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Top 18 HDI PCB Manufacturers In the world

Introduction

High density interconnect (HDI) PCBs enable denser routing, finer lines

and spaces, smaller vias, and more layers than conventional PCBs. They

are essential for miniaturized and high performance electronics like

smartphones, wearables, IoT devices, automotive electronics,

and medical devices.

Selecting the right HDI PCB manufacturer is crucial to get high yields,

quality, and timely delivery for prototyping and volume production.

This article provides a comprehensive list of the top 18 HDI PCB

manufacturers across the globe along with a framework for comparing

their capabilities and selecting the optimum partner.

Overview of HDI PCBs

HDI refers to the use of microvias (smaller than traditional vias) to

interconnect layers in a PCB. This allows greater routing density.

Some key features:

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 Trace/space: ≤ 100 μm (3.9 mils)

 Microvias: ≤ 150 μm with ≥ 20:1 diameter to hole ratio

 Thin dielectric layers: ≤ 60 μm

 More layers: > 10 layers

 Finer pad geometries

 Tighter pitch components: 0201, 01005 discretes, BGAs

Benefits of HDI technology:

 Miniaturization – More compact PCBs

 Higher speeds – Tight impedance control

 Routing channels – Solve high density routing

 Layer count – Complex designs with 30+ layers

 Higher component densities

 Noise isolation – Separate analog and digital

HDI PCBs require specialized manufacturing processes and

equipment. Not all standard PCB manufacturers have HDI

capabilities.

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Top 18 HDI PCB Manufacturers

1. RayMing Technology

Rayming is 18 years HDI PCB manufacturer,

HDI PCB Manufacturing Capabiltiy : 1+N+1, 2+N+2, 3+N+3,4+N+4,

any layer in R&D.

Founded in 2005 and headquartered in Shenzhen, China, RayMing has

established itself as a leading manufacturer of HDI, rigid-flex, and

specialized PCBs. Some key facts:

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 7 manufacturing sites across China

 Employs over 5000 staff

 ISO 9001, ISO 14001, ISO 45001 certified

 IATF 16949 certified facilities

 Reliability testing – IST, HAST, thermal shock/cycling

RayMing provides a one-stop shop from design support and quick-turn

prototyping to high volume manufacturing of HDI, rigid-flex, aluminum,

and RF PCBs. They serve customers globally across telecom, auto,

industrial, medical, aerospace, and instrumentation sectors. Known for

technical expertise at solving complex PCBs using HDI, buried/blind

vias, and advanced multilayering.

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2. TTM Technologies

TTM Technologies is a leading PCB manufacturer with revenues of

$2.2 billion and 16,000+ employees worldwide. Their offerings

include:

 HDI layers: >30 layer

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 Line width/spacing: 3/3 μm

 Microvias: 80 μm, 60 μm capable

 Via in pad, buried and stacked vias

 Sequential lamination

 Any-layer-HDI

TTM utilizes advanced processes like modified semi-additive

(MSAP) to achieve high yields on fine line HDI and rigid-flex PCBs

for smartphones, networking gear, aerospace, defense, and

automotive applications.

3. AT&S

AT&S is Europe’s largest PCB manufacturer and a leading global

producer of HDI boards and IC substrates. The Austria-based

company operates plants in India, China, Korea, and Austria.

Key capabilities for HDI PCBs:

 Trace/space: ≤ 5/5 μm

 Microvias: 50 μm

 Laser drilling down to 15 μm diameter

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 Build-up layer on both sides

 RDL layers on IC substrates

 Flip chip and wafer level packaging

AT&S focuses on high-end PCB technologies for applications

like 5G equipment, automotive radar, and advanced driver assist

systems (ADAS). Other areas of expertise include automotive,

industrial, and medical PCBs.

4. Tripod Technology

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Tripod Technology is one of the largest PCB manufacturers in

Taiwan with revenues of over $1 billion. The company has HDI

capabilities across multiple facilities:

 Build-up layers: Max 36 layers

 Line width/space: 3/3 μm

 Thickness tolerance: ±10%

 Microvias: 80 μm, 70 μm capable

 Pad size: 70 μm minimum

Tripod specializes in producing ultra-thin, high-precision HDI

boards using MSAP for customers serving the communications,

networking, automotive electronics, and consumer wearables

segments.

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6. Zhen Ding Tech

Zhen Ding Tech is a major flexible circuit board manufacturer

headquartered in Taiwan with over $2 billion in revenues. Zhen

Ding has ramped up investments in HDI and substrate production

over the past decade. They provide:

 Over 36 layers

 Blind and buried vias

 Microvias: 60 μm

 Thin laminates down to 12.5 μm

 Flex-on-flex multilayers

 Flexible substrates

ZD Tech produces billions of HDI PCBs annually for automotive

electronics, next-gen smartphones, AR/VR devices, and advanced

chip packaging. Other capabilities cover chip-scale packaging and

wafer level processes.

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8. Samsung Electro-Mechanics

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Samsung Electro-Mechanics is the PCB manufacturing division of

the Korean electronics giant Samsung Group. While best known

for multilayer boards for smartphones, Samsung has advanced

HDI PCB capabilities:

 Build-up layers: 18~36 layers

 Line/space: 2/2 μm

 Microvias: 50 μm

 Interposers

 Rigid-flex

 High layer FC substrates

 IC substrates with >700 IOs

SEM’s phased investment of over $600 million in HDI facilities

provides boards and substrates for Samsung’s IT equipment,

mobile processors, and other component businesses.

HDI any-layer connect printed circuit boards are the next

technological enhancement of HDI microvia PCBs: all the electrical

connections between the individual layers consist of laser-drilled

microvias. The main advantage of this technology is that all the

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layers can be freely interconnected. To produce these HDI PCBs,

RayMing uses laser-drilled microvias electroplated with copper.

9. Compeq Manufacturing

Compeq Manufacturing is a major PCB producer headquartered

in Taiwan with plants in China/Vietnam serving high-end

networking, computing, and communications customers.

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Their advanced HDI plant offers:

 Build-up layers: >12 layers

 Line/space: 2/2 μm

 Microvias: 60 μm

 Stacked microvias

 Blind/buried vias

 Thin cores down to 35 μm

 Rigid-flex

Compeq is a key supplier of high layer count boards for data

center servers and networking infrastructure demanding leading

edge PCB technologies.

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6 layer Blind via hole HDI PCB

12. Dynamic Electronics

Dynamic Electronics is a manufacturer of HDI, rigid-flex, and RF

PCBs based in Thailand. They offer:

 Build-up layers: Up to 20 layers

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 Line/space down to 3/3 μm

 Microvias: 80 μm, 65 μm

 Blind/buried vias

 Flexible multilayering

 Aluminum on flex

Dynamic uses modified semi-additive and subtractive processes

to produce complex HDI. Their key end markets include

aerospace, defense, industrial, and medical applications.

13. CMK Corporation

CMK Corporation is a Japanese PCB manufacturer specializing in

IC substrates, fine pitch boards, and 2.5/3D packages.

Their HDI capabilities cover:

 Build-up layers: >20 layers

 Line/space: 5/5 μm

 Microvias: 60 μm

 Thin cores down to 50 μm

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 Blind/buried vias

 Flexible multilayers

 Flip chip bonding

CMK focuses primarily on HDI boards for semiconductor IC

packaging and high density wire bonding.

14. Nan Ya PCB

Nan Ya PCB is a Taiwan based manufacturer of laminates,

prepregs, copper clad laminates. Its PCB division offers advanced

HDI boards:

 Build-up layers: >10 layers

 Lines/spaces: 3/3 mils (capable of 2/2 μm)

 Microvias: 80 μm and below

 Copper filled vias

 Blind/buried vias

 Thin cores

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Nan Ya produces rigid, flex, and rigid-flex HDI PCBs for

automotive electronics, servers, base stations, routers, switches,

and other networking gear.

15. Shinko Electric

Headquartered in Japan, Shinko manufactures HDI PCBs, IC

substrates, and semiconductor packages. They provide:

 Build-up layers: Up to 20 layers

 Line/space: As tight as 15/15 μm

 Microvias: 60 μm

 Thin cores down to 30 μm

 Laser drilling at 35 μm

 Blind and buried vias

Shinko services customers in computing, communications

infrastructure, automotive infotainment and ADAS applications.

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16. Fujikura

Fujikura is a Japanese manufacturer of flexible printed circuits

with revenues exceeding $1.3 billion. Their flexible HDI

capabilities include:

 Build-up layers: 6 to 8 layers

 Blind vias and microvias

 Flex-on-flex multilayering

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 Rigid-flex integration

 Roll-to-roll mass lamination

Fujikura flex circuits find applications in consumer electronics,

automobiles, robotics, medical devices. Their expertise lies in

high-mix, flexible HDI production.

17. Flexium Interconnect

Flexium is a leading Taiwanese manufacturer of flexible PCBs with

revenues of approximately $1 billion. They possess advanced flex

HDI manufacturing capabilities:

 Build-up layers: 8 layers

 Blind vias

 Thin flexible multilayering

 Roll-to-roll processing

 Laser via ablation

Flexium supplies flex and rigid-flex boards for dynamic flexing

applications in smartphones, laptops, consumer electronics,

wearables, VR/AR devices.

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18. Flex International

Flex International provides comprehensive flex PCB

fabrication and assembly. Their flexible HDI capabilities include:

 Build-up layers: 6 to 10 layers

 Blind and buried vias

 Laser microvias down to 25 μm

 Thin cores down to 25 μm

 Flex-rigid-flex integration

 Quick turnaround prototypes

Flex International produces custom flexible circuits boards for

medical, industrial, aerospace, and defense industry customers.

Comparing HDI PCB Manufacturers

Here are some key factors to consider when selecting an HDI

partner:

Technical Capabilities

 Finest line width/spacing – 2 μm or lower is preferred

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 Microvia size – 50 μm to 80 μm range

 Number of HDI build-up layers – >20 layers ideal

 Thin core handling – 25 μm to 35 μm range

 Laser drilling diameters – Below 50 μm

 Blind and buried vias for dense interconnects

 Stacked or staggered microvias

Quality & Reliability

 IPC 6012 Class 3 and Class 3A certification for HDI

 Robust quality processes – AOI, test, inspection, statistical

process control

 Reliability testing – IST, HAST, drop/shock/vibration

Volume Production

 Monthly capacity – Number of panels per month

 Consistent on-time delivery metrics

 Years of experience with mass HDI production

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Customer Service

 Technical expertise providing layout reviews

and DFM feedback

 Response time for quotations, samples, inquiries

 Supply chain transparency and reporting

 Customer reviews and testimonials

Cost

 HDI pricing – may vary based on complexity, layer count

 NRE charges for prototyping

 Budgetary estimates before design finalization

Location

 Production sites close to key customers

 Global footprint for production redundancy

Carefully evaluating manufacturers against these criteria

simplifies selection of the ideal HDI partner.

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Conclusion

8 layer Hdi PCB

HDI PCB technology enables miniaturized electronics design

through high density interconnects, fine features, and thin

materials. As products become thinner and lighter, HDI provides

the means to pack more functionality and components into tight

spaces. Partnering with specialized manufacturers that have

invested in advanced HDI capabilities and processes is crucial to

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realize the benefits of next-gen PCB technologies. This article

provided an overview of the top 18 HDI PCB

manufacturers globally and a framework to match specific

product needs with the right manufacturing partner. The key is

early supplier engagement to understand capabilities and

limitations before finalizing designs. Investing upfront in DFM and

manufacturability will ensure high yields and repeatable quality

when transitioning to volume HDI production.

FAQ

What are some key differences between HDI and conventional PCBs?

HDI PCBs use smaller microvias rather than traditional vias to

interconnect layers. They allow finer traces and spaces, thinner

dielectric materials, higher layer counts, and greater component

densities versus standard PCBs.

What are the typical applications for HDI PCBs?

HDI PCBs are commonly used in space constrained and high

performance products like smartphones, wearables, medical

devices, auto electronics, aerospace avionics, 5G infrastructure,

and other advanced electronics.

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What are the typical lead times for prototype vs production HDI PCBs?

HDI PCB prototype lead times range from 24 hours to 2 weeks

depending on complexity. Volume production lead times are

usually around 4 to 8 weeks once the design is finalized.

Does HDI improve signal speeds compared to conventional PCBs?

Yes, the thinner dielectrics, dense interconnects, and impedance

control offered by HDI technology allows faster signal

propagation which improves high speed capabilities.

What are the main challenges in manufacturing HDI PCBs?

Tight process controls and special equipment are required to

produce fine features and thin materials consistently. Handling

thin cores without distortion and high yields on microvias require

considerable expertise. Testing and inspection regimes must also

validate the high density interconnects across layers.

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