MIL-HDBK-344A

0.001 0.01 0.1

FRACTION DEFECTIVE PARTS
Figure 4.2: Fraction Of Defective Assemblies Vs Remaining Part Fraction Defective

General awareness of this problem in industry has resulted in improvements in part quality and reliability. For
example, results reported in the Integrated Circuit Screening Report published by the IES in November, 1988
indicated a significant improvement for microcircuits and revealed that the additional handling involved in the
rescreening process was actually introducing more defects that were being screened.

None the less, it should be noted that the foregoing discussion addresses errors only and must be extended to
include latent defects and that it is primarily latent defects that escape to the field and degrade early life reliability.

The requirement for parts rescreening should not be mandated and should only be used as determined to be
necessary by the implementation of the Handbook.

Screening at the assembly level is also a means of finding and eliminating part defects from the hardware. The part
fallout from early screening at the assembly level can provide much of the information needed for resolving such
uncertainties and taking corrective action. There are always uncertainties as to whether the part defects which are
found during assembly level screening, are escapes from part level screens or whether they are newly introduced
defects due to handling, test and assembly operations. A thorough failure analysis of the fallout from assembly
level screening can help in determining defect causes and the types of screens which should be used.

4.4.3.3.3 Air Force R&M 2000 ESS Pollcv-Part Fraction Defective. Air Force R&M 2000 ESS
studies recommend that the manufacturing process begin with piece parts having a remaining part fraction
defective below 1000 PPM by FY87 and below 100 PPM by FY90. Procedure D of Section 5 and ESS results are
used in the Handbook procedures to evaluate the achievement of these goals. However, the prescribed
requirement of 100 PPM defect level for parts may not be adequate for achieving the required reliability The
actual requirements should be determined using Procedure A and may increase or relax the R&M 2000 levels.
The R&M 2000 levels should also be interpreted as being applicable to both latent and patent defects where the
patent defects include errors due to electrical testing, test correlation, specification discrepancies etc.

4.4.3.3.4 Process Maturity and Defects. The maturity of both the product design and the manufacturing
process can significantly impact the quantity and type of defects which can reside in the hardware. The data
shown in Table 4.2 represent experience on several large development and production projects. As the data
illustrate, the proportions of failures in a product which are traceable to design, part or manufacturing causes can
differ substantially, depending upon the stage of maturity of the product and the manufacturing process. During

4-9

S o u r c e : h t t p : / / w w w . a s s i s t d o c s . c o m -- D o w n l o a d e d : 2 0 1 3 - 0 2 - 2 5 T 1 3 : 5 7 Z
C h e c k t h e s o u r c e to v e r i f y t h a t t h i s is the c u r r e n t v e r s i o n b e f o r e u s e .