PD-96-957 RevD

IRAMX16UP60B
Series
Integrated Power Hybrid IC for
Appliance Motor Drive Applications.
16A, 600V
Description with Internal Shunt Resistor
International Rectifier's IRAMX16UP60B is a 16A, 600V Integrated Power Hybrid IC with Internal Shunt
Resistor for Appliance Motor Drives applications such as air conditioning systems and compressor drivers as
well as for light industrial application. IR's technology offers an extremely compact, high performance AC
motor-driver in a single isolated package to simplify design.
This advanced HIC is a combination of IR's low VCE(on) Punch-Through IGBT technology and the industry
benchmark 3 phase high voltage, high speed driver in a fully isolated thermally enhanced package.
A built-in temperature monitor and over-current protection, along with the short-circuit rated IGBTs and
integrated under-voltage lockout function, deliver high level of protection and fail-safe operation. Using a
Single in line package (SiP2) with full transfer mold structure minimizes PCB space and resolve isolation
problems to heatsink.

Features
• Internal Shunt Resistor
• Integrated Gate Drivers and Bootstrap Diodes
• Temperature Monitor
• Low VCE(on) Non Punch Through IGBT Technology
• Undervoltage lockout for all channels
• Matched propagation delay for all channels
• Schmitt-triggered input logic
• Cross-conduction prevention logic
• Lower di/dt gate driver for better noise immunity
• Motor Power range 0.75~2.2kW / 85~253 Vac
• Isolation 2000VRMS min
• UL certification pending (UL number: E78996)
Absolute Maximum Ratings
Parameter Description Value Units
VCES / VRRM IGBT/Diode Blocking Voltage 600
V
V+ Positive Bus Input Voltage 450
IO @ TC=25°C RMS Phase Current (Note 1) 16
IO @ TC=100°C RMS Phase Current (Note 1) 8 A
IO Pulsed RMS Phase Current (Note 2) 30
FPWM PWM Carrier Frequency 20 kHz
PD Power dissipation per IGBT @ TC =25°C 31 W
VISO Isolation Voltage (1min) 2000 VRMS
TJ (IGBT & Diodes) Operating Junction temperature Range -40 to +150
°C
TJ (Driver IC) Operating Junction temperature Range -40 to +150
T Mounting torque Range (M3 screw) 0.5 to 1.0 Nm
Note 1: Sinusoidal Modulation at V+=400V, TJ=150°C, FPWM=16kHz, Modulation Depth=0.8, PF=0.6, See Figure 3.
Note 2: tP<100ms; TC=25°C; FPWM=16kHz. Limited by IBUS-ITRIP, see Table "Inverter Section Electrical Characteristics"

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 IRAMX16UP60B
I nternal Electrical Schematic - I RAMX16UP60B
V+ (10)

V- (12)

VB1 (7)
U, VS1 (8)

VB2 (4)
V, VS2 (5)
VB3 (1)
W, VS3 (2)

22 21 20 19 18 17
23 VS1 VB2 HO2 VS2 VB3 HO3 VS3 LO1 16
24 HO1
25 VB1
LO2 15
1 VCC Driver IC
HIN1 (15) 2 HIN1
HIN2 (16) 3 HIN2 LO3 14
HIN3 (17) 4 HIN3
LIN2 LIN3 F ITRIP EN RCIN VSS COM
LIN1 (18) 5 LIN1 6 7 8 9 10 11 12 13

LIN2 (19)
LIN3 (20)
FLT-EN(21)
ITRIP (22)
THERMISTOR
VTH (13)
VCC (14)

VSS (23)

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 IRAMX16UP60B
Absolute Maximum Ratings ( Continued)
All voltages are absolute referenced to COM/ITRIP.

Symbol Parameter Min Max Units Conditions

Bootstrap Diode Peak Forward tP= 10ms,
IBDF --- 4.5 A
Current TJ = 150°C, TC=100°C
Bootstrap Resistor Peak Power tP=100µs, TC =100°C
PBR Peak --- 25.0 W
(Single Pulse) ESR / ERJ series
High side floating supply offset
VS1,2,3 VB1,2,3 - 25 VB1,2,3 +0.3 V
voltage

VB1,2,3 High side floating supply voltage -0.3 600 V

Low Side and logic fixed supply

VCC -0.3 20 V
voltage
Lower of
VIN, VEN, VITRIP Input voltage LIN, HIN, EN, ITrip -0.3 (VSS+15V) or V
VCC+0.3V

I nverter Section Electrical Characteristics @TJ= 25° C

Symbol Parameter Min Typ Max Units Conditions
Collector-to-Emitter Breakdown
V(BR)CES 600 --- --- V VIN=5V, IC=250µA
Voltage
Temperature Coeff. Of VIN=5V, IC=1.0mA
∆V(BR)CES / ∆T --- 0.3 --- V/°C
Breakdown Voltage (25°C - 150°C)

Collector-to-Emitter Saturation --- 1.55 1.85 IC=8A, VCC=15V

VCE(ON) V
Voltage --- 1.80 2.10 IC=8A, VCC=15V, TJ=150°C

Zero Gate Voltage Collector --- 5 80 VIN=5V, V+=600V

ICES µA
Current --- 165 --- VIN=5V, V+=600V, TJ=150°C
--- 2.0 2.4 IC=8A
VFM Diode Forward Voltage Drop V
--- 1.4 1.9 IC=8A, TJ=150°C

Bootstrap Diode Forward Voltage -- -- 1.25 IF=1A

VBDFM V
Drop --- --- 1.10 IF=1A, TJ=125°C
RBR Bootstrap Resistor Value --- 22 --- Ω TJ=25°C

∆RBR/RBR Bootstrap Resistor Tolerance --- --- ±5 % TJ=25°C

Current Protection Threshold TJ=-40°C to 125°C
IBUS_TRIP 21 --- 28 A
(positive going) See Fig. 2

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 IRAMX16UP60B
I nverter Section Sw itching Characteristics @ TJ= 25° C
Symbol Parameter Min Typ Max Units Conditions
EON Turn-On Switching Loss --- 315 435 IC=8A, V+=400V
EOFF Turn-Off Switching Loss --- 150 180 VCC=15V, L=2mH
µJ Energy losses include "tail" and
ETOT Total Switching Loss --- 465 615
diode reverse recovery
EREC Diode Reverse Recovery energy --- 30 60
tRR Diode Reverse Recovery time --- 70 90 ns See CT1

EON Turn-on Switching Loss --- 500 700 IC=8A, V+=400V

EOFF Turn-off Switching Loss --- 270 335 VCC=15V, L=2mH, TJ=150°C
µJ Energy losses include "tail" and
ETOT Total Switching Loss --- 770 1035
diode reverse recovery
EREC Diode Reverse Recovery energy --- 60 100
tRR Diode Reverse Recovery time --- 120 150 ns See CT1
+
QG Turn-On IGBT Gate Charge --- 56 84 nC IC=15A, V =400V, VGE=15V
TJ=150°C, IC=8A, VP=600V
RBSOA Reverse Bias Safe Operating Area FULL SQUARE V+= 450V
VCC=+15V to 0V See CT3

TJ=150°C, VP=600V,
SCSOA Short Circuit Safe Operating Area 10 --- --- µs V+= 360V,
VCC=+15V to 0V See CT2

TJ=150°C, VP=600V, tSC<10µs

ICSC Short Circuit Collector Current --- 140 --- A V+= 360V, VGE=15V
VCC=+15V to 0V See CT2

Recommended Operating Conditions Driver Function

The Input/Output logic timing diagram is shown in Figure 1. For proper operation the device should be used within the
recommende conditions. All voltages are absolute referenced to COM/ITRIP. The VS offset is tested with all supplies biased
at 15V differential (Note 3)

Symbol Definition Min Max Units

VB1,2,3 High side floating supply voltage VS+12 VS+20
V
VS1,2,3 High side floating supply offset voltage Note 4 450
VCC Low side and logic fixed supply voltage 12 20
V
VITRIP ITRIP input voltage VSS VSS+5
VIN Logic input voltage LIN, HIN VSS VSS+4 V
VEN Logic input voltage EN VSS VSS+5 V
Note 3: For more details, see IR21363 data sheet
Note 4: Logic operational for Vs from COM-5V to COM+600V. Logic state held for Vs from COM-5V to COM-VBS.
(please refer to DT97-3 for more details)
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 IRAMX16UP60B
Static Electrical Characteristics Driver Function
VBIAS (VCC, VBS1,2,3)=15V, unless otherwise specified. The VIN and IIN parameters are referenced to COM/ITRIP and are
applicable to all six channels. (Note 3)
Symbol Definition Min Typ Max Units
VINH , VENH Logic "0" input voltage 3.0 --- --- V
VINL , VENL Logic "1" input voltage --- --- 0.8 V
VCCUV+, VBSUV+ VCC and VBS supply undervoltage Positive going threshold 10.6 11.1 11.6 V
VCCUV-, VBSUV- VCC and VBS supply undervoltage Negative going threshold 10.4 10.9 11.4 V
VCCUVH, VBSUVH VCC and VBS supply undervoltage lock-out hysteresis --- 0.2 --- V
VIN,Clamp Input Clamp Voltage (HIN, LIN, ITRIP) IIN=10µA 4.9 5.2 5.5 V
IQBS Quiescent VBS supply current VIN=0V --- --- 165 µA
IQCC Quiescent VCC supply current VIN=0V --- --- 3.35 mA
ILK Offset Supply Leakage Current --- --- 60 µA
IIN+, IEN+ Input bias current VIN=5V --- 200 300 µA
IIN-, IEN- Input bias current VIN=0V --- 100 220 µA
ITRIP+ ITRIP bias current VITRIP=5V --- 30 100 µA
ITRIP- ITRIP bias current VITRIP=0V --- 0 1 µA
V(ITRIP) ITRIP threshold Voltage 440 490 540 mV
V(ITRIP, HYS) ITRIP Input Hysteresis --- 70 --- mV
RON,FLT Fault Output ON Resistance --- 50 100 ohm

Dynamic Electrical Characteristics

Driver only timing unless otherwise specified.
Symbol Parameter Min Typ Max Units Conditions
Input to Output propagation turn-
TON --- 590 --- ns
on delay time (see fig.11) VCC=VBS= 15V, IC=8A,
Input to Output propagation turn- V+=400V
TOFF --- 660 --- ns
off delay time (see fig. 11)
TFLIN Input Filter time (HIN, LIN) 100 200 --- ns VIN=0 & VIN=5V
TBLT-Trip ITRIP Blancking Time 100 150 ns VIN=0 & VIN=5V
DT Dead Time (VBS=VDD=15V) 220 290 360 ns VBS=VCC=15V
Matching Propagation Delay Time VCC= VBS= 15V, external dead
MT --- 40 75 ns
(On & Off) time> 400ns
ITrip to six switch to turn-off VCC=VBS= 15V, IC=8A,
TITrip --- --- 1.75 µs
propagation delay (see fig. 2) V+=400V
Post ITrip to six switch to turn-off --- 7.7 --- TC = 25°C
TFLT-CLR ms
clear time (see fig. 2) --- 6.7 --- TC = 100°C

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 IRAMX16UP60B
Thermal and Mechanical Characteristics
Symbol Parameter Min Typ Max Units Conditions
Rth(J-C) Thermal resistance, per IGBT --- 3.5 4.0
Flat, greased surface. Heatsink
Rth(J-C) Thermal resistance, per Diode --- 5.0 5.5 °C/W compound thermal conductivity
1W/mK
Rth(C-S) Thermal resistance, C-S --- 0.1 ---
CD Creepage Distance 3.2 --- --- mm See outline Drawings

I nternal Current Sensing Resistor - Shunt Characteristics

Symbol Parameter Min Typ Max Units Conditions
RShunt Resistance 17.9 18.1 18.3 mΩ TC = 25°C
TCoeff Temperature Coefficient 0 --- 200 ppm/°C
PShunt Power Dissipation --- --- 3.0 W -40°C< TC <100°C
TRange Temperature Range -40 --- 125 °C

I nternal NTC - Thermistor Characteristics

Parameter Definition Min Typ Max Units Conditions
R25 Resistance 97 100 103 kΩ TC = 25°C
R125 Resistance 2.25 2.52 2.80 kΩ TC = 125°C

B B-constant (25-50°C) 4165 4250 4335 k R2 = R1e [B(1/T2 - 1/T1)]

Temperature Range -40 125 °C
Typ. Dissipation constant 1 mW/°C TC = 25°C

I nput- Output Logic Level Table

V+

Ho FLT- EN ITRIP HIN1,2,3 LIN1,2,3 U,V,W

Hin1,2,3
1 0 0 1 V+
(15,16,17) U,V,W
IC 1 0 1 0 0
Driver (8,5,2)
1 0 1 1 Off
Lin1,2,3
1 1 X X Off
Lo
(18,19,20) 0 X X X Off

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 IRAMX16UP60B

HIN1,2,3

LIN1,2,3

1 2 3 4 5 6

IBUS_trip
IBUS

6µs 1µs

50%

U,V,W

tfltclr

Sequence of events:
1-2) Current begins to rise
2) Current reaches IBUS_Trip level
2-3) Current is higher than IBUS_Trip for at least 6µs. This value is the worst-case condition with very low
over-current. In case of high current (short circuit), the actual delay will be smaller.
3-4) Delay between driver identification of over-current condition and disabling of all outputs
4) Current starts decreasing, eventually reaching 0
5) Current goes below IBUS_trip, the driver starts its auto-reset sequence
6) Driver is automatically reset and normal operation can resume (over-current condition must be removed
by the time the drivers automatically resets itself)

Figure 2. ITrip Timing Waveform

Note 5: The shaded area indicates that both high-side and low-side switches are off and therefore the half-bridge output
voltage would be determined by the direction of current flow in the load.

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 IRAMX16UP60B
Module Pin-Out Description

Pin Name Description

1 VB3 High Side Floating Supply Voltage 3
2 W,VS3 Output 3 - High Side Floating Supply Offset Voltage
3 NA none
4 VB2 High Side Floating Supply voltage 2
5 V,VS2 Output 2 - High Side Floating Supply Offset Voltage
6 NA none
7 VB1 High Side Floating Supply voltage 1
8 U, VS1 Output 1 - High Side Floating Supply Offset Voltage
9 NA none
+
10 V Positive Bus Input Voltage
11 NA none
-
12 V Negative Bus Input Voltage
13 VTH Temperature Feedback
14 VCC +15V Main Supply
15 HIN1 Logic Input High Side Gate Driver - Phase 1
16 HIN2 Logic Input High Side Gate Driver - Phase 2
17 HIN3 Logic Input High Side Gate Driver - Phase 3
18 LIN1 Logic Input Low Side Gate Driver - Phase 1
19 LIN2 Logic Input Low Side Gate Driver - Phase 2
20 LIN3 Logic Input Low Side Gate Driver - Phase 3
21 FAULT Fault Indicator
22 ITRIP Current Sense and Itrip Pin
23 VSS Negative Main Supply

23

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 IRAMX16UP60B
Typical Application Connection I RAMX16UP60B

1
BOOT-STRAP VB3
2.2µF
CAPACITORS VS3

W
VB2

VS2

IRAMX16UP60B
3-Phase AC
MOTOR
V
VB1

VS1
U
+
V
DC BUS
CAPACITORS
V-

035-Z2L03
VTH
+5V
Vcc (15 V)
+15V
HIN1
+5V 0.1mF 10mF
HIN2
12kohm HIN3
LIN1
Temp
LIN2
Monitor
LIN3
CONTROLLER
Fault/Enable
ITRIP
VSS
23

+5V
Enable
1K

1. Electrolytic bus capacitors should be mounted as close to the module bus terminals as possible to reduce ringing and
EMI problems. Additional high frequency ceramic capacitor mounted close to the module pins will further improve perfor-
mance.
2. In order to provide good decoupling between VCC-VSS and VB1,2,3-VS1,2,3 terminals, the capacitors shown connected be-
tween these terminals should be located very close to the module pins. Additional high frequency capacitors, typically
0.1µF, are strongly recommended.
3. Value of the boot-strap capacitors depends upon the switching frequency. Their selection should be made based on
IR design tip DN 98-2a, application note AN-1044 or Figure 9. Bootstrap capacitor value must be selected to limit the
power dissipation of the internal resistor in series with the VCC. (see maximum ratings Table on page 3).
4. Current sense signal can be obtained from pin 20 and pin 23. Care should be taken to avoid having inverter current
flowing through pin 22 to mantain required current measurement accuracy
5. After approx. 8ms the FAULT is reset. (see Dynamic Characteristics Table on page 5).
6. PWM generator must be disabled within Fault duration to garantee shutdown of the system, overcurrent condition
must be cleared before resuming operation.
7. Fault/Enable pin must be pulled-up to +5V.

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 IRAMX16UP60B
Maximum Output Phase RMS Current - A

14

12

10

6
TC = 100°C
4 TC = 110°C
TC = 120°C
2 TJ = 150°C
Sinusoidal Modulation
0
0 2 4 6 8 10 12 14 16 18 20
PWM Frequency - kHz

Figure 3. Maximum Sinusoidal Phase Current vs. PWM Switching Frequency

V+=400V , TJ=150°C, Modulation Depth=0.8, PF=0.6
Maximum Output Phase RMS Current - A

10
TJ = 150°C
Sinusoidal Modulation
8

FPWM = 20kHz
4
FPWM = 16kHz
FPWM = 12kHz
2

0
1 10 100
Modulation Frequency - Hz

Figure 4. Maximum Sinusoidal Phase Current vs. Modulation Frequency

V+=400V, TJ=150°C, TC=100°C, Modulation Depth=0.8, PF=0.6

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 IRAMX16UP60B
150

125 TJ = 150°C
Total Pow er Losses - W

Sinusoidal Modulation
100

75

FPWM = 12 kHz
50
FPWM = 16 kHz
FPWM = 20 kHz
25

0
0 1 2 3 4 5 6 7 8 9 10 11 12
Out put Phase Current - ARMS

Figure 5. Total Power Losses vs. PWM Switching Frequency, Sinusoidal modulation
V+=400V , TJ=150°C, Modulation Depth=0.8, PF=0.6

150

125 TJ = 150°C
Total Pow er Losses - W

Sinusoidal Modulation
100

75

FPWM = 12 kHz
50
FPWM = 16 kHz
FPWM = 20 kHz
25

0
0 1 2 3 4 5 6 7 8 9 10 11 12
Output Phase Current - ARMS

Figure 6. Total Power Losses vs. Output Phase Current, Sinusoidal modulation
VBUS=400V , TJ=150°C, Modulation Depth=0.8, PF=0.6

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 IRAMX16UP60B

160
Maximum Allow able Case Temperature -° C

140

120

100

80
FPWM = 12 kHz
60
FPWM = 16 kHz
40 FPWM = 20 kHz
TJ = 150°C
20 Sinusoidal Modulation

0
0 2 4 6 8 10 12 14
Output Phase Current - ARMS

Figure 7. Maximum Allowable Case temperature vs. Output RMS Current per Phase

160

TJ avg. = 1.2447 x TTherm+ 30.77

I GBT Junction Temperature - ° C

150

140

130

120

110

100
65 70 75 80 85 90 95 100
I nternal Thermistor Temperature Equivalent Read Out - ° C

Figure 8. Estimated Maximum IGBT Junction Temperature vs. Thermistor Temperature

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 IRAMX16UP60B

5.0
Thermistor Pin Read-Out Voltage - V

4.5 +5V

4.0 REXT
TTHERM RTHERM TTHERM RTHERM TTHERM RTHERM
°C Ω °C Ω °C Ω
VTherm
3.5 -40 4397119 25 100000 90 7481 R Therm
-35 3088599 30 79222 95 6337
3.0 -30 2197225 35 63167 100 5384
-25 1581881 40 50677 105 4594
Min
2.5 -20 1151037 45 40904 110 3934
-15 846579 50 33195 115 3380 Avg.
2.0
-10 628988 55 27091 120 2916 Max
-5 471632 60 22224 125 2522
0 357012 65 18322 130 2190
1.5 5 272500 70 15184 135 1907
10 209710 75 12635 140 1665
1.0 15 162651 80 10566 145 1459
20 127080 85 8873 150 1282

0.5
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130
Thermistor Temperature - ° C

Figure 9. Thermistor Readout vs. Temperature (12kohm pull-up resistor, 5V) and
Nominal Thermistor Resistance values vs. Temperature Table.

16.0
Recommended Bootstrap Capacitor - µF

15.0 15µF

14.0 DBS CBS

V+
RBS
13.0 vB RG1
+15V VCC HO
12.0
HIN HIN
11.0 VS
RG2
U,V,W

10µF LIN LIN

10.0 LO
VSS COM
9.0
VSS GND
8.0
6.8µF
7.0
6.0
4.7µF
5.0
4.0 3.3µF
3.0
2.0
0 5 10 15 20
PWM Frequency - kHz

Figure 10. Recommended Bootstrap Capacitor Value vs. Switching Frequency

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 IRAMX16UP60B
Figure 11. Switching Parameter Definitions

VCE IC IC VCE

90% IC
50%
90% IC
HIN /LIN 50% 50% HIN /LIN
VCE HIN /LIN
HIN /LIN
50%
VCE

10% IC
10% IC

tr tf
TON TOFF

Figure 11a. Input to Output Propagation Figure 11b. Input to Output Propagation
turn-on Delay Time turn-off Delay Time

IF
VCE

HIN/LIN

Irr

trr

Figure 11c. Diode Reverse Recovery

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 IRAMX16UP60B
V+

5V

Ho

IN
Hin1,2,3
IC
Driver U,V,W

Lo IO
Lin1,2,3

Figure CT1. Switching Loss Circuit

V+

Hin1,2,3 Ho
IN
1k 10k
VCC IC
Lin1,2,3 Driver U,V,W

5VZD Lo IO
IN
Io

Figure CT2. S.C.SOA Circuit

V+

Hin1,2,3 Ho
IN
1k 10k
VCC IC
Driver U,V,W

5VZD Lin1,2,3 Lo IO
IN
Io

Figure CT3. R.B.SOA Circuit

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 IRAMX16UP60B
Package Outline I RAMX16UP60B
note 2
62
A
3 56
note 3 B
Ø3.4 TYP.

035-Z2L03
25.3

25.8
IRAMX16UP60B

11.4
1 23
note 1

9
2 TYP. 0.80
Ø0.20 M A B TYP.
0.55
0.70
22 PITCHES = 44 TYP.
0.45

11.4 REF
INT.
2.5

INT.
4.7
46.2

9.0 REF.
C
5.5

R0.6 TYP.

50 CONVEX ONLY
5.0 3.2
2 TYP.

0.10 C
MIN.

Notes:
Dimensions in mm
1- Marking for pin 1 identification
2- Product Part Number
3- Lot and Date code marking
4- Convex only 0.15mm typical
5- Tollerances ±0.5mm, unless otherwise stated

For mounting instruction see AN-1049

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 IRAMX16UP60B
Package Outline I RAMX16UP60B-2
note 2
62
A
3 56
note 3 B
Ø3.4 TYP.

11.4 REF.
035-Z2L03
25.3

25.8
IRAMX16UP60B

11.4

13.9
1 23
note 1

TYP.
5
2 TYP. 0.80
Ø0.20 M A B TYP.

0.70
0.45
0.55 4.7
22 PITCHES = 44

11.4 REF
2.5
46.2

5 REF.
C
5.5

R0.6 TYP. 10°

R EF. CONVEX ONLY
50
3.2
0.10 C
2 TYP.

MIN.

Notes:
Dimensions in mm
1- Marking for pin 1 identification
2- Product Part Number
3- Lot and Date code marking
4- Convex only 0.15mm typical
5- Tollerances ±0.5mm, unless otherwise stated

For mounting instruction see AN-1049

Data and Specifications are subject to change without notice

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