MVSG-JGLH-46-1 4.5 ... 15.0 mW/sr Q65111A2195




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LD MVSG
 

Maximum Ratings
Parameter Symbol Values

Operating Temperature Top min. -40 °C


max. 110 °C
Storage Temperature Tstg min. -40 °C
max. 110 °C
Junction Temperature Tj max. 125 °C
Forward current IF min. 3 mA
TS = 25 °C max. 30 mA
Surge Current IFS max. 300 mA
t ≤ 10 µs; D = 0.005 ; TS = 25 °C
ESD withstand voltage VESD 8 kV
acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)
Reverse current 2) IR max. 200 mA




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LD MVSG
 

Characteristics
IF = 20 mA; TS = 25 °C
Parameter Symbol Values

Peak Wavelength 3) λpeak typ. 455 nm


Dominant Wavelength 3) λdom min. 453 nm
IF = 20 mA typ. 460 nm
max. 465 nm
Spectral Bandwidth at 50% Irel,max ∆λ typ. 20 nm
Viewing angle at 50 % IV 2φ typ. 120 °
Forward Voltage 4) VF min. 2.70 V
IF = 20 mA typ. 3.05 V
max. 3.40 V
Reverse voltage (ESD device) VR ESD min. 45 V
Reverse voltage 2)
VR max. 1.2 V
IR = 20 mA
Real thermal resistance junction/ambient 5), 6) RthJA real max. 430 K / W
Real thermal resistance junction/solderpoint 5)
RthJS real max. 130 K / W




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LD MVSG
 

Brightness Groups
Group Radiant Intensity 1) Radiant Intensity 1)
IF = 20 mA IF = 20 mA
min. max.
Ie Ie

JG 4.5 mW/sr 5.2 mW/sr


JH 5.2 mW/sr 6.1 mW/sr
JI 6.1 mW/sr 7.1 mW/sr
KG 7.1 mW/sr 8.2 mW/sr
KH 8.2 mW/sr 9.7 mW/sr
KI 9.7 mW/sr 11.2 mW/sr
LG 11.2 mW/sr 13.0 mW/sr
LH 13.0 mW/sr 15.0 mW/sr

Forward Voltage Groups


Group Forward Voltage 4) Forward Voltage 4)
IF = 20 mA IF = 20 mA
min. max.
VF VF

Z4 2.70 V 2.90 V
44 2.90 V 3.10 V
86 3.10 V 3.40 V


Wavelength Groups
Group Dominant Wavelength 3) Dominant Wavelength 3)
IF = 20 mA IF = 20 mA
min. max.
λdom λdom

4 453 nm 457 nm
5 457 nm 461 nm
6 461 nm 465 nm


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LD MVSG
 

Group Name on Label


Example: JG-4-44
Brightness Wavelength Forward Voltage

JG 4 44




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LD MVSG
 

Relative Spectral Emission 7)

Irel = f (λ); IF = 20 mA; TS = 25 °C


LD MVSG
1,0
Irel
: Vλ
: deep blue

0,8

0,6

0,4

0,2

0,0
350 400 450 500 550 600 650 700 750 800
λ [nm]

Radiation Characteristics 7)

Irel = f (ϕ); TS = 25 °C
LD MVSG

ϕ [°]
-10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90°
-20° 1,0
Irel
-30°

-50°

-40° 0,8

0,6
-60°

0,4
-70°

-80° 0,2

-90° 0,0

-100°


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LD MVSG
 

Forward current 7)
Relative Radiant Intensity 7), 8)

IF = f(VF); TS = 25 °C IE/IE(20 mA) = f(IF); TS = 25 °C


LD MVSG
30
LD MVSG Ie
IF [mA]
Ie(20mA)

20 1

10
0.5

0.4

0.3
5

4
0.2

3
2.7 2.8 2.9 3.0 3.1 3.2
3

4
5
6
7
8
9
10

20

30
VF [V] IF [mA]

Dominant Wavelength 7)

λdom = f(IF); TS = 25 °C
LD MVSG
λ dom [nm]

500

480 
460

440

420
3
5

10

15

20

25

30

IF [mA]


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LD MVSG
 

Forward Voltage 7)
Relative Radiant Intensity 7)

∆VF = VF - VF(25 °C) = f(Tj); IF = 20 mA IE/IE(25 °C) = f(Tj); IF = 20 mA


LD MVSG LD MVSG
0,3 IE 1.2
∆VF [V]
: deep blue IE (25°C)

0,2 1.0

0,1 0.8

0,0 0.6

-0,1 0.4

-0,2 0.2

-0,3 0.0
-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100
Tj [°C] Tj [°C]

Dominant Wavelength 7)

λdom = f(Tj); IF = 20 mA
LD MVSG
λ dom [nm]
500

480 
460

440

420

-40 -20 0 20 40 60 80 100


Tj [°C]


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LD MVSG
 

Max. Permissible Forward Current


IF = f(T)
LD MVSG
IF [mA]
30

25

20

: TA
: TS
15

10

Do not use below 5 mA


0
0 20 40 60 80 100 120
T [°C]

Permissible Pulse Handling Capability


IF = f(tp); D: Duty cycle
TS = 0°C ... 110°C LD MVSG
IF [A]
: D = 1,0
0.3 : D = 0,5


: D = 0,2
: D = 0,1
: D = 0,05
: D = 0,02
: D = 0,01
: D = 0,005
0.2

0.1

10-5 10-4 10-3 0.01 0.1 1 10


Pulse time [s]


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LD MVSG
 

Dimensional Drawing 9)

Approximate Weight: 9.0 mg

Package marking: Anode

Corrosion test: Class: 3B


Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter then IEC
60068-2-43)
ESD advice: The device is protected by ESD device which is connected in parallel to the
Chip.


11 Version 1.3 | 2018-09-26


LD MVSG
 

Recommended Solder Pad 9)

2.8 (0.110)

1 (0.039)
0.8 (0.031)

2.8 (0.110)
0.8 (0.031)

1 (0.039)
Padgeometrie
für verbesserte
Wärmeableitung
Paddesign
for improved
heat dissipation

Cu-Fläche > 16 mm 2
Cu-area > 16 mm 2

Lötstopplack
Solder resist OHLPY978

For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere.




12 Version 1.3 | 2018-09-26


LD MVSG
 

Reflow Soldering Profile


Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
OHA04525
300
˚C
T 250
240 ˚C Tp 245 ˚C
217 ˚C tP
200
tL

150
tS

100

50
25 ˚C
0
0 50 100 150 200 250 s 300
t

Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit


Minimum Recommendation Maximum
Ramp-up rate to preheat*) 2 3 K/s
25 °C to 150 °C
Time tS tS 60 100 120 s
TSmin to TSmax
Ramp-up rate to peak*)
TSmax to TP  2 3 K/s

Liquidus temperature TL 217 °C


Time above liquidus temperature tL 80 100 s
Peak temperature TP 245 260 °C
Time within 5 °C of the specified peak tP 10 20 30 s
temperature TP - 5 K
Ramp-down rate* 3 6 K/s
TP to 100 °C
Time 480 s
25 °C to TP

All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range


13 Version 1.3 | 2018-09-26


LD MVSG
 

Taping 9)




14 Version 1.3 | 2018-09-26


LD MVSG
 

Tape and Reel 10)

Reel dimensions [mm]


A W Nmin W1 W2 max Pieces per PU

180 mm 8 + 0.3 / - 0.1 60 8.4 + 2 14.4 3000




15 Version 1.3 | 2018-09-26


LD MVSG
 

Barcode-Product-Label (BPL)

Dry Packing Process and Materials 9)

Moisture-sensitive label or print

N s VE RS rel rar ck
inf pa
LE

30
ati
ve
VE

If

hu

ed ag
L

bar

mi
nk,
bla cod

dit

e
see
e
lab

y
(R
el

H)

˚C
/60
.

%
RH
.
Barcode label
TIO
% <
_
ainITI TO 90 to ak of
ntNSUC < d ns ). urs

U g coSEND d (pe or urs


cte itio , de Ho
urs
Ais baRE
an bje ing ˚C co Ho
˚C su ss
nd 5
72 Ho urs
CO te 48
CThIS co ± e Ho
ce 24 6
TU MI 40 be y
˚C
da tim e
e
SE < ll pro tor th tim
or
at t wi nt ).
fac 23 l wi or tim e
MOTO s ˚C at ca
Flo or tim
OP nth tha ale el at d re.
nti
Flo or
uiv du Flo
mo es
eq lab low
if: rea
ce ide l 4 5 Flo
vic g, ve l
24 or de be tin en pro is 5a
de , e Le ve l 6
un wh te
g: ,
r
co
se ke Le ve l
ba ed low da Le ve
d ba e mo % ba al
ure
en ref e e 10 ist ure Le
tim for se ist ure
ale op se se for > 3 , Mo ure
se is ha , or . be
is
nk Mo istist
in g nk rd -03 Mo
r-p n Flo RH g, bla Mo
ba
life s po If blathi % kin Ca t.
TD (if ar
elf thi, va p. wi 10 ba tor J-S Ye ar ks
tem ted
<
_ e icat me , C 1 Ye ee urs
Sh ter low at ed
uir > 1 W Ho
1. Af dy un d Ind no uir DE e 4
2. ref req y is JE 8
bo Mo ore tim e
a) St es dit2b req C/ :
tim e 16
mior is IP or
b) vic g e
ed
or tim e
Hu en Flo or tim
De 2a kin nc te Flo
3. a) op or
b) baere da e Flo
If al l 1 2 Flo
ref tim ve


4. l
g
se d
Le ve l 2a3
an Le ve l
Ba te ure Le ve
Da ist ure Le
ist ure
Mo ist ure
Mo
Mo ist
Mo

M
RA
OS

Humidity indicator
Barcode label
Do not eat.
Avoid metal contact.
Discard if circles overrun.
bag opening.
Please check the HIC immidiately after

check dot WET


Comparator

bake units
examine units, if necessary 15%
If wet,

bake units
examine units, if necessary 10%
If wet,

change desiccant
parts still adequately dry. 5%
If wet,

MIL-I-8835
Humidity Indicator

Desiccant
AM
OSR

OHA00539

Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.


16 Version 1.3 | 2018-09-26


LD MVSG
 

Transportation Packing and Materials 9)

Barcode label Barcode label

: 1- 20
n3 : Q- 1-

20
Bi n2 : P-
D n1

24 0 p ST
E Bi

Muster Ad 26 0 C R
22 m
Bi

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ba ty .

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to to

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at wi nt 23 l wi

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fa

(X
M TO s at ale ˚C at e. Fl oo r tim
th th at ica Fl oo r
OP on es uiv
el
if: read
ur nt Fl oo
m eq lab , ed ide l 4 5 Fl
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vic oc ve l
24 de or de be ingen
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Le ve l 5a6
g: , w, co e te ve l
r se ou% ke re Le
ba ed flo ba da Le ve
e m ba al tu re
d en re Le
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se ois tu re
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se is ha oo . be 03 nk M
in g nk rd M ois
ba
r-p in Fl RH g, D- bla M
po If blath % Ca
life is kin . ST (if ar
p. wi 10 baator et
elf r th va m <
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J- Ye ar ks s
Sh te w, te ed iredic t d, C 1 Ye ee ur
nt at > 1 W Ho
1. Af flody ou qu In no ire DE e 4 8
2. re ed re ty is qu JE
bo M or tim e e
es idi 2b re C/ : r 16
a) St mor is IP tim
vic ed oo r tim e
b) Hu g e Fl oo r
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3. b) ba re da e Fl oo
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Bi n2 : P-

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tu re
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PA 77 na RT

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tu re
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SR
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PR
)
(X

Packing
Sealing label OHA02044

Dimensions of transportation box in mm


Width Length Height

200 ± 5 mm 195 ± 5 mm 30 ± 5 mm




17 Version 1.3 | 2018-09-26


LD MVSG
 

Type Designation System

Wavelength Emission Color Color coordinates according


(λdom typ.) CIE 1931/Emission color:
B: 470 nm blue W: white
S: 633 nm super red CW: warm white
T: 528 nm true green CB: color on demand blue
Y: 587 nm yellow CG: color on demand green
O: 606 nm orange CL: color on demand lagune
G: 570 nm green
P: 560 nm pure green
A: 617 nm amber
D: 460 nm deep blue Package Type
M: MiniTOPLED

L: Light
emitting
diode

L A M 6 7 6

Lead / Package Properties


4: through hole
6: folded leads
T: folded leads, improved corrosion stability
(Au-LF), w/o TiO2 jetting
V: folded leads and UX:3 w/ improved corrosion


stability (Au-LF), TiO2 jetting

Encapsulant Type / Lens Properties


7: Colorless clear or white volume conversion
(resin encapsulation)
S: Silicone (with or without diffuser)

Chip Technology:
3: standard InGaN
5: HOP 2000
6: Standard InGalP
B: HOP 2000
C: ATON
F: Thinfilm InGaAlP
G: ThinGaN (Thinfilm InGaN)
(Subcon: Sapphire)
K: InGaAlP low current
S: standard InGaN low current
1: individual definition
0: TSN


18 Version 1.3 | 2018-09-26


LD MVSG
 

Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this
data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-
sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the
eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light
sources have a high secondary exposure potential due to their blinding effect. When looking at bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-
tion, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal filled materials including silver.
Metal filled materials can be affected by environments that contain traces of aggressive substances. There-
fore, we recommend that customers minimize device exposure to aggressive substances during storage,
production, and use. Devices that showed visible discoloration when tested using the described tests above
did show no performance deviations within failure limits during the stated test duration. Respective failure
limits are described in the IEC60810.
For further application related informations please visit www.osram-os.com/appnotes




19 Version 1.3 | 2018-09-26


LD MVSG
 

Disclaimer
Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language word-
ings.

Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version on the OSRAM OS webside.

Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For
packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to
invoice you for any costs incurred.

Product safety devices/applications or medical devices/applications


OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.

In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi-
nate the customer-specific request between OSRAM OS and Buyer and/or Customer.




20 Version 1.3 | 2018-09-26


LD MVSG
 

Glossary
1)
Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal
reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of
k = 3).
2)
Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse opera-
tion is not allowed.
3)
Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal repro-
ducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k =
3).
4)
Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an
internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage
factor of k = 3).
5)
Thermal Resistance: Rth max is based on statistic values (6σ).
6)
Thermal Resistance: RthJA results from mounting on PC board FR 4 (pad size 16 mm² per pad)
7)
Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-
es, the typical data or calculated correlations of technical parameters can only reflect statistical figures.
These do not necessarily correspond to the actual parameters of each single product, which could dif-
fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g.
because of technical improvements, these typ. data will be changed without any further notice.
8)
Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ-
ences between single devices within one packing unit.
9)
Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and
dimensions are specified in mm.
10)
Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.




21 Version 1.3 | 2018-09-26


LD MVSG
 

Published by OSRAM Opto Semiconductors GmbH


Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.


22 Version 1.3 | 2018-09-26

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