See discussions, stats, and author profiles for this publication at: https://www.researchgate.

net/publication/328254961

Heat transfer enhancement of circular and square LED geometry

Article in International Journal of Numerical Methods for Heat and Fluid Flow · October 2018
DOI: 10.1108/HFF-04-2018-0172

CITATIONS READS

14 354

2 authors:

Sana Ben Salah Mohamed Bechir Ben Hamida

National Engineering School of Monastir University of Ha'il - College of Engineering - Saudi Arabia
3 PUBLICATIONS 30 CITATIONS 74 PUBLICATIONS 590 CITATIONS

SEE PROFILE SEE PROFILE

Some of the authors of this publication are also working on these related projects:

Study of heat transfer inside different geometric medium under the effect of a magnetic field and a production or absorption. View project

Fuzzy Topology and order View project

All content following this page was uploaded by Mohamed Bechir Ben Hamida on 19 January 2019.

The user has requested enhancement of the downloaded file.

 International Journal of Numerical Methods for Heat & Fluid Flow
Heat transfer enhancement of circular and square LED geometry
Sana Ben Salah, Mohamed Bechir Ben Hamida,
Article information:
To cite this document:
Sana Ben Salah, Mohamed Bechir Ben Hamida, (2018) "Heat transfer enhancement of circular and
square LED geometry", International Journal of Numerical Methods for Heat & Fluid Flow, https://
doi.org/10.1108/HFF-04-2018-0172
Permanent link to this document:
https://doi.org/10.1108/HFF-04-2018-0172
Downloaded by University of Sunderland At 13:01 12 October 2018 (PT)

Downloaded on: 12 October 2018, At: 13:01 (PT)

References: this document contains references to 40 other documents.
To copy this document: permissions@emeraldinsight.com
Access to this document was granted through an Emerald subscription provided by emerald-
srm:380143 []
For Authors
If you would like to write for this, or any other Emerald publication, then please use our Emerald
for Authors service information about how to choose which publication to write for and submission
guidelines are available for all. Please visit www.emeraldinsight.com/authors for more information.
About Emerald www.emeraldinsight.com
Emerald is a global publisher linking research and practice to the benefit of society. The company
manages a portfolio of more than 290 journals and over 2,350 books and book series volumes, as
well as providing an extensive range of online products and additional customer resources and
services.
Emerald is both COUNTER 4 and TRANSFER compliant. The organization is a partner of the
Committee on Publication Ethics (COPE) and also works with Portico and the LOCKSS initiative for
digital archive preservation.

*Related content and download information correct at time of download.

 The current issue and full text archive of this journal is available on Emerald Insight at:
www.emeraldinsight.com/0961-5539.htm

Heat transfer
Heat transfer enhancement of enhancement
circular and square LED geometry
Sana Ben Salah
Research Unit of Ionized and Reactive Media (EMIR),
Preparatory Institute for Engineering studies of Monastir (IPEIM),
University of Monastir, Tunisia, and
Received 28 April 2018
Mohamed Bechir Ben Hamida Revised 21 June 2018
Accepted 27 June 2018
High School of Sciences and Technology of Hammam Sousse, University of Sousse,
Sousse, Tunisia
Downloaded by University of Sunderland At 13:01 12 October 2018 (PT)

Abstract
Purpose – The purpose of this paper is to compare the thermal effect between square and circular geometry
of light emitting diode (LED) with respect of the same surface for the intent of reducing the junction
temperature.
Design/methodology/approach – The heat equation is presented in a dimensionless form. To solve it
numerically subject to the boundary conditions, the authors realized a three-dimensional code with Comsol
Multiphysics.
Findings – The model is validated with previously published works. The authors found a good agreement.
Originality/value – New design of heat sink is improved for circular LED and a reduction of 18 per cent of
the junction temperature is permitted. The authors study the influence of various parameters: number and
length of fins and number and width of splits. New distribution of multichip LED in circular geometry
permits to put 42 chips instead of 36 chips with respect of the same surface and pitch and with reduction of the
junction temperature by 16 per cent.

Keywords Natural convection, Comsol multiphysics, Junction temperature, Multichip LED,

Square and circular geometry
Paper type Research paper

Nomenclature
T = temperature (°C);
l = Thermal conductivity, W/m K;
r = density, kg/m3;
C = specific heat at constant pressure, kJ/kg K;
h = heat transfer coefficient W/(m2K);
a = side length of the square;
r = radius of corresponding cercal;
N = number of fins;
L = length of fin, mm;
t = thickness of fin, mm;
n = number of splits;
International Journal of Numerical
w = width of split, mm; Methods for Heat & Fluid Flow
Alpha = angle between two splits; and © Emerald Publishing Limited
0961-5539
Pitch = distance between two chips, mm. DOI 10.1108/HFF-04-2018-0172
 HFF
1. Introduction
In various fields, the enhancement of heat transfer has been and will always remain the
interest of several researchers. One of the solutions found by these researchers is the use of
nanofluids.
Most of the domains used are porous media, which have been studied by Chamkha and
Khaled (1999), Chamkha and Rashad (2011) and Chamkha et al. (2015). The investigation of
micro- and nano-sized particle erosion in a 3-D, 90° elbow was the object of Shamshirband et
al. (2015) and Safaei et al. (2014). The natural convection of electrically conducted heat and
mass transfer in the presence of radiation and chemical reaction has been studied by
Sudarsan Reddy and Chamkha (2018). The natural convection in micropolar and viscous
fluids is reported by Prathap Kumar et al. (2010), in a CNT nanofluid by Estelle et al. (2017)
and in an enclosure filled with nanofluid by Goodarzi et al. (2014b), Ben Hamida and
Downloaded by University of Sunderland At 13:01 12 October 2018 (PT)

Charrada (2014, 2015a) and Esfandiary et al. (2016). The improvement in heat and mass
transfer during absorption of vapor into liquid film along a vertical channel was the focus
by Ben Hamida et al. (2018), who added copper nanoparticles to the working fluid. The
numerical studies are not only consecrate on natural convection but also consider the mixed
convection Chamkha et al. (2000), Umavathi et al. (2005) and Goodarzi et al. (2014a). The
laminar mixed convection in a rectangular inclined cavity with moving top lid is
investigated by Karimipour et al. (2013). The forced convection of nanofluid in a
microchannel including slip velocity was studied by Karimipour et al. (2014, 2015),
Karimipour (2015). He detailed the effect of different nanoparticle volume fraction and slip
coefficient. The influence of magnetic field was added by Karimipour et al. (2016).
The amelioration of convection is caused by not only increasing the fluid efficiency but
also ameliorating the surface of heat exchange between the fluid and the electronic device.
That is the problem of lamp of light emitting diodes (LEDs) because it became the most
interesting lamp (Zhua and Sun, 2016). It replaces mercury discharge lamp (Ben Hamida and
Charrada, 2015b, 2015c, 2013, 2012) and metal halide lamp (Ben Hamida and Charrada, 2016;
Ben Hamida et al., 2015) because of its instantaneous ignition, low consummation and high
lifetime, which can reach 50,000 h. But, it converts more than 80 per cent of the electric
power into heat. If this heat is not properly dissipated outside, it can affect the lifetime and
the luminous flux (Ha and Graham, 2012).
In 1963, Starner (1963) studied experimentally the free convection heat transfers from
rectangular fin arrays and found that the heat transfer coefficient for the vertical arrays
decrease by 10-30 per cent under those of horizontal arrays. Leung and Probert (1990) gives
a three-dimensional numerical model for the free convection and radiation of vertical arrays.
In recent years, there are many studies which give various methods for cooling LEDs. In
active method, Hsu and Huang (2016) showed high performance of LED with forced
convection cooling fluid airflow. Zheng and Xu (2017) reduced the junction temperature of
LED by 30°C by using ionic wind. Drãghici et al. (2017) compared between the use of a
passive heat sink and the use of an active cooling method based on synthetic air jets.
Natural convection is preferred for LED devices more than forced convection because it
does not require additional moving parts.
So, we want to reduce the junction temperature with the intervention on the heat sink.
Many investigators study experimentally the effect of orientation on the heat transfer; for
example, Costa and Lopes (2014) upgrade radial heat sink and Tari and Mehrtash (2013)
numerically study inclined plate fin heat sink. Huang and Shen (2016) combined pin fins and
oblique fins. He found the two optimum numbers of plate fins in each model (seven in
oblique-plate fin heat sink and eight in pin-plate fin heat sink). Yu and Lee (2010) studied
 Heat transfer
enhancement
Downloaded by University of Sunderland At 13:01 12 October 2018 (PT)

Figure 1.
The structure of the
LED package

experimentally and numerically the natural convection in a radial heat sink, composed of a
horizontal circular base and rectangular fins.
We propose a new design of circular heat sink. We want to increase the heat exchange
surface to reduce the junction temperature without increasing the size of component.

Thickness Size Materials Thermal conductivity (W/m2K)

LED-chip 4 mm 1
1 mm GaN 130

Metallization 10 m m Au-Si eutectic bonding 27
Die 375 m m Si 124
Table I.
Die-attach 50 m m Au-20Sn 57
Substrate 127 m m 1
1 cm Copper 385 Structural
381 m m DBC:AlN 180 dimensions and
TIM 50 m m 1
1 cm Thermal grease 3 thermal conductivities
Heat sink – – Al 150 at 25°C
 HFF
Downloaded by University of Sunderland At 13:01 12 October 2018 (PT)

Figure 2.
Translation from
square to circular
geometry with
respect of the same
surface
 Heat transfer
enhancement
Downloaded by University of Sunderland At 13:01 12 October 2018 (PT)

Figure 3.
The temperature
distribution of the
LED package
 HFF

Figure 4.
The vertical
temperature profile
along the center line
(z-axis)
Downloaded by University of Sunderland At 13:01 12 October 2018 (PT)

Figure 5.
The variation of
junction temperature
with the thickness
of fin

We study its various parameters compared with square geometry. We began with simple
chip LED and finish by multichip LED.

2. Geometry and governing equations

Figure 1 shows the simplified structure of LED, the structure of the IMS substrate and the
structure of heat sink (Ha and Graham, 2012).
The dimensions of the structure and the proprieties of materials are summarized in
Table I.
 Heat transfer
enhancement
Downloaded by University of Sunderland At 13:01 12 October 2018 (PT)

Figure 6.
The profile of
temperature in the
heat sink with
different fin thickness
 HFF
Downloaded by University of Sunderland At 13:01 12 October 2018 (PT)

Figure 7.
Junction temperature
function of angle
alpha between two
splits in circular
geometry (fin
thickness = 1 mm)

The heat equation is:

dT
r C ¼ r  ðl  rT Þ (1)
dt

where T is the temperature, l the thermal conductivity, C the specific heat and r the
density.
If the coefficients are constant, the equation is reduced to:

dT
 a  DT ¼ 0 (2)
dt

Here, a ¼ rlC is the thermal diffusivity,

r CL2
We choose the temperature scale T*, the length scale L and the time scale ts ¼ l .
Then we introduce the scaled non dimensional variable:
x y z l T  Tamb
^x ¼ ; ^y ¼ ; ^z ¼ ; t ¼ 2  t and U ¼
L L L L T*

By the use of the chain rule for the derivatives:

@T @U @ t l @U
¼ T*   ¼ T*  2  (3)
@t @ t @t L @t
 Heat transfer
enhancement
Downloaded by University of Sunderland At 13:01 12 October 2018 (PT)

Figure 8.
Junction temperature
according to the
number of splits with
its different width (fin
thickness = 1 mm)

Figure 9.
Junction temperature
according to the
number of splits (split
width = 0.2 mm)
 HFF
Downloaded by University of Sunderland At 13:01 12 October 2018 (PT)

Figure 10.
Profile of temperature
in the heat sink with
different split number
 Heat transfer
enhancement
Downloaded by University of Sunderland At 13:01 12 October 2018 (PT)

Figure 11.
Variation of junction
temperature
according to the
number of fins (fin
thickness = 0.5 mm)

1
r2 T ¼  T*  r2 U (4)
L2

The heat equation for U becomes:

@U
þ Bi  U ¼ 0 (5)
@n

hL
with Bi ¼ (6)
l
Bi is the Biot number and represents the ratio of the thermal resistance.
(if 1D domain, the equation is @U
@ x^ þ Bi  U ¼ 0)

3. Assumptions and boundary conditions

The translation from square to circular geometry is made with conservation of the same
thickness and the same surface as is shown in Figure 2:

a2 ¼ p  r2 (7)

where a is the side length of the square and r is the radius of the corresponding cercal. So
11.28 mm is the radius of the heat sink base, 5.64 mm is the radius of substrate and 0.56 mm
is the radius of circular chip.
We assume that the materials are homogeneous and isotropic, and their thermal
conductivities are independent of temperature. A free convection occurs at ambient
temperature 25°C.
 HFF
Downloaded by University of Sunderland At 13:01 12 October 2018 (PT)

Figure 12.
Profile of temperature
in the heat sink with
different number of
fins
 Heat transfer
enhancement
Downloaded by University of Sunderland At 13:01 12 October 2018 (PT)

Figure 13.
Junction temperature
according to number
of fins with different
length in square
geometry

The conductive cooling of the domain is represented by:

l  DT  !
n ¼ h  ðTamb  T Þ (8)

Here, h is the heat transfer coefficient that is taken in our study as:
 Uniform: h = 10 W/(m2K)

or
 Variable: i.e. variable with the geometry, the fluid, the pressure and the temperature.

The boundary conditions are:

On top of the die, there is a uniform heat flux; around heat sink, there is uniform
convection heat transfer coefficient; and other surfaces are adiabatic.
 HFF
Downloaded by University of Sunderland At 13:01 12 October 2018 (PT)

Figure 14.
Junction temperature
according to length of
fins with different
radii of heat sink base

4. Numerical procedure and validation

The commercial simulation software Comsol Multiphysics 5.0, which is based on finite
technical elements, is used as the computational platform in which the applied modules are
used for solving the physical model. The mesh used and is adequate to satisfy the accuracy
of the results contains 47,836 elements.
Figure 3 shows the temperature profile of the LED package. With the same conditions
taken by Ha and Graham (2012), puissance, 1 W; ambient temperature, 25°C; and heat
transfer coefficient, h = 10 W/(m2K), the maximum and minimum temperatures are 60.37°C
 and 53.22°C, respectively. Compared with those found by Ha and Graham (2012), which are Heat transfer
60.30°C and 53.32°C, respectively, the difference is less than 0.001 per cent. Figure 4 shows enhancement
the vertical temperature profile along the center line. We found a good agreement.

5. Results and discussion

5.1 Effect of thickness of fin
Figure 5 shows the variation of the junction temperature with the thickness of fins in square
and circular geometries.
In circular case, the increase in the thickness from 0.5 to 2 mm causes an increase in the
junction temperature from 47.8°C to 49.2°C. That is because of the decrease in the internal
surface of the cylinder, so the total heat exchange surface. In square geometry, there is no
variation in the total surface because the surface added to fin by the thickness is reduced
from the surface between fins in the base. But the temperature with thin fin is more than that
Downloaded by University of Sunderland At 13:01 12 October 2018 (PT)

with thick fin because the thermal diffusion from base to fin is made with direct contact
(collision between fast and slow particles in vibration). This contact decrease with thin fin.
With variable h, the junction temperature is more because it describes better natural
convection than that with fixed h.
With variable h, the junction temperature with 1.5 mm of thickness (structure in Figure 1)
is about 62.5°C in the old design and 50.9°C in our design, so there is a reduction by 18 per
cent.
To show the effect of the thickness on the profile of the heat sink temperature, examples
are presented in Figure 6 for the two designs.

5.2 Effect of splits putted into fin

We propose to add splits into the fin to permit the liberation of the hot air outside the fin. As
it is demonstrated in Figure 7, alpha is the angle of rotation of split in circular geometry, so
more alpha is small, more we can put splits and more the number of splits in each fin. When

Figure 15.
Temperature profile
with three chips in
the two case of design
 HFF alpha is 180°, there are 2 splits, when alpha is 90°, there are 4 splits, when alpha is 45°, there
are 8 splits and when alpha is 22.5°, there are 16 splits.
We take a thickness of fin equal to 1 mm and vary the width of the split from 1 to 0.1 mm.
The junction temperature function of the splits’ number with different width is showed in
Figure 8 for square and circular geometries. More the split width is lower than the thickness
of fin, the junction temperature decreases with the increase in split number.
We explain this as follows: Each split delate horizontal exchange surface from the fin
proportional to the split width and create vertical heat exchange surface proportional to the
fin thickness. So the split width must be lower than the fin thickness.
Downloaded by University of Sunderland At 13:01 12 October 2018 (PT)

Figure 16.
Temperature profile
with six chips in the
two case of design

Figure 17.
Temperature profile
with nine chips in the
two case of design
 Figure 9 is specified to split width of 0.2 mm. It proves the reduction in the junction Heat transfer
temperature with variable h to 57°C and 48°C, respectively, in square and circular designs. enhancement
The percentage of this reduction is about 8 per cent and 23 per cent respectively for square
and circular design by comparing with the first structure in Figure 1. Examples of the
temperature profile of heat sink with different number of splits in that width are shown in
Figure 10.
Downloaded by University of Sunderland At 13:01 12 October 2018 (PT)

Figure 18.
New distribution of 3

3 LED array
 HFF 5.3 Effect of number of fins
In the same surface of base, we reduce the thickness of fin to 0.5 mm to put more number of
fins in the heat sink. Figure 11 displays the variation of the junction temperature with the
number of fins. It is reduced to 46.5°C and 42°C, respectively, in square and circular design.
The percentage of this reduction is about 25 per cent and 32 per cent respectively for square
and circular design by comparison with the first structure. The effect of fins number on
temperature profile of the heat sink is showed in Figure 12.
Downloaded by University of Sunderland At 13:01 12 October 2018 (PT)

Figure 19.
New distribution of 6
by 6 LED array
 No doubt, the increase in fin number increases the heat exchange surface and decreases the Heat transfer
junction temperature. But, close fins can cause overlapping in boundary layer, then we must enhancement
increase the heat sink size to put more fins with a good distance between those. The problem
here is that we are limited by the size of the electronic component. For that reason, we want
to study this parameter with relation with other parameters such as the length of the fin and
the radius of the base in the next part.

5.4 Effect of size of heat sink

Figure 13 shows the variation of junction temperature function of number of fins of different
lengths. We observe that the increase in the number or the length of fin permit decreases the
temperature. We explain this by the augmentation of the heat exchange surface, which
promotes the evacuation of heat by natural convection.
For a few number of fins, the effect of length is significant, but with great number, the
Downloaded by University of Sunderland At 13:01 12 October 2018 (PT)

effect of length become negligible. For this reason, with 20 fins and 5 mm length, we found
the same temperature as with 5 fins and 18 mm length.
Without changing the same number of fins, we can also reduce the junction temperature
as it showed in Figure 14. We can choose between increasing the radius of heat sink with
reducing the length of fins or increasing the length of fins with reducing the radius of base.

5.5 Multichip light emitting diode

Figures 15, 16 and 17 show the profile of temperature in multichip LED in the two designs.
The maximal temperature in our new design is lower. It is reduced from 70.5°C to 53.1°C (24
per cent) with three chips, from 110°C to 75.1°C (31 per cent) with six chips and from 149°C
to 97.3°C (34 per cent) with nine chips. That is because of cylindrical fins made in circular
geometry, which permits us to increase the heat exchange surface with saving of the same
size.
Besides, in square substrate, there are four rectangular corners in which the heat
produced by the chip does not spread enough. For that reason, the increase in temperature
with the increase in the number of chips in square case is more fast and the percentage of
difference between the two designs increase.

5.6 New distribution of chips in circular design

From Ben Abdelmlek et al. (2017), the optimal pitch of 3
3 LED array and 2.82 mm length,
the translation from square to circular geometry permits us to put ten chips instead of nine
with respect of the same pitch (distance between two chips), as it is shown in
Figure 18.
Same is the case with in 6
6 LED array: The size of the square substrate is 72 mm
72
mm. To obtain the same surface with square geometry (equation 7) the radius of substrate is
about 40.632 mm. With keeping the same pitch (distance between chips), we can put 42 chips
in circular geometry instead of 36 chips in square geometry as it is shown in Figure 19. The
last mentioned figure executes also the profile of temperature in the two cases.
We find the maximal temperature as 62.6°C and 52.4°C in square and circular LED,
respectively. The circular geometry is better: On the one hand, we can put 6 chips more. On
the other hand, we obtain 16 per cent more of reduction of the junction temperature.
The increase of the number of chips in the same size of LED permit the amelioration of
the light generated but we must study the optic effect.
 HFF 6. Conclusion
To improve the design of heat sink, it is important to lower the junction temperature with
natural convection conditions. With a circular LED design, we can increase the heat
exchange surface without increasing the size of component.
We study the influence of various parameters in square and circular geometries.
The main results of the numerical analysis led to the following conclusions:
 The junction temperature is reduced with our new design of heat sink by 18 per cent
with single chip, by 24 per cent with three chips, by 31 per cent with six chips and
by 34 per cent with nine chips.
 The splits putted into fins permit the reduction in the junction temperature by 23
per cent with 16 splits in each fin in circular geometry.
 The number of chips putted with our new distribution in multichip LED increase
from nine to ten in 3
3 LED array and from 36 to 42 in 6
6 LED array with a
Downloaded by University of Sunderland At 13:01 12 October 2018 (PT)

reduction in the junction temperature by 29 and 16 per cent, respectively.

References
Ben Abdelmlek, K., Araoud, Z. and Charrada, K. (2017), “Optimization of the thermal distribution of
multi-chip LED package”, Applied Thermal Engineering, Vol. 126, pp. 653-660.
Ben Hamida, M.B. and Charrada, K. (2012), “Contrast the effect of the mass of mercury between the
vertical and horizontal mercury discharge lamps”, IEEE Transactions on Plasma Science,
Vol. 40 No. 8, pp. 2065-2072.
Ben Hamida, M.B. and Charrada, K. (2013), “Contrasting the effect of electric current between vertical
and horizontal High-Pressure mercury discharge lamps”, IEEE Transactions on Plasma Science,
Vol. 41 No. 7, pp. 1696-1702.
Ben Hamida, M.B. and Charrada, K. (2014), “Natural convection heat transfer in an enclosure filled with an
ethylene Glycol-Copper nanofluid under magnetic fields”, Numerical Heat Transfer, Part A:
Applications: An International Journal of Computation and Methodology, Vol. 67 No. 8, pp. 902-920.
Ben Hamida, M.B. and Charrada, K. (2015a), “Heat generation/absorption effect on natural convection
heat transfer in a square enclosure filled with an ethylene glycol – copper nanofluid under
magnetic field”, American Journal of Modern Energy, Vol. 1 No. 1, pp. 1-16.
Ben Hamida, M.B. and Charrada, K. (2015b), “Application of a three-dimensional model for a study of the
energy transfer of a high-pressure mercury horizontal lamp”, Physics of Plasmas, Vol. 5, p. 107212.
Ben Hamida, M.B. and Charrada, K. (2015c), “A three-dimensional thermal study of a mercury discharge
lamp with double envelope for different orientations”, Journal of Plasma Physics, Vol. 81 No. 2,
p. 905810202.
Ben Hamida, M.B. and Charrada, K. (2016), “Three dimensional dynamic study of a metal halide
thallium iodine discharge plasma powered by a sinusoidal and square signal”, The European
Physical Journal D, Vol. 70, p. 7.
Ben Hamida, M.B., Belghaieb, J. and Hajji, N. (2018), “Heat and mass transfer enhancement for falling
film absorption process in vertical plate absorber by adding copper nanoparticles”, Arabian
Journal for Science and Engineering, Vol. 43 No. 9, pp. 1-11.
Ben Hamida, M.B., Salah, S.H. and Charrada, K. (2015), “Total pressure and atomic ratio effect on
transport coefficients of HgTlI discharge plasma using a LTE chemical model”, The European
Physical Journal D, Vol. 69 No. 9, pp. 1-10.
Chamkha, A.J. and Khaled, A.-R.A. (1999), “Similarity solutions for hydromagnetic mixed convection
heat and mass transfer for Hiemenz flow through porous media”, International Journal of
Numerical Methods for Heat and Fluid Flow, Vol. 10 No. 1, pp. 94-115.
 Chamkha, A.J. and Rashad, A.M. (2011), “Natural convection from a vertical permeable cone in a nanofluid Heat transfer
saturated porous media for uniform heat and nanoparticles volume fraction fluxes”, International
Journal of Numerical Methods for Heat and Fluid Flow, Vol. 22 No. 8, pp. 1073-1085.
enhancement
Chamkha, A., Abbasbandy, S. and Rashad, A.M. (2015), “Non-darcy natural convection flow for non-
newtonian nanofluid over cone saturated in porous medium with uniform heat and volume
fraction fluxes”, International Journal of Numerical Methods for Heat and Fluid Flow, Vol. 25
No. 2, pp. 422-437.
Chamkha, A.J., Rahim, A. and Khaled, A. (2000), “Similarity solutions for hydromagnetic mixed
convection heat and mass transfer for Hiemenz flow through porous media”, International
Journal of Numerical Methods for Heat and Fluid Flow, Vol. 10 No. 1, pp. 94-115.
Costa, V.A.F. and Lopes, A.M.G. (2014), “Improved radial heat sink for led lamp cooling”, Applied
Thermal Engineering, Vol. 70 No. 1, pp. 131-138.
Drãghici, N.B., Svasta, P. and Codreanu, N. (2017), “Comparison of synthetic air jet vs. passive heat
Downloaded by University of Sunderland At 13:01 12 October 2018 (PT)

sinks for cooling COB LED modules”, 40th International Spring Seminar on Electronics
Technology (ISSE).
Esfandiary, M., Mehmandoust, B., Karimipour, A. and Pakravan, H.A. (2016), “Natural convection of
Al2O3 water nanofluid in an inclined enclosure with the effects of slip velocity mechanisms:
Brownian motion and thermophoresis phenomenon”, International Journal of Thermal Sciences,
Vol. 105, pp. 137-158.
Estelle, P., Mahian, O., Mare, T. and Öztop, H.F. (2017), “Natural convection of CNT water-based
nanofluids in a differentially heated square cavity”, Journal of Thermal Analysis and
Calorimetry, Vol. 128 No. 3, pp. 1765-1770.
Goodarzi, M., Safaei, M.R., Karimipour, A., Hooman, K., Dahari, M., Kazi, S.N. and Sadeghinezhad, E.
(2014a), “Numerical study of entropy generation due to coupled laminar and turbulent mixed
convection and thermal radiation in an enclosure filled with a semitransparent medium”, The
Scientific World Journal, Vol. 2014, Article ID 761745, p. 8.
Goodarzi, M., Safaei, M.R., Oztop, H.F., Karimipour, A., Sadeghinezhad, E., Dahari, M., Kazi, S.N. and
Jomhari, N. (2014b), “Comparison of the finite volume and lattice Boltzmann methods for solving
natural convection heat transfer problems inside cavities and enclosures”, Abstract and Applied
Analysis, Vol. 2014, Article ID 762184, p. 15.
Ha, M. and Graham, S. (2012), “Development of a thermal resistance model for chip-on-board packaging
of high power LED arrays”, Microelectronics Reliability, Vol. 52 No. 5, pp. 836-844.
Hsu, C.-N. and Huang, C.-C. (2016), “Cooling of multichip light emitting diode with ultra-high power–an
application of bypass cooling from an air-conditioning system”, International Journal of Green
Energy, Vol. 13 No. 10, pp. 1026-1034.
Huang, Y. and Shen, S. (2016), “Improved thermal design of fin heat sink for high-power LED lamp cooling”,
IEEE 17th International Conference on Electronic Packaging Technology (ICEPT), 1069-1074.
Karimipour, A. (2015), “New correlation for Nusselt number of nanofluid with Ag/Al2O3/Cu
nanoparticles in a microchannel considering slip velocity and temperature jump by using lattice
Boltzmann method”, International Journal of Thermal Sciences, Vol. 91, pp. 146-156.
Karimipour, A., D’Orazio, A. and Shadloo, M.S. (2016), “The effects of different nano particles of Al2O3 and
Ag on the MHD nano fluid flow and heat transfer in a microchannel including slip velocity and
temperature jump”, Physica E: Low-Dimensional Systems and Nanostructures, Vol. 86, pp. 146-153.
Karimipour, A., Nezhad, A.H., D’Orazio, A. and Shirani, E. (2013), “The effect of inclination angle and
prandtl number on the mixed convection in the inclined lid driven cavity”, Journal of Theoretical
and Applied Mechanics, Vol. 51 No. 2, pp. 447-462.
Karimipour, A., Esfe, M.H., Safaei, M.R., Toghraie Semiromi, D. and Kazi, S.N. (2014), “Mixed convection of
copper–water nanofluid in a shallow inclined lid driven cavity using the lattice Boltzmann method”,
Physica A: Statistical Mechanics and Its Applications, Vol. 402, pp. 150-168. Issue C.
 HFF Karimipour, A., Hossein Nezhad, A., D’Orazio, A., Hemmat Esfe, M., Safaei, M.R. and Shirani, E. (2015),
“Simulation of copper–water nanofluid in a microchannel in slip flow regime using lattice
Boltzmann method”, European Journal of Mechanics – B/Fluids, Vol. 49, Part A, pp. 89-99.
Leung, C.W. and Probert, S.D. (1990), “Natural convection and radiation from vertically-based arrays of
vertical, rectangular fins: a numerical model”, Appl. Energy, Vol. 35 No. 4, pp. 253-266.
Prathap Kumar, J., Umavathi, J.C., Chamkha, A.J. and Pop, I. (2010), “Fully-developed free-convective
flow of micropolar and viscous fluids in a vertical channel”, Applied Mathematical Modelling,
Vol. 34 No. 5, pp. 1175-1186.
Safaei, M.R., Mahian, O., Garoosi, F., Hooman, K., Karimipour, A., Kazi, S.N. and Gharehkhani, S. (2014),
“Investigation of micro- and nanosized particle erosion in a 90° pipe bend using a two-phase
discrete phase model”, The Scientific World Journal, Vol. 2014, Article ID 740578, p. 12.
Shamshirband, S., Malvandi, A., Karimipour, A., Goodarzi, M., Afrand, M., Petkovic, D., Dahari, M. and
Mahmoodian, N. (2015), “Performance investigation of micro- and nano-sized particle erosion in
a 90° elbow using an ANFIS model”, Powder Technology, Vol. 284, pp. 336-343.
Downloaded by University of Sunderland At 13:01 12 October 2018 (PT)

Starner, K.E. (1963), “An experimental investigation of free convection heat transfers from rectangular
fin arrays”, Journal of Heat Transfer, Vol. 85 No. 3, pp. 273-277.
Sudarsan Reddy, P. and Chamkha, A. (2018), “Heat and mass transfer characteristics of MHD three-
dimensional flow over a stretching sheet filled with water-based alumina nanofluid”,
International Journal of Numerical Methods for Heat and Fluid Flow, Vol. 28 No. 3, pp. 532-546.
Tari, I. and Mehrtash, M. (2013), “Natural convection heat transfer from inclined plate-fin heat”,
International Journal of Heat and Mass Transfer, Vol. 56 Nos 1/2, pp. 574-593.
Umavathi, J.C., Kumar, J.P., Chamkha, A.J. and Pop, I. (2005), “Mixed convection in a vertical porous
channel”, Transport in Porous Media, Vol. 61 No. 3, pp. 315-335.
Yu, S.-H. and Lee, K.-S. (2010), “Natural convection around a radial heat sink”, International Journal of
Heat and Mass Transfer, Vol. 53 Nos 13/14, pp. 2935-2938.
Zheng, H. and Xu, C.L. (2017), A Novel Cooling Method for LED Filament Bulb Using Ionic Wind, IEEE,
Piscataway, NJ, 998-1003.
Zhua, J.X. and Sun, L.X. (2016), “Mathematical model and computation of heat distribution for LED
heat sink”, The European Physical Journal Plus, Vol. 131, p. 179.

Website
Available at: www.electronics-cooling.com/2015/12/calculation-corner-estimating-parallel-plate-fin-
heat-sink-thermal-resistance/

Corresponding author
Sana Ben Salah can be contacted at: sana.bensaleh@yahoo.com

For instructions on how to order reprints of this article, please visit our website:
www.emeraldgrouppublishing.com/licensing/reprints.htm
Or contact us for further details: permissions@emeraldinsight.com

View publication stats