What Is PCB X-Ray Inspection

RAYMING PCB & ASSEMBLY
What is PCB X-Ray Inspection

Rayming invest 3D Automatic X-Ray Inspection (AXI) machines to
detect QFN,FBGA and other lead-less package types
components, our BGA x-ray inpection services is now included
by default on any Rayming quotations including the assembly of
lead-less packages, The X-ray images can help us also to analyse
root causes of detective boards, such as excessive solder, lack of
solder, mechanical failures of components, cracks, but also to
detect hidden problems inside the PCB, such as bad metallisation
in the holes or via cracks, This technique contributes greatly to
Rayming’s Quality Management strategy for complex
components.
Introduction
PCB Manufacturing & Assembly Services https://www.raypcb.com/

X-ray inspection is a non-destructive test method used to reveal
internal structure and detect defects in printed circuit board (PCB)
assemblies. This article provides an overview of PCB X-ray technology
covering:
 How X-ray inspection works
 Defect types detected
 2D vs 3D X-ray
 Pros and cons of the technology
 X-ray vs other test methods
 When to use X-ray in the process flow
 Implementing X-ray inspection

Understanding X-ray inspection capabilities and limitations is important
for quality management in PCB manufacturing and assembly.
Request PCBA X-Ray Inspection Service
Contact Us
How X-ray Inspection Works
1、IC’s footprint inspection: Peel, cracking, empty, wire bonding.
2、Print circuit boards fabrication inspection: Welding line offset
bridging, open circuit.

3、SMT weldability inspection: Solder joints empty inspection and
measurement.
4、Circuit line inspection: Open circuit, short circuit, defective or fault
connection.
5、Integrity inspection of solder ball in array package and chip covering
packaging.
X-ray imaging uses short wavelength electromagnetic radiation to
penetrate materials and reveal internal structure:
X-ray Generation
 X-rays produced by bombarding metal anode target
 Small focal spot for high resolution
 Voltages from 30 to 320 kV
X-ray Detection
 X-rays passing through board converted to visible light
 Captured by sensor and converted to digital data
Image Processing

 Software renders cross section image
 Computer aided detection finds defects
Advantages
 Non-destructive, no sample preparation
 Reveals insides of packaged boards
 Detects defects other methods may miss
X-ray inspection can find various defects on and within PCB
assemblies:
Solder Defects
 Insufficient or excessive solder
 Solder voids
 Bridging under components
 Head-in-pillow
 Misaligned BGA balls
Component Issues

 Missing parts or wrong parts
 Shifted component position
 Skewed parts
 Incorrect insertion depth
PCB Defects
 Pad cratering
 Lifted lands
 Plating voids
 Inner layer separation
 Buried broken traces
Foreign Objects
 Debris lodged within board
 Metallic contamination
2D X-ray
 Single axis inspection

 Fast imaging for high throughput
 Limited to one viewing angle
3D X-ray
 CT scan builds 3D model
 Multi-axis composite viewing
 More defect analysis capability
 Slower throughput speed

Validation
 Qualify and analyze components
 Detect defects in incoming boards
Troubleshooting
 Find hidden issues escaping normal testing
 Diagnose field failures
Process Control

 Sample production assemblies
 Periodic process monitoring
High Value Products
 100% inspection of mission-critical boards
 Aerospace, military, medical devices

Request PCB PCBA Quote
Contact Us
Implementing X-ray Inspection
Key considerations when applying X-ray inspection:
 Determine appropriate usage within process
 Select system technology – 2D, 3D, computed tomography
 Develop inspection routines for products
 Understand and interpret X-ray images
 Correlate findings with other test methods
 Institute safety procedures for radiation exposure
 Leverage for troubleshooting escapes and field returns
 Apply judiciously based on value vs. cost tradeoffs
Conclusion

X-ray inspection is a highly valuable but selectively used test
method for revealing PCB assembly defects invisible to other
techniques. When applied appropriately, X-ray provides unique
subsurface inspection capabilities to enhance quality and
reliability. Understanding the technology, interpreting results and
correlating with other test data allows manufacturers to
strategically leverage X-ray to improve process control.
Frequently Asked Questions
Here are some common questions about PCB X-ray inspection:
Q: What types of defects are best found by X-ray vs optical AOI?
X-ray is superior at finding subsurface flaws like voids and buried
discontinuities while AOI excels at surface mount defects.
Q: Does X-ray inspection replace functional board testing?
No, X-ray reveals physical defects but does not verify electrical
performance like ICT and flying probe testing.
Q: Can X-ray inspection be used on boards with BGAs and QFNs?
Yes, X-ray is an ideal technique for inspecting solder joints under BGAs.
It can reveal bridging and head-in-pillow.

Q: What safety precautions are required for PCB X-ray inspection?
Radiation shielding, trained operators, safety interlocks, and
procedures are necessary to protect staff from X-ray exposure.
Q: What is the difference between 2D and 3D X-ray inspection?
2D X-ray provides a single 2D view while 3D generates a 3D model
through computed tomography scanning at multiple angles.
https://www.raypcb.com/pcb-x-ray-inspection/

What Is PCB X-Ray Inspection

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RAYMING PCB & ASSEMBLY

What is PCB X-Ray Inspection

detect QFN,FBGA and other lead-less package types

components, our BGA x-ray inpection services is now included

by default on any Rayming quotations including the assembly of

lead-less packages, The X-ray images can help us also to analyse

root causes of detective boards, such as excessive solder, lack of

solder, mechanical failures of components, cracks, but also to

detect hidden problems inside the PCB, such as bad metallisation

in the holes or via cracks, This technique contributes greatly to

Rayming’s Quality Management strategy for complex

PCB Manufacturing & Assembly Services https://www.raypcb.com/

X-ray inspection is a non-destructive test method used to reveal

internal structure and detect defects in printed circuit board (PCB)

assemblies. This article provides an overview of PCB X-ray technology

 How X-ray inspection works

 Defect types detected

 Pros and cons of the technology

 X-ray vs other test methods

 When to use X-ray in the process flow

 Implementing X-ray inspection

PCB Manufacturing & Assembly Services https://www.raypcb.com/

Understanding X-ray inspection capabilities and limitations is important

for quality management in PCB manufacturing and assembly.

Request PCBA X-Ray Inspection Service

How X-ray Inspection Works

1、IC’s footprint inspection: Peel, cracking, empty, wire bonding.

2、Print circuit boards fabrication inspection: Welding line offset

bridging, open circuit.

PCB Manufacturing & Assembly Services https://www.raypcb.com/

3、SMT weldability inspection: Solder joints empty inspection and

4、Circuit line inspection: Open circuit, short circuit, defective or fault

5、Integrity inspection of solder ball in array package and chip covering

X-ray imaging uses short wavelength electromagnetic radiation to

penetrate materials and reveal internal structure:

 X-rays produced by bombarding metal anode target

 Small focal spot for high resolution

 Voltages from 30 to 320 kV

 X-rays passing through board converted to visible light

 Captured by sensor and converted to digital data

PCB Manufacturing & Assembly Services https://www.raypcb.com/

 Software renders cross section image

 Computer aided detection finds defects

 Non-destructive, no sample preparation

 Reveals insides of packaged boards

 Detects defects other methods may miss

X-ray inspection can find various defects on and within PCB

 Insufficient or excessive solder

 Bridging under components

 Misaligned BGA balls

PCB Manufacturing & Assembly Services https://www.raypcb.com/

 Missing parts or wrong parts

 Shifted component position

 Incorrect insertion depth

 Inner layer separation

 Buried broken traces

 Debris lodged within board

 Single axis inspection

PCB Manufacturing & Assembly Services https://www.raypcb.com/

 Fast imaging for high throughput

 Limited to one viewing angle

 CT scan builds 3D model