16G Intel PowerEdge R660 and R760 Features Participant Guide PDF

16G INTEL POWEREDGE
R660 AND R760

FEATURES
PARTICIPANT GUIDE
PARTICIPANT GUIDE
16G Intel PowerEdge R660 and R760 Features - PG
© Copyright 2023 Dell Inc Page 2

Table of Contents
16G Intel PowerEdge R660 and R760 Features 5
Platform Overview 6
Platform Overview 7
Platform Introduction 7
Internal Component 11
Platform Restrictions 17
Scavenger Hunt Activity 18
Enhanced Features 20
Enhanced Features and Technologies 21

Features and Technologies 21
Intel Sapphire Rapids Overview 25
DDR5 Rules and Population 26
Graphics Processing Unit (GPU) 28
Network Cards and DPU 30
Open Compute Project (OCP) 32
Configuration Options 35
Storage Configuration 36
BOSS-N1 and E3.S Storage 39
Expansion Card Risers Slots 42
R760 Riser Configurations 43
R660 Riser Configurations 46
PCIe Slot Considerations 47
Scavenger Hunt Activity 49
Heat Sink Assembly Design 51
Liquid Cooling Module 52
Air Shroud Support 56
Fans 58

Knowledge Check - Cooling 59
Appendix 61

PowerEdge R660 and R760 Features
16G Intel PowerEdge R660 and R760 Features

Platform Overview

Platform Overview
Platform Introduction
The PowerEdge R760 is a two-socket, 2U rack system whereas the

PowerEdge R660 is a two-socket, 1U rack system. The PowerEdge R760
and R660 support the latest emerging technology such as DDR5, Gen5
PCIe, and Enterprise Datacenter Small Form Factor (EDSFF) with class
leading system management features.
Use cases for the platforms include environments with high-performance

workloads for data warehouses, eCommerce, databases, and High-
Performance Computing (HPC).
PowerEdge R760 and R660 Overview
Features of R760 and R660 are:
PowerEdge R660 and R760.

• Optimized air flow design to enable configuration flexibility and energy

efficiency.
• Support for riser, backplane, rear I/O, and iDRAC.
• OCP3.0 includes up to x16 PCIe at Gen 4 speeds.
• Supports Direct Liquid Cooling (DLC) options.
Benefits of R760
Key features of R760.
Benefits of R760 are:

• High-Performance Scale-Out Databases: Architecture for growth

and scalability using High Core Count (HCC) CPUs with DDR5
memory, high-bandwidth networking, and Gen5 NVMe storage.
• Next Level of Virtualization: The combination of up to 8 TB of DDR5,
High Core Count (HCC) Sapphire Rapids CPUs provide high-density
virtualization in a 2U 2S package.
• Accelerated AI Training: The latest PCIe Gen5 NVIDIA GPUs and
NVMe provide high throughput enabling large datasets, reduced deep
learning training cycles, and increased AI deployments.

Benefits of R660
Key features of R660.
Benefits of R660 are:
• High-Performance Simulation and Modeling: Deliver unparalleled

performance in air-cooled 1U HPC clusters with HCC CPUs and
DDR5.

• Online Transaction Processing: Enable faster, online transactions

with next-gen high-performance CPU from Intel built with NVMe PCIe
Gen5 drives and high-capacity memory.
• All-Flash vSAN: Advance HCI implementations and gain higher
throughput by deploying vSAN nodes that are equipped with high-
frequency CPUs on NVMe direct attached storage configurations.
Important: Refer 16G PowerEdge E3 Drives Features

course to learn more about EDSFF.
Deep Dive: View the comparison and specifications of the

components in PowerEdge R760 with its predecessor
PowerEdge R750.
View the comparison and specifications of the components
in PowerEdge R660 with its predecessor PowerEdge R650.
View the R760 and R660 block diagram and PCIe block
diagram for granular system board details.
Internal Component
The graphics show the internal components of each system along with a
table that adds a brief description. The course covers many of the
components in detail. Each graphic shows only one configuration option.
See the FSM for more options.
R760
The table lists the components inside the PowerEdge R760 chassis.

The graphic shows an R760 liquid cooled system.
Item Component Brief Description

1 Backplane The system has multiple backplane options.

The graphic shows a storage configuration
with two backplanes. Each backplane
supports a bay of disks.
2 fPERC Image shows a rear mounting front PERC.
3 Fans Multiple fans are available. The type of fan

implemented depends on the configuration.
4 Liquid cooling Various heat sink and processor cooling

module options are available.
5 DIMM sockets System has 32 DIMM socket for DDR5

memory.
6 Riser 4 Provides optional PCIe expansion.
8 Intrusion switch Provides alert that the top cover is off.
9 PSU2 Supplies system power.
10 PSU1 Supplies system power.
11 Rear handle Handle to enable sliding the server from the

rack for servicing.
14 System board This system board is a Planar design and

similar to previous generations.

15 Fan gantry The fan gantry is a case for the individual

cooling fans and can be removed with the
fans as a single unit.

The graphic shows a storage configuration
with two backplanes. Each backplane
supports a bay of disks.
17 Service Tag Provides the platform information for

services.
R660
The table lists the components inside the PowerEdge R660 chassis.

The graphic shows an R660 with a single CPU and without riser 2.
Item Component Brief Description

1 Cooling fans Multiple fans are available. The type of fan

implemented depends on the configuration.
2 Air shroud The air shroud configuration depends on the

configuration implemented.
3 Heat sink Various heat sink and processor cooling

options are available.
4 Intrusion switch Provides alert that the top cover is off.
5 Rear I/O board Provides much of the internal communication.

(RIO)
6 PSU1 and PSU2 Supplies system power.
7 BOSS carrier Chassis to hold the BOSS-N1 module
8 OCP card Optional card that provides network ports.
9 LOM card Optional card that provides network ports.
10 Socket 1 Processor socket that fits CPU 1
12 Service Tag Provides the platform information for

services.
Tip: Graphics are excerpts from the FSM. See the FSM
attached in the Resources tab for additional system views
such as shrouds and extended risers.

Platform Restrictions
The table shows the platform restrictions and description.
Components Description
Chassis Servers with liquid cooling components do not

support the use of Cable Management Arm (CMAs)
due to crowding or lack of space in the rear of the
rack.
CPU Single CPU configurations do not support Direct

Liquid Cooling (DLC), and CPUs must match.
Memory Minimum configuration is one DIMM per CPU.

DIMM capacity and type must match.
Storage In 24x 2.5" and 12x 3.5" rotational drives

configuration requires additional acoustic foam on
the top cover for the high performance and very
high-performance fans.
GPU and Field-Programmable Gate Array (FPGA)
do not support 12x 3.5" configuration.
GPU and FPGA configuration are not supported for
24x 2.5" SAS/SATA rear drive configurations.
2.5" NVMe backplane only supports NVMe SSD.
Only riser configuration 11 supports 24x 2.5" NVMe
configuration.

Scavenger Hunt Activity
Instructions
1. Scenario: The user plans to purchase a new PowerEdge R760. The

user wants to know what storage configurations are available.
2. Open the R760 activity FSM and utilize the activity FSM to answer the
questions.
3. Refer to the Participant Guide for answers to the questions.
Important: Use the Activity FSM for learning purposes only.
Activity
Question
What front bay storage options are available for PowerEdge R760?
Answer: PowerEdge R760 support up to 24 x 2.5-inch and up to 8 x 2.5-

inch SAS/SATA/NVMe (HDD/SSD). The SAS, SATA, or NVMe drives are
hot-swappable. See the product overview page.

Question
What rear bay storage options are available for PowerEdge R760?
Answer: PowerEdge R760 supports up to 4 x 2.5-inch SAS/SATA/NVMe

(HDD/SSD). The SAS, SATA, or NVMe drives are hot-swappable. See the
Product positions section in the activity guide.

Enhanced Features

Enhanced Features and Technologies
Features and Technologies
The PowerEdge system is a general-purpose system capable of handling

demanding workloads, applications, and 16G technologies. Listed are the
enhanced features of PowerEdge R760 and R660.
1:
• The PowerEdge R760 and R660 supports up to two AC or DC power

supplies with 1+1 redundancy, autosensing, and auto-switching
capability.
• Two AC or DC power supply units support 700 W/1100 W/1800
W/2800 W AC Titanium, 800 W/1400 W/2400 W AC, and 1100 W -48
VDC.
2:
• 4th Gen Intel Xeon scalable processors.

• Supports up to 56 cores with a maximum Thermal Design Power

(TDP) on selected CPUs of 350W.
• Liquid cooling is supported in specific CPU configurations only.
• Faster UPI with up to four Intel Ultra Path Interconnect (Intel UPI) at up
to 16 GT/s, increasing multi socket bandwidth.
• Faster I/O with PCI Express 5 and support up to 80 lanes (per socket).
3:
• Supports separate RAID controller for an operating system with secure

UEFI boot that is rear facing and hot-pluggable.
• 2xM.2 NVMe enterprise-class devices that are high-quality and have
strong endurance offers increased performance over BOSS-S1 with
SATA drives.
• Each M.2 NVMe drive supports 2 x Gen 4 PCIe lanes.
• M.2 devices are read intensive with 480 GB or 960 GB capacity and
1.92 TB post RTS.
4:
• PERC H965i adapter and front PERC H965i supports PCIe Gen 4 with
X16 lanes.
• PERC 12 does not support Gen 5.
• Supports 8 GB DDR4 with 3200 MT/s cache.
• SAS/SATA supports maximum drive along with 16 drives per controller
but without SAS expander.
• NVMe supports maximum of 8 drives per controller.
• Supports SAS 4 with speeds of 22.5 Gbps, 12 Gbps SAS, and 6 Gbps
SATA/SAS.
• NVMe drives are supported at PCIe Gen 4 speeds.
5:
• E3.S form factor supports PCIe Gen5 NVMe drives, which double the
bandwidth over Gen 4 NVMe.

• In a space-constrained server, E3.S provides improved density,

thermals, and packaging.
• Each E3 drive receives x2 PCIe lanes when connected to the onboard
controller.
• E3 drivers support Gen 4 speeds when linked to a PERC.
• The following capacities are supported: 1.92 TB, 3.84 TB 7.68 TB and
15 TB (Post RTS).
6:
• DPU with hardware accelerated networking and storage enables to

save CPU cycles.
• Improved security, running workloads, and security software on
different CPUs.
• Offload hypervisor, networking stack, and storage stack to the DPU
making them Operating System independent.
7:
• DDR5 RDIMM memory supports 16 DIMMs per socket with a total of

32 DIMMs in x2 CPU configuration.
• Supported memory speed is up to 4800 MT/s in one DIMM per channel
(1DPC) and 4400 MT/s in two DIMMs per channel (2DPC).
• DDR5 configurations are 16 GB x1R, 32 GB & 64 GB x 2R, 128 GB x
4R, and 256 GB x8R.
• DDR5 supports voltage of 1.1 V.
8:
• PCIe 5 supports a maximum data transfer rate of 32 GT/s per lane.

• The R760 system supports up to six Full Height and two Low Profile
riser slots with up to 8 PCIe x16 slots.

• The R660 supports up to 3 x16 Low Profile slots.

• All PCIe Slots have 75 W per slot with two extra PUCK power
connectors providing up to 350 W for Double-Width GPUs on both the
R660 and R760.
Important: The PowerEdge R760 system supports the Red

Hat Enterprise Linux, Canonical Ubuntu Server LTS,
Microsoft Windows Server with Hyper-V, SUSE Linux
Enterprise Server, and VMware ESXi.
Boss cards do not support E3.S (EDSFF) drives.
Go to: 16G PowerEdge PERC 12 Features course to learn

more about PERC12.
16G Intel PowerEdge E3 Drives Features course to learn
more about E3 drives.
PowerEdge 16G Intel Memory Features course to learn
more about DDR5.

Intel Sapphire Rapids Overview
Intel processor generations.
Xeon processors are primarily used in Enterprise servers. Xeon powered

servers such as PowerEdge are targeted for workload-heavy solutions
such as computation for cloud computing data centers, analytical and
trending applications, radar systems, industrial manufacturing, and
intelligence gathering programs.
CPU attributes:
• Clock Speed (GHz) is the processor speed, which is calculated by the
number of clock cycles that are managed per second.
• Core count is the number of compute cores available on a CPU,
determining the compute capability of a CPU.
• Thermal Design Power (TDP) is the power target of the CPU or
wattage that the CPU runs.

DDR5 Rules and Population
DDR5
The image illustrates the high-level DDR5 implementation plan for the 2-
socket platform with two slots per channel. The convention is to have
DIMM slot 0 further away from the CPU than slot 1 within the same
channel. Use the optimized population order:

• Single CPU: Populate sequentially - A1, A2, A3, and so on.

• Dual CPU: Populate round robin in a sequential manner - A1, B1, A2,
B2, A3, B3, and so on.
DDR5 implementation plan for the 2-socket platform with two slots per channel.
The R760 and R660 supports up to 32 DIMMs with 256GB capacity

DIMMs and speeds up to 4800MTS in a 1DPC configuration. The R760
and R660 supports the registered DIMMs (RDIMMs), which use a buffer to
reduce memory loading and provide greater density, allowing for the
maximum platform memory capacity. LRDIMMS and Unbuffered DIMMs
(UDIMMs) are not supported.
DIMM Rank Capacity DIMM Operating Operating Speed

Type Rated Speed 1 2 DIMMs per
Voltage and DIMM per Channel (DPC)
Speed Channel
(DPC)
RDIMM 1R 16 GB DDR5 (1.1 4800 MT/s 4400 MT/s

V), 4800
MT/s
2R 32 GB, DDR5 (1.1 4800 MT/s 4400 MT/s

64 GB V), 4800
MT/s
4R 128 GB DDR5 (1.1 4800 MT/s 4400 MT/s

V), 4800
MT/s

8R 256 GB DDR5 (1.1 4800 MT/s 4400 MT/s

V), 4800
MT/s
Supported memory matrix.
Go to: PowerEdge 16G Intel Memory Features course to

learn more about DDR5.
Graphics Processing Unit (GPU)
The latest PCIe Gen5 enabled Nvidia GPU1s, and NVMe drives offer
highest throughput on largest datasets. GPU density maximizes
performance for accelerated environments. GPU use cases include:
• High-Performance Computing (HPC)

• Artificial Intelligence (AI) Machine Learning (ML) or Deep Learning
(DL) training and inferencing
• Database analytics
• Workloads
Power Universal Cable Kit (PUCK)
1GPU blank is required for empty slots or non-GPU cards or half length
(HL) A2 GPU.

The Power Universal Cable Kit (PUCK) provides additional power to

devices such as GPUs and DPUs. See the GPU power cable page for an
explanation of the PUCK 3-way connection and cable graphic.
1: 1) MB to Riser4 GPU power and signal (Left side). Part Number:

MN65V (X cable, new) / 5XCTV (Y cable).

2: 2) MB to Riser1 GPU power and signal (right side). Part Number:

9P02C (X cable, new) / PRDK1 (Y cable).
Important: The R660 and R760 support up to two Double

Width (DW) GPU's PUCK cables that are available for each
DW GPU in the system to accommodate the extra wattage
required. It can produce up to 350W and is only supported
by R1P and R4P risers, which are available with the R660
and R760. The Intel GPU will be available post RTS
release. At RTS, the component could not be accessible.
Network Cards and DPU
Network Cards
The system allows a customizable port choice for the OCP cards as well
as up to two embedded 1Gbe Network Interface Controller (NIC) ports on
the LAN on Motherboard (LOM) card. Network cards are supported based
on the system configuration. On the 16G platforms, the LOM and OCP
cards are both optional, but a system will ship with either a LOM or OCP
card in the system.
Feature Specifications
LOM card 1 GB x 2
OCP card (OCP 3.0) 4x1Gbe, 4x10Gbe, 2x10Gbe 4x10Gbe,

2x25Gbe, 4x25Gbe
NIC port specification of the system R760.

Data Processing Unit (DPU)
DPU Architecture.
DPU is a network interface controller card with a programmable

accelerator and Ethernet connection. DPU can accelerate infrastructure
applications running on the host.
Go to: 16G PowerEdge Data Processing Unit (DPU)

Features course to learn more about DPU features.
Important: A MIC (management interface card) will be

populated in the LOM slot for every Dell DPU configuration.
The MIC, in conjunction with the Rear I/O card (RIO)
enables the communication between the DPU and the
iDRAC.

Open Compute Project (OCP)
The OCP NIC card supports OCP 3.0. The NIC ports are integrated on the
OCP card which connects to the system board.
The PowerEdge R760 system supports up to two 10/100/1000 Mbps NIC

ports on the LOM and OCP card.
The table highlights the OCP 3.0 card features:
OCP card connected to the port side of a server.
Feature Support
Form Factor Small Form Factor (SFF)
PCIe Gen Gen4
Maximum PCIe x8 or x16 with optional SL cable

Width

Maximum of Ports 4
Port Type BaseT/SFP/SFP+/SFP28/SFP56
Supported Port 4x1Gbe, 4x10Gbe, 2x10Gbe 4x10Gbe, 2x25Gbe,

Speed 4x25Gbe
Network Controller Yes

Sideband Interface
(NC-SI)2
SNAPI are Yes

supported with the
PCIe OCP adaptor
card and SNAPI
riser.
Wake on LAN3 Yes

(WoL)
2 NC-SI (Network Controller Sideband Interface) is a protocol used in data

centers to manage network traffic. It provides an out-of-band
communication path between the network controller and the physical
network interface controllers (NICs) in servers. NC-SI enables the network
controller to monitor and manage network configuration, traffic, and
performance, and to send commands to the NICs to change network
settings and control the flow of data. This allows for centralized
management of network resources and enables network administrators to
monitor and troubleshoot network issues more effectively.
3 Wake on LAN (WoL) is a feature of Dell system which help to start the
system using a signal over the local network.

Power Consumption 15 W ~ 150 W
Important: SNAPI is only supported on PCIe version OCP

cards when populated in a SNAPI capable riser.

Configuration Options

Storage Configuration
Each platform has flexible storage configuration options.
R760
Front view of drive configurations.
R660
Front view of drive configurations.

Backplane
The PowerEdge R760 supports hard drives options with 2.5 inch (x 8)
SAS or SATA backplane. The drives plug into the front of the backplane
and a lever secures the drive in place.
1. The BP_PWR_CTRL is the backplane power and signal cable that

connects to system board.
2. The BP_DST_SA1 is the port that connects the PERC to the
backplane.
3. The BP_PWR_1 connects to the system board for backplane power.

8 x 2.5 inch drive backplane showing the data side of the backplane.
Important: Some storage and riser configuration options

may not be available at RTS.

BOSS-N1 and E3.S Storage
BOSS-N1
Dell Boot Optimized Storage Solution (BOSS) is the RAID controller card
that offers expandable storage capacity to improve the performance of the
server systems. BOSS-N1 is the latest version of BOSS. The double
module channel provides high-speed connectivity for one or two NVMe
M.2 drive modules.
The BOSS-N1 has two M.2 connectors.

BOSS-N1.
Features of BOSS-N1 subsystems are:

• Hardware:
- BOSS-N1 controller and carrier (x2)
-It utilizes the inbox NVMe driver with major Operating Systems
(Linux/Windows/VMware)
- Supports dual 80 mm
• Reliability:

- Enterprise NVMe M.2 drives

- LED for M.2 device
• Accessibility:
- Rear Facing
- Supports UEFI only
• Serviceability:
- Full Hot-Plug support

- Controlled firmware pgrade through iDRAC
E3.S Drives
E3.S drives.
E3.S drives or the Enterprise and Data Center Small Form Factor
(EDSFF) is an SSD design for NAND and Storage Class Memory (SCM).
E3.S drives optimize storage in enterprise, private, and public data
centers.
Benefits of E3 drives:
• Density and improved packaging in space constrained servers.
• Double the performance over NVMe Gen4.
• Optimized for high-speed signal and more lanes.

• Better air impedance and thermal resistance.

• Optimized to fit more front-end accessible devices and more future
proof.
Tip: To learn more about the BOSS-N1, E3, and DPU,

navigate to My Learning.
Expansion Card Risers Slots
The expansion card riser enables to connect PCI express (PCIe)

expansion cards. The R760 supports up to eight PCIe riser slots and the
R660 support up to 3 PCIe riser slots. The picture shows the number of
riser slots available on both the R660 and R760.
Important: The images are a sample of risers available in

the R760. Each slot on the R760 and R660 can
accommodate different risers. The risers in a system are
determined by the riser configuration ordered.

Illustration of Expansion card riser slot connectors.
• Slot 1 is for Riser 1R

• Slot 2 is for Riser 2A
• Slot 3 is for Riser 3A
• Slot 4 is for Riser 4P
R760 Riser Configurations
Many of the riser in 16G have an updated latch mechanism and

placement guides. Risers might include a lock and unlock feature.
The PowerEdge R760 has 13 riser configurations numbered 0 through 12.

The tabs show a subset of the riser configurations, configuration 1 and
configurations 9 through 12.
Slots noted with orange are assigned to CPU1. Slots noted with blue are
assigned to CPU 2.

Configuration 1
6 x8 FH and 2 x16 LP
Configuration 9
3 x8 FH (Gen5) + 1 x16 LP
Configuration 10
1 x16 LP + 1 x8 FH (Gen5) +1 x16 FH (Gen5)
Configuration 11
2 x16 LP + 2 x8 FH

Configuration 12
2 x16 LP + 4 x8 FH (Gen5)
Common Form Factor Acronyms
FH - full height
HH - half height
LP - low profile
HL - half length
FL - full length
SW - single wide (typically refers to GPUs)
DW - double wide (typically refers to GPUs)
Important: To learn about the definition of different types of

risers, see the Riser Card Categories Job Aid in the
Resources tab.

R660 Riser Configurations
The PowerEdge R660 has 11 riser configurations numbered 0 through 10.

The tabs show a subset of the riser configurations, configurations 7
through 10.
Slots noted with orange are assigned to CPU1. Slots noted with blue are
assigned to CPU 2. Slots noted with a red dot indicate Gen 5.
Configuration 7
Riser configuration R3P: Slot 3: HL, low profile, CPU2 - PCIe Gen5 x16
Riser configuration R3P.
Configuration 8
Riser configuration R2A: Slot 1: HL, low profile, CPU1 - PCIe Gen3/Gen4
x16 (x16 connector)
Riser R2A.
Configuration 9
Riser configuration R2S and R3S:
• Slot 1: HL, low profile, CPU1 - PCIe Gen5 x16 (x16 connector)

Riser R2S and R3S.
Configuration 10
Riser configuration R2V:

• Slot 2: HL, low profile, CPU2 - PCIe Gen3/Gen4 x16 (x16 connector)
Riser configuration R2V.
PCIe Slot Considerations
The expansion cards with the highest priority should be installed first using
the slot priority. All the other expansion cards should be installed in the
card priority and slot priority order. The table provides guidelines for
installing expansion cards to ensure proper cooling and mechanical fit.
Configuration Expansio PCIe Controllin Heigh Lengt Slot

s n card Slot g t h Widt
risers s Processor h
Config 5-1 with R1R 1 Processor Full Half x16 +

4x FH and 2x and 1 Height Length x16
LP 2
R2A 3 Processor Low Half x16 +

and 1 and 2 Profile Length x16
6

R3A 5 Processor Full Half X16

2 Height Length
R4P 7 Processor Full Half x16

2 Height Length
Table 1: Expansion Card Riser Configurations
The table lists the card type, slot priority, and maximum card supported.
Card Type Slot Priority Maximum Number

of cards
Inventec (LOM card) Integrated slot 1
Foxconn (fPERC 11) Integrated slot 1
Broadcom (OCP:10Gb) Integrated slot 1
(Mellanox) NIC: High 5, 7, 1,2 1

Dynamic Range (HDR) -
Virtual Protocol
Interconnect® (VPI). These
are InfiniBand cards.
(Mellanox) NIC:100Gb 5, 7, 1, 2 1
(Intel) NIC:100Gb 6, 3 2
Table 1: Configuration: R1R + R2A + R3A + R4P
Important: To learn more about the specific slots see the

Slot Priority Matrix attached in the Resources tab.

Instructions
1. Open the activity FSM.

2. Use the activity FSM to answer the question.
3. See the participant guide for answers to the questions.
Activity
Question
Can both a LOM card and OCP card be installed on the same PowerEdge
R760?
Answer: Yes. The system allows either LOM card or an OCP card or both
to be installed in the system. See the note in the NIC port specifications.

Question
The PowerEdge R760 is deployed with riser configuration 2. What is the

slot priority when installing a Mellanox DPU?
Answer: 5, 4, 7, 1, 2. See Table 45 Configuration 2.

Heat Sink Assembly Design
Processor Heatsink Module (PHM) combines the processor and heat sink
into a single unit prior to installation. The torsion wires on the bolster plate
secures the connection. Benefits include reduced socket contact damage,
and minimal board keep - out space.
Socket retention hardware consists of three main components:
Graphic showing the heat sink assembly components using a 2U high performance heat
sink.
• PHM
• Bolster plate assembly
• Back plate assembly

Supported heatsinks of R660 are:
• 1U standard heatsink with CPU TDP <= 185W

• 1U L-type HPT heatsink with CPU TDP > 185W
Supported heatsinks of R760 are:
• 1U standard heatsink with CPU TDP ≤ 165 W (supports only 2.5-inch

drives and non-GPU configuration)
• 2U standard heatsink with CPU TDP ≤250 W (supports 3.5-inch drives
and non-GPU configuration)
• 2U standard heatsink with CPU TDP ≤350 W (supports 2.5-inch drives
and non-GPU configuration)
• 1U L-type HPT heatsink with CPU TDP > 185W (supports All
GPU/FPGA configurations)
Photograph of heatsinks.
Liquid Cooling Module
As CPU performance improves, increased heat becomes a concern.
R760 and R660 includes the latest Direct Liquid Cooling (DLC). The
optional DLC solution absorbs the generated heat using a coolant that

travels through closed channels. This update includes redesigned cold

plates, improved logging, and a universal leak sensor4.
Liquid Cooling Module
PowerEdge R760 liquid cooling modules.
The liquid cooling module5 is an assembly of:
4 Prevent on when liquid is present. Power off local mode using

OpenManage Enterprise and a smart PDU. Notify using iDRAC -
notification through SNMP or IPMI.
5 The liquid cooling module is also known as the cold plate or cold plate
assembly.

• Two liquid leak sensor (LLS) boards, one for each CPU with tubes
connecting to the external liquid cooling system
• An alert cable or detection cable
Liquid Cooling Rear I/O Board
PowerEdge R760 rear view and LC RIO top view.
The Liquid Cooling Rear I/O (LC RIO) board is unique to liquid-cooled
PowerEdge servers that follow the monolithic architecture.
LC RIO attributes:
• The LC RIO board is smaller than the standard rear I/O board.
• The VGA port cable is a default optional kit with the LC RIO board.

Liquid Leak Sensor (LLS) Board
LLS printed circuit board assembly (PCBA).
The LLS board communicates the status6 to the immediate upstream

entity. Signaling uses the LC RIO for monolithic architecture and CPLD for
modular architecture.
Attributes of the LLS board:

• Component of the liquid cooling module
6 Communication uses a unidirectional signaling scheme on ALERT#. The

information transmitted from the sensor on the ALERT# includes a
heartbeat signal and error messages. The heartbeat signal indicates a
healthy sensor. The iDRAC error messages include small leak, large leak,
or leak sensor errors.

• Sensors to detect a liquid leak within the system

• Capable of distinguishing between high humidity, a small leak, or a
large leak
• Different in design for Intel and AMD products
Important: DLC supported PowerEdge servers have:

- A factory-installed liquid cooling solution combined with
leak detection7 capabilities options.
- A proactive response to coolant leaks
Important: A graceful shutdown caused by large leak is not

performed by iDRAC. The actual shutdown must be done by
customers themselves. The LLS mechanism only sends out
alerts.
Air Shroud Support
The air shroud directs the airflow across the entire system, prevents the
system from overheating, maintains uniform airflow inside the system.
7PowerEdge servers before 15G do not include leak detection

capabilities.

Types of Air Shroud Support.
R760 full length risers and GPU shroud.
PowerEdge R760 supports three types of air shrouds:
• Regular Shroud — Standard Air Shroud for Non-GPU and for Liquid
cooling
• Regular Shroud Rear Drive Shroud — Used on air cooling system
with 2x 2.5" rear drive configuration
• General-Purpose Graphics Processing Unit (GPGPU) Shroud —
For GPU configurations

PowerEdge R660 supports three types of air shrouds:
Photograph of R660 air shroud.
• CPU Shroud — Used on all air-cooling configurations system

• PCH Shroud — Used on systems with no riser configuration (RC0)
• Rear Drive Shroud — Used on air cooling system with 2x 2.5" rear
drive configuration
Fans
The image illustrates the fans supported on the R760 and R660.
The PowerEdge R660 supports up to four standard (STD) or high

performance gold grade (HPR) dual cooling fan modules. The type of fan
used is based on certain CPU TDP, drive configurations, GPU, and
memory.

The PowerEdge R760 supports up to six standard (STD), high

performance silver (HPR), or high-performance gold (VHP) grade cooling
fans.
HPR and VHP fans provide a higher air flow rate through the system. For
certain single CPU configurations only three fan modules are required and
in such configurations a fan blank is required to block fan bay 1. System
should have the correct fan type. Any standard fan can upsell to high
performance fan.
The table shows the R660 fan characteristics.
Fan Type Description Usage
Standard (STD) Fan ASSY, FAN, STD, Either one matched:

R660/R6625 - CPU TDP <= 185
- 3.5 Chassis
Gold High-performance ASSY, FAN, HPR, Either one matched:

(HPR) Fan GOLD, 1U, 15G, V3 - CPU TDP >= 185
- Rear Drive
- RDIMM >=128G
Knowledge Check - Cooling
1. You need to replace the heat sink on a PowerEdge R760. The system
has a GPU configuration. What type of heat sink must be ordered as a
replacement? Use the activity FSM to help answer the question.
a. 1U L-type HPR HSK

b. 2U HPR HSK
c. 1U STD HSK
d. 2U L-type HPR HSK
Answer: The 1U L-type HPR HSK heat sink. The 1U and 2U heat sinks
are for non-GPU configurations. See the Processor and heat sink matrix.

Appendix
R760 Specifications and Comparison

The table below provides a comparison of the components in PowerEdge
R760 and PowerEdge R750.
Components PowerEdge R760 PowerEdge R750 (Ice

(Sapphire Rapids) Lake)
Processors Intel Sapphire Rapids Intel Ice Lake

• Support up to two • Support up to two
Intel's 4th Gen Intel's 3rd Gen
Xeon Scalable Xeon Scalable
processor Sapphire processor Ice Lake
Rapids • Support up to 40
• Support up to 56 cores per processor
cores per processor

Appendix
Memory • Supports registered • Supports registered

ECC DDR5 DIMMs ECC DDR4 DIMMs
only only
• 32 DDR5 DIMM • 32 DDR4 DIMM
slots slots (16 Intel
Persistent Memory
• Memory type is
200 series (BPS)
RDIMM
only)
• DIMM speed is up
• 3 LRDIMM
to 4800 MT/s
supports up to 3200
MT/s speed
• Memory type is
RDIMM and
LRDIMM
• Intel Persistent
Memory 200 series
(BPS)

Appendix
Storage Controller • Internal controllers: • Internal controllers:

PERC H755N, PERC H745, PERC
PERC H755, PERC H345, PERC
H355, PERC H965i H755N, PERC
H755,
• Boot Optimized
Storage Subsystem • BOSS S2
(BOSS-N1) • External: H840 and
• HBA 11: HBA355i, HBA355e
HBA355e • SAS Host Bus
• SAS Host Bus Adapters: HBA355i
Adapters: HBA355i. • SW RAID: S150
H965 Adaptor with (Chipset
the H965e Post SATA/NVMe)
RTS
• SW RAID: S160
(Chipset
SATA/NVMe)
PCIe Storage • Front: Supports up • Front: Supports up

to 24x 2.5” NVMe to 16x 2.5” NVMe
(direct attach and and 24x 2.5” NVMe
Gen5 switch) SAS3
SAS4; EDSFF • Rear: Supports up
supports up to 16x to 2x and 4x 2.5”
E3.s. The NVME NVMe and an
switch can be optional hot-plug
available post RTS BOSS
release
• Rear: Supports up
to 2x and 4x 2.5”
NVMe, an optional
hot-plug NVMe
BOSS, and EDSFF
up to 4x E3.s

Appendix
PCIe slots Support Up to 8x x16 Support up to 8 x PCIe

Gen4 slots or 4 x PCIe Gen4 slots (up to 6 x16)
Gen5 slots with support for SNAP I/O
modules
Rear Ports • 1x USB 3.0 Port • 1x USB 3.0 Port

• 1x USB 2.0 Port • 1x USB 2.0 Port
• 1x Dedicated iDRAC • 1x Dedicated iDRAC
Ethernet port Ethernet port
• 1 x Serial (optional) • 1 x Serial (optional)
• 1x VGA (optional for • 1x VGA (optional for
Direct Liquid Cooling Direct Liquid Cooling
configuration) configuration)
Front Ports • 1 x iDRAC Direct • 1 x iDRAC Direct

(Micro-AB USB) port (Micro-AB USB) port
• 1 x USB 2.0 • 1 x USB 2.0
• 1 x VGA • 1 x VGA
Network options 2 x 1 GbE and 1 x OCP 2 x 1 GbE and 1 x OCP

3.0 3.0
Chipset Intel C741 series chipset Intel C620 series chipset
System LC 3.x, OpenManage, LC 3.x, OpenManage,

Management QuickSync2.0, OMPC3, QuickSync2.0, OMPC3,
Digital License Key, Digital License Key,
iDRAC Direct (dedicated iDRAC Direct (dedicated
micro-USB port), Easy micro-USB port), Easy
Restore Restore

Appendix
PSUs 16G PSU – 700 W/1100 15G PSU – 800 W, 1100

W/1800 W/2800 W AC W, 1400 W, 2400 W,
Titanium, 800 W/1400 1100 W-48 VDC, hot
W/2400 W AC, 1100 W swap redundant
Platinum -48 VDC, hot
swap redundant
Storage • Front: Support up to • Front: Support up to

24 x 2.5-inch 24 x 2.5-inch
SAS/SATA/NVMe SAS/SATA/NVMe
(HDD/SSD), 16 x 2.5- (HDD/SSD), 16 x 2.5-
inch inch
SAS/SATA/NVMe SAS/SATA/NVMe
(HDD/SSD), 8 x 2.5- (HDD/SSD), 8 x 2.5-
inch inch NVMe SSD, and
SAS/SATA/NVMe 12 x 3.5-inch
(HDD/SSD), and 12 x SAS/SATA (HDD/
3.5-inch SAS/SATA SSD)
(HDD/ SSD). • Rear: Support up to 2
• Rear: Support up to 2 x 2.5-inch
x 2.5-inch SAS/SATA/NVMe
SAS/SATA/NVMe (HDD/SSD) and 4 x
(HDD/SSD) and 4 x 2.5-inch
2.5-inch SAS/SATA/NVMe
SAS/SATA/NVMe (HDD/SSD)
(HDD/SSD)
R660 Specifications and Comparison

The table below provides a comparison of the components in PowerEdge
R660 and PowerEdge R650.
Components PowerEdge R660 PowerEdge R650

(Coleto) (Miura)

Appendix
Processors Support up to two 4th Support up to two 3rd

Generation Intel Xeon Generation Intel Xeon
Scalable processors Processor Scalable
with up to 56 cores per processors with up to
processor 40 cores per processor
Memory 32 DDR5 DIMM slots, 32 x DDR4 RDIMM,

supports RDIMM LRDIMM, 16 x Intel
Persistent Memory 200
series (BPS)
Storage Controller • fPERC: PERC • fPERC: H345,

H965i, PERC H755, H355, H745, H755,
PERC H755N, H755N, HBA355I
PERC H355, • APERC: H840 and
HBA355i HBA355E
• External HBAs • Software RAID:
(non-RAID): S150
HBA355e
• Boot Optimized
• External: HBA355e
Storage Subsystem
• Software RAID: (BOSS-S1 and
S160 BOSS-S2)
• Boot Optimized
Storage Subsystem
(BOSS N1)
PCIe slots Max 5: Gen4 PCIe slots Max 3: Gen4 PCIe slots
(3) ; Gen5 PCIe slots (3)
(2)
LOM 2 x 1 GbE LOM card 2 x 1 GbE LOM card

(optional)
OCP 1 x OCP card 3.0 Max 1 OCP 3.0 (x8

(optional) PCIe)

Appendix
USB Ports • Front: 1 x USB 2.0, • Front: 1 x USB 2.0,

1 x iDRAC USB 1 x iDRAC USB
(Micro-AB USB) (Micro-AB USB)
• Rear: 1 x USB 3.0, • Rear: 1 x USB 3.0,
1 x USB 2.0 1 x USB 2.0
System Management OpenManage, LC 4.x, OpenManage,

QuickSync2.0, Digital QuickSync2.0, Digital
License Key, iDRAC License Key, iDRAC
Direct (dedicated Direct (dedicated
micro-USB port), Easy micro-USB port), Easy
Restore Restore
Internal GPU Up to 2 x 75 W SW Up to 3 x 70 W single

width (SW)
Block Diagram of the R760 and R660
R760 and R660 Block Diagram
System board block diagram.

Appendix
PCIe Block Diagram
The PCIe diagram is applicable to both the R660 and R760.
PCIe block diagram.
GPU Power Cable

The Power Universal Cable Kit (PUCK) module consists of 3-way
connection, one or two upstream power connections (also called power
taps), at least one downstream end device connector, and sideband
signals. The upstream connection features 12V conductors directly
coming from the power supply8 connector. The downstream connection
8The power is supplied to Data Processing Unit (DPU) or GPU add-in

cards where system board power is insufficient.

Appendix
provides 12V to the end devices such as GPUs. The PUCK requires two
connected power cables to prevents an over current condition when only
one cable is connected.
GPU power cable.
Open Compute Project (OCP) Cable

The optional OCP cable provides an additional x8 lanes to support x16
speeds.

Appendix
OCP cable.
Riser 1R have two riser slots.

Appendix
Riser 2A have two riser slots.
Riser 3A have one riser slot.

Appendix
Riser 4P have one riser slot.
Supported Heatsinks
Heatsinks.

Appendix
R660 Air Shroud
R660 air shroud.

10 Gigabit Media Independent Interface (XGMII)
XGMII connects full duplex 10 GbE ports to each other and to other
devices on a printed circuit board. XGMII is typically used for on-chip
connections.
15G
Generation 15 modifier to distinguish different features available for
generation 15 servers.
2S
Two socket form factor. Used to identify the family of servers. PowerEdge
servers can have 1S, 2S, or 4S. See the PowerEdge rack server portfolio
page for details.
AI
Artificial Intelligence (AI) is the designing and building of intelligent agents
that receive precepts from the environment and act to affect that
environment.
AI Inferencing
Machine learning inferencing is the ability of a system to make predictions
from novel data. ML Inferencing teaches an AI to sort different fruits by
color. The user shows the AI a tomato, apple, and cherry to learn the fruits
are red. Later, when showing the AI a strawberry, it can infer the
strawberry is also red.
Boot Optimized Server Storage (BOSS)

Dell Technologies boots optimized storage solution. RAID solution card
that is designed for booting a server's operating system.
CPLD

A complex programmable logic device (CPLD) is a programmable logic
device with complexity between that of PALs and FPGAs, and
architectural features of both. The main building block of the CPLD is a
macrocell, which contains logic implementing disjunctive normal form
expressions and more specialized logic operations.
Data Processing Unit (DPU)

The Data Processing Unit (DPU) is a PCIe card that runs and accelerates
infrastructure services such as a hypervisor, networking solution, storage
solution, or distributed firewall.
DDR5
PowerEdge 16G introduces DDR5 memory. DDR5 reduces latency and
optimizes workloads that are memory, capacity, and cost constrained.
DDR5 offers up to 1.5X bandwidth improvement over DDR4. DDR5
scaling enables performance, capacity, power, and cost advantages not
available to DDR4. DDR5 provides a power-efficient design and improved
reliability features.
DIMM
Direct Access Inline Memory Module. DIMMs are available in varying
capacities. All DIMMs in a cache must have the same capacity
Direct Liquid Cooling (DLC)

The Direct Liquid Cooling (DLC) solution absorbs the generated heat
using a cooling solvent (coolant) that travels through closed loop
channels. DLC uses the thermal conductivity of liquid to provide dense
and concentrated cooling to the targeted areas. DLC reduces the
dependence on fans and expensive air handling systems.
DL
Deep Learning (DL) is a form of Machine Learning which uses Artificial
Neural Networks.
DRAM

x4, x8, and x16 DIMMs refers to the width of the DRAM components on a
memory module. x4 DIMMs use DRAM components that have a 4-bit data
width. x8 DIMMs use components with an 8-bit data width. x16 DIMMs
use components with a 16-bit data width.
E3 Drives
The Enterprise and Data Center Small Form Factor (EDSFF) is an SSD
design for NAND and Storage Class Memory (SCM). EDSFF optimizes
storage in enterprise, private, and public data centers.
E3 Drives
The Enterprise and Data Center Small Form Factor (EDSFF) is an SSD
design for NAND and Storage Class Memory (SCM). EDSFF optimizes
storage in enterprise, private, and public data centers.
EE
Enhanced Edge (EE) Intel CPU's are used to acceleration network traffic
in Edge deployments. Edge computing is a distributed information
technology (IT) architecture in which client data is processed at the
periphery of the network, as close to the originating source as possible.
HCI
Hyper Converged infrastructure (HCI) combines compute, virtualization,
storage, and networking in a single cluster.
HII
The Human Interface Infrastructure (HII) configuration utility is a storage
management application integrated into the System BIOS <F2> It is used
to configure and manage RAID disk groups, virtual disks, and physical
disks. This utility is independent of the operating system.
HPC
High performance computing (HPC) is the ability to process data and
perform complex calculations at high speeds.
HPC

High performance computing (HPC) is the ability to process data and
perform complex calculations at high speeds.
HW RAID
Form of RAID. The motherboard or a separate RAID card handles the
processing.
iDRAC
The Integrated Dell Remote Access Controller (iDRAC) is designed for
secure local and remote server management and helps IT administrators
deploy, update, and monitor PowerEdge servers.
IDSDM
Redundant SD-card module for embedded hypervisors. PowerEdge
servers can boot to the hypervisor out-of-the-box. The embedded
hypervisor is mirrored across dual SD cards using an integrated hardware
controller.
IEEE 802.3
The Electrical and Electronics Engineers (IEEE) 802.3 is a collection of
IEEE standards. The working group defining the physical layer and Media
Access Control (MAC) of Data Link Layer in the Ethernet set the
standards.
Intel Ice Lake

Codename for the 3rd generation Xeon Scalable server processors.
Inter-Integrated Circuit (I2C)

I2C is a serial communication bus that is used for attaching lower-speed
peripheral ICs to processors and microcontrollers in short-distance,
intraboard communication.
IoT

The Internet of things (IoT) describes the network of physical objects such
as sensors, software, and other technologies for the purpose of
connecting and exchanging data with other devices and systems over the
Internet. (Wikipedia)
LAN On Motherboard (LOM)

Short for LAN on motherboard. The term sees a chip or chipset capable of
network connections that has been embedded directly on the motherboard
of a desktop, workstation, or server. Instead of requiring a separate
network interface card to access a local-area network, such as Ethernet,
the circuits are attached to the motherboard. An advantage of a LOM
system is an extra available PCIslot that is not being used by the network
interface controller.
LAN On Motherboard (LOM)

Short for LAN on motherboard. The term sees a chip or chipset capable of
network connections that has been embedded directly on the motherboard
of a desktop, workstation, or server. Instead of requiring a separate
network interface card to access a local-area network, such as Ethernet,
the circuits are attached to the motherboard. An advantage of a LOM
system is an extra available PCIslot that is not being used by the network
interface controller.
Latency
Latency is the response time or the period of time that a component waits
for an answer from another component. Latency is the time it takes for the
storage to respond to a request.
LRDIMM
Load-Reduced DIMM. Has higher densities than RDIMMs. Uses a
memory buffer chip to reduce the load on the server memory bus.
Media Access Control (MAC) address

The server is connected to the network through a switch. A Media Access
Control (MAC) address identifies the switch. A MAC address is a unique
identifier for an Ethernet or NIC over a network

micro Secure Digital card (uSD)
Type of removable flash storage commonly used in servers and other
computing devices. It is used to store data and software, and can be
easily removed or replaced as needed.
ML
Machine Learning (ML) is an application of AI where systems use data to
learn how to respond, rather than being explicitly programmed.
MT/s
Mega-Transfers per Second (MT/s). Measurement of bus and channel
speed in millions of cycles per second.
Multicasting
Multicasting involves sending the same message to many endpoints such
as in a video conferencing facility.
NVDIMM
Non-Volatile DIMM
NVMe
Non-Volatile Memory Express (NVMe). Communications interface for
PCIe-based SSDs. Used to increase efficiency and performance.
NVMe
Non-Volatile Memory Express (NVMe). Communications interface for
PCIe-based SSDs. Used to increase efficiency and performance.
OCP
Open Compute Project (OCP) is an organization that shares designs of
data center products and best practices among companies. OCP designs
and projects include server designs, data storage, rack designs, and open
networking switches. Read more information about the organization by
going to www.opencompute.org.
OCP

Open Compute Project (OCP) is an organization that shares designs of
data center products and best practices among companies. OCP designs
and projects include server designs, data storage, rack designs, and open
networking switches. Read more information about the organization by
going to www.opencompute.org.
OMSA
OpenManage Server Administrator (OMSA) is a software agent that
provides a comprehensive, one-to-one systems management solution in
integrated web browser-based graphical user interface (GUI) or command
line interface(CLI) throught the operating system.
PCH
Platform controller hub (PCH) controls certain data paths and support
functions used in conjunction with Intel CPUs.
PCIe
Peripheral component interconnect express (PCIe) is an interface
standard for connecting high-speed components.
PCIe
Peripheral component interconnect express (PCIe) is an interface
standard for connecting high-speed components.
PERC
PowerEdge RAID Controller (PERC). Family of controllers that enhance
performance, increase reliability, add fault tolerance, and simplifies
management.
RAID
Redundant Arrays of Independent Disks (RAID). RAID controllers combine
multiple server physical hard drives together into a virtual drive or multiple
drives to improve data efficiency and protection.
RDIMM

Registered DIMM. Dual in-line memory module (DIMM) with improved
reliability.
RSA SecurID
RSA SecurID is multi-factor authentication (MFA) technology used to
protect network resources, such as applications and websites. MFA
mitigates risk and maintains compliance without disrupting employee
productivity. MFA can confirm user identities to ensure they are only
granted access to the resources they need to do their jobs. RSA SecurID
can quickly and securely provide appropriate access to resources both on-
premises and in the cloud.
SAS
SAS (serial-attached SCSI) is a type of SCSI that uses serial signals to
transfer data, instructions, and information. SAS drives are dual ported.
SATA
SATA (Serial Advanced Technology Attachment) uses serial signals to
transfer data, instructions, and information. SATA drives have only a
single port.
SCSI
A set of standards for physically connecting and transferring data between
computers and peripheral devices. The SCSI standards define
commands, protocols, electrical, optical and logical interfaces.
SDS
Storage data services such as APEX Data Storage Services. APEX is an
as-a-Service portfolio of scalable and elastic storage resources. The
storage as-a-Service model simplifies the storage process.
Secure Enterprise Key Manager (SEKM)

SEKM is a licensed feature that allows users to apply iDRAC9 to
authenticate with Gemalto/SafeNet AT KeySecure Management Server
through the Key Management Interoperability Protocol (KMIP). To protect
the data against server theft, the SEKM enables the KEY to be held on
either the iDRAC iLKM or a remote KMS server as opposed to getting
stored locally on the PERC.
Self-Describing I/O (SDIO)

Self-describing data is data and metadata that describes the format and
meaning of a message. SDIO usually contains data needed to understand
the message, and the information necessary to complete a task.
Small Form-factor Pluggable (SFP)

Small Form-factor Pluggable (SFP) is a hot-pluggable network interface
module used for network connectivity and communication. Nomenclature
such as SFP+, SFP28, and SFP56 represent different speeds.
SMART
Self-Monitoring, Analysis and Reporting Technology (SMART) is a
monitoring system included in hard disk drives (HDDs) and solid state
drives (SSDs). Its primary function is to detect and report various
indicators of drive reliability with the intent of anticipating imminent
hardware failures.
SNAP I/O
Balances I/O performance. CPUs share one adapter, which prevents data
from traversing the inter-processor link when accessing remote memory.
SP
A service provider (SP) is a company that provides its subscribers access
to the internet.
STP cable
Shielded Twisted Pair (STP) Ethernet cable that is commonly used for
high-speed networks. A metallic substance shields STP. An additional
metal foil wraps each set of twisted wire pairs together.

UDIMM
Unregistered or unbuffered DIMM. UDIMMs do not have an onboard
register as seen with an RDIMM. UDIMMs are typically used in desktops
and laptops.
UEFI boot
Unified Extensible Firmware Interface (UEFI). UEFI secure boot prevents
systems from booting from unsigned or unauthorized preboot device
firmware, applications, and operating system boot loaders. Without secure
boot enabled, systems are vulnerable to malware corrupting the startup
process. UEFI is a firmware interface that connects the firmware to the
operating system. UEFI initializes the hardware components and starts the
operating system.
Unique Identifier (UID)

A UID is a numeric or alphanumeric string for an element within a system.
UIDs address an element for access, interaction, management, and
monitoring.
UTP cable
Unshielded Twisted Pair (UTP) Ethernet cable that is commonly used
between a system and wall. It is also used for desktop communication
applications.
vRAN
Virtualized radio access networks (vRANs) are a way for
telecommunications operators to run their baseband functions as
software. One of the primary benefits of virtualizing radio access networks
(RANs) is that RAN functions no longer require special proprietary
hardware to run, and can instead be run on standard servers. This is
achieved by applying the principles of virtualization to RAN, and is usually
one part of a larger network function virtualization (NFV) effort.

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16G INTEL POWEREDGE

R660 AND R760

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Enhanced Features and Technologies 21

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