RAYMING PCB & ASSEMBLY

PCB Classification – Pattern Class

and Drill Class

Printed circuit boards (PCBs) are essential components in nearly all modern

electronics. They provide the physical structure and electrical connections for

integrated circuits and other electronic components. With the increasing

complexity and density of electronics, PCBs have become more advanced,

requiring tighter tolerances and more layers. As a result, PCB manufacturers

use classification systems to categorize boards based on their design

complexity and manufacturing requirements. Two important PCB

classifications are pattern class and drill class. Understanding these

classifications helps designers select the appropriate PCB technology for their

applications and enables manufacturers to produce boards efficiently.

Pattern Class

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Pattern class refers to the tolerance requirements for conductors (traces) and

spacing on a PCB. As circuits shrink in size, conductors must be thinner and

more closely spaced without shorting. Pattern classes define the range of

conductor widths and clearances that a PCB fabrication process can reliably

achieve. The classes are defined in the IPC-2221 standard as follows:

Class 1

Class 1 has the largest feature sizes and loosest tolerances. It is suitable for

simple circuits without space constraints.

 Minimum conductor width: ≥ 0.25 mm (10 mils)

 Minimum spacing between conductors: ≥ 0.25 mm (10 mils)

Class 2

Class 2 allows finer features than Class 1 and is suitable for more complex,

dense boards.

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 Minimum conductor width: ≥ 0.15 mm (6 mils)

 Minimum spacing between conductors: ≥ 0.15 mm (6 mils)

Class 3

Class 3 enables the highest density boards with very fine traces and spacing. It

requires advanced fabrication processes.

 Minimum conductor width: ≥ 0.10 mm (4 mils)

 Minimum spacing between conductors: ≥ 0.10 mm (4 mils)

As the class number increases, the tolerances get tighter, allowing conductors

to be placed more closely together. This enables higher circuit density but

requires more precise fabrication. The class chosen depends on the circuit

complexity and density required for the application.

Drill Class

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Drill class defines the tolerances for drilled holes on a PCB, which are used to

mount and interconnect components. As boards become denser, holes must

have tighter diameter tolerances and be placed more precisely. The IPC-2222

standard defines drill classes as:

Class 1

Class 1 has the largest holes and loosest tolerances. It is suitable for simple

through-hole PCBs.

 Minimum hole diameter: ≥ 0.4 mm (16 mils)

 Minimum annular ring: ≥ 0.15 mm (6 mils)

Class 2

Class 2 allows smaller vias and tolerance than Class 1 for interconnects on

double-sided boards.

 Minimum hole diameter: ≥ 0.25 mm (10 mils)

 Minimum annular ring: ≥ 0.10 mm (4 mils)

Class 3

Class 3 enables very small holes and tight tolerances needed for multi-layer

boards with microvias.

 Minimum hole diameter: ≥ 0.15 mm (6 mils)

 Minimum annular ring: ≥ 0.05 mm (2 mils)

The drill class must align with the pattern class for a PCB. As the class number

increases, the holes and annular rings decrease in size, enabling greater

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component density. But this requires more precise drilling and alignment

during fabrication.

PCB Stackup and Layer Count

In addition to pattern and drill class, the layer stackup and total layer count are

important PCB characteristics. Stackup refers to the sequence and thickness of

copper and dielectric layers in a multilayer board. Layer count is the total

number of copper layers. Some key stackup configurations are:

 Double-sided: 2 copper layers with components on both sides. Holes are drilled through.
 Multilayer with blind/buried vias: 4+ copper layers with interconnections between layers
using blind/buried vias. Allows higher density.
 High-speed designs: Tight dielectric tolerances and controlled stackups for impedance
matching.
 Thick copper boards: Outer copper layers up to 5x the standard thickness to handle high
currents.

Choosing Pattern, Drill, and Layer Classes

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The appropriate PCB classes depend on the circuit density, routing complexity,

layer count, and electrical performance needs. Some guidelines:

 Class 1 or 2 for simple, low-density circuits like hobby electronics. Easy to manufacture.
 Class 2 or 3 for complex digital boards with high component density.
 Class 3 for RF, analog, or high-speed digital circuits requiring fine features.
 Tighter classes for boards with more layers to align tolerances between layers.
 Thick copper outer layers for high current applications like power electronics.

Work with your PCB manufacturer early in the design process to determine the

optimal classes and layer stackup for your application requirements and

fabrication process capabilities. Using appropriate PCB classifications will help

ensure manufacturability and prevent costly re-spins.

Conclusion

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Pattern and drill classifications provide a simple system to characterize the

complexity of PCB designs and manufacturing requirements. Understanding

PCB classes enables designers to match the board technology to their

functional needs while giving manufacturers critical specifications for

production. With rising demands on electronics performance, density, and

capabilities, PCB classification continues to be an important factor in achieving

cost-effective, reliable printed circuit boards.

Frequently Asked Questions

What are the key factors in determining the appropriate PCB

class for a design?

The main factors are:

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 Circuit density - Higher density requires finer features and tighter tolerances (higher
classes)
 Routing complexity - More routing layers and blind/buried vias need higher classes
 High-speed design - Controlled impedances and dielectrics need tighter tolerances
 Current levels - High currents demand thicker copper layers
 Component types - Fine-pitch ICs and BGAs need higher classes
 Manufacturing process - Align with your PCB fab's capabilities

Do drill and pattern classes always match for a given PCB?

Drill and pattern classes should be properly aligned for a given PCB. Having a

drill class that exceeds the pattern class too much can result in annular ring

violations. The classes do not always match exactly but are usually within one

number of each other for a consistent board.

Can different pattern classes be used on different layers of the

same PCB?

Yes, some complex boards will use different pattern classes on outer and inner

layers. For example, you may use Class 3 for inner layers that require fine

trace/space, but Class 2 on outer layers for board simplicity and reduced costs.

Inner layer requirements usually dictate the minimum class.

How are HDI PCBs classified?

HDI (High Density Interconnect) PCBs use microvias with very small diameters

(<0.15mm) and high density wiring patterns, typically meeting Class 3 or even

tighter requirements. Additional HDI stackup classes characterize the microvia

pads and capture pad structures.

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What are some key benefits of understanding PCB classification?

Key benefits include:

 Selecting the most cost-effective class to meet design needs

 Ensuring manufacturability and avoiding re-spins
 Communicating clearly with PCB fabricators
 Evaluating different vendor capabilities
 Planning for assembly based on component density
 Budgeting and estimating costs accurately

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