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Hayase 2004 Electrochem. Solid-State Lett. 7 A231
Hayase 2004 Electrochem. Solid-State Lett. 7 A231
Letters
A fabrication technique of miniature fuel cell electrodes was developed from Si wafers. The fuel channels, porous layer, and
catalyst layer were formed in the Si wafer. The fuel channels were fabricated by photolithographic patterning and subsequent wet
etching on the Si. The porous layer was formed by anodization of Si from the polymer electrolyte membrane side through the
bottom of the fuel channels. Catalyst metals were deposited inside the porous layer by wet plating. The two electrodes were
hot-pressed with a Nafion 112 sheet. Open-circuit voltage of 840 mV and maximum power density of 1.5 mW/cm2 were observed
by hydrogen feed.
© 2004 The Electrochemical Society. 关DOI: 10.1149/1.1756859兴 All rights reserved.
Manuscript submitted December 2, 2003; revised manuscript received January 12, 2004. Available electronically May 25, 2004.
The increasing interest for portable electronic systems drives the ness of the Si wafer is 100 m and the total thickness of the cell is
research toward integrated regenerating power sources with small less than 300 m. In this paper, we describe the fabrication proce-
dimensions and miniaturized fuel cells are attractive. The microfab- dure of this fuel cell and preliminary experimental results of power
rication technology of Si is an important tool to reduce the fuel cell generation.
structure to micrometer sizes and have been employed by several
research groups.1-11 Those miniaturized fuel cells using various de-
grees of microfabrication techniques have been reported. Lee et al.1 Experimental
created flowfields on Si substrate and formed hydrogen feed fuel cell
array on a Si wafer. Kelley et al.4 created catalyst layer supporter on Fuel channels.—Si electrodes were prepared using usual micro-
a Si chip and demonstrated that the miniaturized direct methanol fabrication techniques. The first step was to spin-coat photoresist on
fuel cell 共DMFC兲 has almost same performance as state-of-the-art 具100典 oriented 100 m thick double-side mirror polished Si wafer
larger fuel cells. However, those miniaturized fuel cells uses con- which has 500 nm thick thermal oxide films on both sides. For the
ventional catalyst layers, in which Pt/Ru on activated carbon is substrate, n-type Si was used because of the slow wet etching rate of
splayed on the gold sputter deposited silicon electrodes or conven- p-type Si. Because the Si substrate is expected to work as a current
tional membrane electrode assembly 共MEA兲 is used, and treating collector, the lowest resistivity Si wafer among commercially avail-
powders such as activated carbon is not suitable for silicon batch able products 共supplied by Friend Science Inc., Japan兲 was chosen
fabrication process. To adapt the construction process to more Si and its resistivity was 0.001 ⍀ cm.
processing steps, various approaches have been tried. In those stud- Next, using photolithographic patterning and subsequent wet
ies, catalyst metals were deposited by physical vapor deposition etching, the thermal oxide film on the Si wafer was patterned with
共PVD兲 on porous layers formed by photolithographic patterning or 150 m pitch stripes. By etching the exposed silicon in 15% tetram-
anodization of Si.5-8 Generally, it is difficult to deposit materials ethylamonium hydride 共TMAH兲 solution, fuel channels of 80-90
inside a porous layer by PVD and the catalyst deposits only on the m depth were formed. Then the thermal oxide films of both sides
were etched in a dilute HF solution.
surface of the porous layer and the performance of the catalyst will
be poor. Therefore, a different approach to forming a catalyst layer Porous Si layer.—Si becomes porous by anodization in a con-
should be developed. Recently, D’Ariggo et al.9 proposed a novel centrated HF solution and this technique was used for the formation
Si-based electrode fabrication technique, although the power genera- of the porous layer on the electrodes. The morphology of porous Si
tion is not reported yet. In this technique, the fuel channels were depends largely on the current density of anodization and the doping
formed inside the Si substrate by depositing an epitaxial Si layer ratio of the Si wafer. To find proper conditions, the anodization of
after wet etching of a Si substrate, then the deposited epitaxial Si the highly doped Si wafer was performed with several current den-
layer was anodized and the porous Si layer was obtained. Pt and Ru sities. The composition of HF solution was HF (46%):ethanol
were electrodeposited into the porous layer and the catalyst layer ⫽ 1:1 共volume兲. A porous Si layer was obtained stably around 100
was formed. Generally, resistivity of porous Si is high and it has mA/cm2 and 100 mA/cm2 was chosen for the anodization process.
been supposed to be difficult to use a porous Si layer as a catalyst After the fuel channel formation, a Cu layer about 100 nm thick
support layer. However, porous Si has a large surface area up to was deposited by sputtering for good conductivity and the contact
1700 m2/cm3 which is comparable with that of activated carbon12 pins were used for the current supply to the Si wafer from a poten-
and porous Si is attractive if it works as a catalyst support layer, tiostat. The Cu layer was removed after catalyst deposition by im-
because fabrication of porous Si is easy and suitable for the batch Si mersing the chip in 40 wt% FeCl2 solution at 313 K for 3-5 min.
process. Our approach is close to the one by D’Arrigo and we pro- The anodization was performed from the PEM side of the Si wafer
pose a more simple structure of the electrode and a simple fabrica- until the porous layer reached the bottom of the fuel channels. Al-
tion method. though potential variation was observed during anodization using Pt
Figure 1 shows the structure of our miniaturized fuel cell. Fuel wire as a reference electrode, we could find no sign when the porous
channels, fuel diffusion layer, and the catalyst support layer are layer reached the bottom of the fuel channels. Excess anodization
formed on the Si wafer without addition of other substances. A damages the porous layer especially around the bottom of the fuel
porous Si layer is formed from the polymer electrolyte membrane channels and strict time control of the anodization was required. The
共PEM兲 side through the bottom of the fuel channels and a simple depth of the trench varied up to a few micrometers even though
cell structure is realized. Highly doped low resistivity Si is used and close attention was paid in the etching process. The growth rate of
the Si wafer itself is expected to work as a current collector. Thick- the porous layer was about 45 nm/s and it varied by a small differ-
ence of the HF concentration or other conditions. Therefore, the
time of anodization was determined empirically by observing the
* Electrochemical Society Active Member. results with the same lot of trench-formed chips and the typical time
z
E-mail: hayase.masanori@pi.titech.ac.jp for the anodization was 5-6 min.
A232 Electrochemical and Solid-State Letters, 7 共8兲 A231-A234 共2004兲
Figure 1. Schematic view of the miniature fuel cell design. PEM sheet is
hot-pressed with monolithically fabricated Si electrodes. Catalyst metals are
supported by porous Si formed by anodization.
Figure 5. Aluminum casing for the miniature thin fuel cell testing. Gener-
ated current is collected by this casing from the silicon electrode by direct
contact. The cells are put between the two casings as shown in right figure.
Fuel is supplied to the fuel channels from the right hole and is discharged Figure 7. Current-voltage characteristics of the miniature fuel cell with 1 M
from the left hole on the stage. methanol solution feed.
A234 Electrochemical and Solid-State Letters, 7 共8兲 A231-A234 共2004兲
Conclusion References
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