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Af 163-2
Af 163-2
Af 163-2
Descript¡on l'hc lbllowing Scotch-Weld AIr 163 p¡oducts arc included in this data sheet:
Weight Nominal
Product (r .005) Lb/ft, Color Th¡ckness - m¡ls
Scotch-Weld AF 163-2G108 0.100 Pink 16
Scotch-Weld AF '163-2K 0.045 Yellow
Scotch-Weld AF ',63-2K 0.060 Red
Scotch-Weld AF 163-2K 0.085 Blue '13
Scotch-Weld AF 163-2L 0.030 Pink
Scotch-Weld AF 163-2lV 0.045 Yellow 7.5
Scotch-Weld AF 163-2M 0.060 Red 9.5
Scotch-Weld AF 163-2M 0.085 Blue '13
Scotch-Weld AF 163-20ST 0.030 Green 5.5
Scotch-Weld AF 163-205T 0.045 Green 5.5
Scotch-Weld AF 163-205T 0.060 Red 9.5
Scotch-Weld AF 163-2U 0.015 Red 2.5
Scotch-Weld AF 163-2U 0.030 Red
Scotch-Weld AF 163-2U 0.060 Red
Scotch-Weld AF'163-3lV 0.030 Green 5.5
Product Performance Note: The follorving technical information and data shou¡d be considered representat¡ve
or typical only and should not be used for specific¡tion purpos€s.
Scotch-Weld AF I63-2K
8-12.4 GHz .033 3.08
12.4-18 GHz .o29 3.01
Scotch-Weld AF '163-2M
a-12.4 GHz .037 2.91
12.4-18 GHz .029 2.74
A. 75'F Bulk Modulus, Shear Modulus, and Poisson's Ratio - knit supported
l7 ply laminate - 0.1 inches thick (ASTM D 3039) cure 60 minutes at 250oF
Modulus Elasticity t6l x torpsi
Shear Modulus 60 x l0r psi
Poisson's Ratio 0.34
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Scotch-Weld"'
Structural Adhesive FiIm
AF 163-2
Performance
Product Note: The following technical inforñation and data should be considered representative
(continued) or typical only ¿nd should not be used for specification purposes.
IN LBS
Grc 25 22 21 17
lN2
IN LBS
Gre 15 13 10
IN,
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Scotch-Weld"'
Structural Adhesive Film
AF 163-2
Performance
Product Note: The following technical information and data should be considered representative
(continaed) or §pical only and should riot be used for §pecification pürposes.
Scotch-weld Scotch-Weld
Temperature AF 163-2L.03 tb/ft, AF 163-2K .085 tb/ft,
-67'F 5970 6430
75'F 5290 5S90
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Scotch-Weld'^'
Structural Adhesive Film
AF 163-2
Product Performance Note: The following technical informatio[ ard data should be considered representative
(conlinued) or typical only and §hould not be used for specification purpose§.
-67'.F 33 29
7 s',F 29 44 45 41
1BO'F 24 40 38 35
250'F 20 30 28 20
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Scotch-Weld"'
Structural Adhesive Film
AF 163-2
Product Performance Note: The following technical ilformation and data should be considered representat¡ve
(continaed) or typical only and should not be used for specification purposes.
Scotch-Weld Scotch-Weld
AF 163-2M AF 163-2K
Test Temperature .045 tbtfl2 .085 tb/ñ, .045 tb/ft,
{7"F 57
75'F 55 63
160'F 46 45
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Scotch-Weld"'
Structural Adhesive Film
AF 1632
Product Performance Note: The follorving technical information and data should be considered represent¿tiye
(continued) or §pical only and should not be u§ed for specification purpo§c§.
75'F 26
,1BO'F 19
18
250'F I s
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Scotch-Weld'"
Structural Adhesive Film
AF 163-2
Performance
Product Note: The followiry technical information and data should be considered representative
(continued) or §pical only and should not be used for specification purposes.
4. Cure Cycle: 270'F, 60 minutes, 50 psi, loF/min. rise rate
Primer: 3MrM Scotch-Weldru Structu¡al Adhesive P¡imer EC-39248
Skins: Same as (3.) above
Core:3/16" cell,112" thick 5052 alloy non pedorated
Test Rate: 1.O"/min. (cross head speed)
Product Performance Note: The follo$ing technical information and data should be cons¡dered representative
(conlinued) or typical orrly rrd should not be used for specilication purposes.
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Scotch-Weld"'
Structural Adhesive Film
AF 163-2
Performance
Product Note: The following lechnical irform¡tion and dat¡ should be considered representative
(confinaed) or typical only and §hould rot be used for specilication purpo§e§.
Adhesive Load: 970lbs. '1500 lbs. 970 lbs. 1500 lbs. 970 lbs. 1500 lbs.
Scotch-Weld
AF 163-2M
(.045 tb/ftr) .0005' .003' .005"
301 Stainless Steel .063" Thick Metal .020" Thick N¡etal Peel Skin
Epoxy FRP
("Scotchply" Brand Type '116) 0.150" Thick Skin
Abrade & degrease - unprimed 4300. 2300-
*lnterlaminar adherend failure
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Scotch-Weld"'
Structural Adhesive Film
41 163-2
Performance
Product Note: The following technical information and data should be coosidered representative
(continued) or typical only and should not be used for specification purposes.
3MrM Scotch-We¡drM
Structural Adhes¡ve Film
AF 't63-2U (.06 rb/ft')
with 3MrM Scotch-WeldrM
MMM-A-í32B Type I Structural Adhesive
MMM.A.132B Test Class 2 Requ¡rements Primer EC-3960
Scotch-Weld AF 163-2U
Description MIL-A-25463B Type I (.06 lb/ft'?) w¡th
Test Number Class 2 Requiremeñts Scotch-Weld EC-3960
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Scotch-Weld"'
Structural Adhesive Film
AF 163-2
Performance
Product Note: The following technical information and data should be considered representative
(conlinued) or rypical only and should not be used for specificatior purposes.
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Scotch-Weld'-'
Structural Adhesive Film
AF 163-2
Product Performance Note: The following technical information and data should be considered representative
(continued) or typical only and should not be used for specilication purposes.
C. Metal to Metal Floating Roller (Belt) Peel (piw) - 3M Test Method C-260
Cure Cycle: (same as B.)
Primer: 3Mru Scotch-WeldrM Structual Adhesive Primer EC-39248
Metal: 2024 T:3 Bare .025" thick to .063" thick aluminum
- FPL etched
Adhesive: 3MrM Scotch-WeldrM Structural Adhesive Film AF 163-2K (.06 lb/ff)
Specimens: Precut to I" wide before exposure
Test Temperature: 75oF
Peel Rate: 6"/min.
Env¡ronmental Exposure Peel Strength (piw)
1. Control (No Exposure) 82
2.7 day immersion in JP-4 83
3.7 day immersion in l\,llil-H-5606 85
4.7 day immersion in l\¡il-L-7808 85
5. 30 day Exposure '120"F and 95 to 100% RH BO
D. Metal to Metal Wide Area Blister Detection Shear (psi) - 3M Test Method C-2232
Cure Cycle: 235"F, 90 minutes, 35 psi, 5oF/min. ¡ise ¡ate
Primer: 3MrM Scotch-WeldrM Structual Adhesive Primer EC-3960
ltretaL 2024 T3 Bare .063 " thick FPL etched
Specimens: Precut to l " width and notched prior to exposure
Test Temperature: 75oF
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Scotch-Weld"
Structural Adhesive Film
AF 163-2
Product Performance Note: The follorving technical information and data should be considered representative
(continued) or typical only and should not bé us€d for specilication purposes.
0 57 pú 55 piw 46 p¡w
7 days 55 piw 61 piw 50 piw
15 days 59 piw 55 piw 44 p¡w
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Scotch-Weld"'
Structural Adhesive Film
AF 163-2
Product Performance Note: The follolring tech[ical information and data should be considered representatñ'e
(corrtin ed) or typical only and should not be used for specification purposes.
C. 75oF Honeycomb Peel 2024 T-3 Bare .020 Aluminum Skins (in.lb/in) -
3M Test Method C-245
3Mr" Scotch.WeldrM Structural Adhesive Film AF'163-2M
Exposure Time .045 tbtft, .085 rb/ft,
0 l5 in.lb/in 39 in.lb/in
7 days 15 in.lb/in 31 in.lb/in
15 days l1 ¡n.lb/in 26 in.lb/¡n
D. 75oF Honeycomb Flahvise Tensile 2024 T-3 Bare Aluminum Skins (psi)
3M Test Method C-251
Scotch-Weld AF '163-2M
Exposur€ T¡me .045 tb/ft, .085 rb/ft,
0 935 1500
7 days '1050 1600
15 days '1000 1570
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Scotch-Weld"
Structural Adhesive Film
AF 163-2
Product Performance Note: The following technical information aDd data should be considercd representative
(conÍihued) or typicál only and should not be used for specilication purposes.
Product Application Note: While this information is provided as a general application guideline based upon
typical conditions, it is rccognized fhat no two applications are ¡dentical due to
dillering assemblies, method ofheat and pressure applic¡fior, production equipment
and other limitations. It is therefore suggested that experiments be runr \iithin the
sctual constr¿ints imposed, to determine optimum conditions for your specilic
applicrtion and to determine suitabilit¡/ of product for particular ¡ntended use.
l. Surface Preparation
A thoroughly cleaned, dry, grease-ñec surface is esscntial lo¡ maximum
perfonnance. Cleaning methods which will produce a break free watc¡ film on
melal suúáces are generally satisfáctory.
A. Aluminum: Phosphoric acid anodize (3M Test Method C-2780), Chromic
acid anodize with or without a chromate seal (3M Test Mcthods C-2801 or
C-2782) are prefcrred for maximum joint durability in moist environmenrs.
Optimized FPL Etch has also demonst¡ated improved durability performancc.
Optimized FPL Etch 3M Company (3M Test Method C-2803 or ASTM D 2651)
1. Alkaline degrcase - Oakite* 164 solution 9-1 1 oz./gallon ofwarer at 190o
+ lo"F for l0 to 20 minutcs. Rinse immcdiately in largc quantities ofcold
running water (3M Test Method C-2802).
*Available f¡om Oakite, Berkelcy Heights, NJ.
2. Optimized FPL Etch Solution (1 litcr):
Material Amount
Distilled Water 700 ml plus balance of liter (sec below)
Sodium Dicb¡omate 28 to 67.3 grams
Sulfu¡ic Acid 287.9 to 310-0 grams
Aluminum Chips 1.5 gramsAiter of mixed solution
Note: Review and follow safety and prccautionary information provided
by chemical supplicr p orto preparation ofthis etch solution.
To prepare I liter of this solution, dissolve sodium dichromate jn 700 ml
of distilled ,,\,-ater. Add sulfuric acid and mix well. Add additional distillcd
water ro fill to I liter Heatmixedsolutionto66toTl'F(l50to 160"F).
Dissolve 1.5 grams of2024 bare aluminum chips per liter ofmixcd
solution. Ge¡tle agitation will help aluminum dissolve in about 24 hous.
To FPL etch panels, place them in thc above solution at 150 to 160'F (66
to 7l"C) lbr 12 to 15 minutes.
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Scotch-Weld'"'
Structural Adhesive Film
AF 163-2
Application
Product 3. Rinsc immcdiately in large quantities ofclear running tap water.
(conlinued) 4. Dry Air dry approximately 15 minutes followed by a force dry at
l40oF (maximum).
5. CuÍent theory suggests that both suface struch¡re and chemistry play a
significant role in determining the strength and permanence ofbonded stlucture.
It is therefore adüsable to bond or prime freshly cleaned surfaces as early as
possible after preparing to avoid contamination and./o¡ mechanical damage.
l8
Scotch-Weld''
Structural Adhesive Film
AF 163-2
Application
Product B. 3MaM Scotch-WeldrM Structural Adhesive Film AF 163-20ST
(confinued) Scotch-Weld OST fitms are designed to facilitate the removal ofair from large
area solid panel construction. Application of vacuum to the assembly prior to and
during the initial heat cycle is normally required (see cure conditions below).
1. Cut a portion of film sufficient for the application with the liner in place.
2. Remove the protective liner and apply the high tack side ofthe film against the
substrate (high tack side is adjacent to the liner).
3- Position the ñlm and rub out all air between the adhesive afld the substate (use
ofa rubber and roller will facilitate this process).
4. Complete assembly and cure.
VI. Cure Conditions & Characteristics
Scotch-Weld AF 163-2 films are designed to provide short cule times in the
225 to 300'F temperature raage. While performance outside this cure temperature
range has not been fully investigated, limited results suggest that cure temperatures
as high as 350'F may be used as well as longer cure times at 200'F (6 hrs.) to obtain
useful performance.
A. Weight Loss During Cure (3M Test Method C-274): Less than loá
(60 min at 250'F)
B. Gel Time: The following times are ¡pically required to convert the Scotch-Weld
AF 163-2 resin system to a 1ow strength, rubbery solid on a pre-heated stage.
Témperature GelTime
200'F 103 m¡nutes
225"F 47.5 minutes
250'F 20.5 minutes
275"F 10 minutes
300"F 5.5 minutes
C. Flow During Cure (3M Test Method C-261):
The following levels are typical avemges for Scotch-Weld AI 163-2 and
Scotch-Weld AF 163-3M films using a cure of235"F,30 minutes,35 psig,
5'F/min rise rate
Adhesive % Flow (area ¡ncreases)
Scotch-Weld AF 163-3¡, (.03 lb,m1 25oyo
Scotch-Weld AF 163-20ST (.03|b/ft'?) 225%
Scotch-Weld AF 163-2K (.06 lb/ft1 350%
Scotch-Weld AF 163-2M (.061b/fr'z) 400%
Scotch-Weld AF '163-2K (.085lb/fe) 450yo
D. Cure Time and Temperature
1. For temperatues from 250 to 300"F, a cure time of 60 minutes at temperature
is suggested.
2. For temperatues between 225 afld 250'F, a cure time of 90 minut€s at
tempercture is suggested.
3. A cure temperatu¡e of350'F for 2 hours did not result in an overcure (gave
equivalent performance to a I hour at 250"F cure).
Following cure, it is suggested that pressure be maintained until the assembly has
been cooled to 150"F or below.
E. Heat up rate
Bond line temperature rise rates between l'F/min. and 2O'F/nrin. have been used
successfully with Scotch-Weld AF I 63-2 ñlms. It must be noted that hot entry
cures at 300oF and above can be expected to produce reduced performance due
to formation ofbond line porosity.
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