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RAYMING PCB & ASSEMBLY

What is FCT Test Meaning to PCB


FCT (Functional Circuit Test) is an important testing method used

during the manufacturing process of printed circuit boards (PCBs). It

involves testing the functionality of the circuits on the PCB to ensure

there are no defects before the board moves to the next stage of

production.

FCT testing provides key insights into the quality and reliability of

the PCB design and its ability to function as intended. For electronics

manufacturers, performing FCT testing properly is crucial for avoiding

costly errors and producing high-quality boards that work correctly

when assembled into finished products.

This article will provide a comprehensive overview of FCT testing for

PCBs. We’ll look at what FCT testing is, why it’s needed, how testing

fixtures are used, the types of defects it finds, and the implications of

FCT results for PCB manufacturers.

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What is FCT Testing?

FCT stands for functional circuit test. It is a method of testing

unpopulated or bare printed circuit boards to verify the electrical

connectivity and functionality of the circuits based on the intended

design.

The key goals of FCT testing include:

 Validate PCB fabrication: FCT testing checks for any

manufacturing defects, errors or flaws in the PCB fabrication

process that can lead to malfunctioning circuits. This verifies

the PCB vendor correctly fabricated the boards according to

specifications.

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 Catch assembly errors early: By testing boards before they are

assembled and populated with components, FCT testing can

identify any issues in the bare boards that would be harder to

detect after assembly. Catching errors early prevents wasting

time and money on assembling defective boards.

 Ensure design integrity: FCT confirms that the circuits and

connections implemented on the fabricated board match the

intended PCB design files and schematics.

 Check for shorts and opens: The testing detects any unintended

electrical connections (shorts) or breaks in continuity (opens) in

the circuits on the bare boards that could lead to field failures

upon assembly.

 Evaluate manufacturability: FCT results provide feedback on the

manufacturability of the PCB design and highlight any areas that

may need to be improved or corrected in the design.

In summary, FCT provides a vital quality control gate between PCB

fabrication and assembly to verify the fabricated boards meet

functionality and reliability requirements for further production.

FCT Testing Fixtures


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To perform FCT on printed circuit boards, specialized testing

fixtures are used to interface the bare PCBs with test systems that

apply signals and measure the board’s electrical responses. FCT

fixtures provide both mechanical handling of the boards and

electrical connectivity to test points on the board circuits.

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There are two primary categories of fixtures used for FCT testing:

Bed-of-Nails Fixture

This type of fixture uses an array of spring-loaded “nails” or pins

to contact test pads on the PCBs. It provides access to test points

across the entire board area. The bed-of-nails approach can

test digital circuits and simple analog circuits.

Flying Probe Fixture

Flying probe fixtures use movable test probes on precision robots

to target specific test points on the PCB. This provides more

versatility to reach points on complex board geometries. Flying

probe can test digital and more complex analog circuits.

Hybrid fixtures combining both bed-of-nails and flying probes are

also available. The type of FCT fixture selected depends on the

PCB design, complexity, test access needs, and other

considerations.

FCT testing checks for a variety of circuit defects and faults that

can occur in the PCB fabrication process. By applying test signals

and measuring the output responses, issues like the following can

be detected:

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Open circuits – A break in the conductive path between points

that should be connected according to the design schematics.

Opens may be caused by gaps or thinning of copper traces,

incomplete holes, or other fabrication flaws.

Short circuits – An unintended conductive bridge between two

points not meant to be connected per the design schematics.

Causes include copper smearing, unwanted solder, or drill errors

like plating through a hole wall.

Value faults – When impedances like capacitances or resistances

are out of tolerance from their designed value due to variations or

flaws in fabricated components on the PCB.

Leakage – Unwanted current flows between circuits that should

be isolated, indicating insulation resistance issues. Often caused

by contaminants like moisture or residues on the PCB surface.

Intermittent faults – Defects that appear intermittently during

testing, indicating marginal or unstable connections likely to cause

reliability issues over time.

Circuit logic faults – Circuits failing functional tests due to

problems with fabricated connections or components that

prevent correct logic function per the design.

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Crosstalk – Unexpected signal coupling between neighboring

traces, vias, or components due to fabrication variations. Can

cause interference and noise.

Impedance faults – Incorrect characteristic impedance of

transmission lines like microstrips that can impair signal

integrity at high frequencies.

In addition to identifying the type of defect, FCT testing also

locates the physical position of faults on the PCBs for diagnosis

and correction. Catching these issues early prevents improper

board performance or failures once assembled and deployed.

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When FCT testing reveals defects in a manufactured PCB, further

analysis is required to determine the root cause so the underlying

process errors can be corrected. Typical steps in FCT failure

diagnosis include:

 Repeat testing – Re-test the fault location to verify the failure

is consistent and not an anomaly. Intermittent issues may

require multiple repeated tests to isolate.

 Correlate to design data – Compare the failure location and

type to the PCB layout, schematics, bill of materials and

other design files. Review the nominal circuit characteristics

expected at the test nodes.

 Visually inspect the PCB – Use optical inspection and tools

like high-power microscopes to look for visible defects or

damage at the failure location that may explain the issue.

 Take electrical measurements – Use multimeters,

time-domain reflectometers, or other tools to take further

electrical readings like continuity, resistance, capacitance,

and impedance around the fault.

 Review process records – Examine PCB fabrication, handling,

and test records for any anomalies that could be related to

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the failure like unusual measurements, tolerances exceeded,

or equipment issues.

 Reproduce with design experiments – Make deliberate

modifications to the design data like adding shorts or opens

and re-fabricate test boards to attempt reproducing and

better characterize the failure mode observed.

 Perform materials analysis – In some cases, use analytical

techniques like scanning electron microscopy to inspect PCB

materials like laminates or drill holes for flaws indicating

process errors.

By correlating multiple data points from testing, inspection,

design records, and materials analysis, the factors responsible for

FCT failures can usually be effectively identified so that PCB

fabrication processes can be adjusted to prevent similar defects

going forward.

The outcomes and data gathered from FCT testing have important

implications for PCB manufacturers in terms of quality control,

process adjustments, and communication with customers:

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 Pass/Fail criteria – PCBs must meet predefined limits for

acceptable defect rates in order to pass FCT. Failed boards

are rejected or subject to rework if possible.

 Process adjustments – Failures pointing to systematic

fabrication process errors require correcting the processes

to address root causes. Common process tweaks may

involve lamination, drill, plating, etching, or handling steps.

 Verification of fixes – Once a process is corrected, further

FCT testing on new boards verifies the failures are

eliminated before full production proceeds.

 Design rule updates – If FCT reveals

design-for-manufacturing issues, it provides feedback to

update design rules and recommendations to improve

manufacturability.

 Reporting – FCT results and data metrics are compiled into

reports that allow monitoring fab process capabilities over

time as a key performance indicator (KPI).

 Documentation – Detailed FCT failure documentation

provides records that can be referenced during quality

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discussions with customers. Thorough reporting

demonstrates quality vigilance.

 Continuous improvement – By providing closed-loop

feedback on defects and corrections, FCT testing enables

continuous refinement of PCB fabrication processes and

design rules toward higher reliability and yields.

In summary, properly leveraging the data from FCT testing helps

PCB manufacturers achieve improved quality, process control,

and customer confidence.

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1.

2.

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1.

What are some key questions FCT testing helps answer?

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2.

FCT testing provides answers to critical questions including:

3.

o Are there any shorts or opens on the bare boards

indicating potential defects?

o Do all tested nodes show the right connectivity to

adjacent points per the design?

o Are there any indications of impedance issues or

propagation delays that could affect signal

performance?

o Do the circuits function correctly when stimulated with

logic test patterns and clocks?

o Are any power or ground networks skewed out of

tolerance on impedance or resistance?

o Do analog circuits like oscillators operate within

expected frequency ranges?

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o Are there any signs of crosstalk or leakage between

circuits that should be isolated?

4.

How is FCT testing integrated into the PCB fabrication workflow?

5.

FCT testing is performed after all fabrication processing is

complete but before solder mask, silkscreen, or surface

finishes are applied to the PCBs. This allows access to test

points that may be blocked after these steps. FCT occurs

before routing the boards on to assembly and provides a

quality gate to avoid wasting further value-add on defective

boards.

6.

7.

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8.

How do you design FCT test fixtures and test points?

9.

FCT fixtures are designed based on CAD data for each

unique PCB design. Test points are added to the PCB layout

in unused areas, often on non-functional edges/corners.

Testpoint locations are optimized to access key nodes while

minimizing fixtures complexity. Strategies like daisy-chaining

can minimize total test points. Both fixture and board

designers collaborate to enable effective testing.

10.

11.

12.

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What is the difference between “flying probe” and “bed of nails”

FCT testing?

13.

Flying probe testers use movable probes to target individual

test points. This provides more versatility for complex

boards but lower throughput. Bed of nails uses an array of

fixed pins to contact boards and enables higher throughput

but only for simpler board geometries. Hybrid fixtures can

leverage benefits of both approaches.

14.

15.

16.

How can you calculate the ROI for implementing FCT testing?

17.

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The ROI justification factors the costs of testing (equipment,

fixtures, labor) versus the defect risks detected multiplied by

their associated costs (rework, scrap, field failures). As an

example, catching even a 2% defect rate before assembly

could save millions in avoiding wasted components and

recalls. The more complex and critical the PCB application,

the higher the ROI.

18.

Conclusion

FCT testing provides PCB manufacturers with invaluable quality

control and feedback by enabling early detection of fabrication

defects before boards proceed to assembly. Rigorous FCT

procedures and failure analysis prevents avoidable functionality

issues or field failures and the significant costs associated with

them.

By validating designs, catching flaws, and driving process

improvements, FCT testing delivers large returns on investment

and is considered essential for quality management of PCB

production. As PCBs grow more complex, FCT helps ensure they

function correctly when deployed in finished products. With

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careful fixture design, testing best practices, and diagnostic

diligence, manufacturers can leverage FCT to deliver the highest

reliability and yields.

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