VALLIAMMAI ENGINEERING COLLEGE

SRM Nagar, Kattankulathur – 603 203.

DEPARTMENT OF
ELECTRICAL AND ELECTRONICS ENGINEERING

QUESTION BANK

VI SEMESTER

EE6007 – Micro Electro Mechanical Systems

Regulation – 2013

Academic Year 2017 – 18

Prepared by

Ms. V.Kalaiarasi, Assistant Professor/EEE

 VALLIAMMAI ENGINEERING COLLEGE
SRM Nagar, Kattankulathur – 603 203.

DEPARTMENT OF ELECTRICAL AND ELECTRONICS ENGINEERING

QUESTION BANK
SUBJECT: EE6007 MICRO ELECTRO MECHANICAL SYSTEMS

SEM / YEAR: VII / IV

UNIT I - INTRODUCTION
Intrinsic Characteristics of MEMS – Energy Domains and Transducers- Sensors and
Actuators – Introduction to Micro fabrication - Silicon based MEMS processes – New
Materials – Review of Electrical and Mechanical concepts in MEMS – Semiconductor
devices – Stress and strain analysis – Flexural beam bending- Torsional deflection.

PART - A
Q.No Questions BT Level Competence

1. Differentiate CVD and PVD. 2 Understand

2. Distinguish between Microelectronics and Microsystem. 2 Understand
3. systemthe components of a Microsystem.
Label 1 Remember
4. Define Torsion and Torsional rigidity. 1 Remember
5. Give any five applications of Microsystems. 2 Understand
6. Illustrate the functional relationship between the 3 Apply
actuating element and the transduction unit in a Micro
sensor.
7. Define shear stress and shear strain. load system 1 Remember
8. Define Hook’s law and explain elastic limit. 1 Remember
9. Evaluate the options for integrating micromechanical and 5 Evaluate
circuit elements.
10. Explain the process of CVD with neat sketch. 4 Analyze
11. With neat labelled figures, demonstrate the steps involved in 3 Apply
photolithography.
12. Compare between silicon and GaAs as materials for MEMS 4 Analyze
device fabrication.
13. Describe the method of Micro actuators. 1 Remember
14. Define MEMS. 1 Remember
15. Distinguish between bulk micromachining and surface 2 Understand
micromachining.
16. Classify the types of beams. 4 Analyze
17. Summarize the boundary conditions for various types of 5 Evaluate
beams.
18. What is bending moment. 3 Apply
19. What do you mean by quality factor (Q) 6 Create
20. Name the material having zero stress. 6 Create
PART – B
1. (i) Describe the role of semiconductor materials in the 1 Remember
design of MEMS and also calculate the charge carrier
concentration. (8)
(ii) Examine the concept of conductivity and resistivity. 1
(8)
2. (i) Illustrate the functional relationship between the 3 Apply
actuating element and the transduction unit in a Micro
actuator. (8)
(ii) Describe the energy domains of sensors and 1
Remember
actuators. (8)
3. (i) Discuss in detail about the properties of silicon as a 2 Understand
substrate material. (8)
(ii) Explain how oxidation principle is used in Micro
system fabrication. (8) 4
Analyze
4. (i) Summarize the applications of Microsystems in 5 Evaluate
different industries. (8)

(ii) Give short notes on diffusion process used in MEMS

2
industry. (8) Understand
5. (i) Summarize the processing steps of photolithography 5 Evaluate
with neat sketch. (8)
1
(ii) Describe about the PVD with neat diagrams. (8)
Remember

6. (i) Explain about ion implantation technique to produce 4 Analyze

Microsystems. (8)
4
(ii) Explain in detail about torsional deflection. (8)
7. Show the fundamental classes of fabrication technologies 6 Create
and design a typical micromachining process involving
one structural and one sacrificial layer. (16)
8. (i) Demonstrate the equations for Mass, Acceleration, 3 Apply
Transient time and Power Density using Trimmer Force
Vector. (8)
(ii) Compare and contrast PECVD, APCVD and 4
Analyze
LPCVD. (8)
9. Give the relation between stress and strain in brief with 2 Understand
relevant diagrams and equations. (16)
10. (i) Define beam. Name the types of beams and point out 1 Remember
the possible boundary conditions. (6)
(ii) Describe about the flexural beam bending analysis
1
under simple loading conditions. (10)
 11. In detail explain about the relation between tensile stress 4 Analyze
and strains also give the details of mechanical properties
of silicon. (16)
12. Discuss in detail about torsional deflections. (16) 2 Understand
13. Describe about photolithography process and also about 1 Remember
Czochralski (CZ) method for producing single crystal
silicon. (16)
14. Illustrate about crystal planes and orientation in MEMS. 4 Analyze
(16)

VALLIAMMAI ENGINEERING COLLEGE

SRM Nagar, Kattankulathur – 603 203.

DEPARTMENT OF ELECTRICAL AND ELECTRONICS ENGINEERING

QUESTION BANK
SUBJECT : EE6007 MICRO ELECTRO MECHANICAL SYSTEMS
SEM / YEAR: VII / IV

UNIT II - SENSORS AND ACTUATORS-I

Electrostatic sensors – Parallel plate capacitors – Applications – Interdigitated Finger capacitor
– Comb drive devices – Micro Grippers – Micro Motors - Thermal Sensing and Actuation – Thermal
expansion – Thermal couples – Thermal resistors – Thermal Bimorph - Applications – Magnetic
Actuators – Micromagnetic components – Case studies of MEMS in magnetic actuators- Actuation
using Shape Memory Alloys.
PART – A
Q.No Questions BT Level Competence
1. Give the principle of operation of electrostatic sensors and 2 Understand
actuators.
2. Name the materials used in fabrication of parallel plate capacitors. 1 Remember
3. Define pull-in voltage. 1 Remember
4. Summarize the advantages and disadvantages of electrostatic sensing 5 Evaluate
and actuation.
5. Generalize the principle of tactile sensor with an example. 6 Create
6. Name any three thermal sensors. 1 Remember
7. Discuss on the concept of seebeck coefficient. 2 Understand
8. Compare and contrast the characteristics of electrostatic and 4 Analyze
thermal bimetallic actuation.
9. Distinguish between volumetric thermal and linear expansion 2 Understand
coefficient.
10. Discover the need of thermal sensing. 3 Apply
11. Give the principle of thermal bimorph. 2 Understand
12. Define thermal resistance in the case of conduction, convection and 1 Remember
radiation.
13. Summarize the advantages and disadvantages of thermal sensing and 5 Evaluate
actuation.
14. Demonstrate the thermal transfer process with neat diagram. 3 Apply
15. Generalize the principle of magnetic actuator with an example. 6 Create
16. Illustrate the relationship between B and H. 3 Apply
17. Compare and contrast hard and soft magnets. 4 Analyze
18. Classify the types of magnetic materials based on susceptibility. 4 Analyze
19. Define Lorentz force on a current carrying wire. 1 Remember
20. Tabulate the advantages and disadvantages of magnetic actuation. 1 Remember
PART – B
1. (i) With suitable diagram, explain the working principle of 4
parallel plate capacitor and the equilibrium position of
electrostatic actuator under bias. (8) Analyze
1 Remember
(ii) Describe the pull in effect of parallel plate actuators. (8)
2. (i) Describe the fabrication process of condenser microphone. (8) 1 Remember

(ii) Discuss on electrostatic actuation model with neat diagram. 2 Understand

(8)
3. Discuss in detail about the fabrication process of pressure sensor Understand
2
with sealed activity. (16)

4. (i) Give short notes on Micro motors. (8) 2 Understand

(ii) Summarize the applications of comb drive devices. (8) 5 Evaluate

5. (i) With schematic diagram, explain bulk micro machined parallel Remember
4
plate capacitor sensing as differential mode tactile sensor. (8) Analyze
(ii) Explain the design and fabrication process of torsional parallel
6 Create
plate capacitive accelerometer. (8)

6. Explain different configurations of interdigitated finger capacitors 3 Apply

and their relative pros and cons in terms of maximum
displacement, linear / angular displacement and force output. (16)
7. (i) Define thermal resistor and thermistor. Draw the IV 1 Remember
characteristics of thermal resistor. (8)
(ii) Describe the working of thermocouple element with neat 1
diagram. (8)
8. (i) Explain thermal bimetallic bending and evaluate the vertical 5 Evaluate
displacement at the free end of the cantilever beam. (8)
(ii) Summarize the fabrication steps involved in the design of 5
bimetallic artificial cilia actuator. (8)
9. (i) Give short notes on Micro grippers. (8) 2 Understand
(ii) Demonstrate the two strategies of lateral thermal actuators. (8) 3 Apply
10. Explain in detail about the fabrication of thermal transfer shear 4 Analyze
stress sensor. (16)
11. Design an infrared sensor by giving out the fabrication steps in 6 Create
detail. (16)
12. Explain the fabrication process of a surface micro machined hot- 5 Evaluate
wire anemometer. (16)
13. (i) Describe the principle operation of magnetic actuation and the 1 Remember
deposition process of magnetic materials. (8) 6
Remember
(ii) Draw the magnetic curve for a ferromagnetic material. (8)
14. (i) List out the various actuation methods used in MEMS. Explain 1 Remember
the design and fabrication of magnetic materials. (8)
(ii) Explain about the structure and principle of a bistable
magnetic switch. (8) 3
 VALLIAMMAI ENGINEERING COLLEGE
SRM Nagar, Kattankulathur – 603 203.

DEPARTMENT OF ELECTRICAL AND ELECTRONICS ENGINEERING

QUESTION BANK
SUBJECT : EE6007 MICRO ELECTRO MECHANICAL SYSTEMS
SEM / YEAR: VII / IV

UNIT III - SENSORS AND ACTUATORS-II

Piezoresistive sensors – Piezoresistive sensor materials - Stress analysis of mechanical elements
– Applications to Inertia, Pressure, Tactile and Flow sensors – Piezoelectric sensors and actuators
– piezoelectric effects – piezoelectric materials – Applications to Inertia , Acoustic, Tactile and Flow
sensors.
PART – A
Q.No Questions BT Level Competence
1. Distinguish between longitudinal and transverse piezoresistors. 2 Understand
2. Differentiate longitudinal and transverse gauge factor. 4 Analyze
3. Describe PVDF. 1 Remember
4. Relate the effective and ineffective design of cantilevers with 6 Create
piezoresistors.
5. Discuss about the materials that are used as piezoresistors. 2 Understand
6. Analyze, why the doping concentration takes an important 4 Analyze
consideration when designing silicon photo resistors.
7. List the applications of piezoresistive sensors. 1 Remember
8. Summarize the advantages and disadvantages of using 5 Evaluate
piezoresistive sensors.
9. Define piezoelectric effect. 1 Remember
10. Illustrate the relationship between electrical polarization and applied 3 Apply
mechanical stress.
11. Illustrate the relationship between stress and strain. 3 Apply
12. Define electromechanical coupling coefficient. 1 Remember
13. Point out the assumptions that have been made for calculating the 4 Analyze
curvature of ending.
14. Define Curie temperature. 1 Remember
15. Discover the need of acoustic sensors. 3 Apply
16. Generalize the principle of piezoelectric accelerometer. 6 Create
17. Why ZnO is used instead of PZT? 2 Understand
18. Name the materials used as bonding agent in preparing PZT 1 Remember
materials.
19. Describe the need of flow rate sensors. 2 Understand
20. Summarize the advantages and disadvantages of piezoelectric sensing 5 Evaluate
and actuation.
PART - B
1. (i) Discuss about the properties of the materials used in the Understand
2
fabrication of piezoelectric sensors. (8)
(ii) With neat diagram, describe the fabrication process of PZT 1 Remember
piezoelectric acoustic sensor. (8)
2. (i) Discuss on the concept of cantilever piezoelectric actuator Understand
model with neat diagram. (8) 2
(ii) Discuss about the properties of the materials used in the
fabrication of piezoresistive sensors. (8) 2

3. (i) List some of the piezoelectric materials and piezoresistive Remember

1
materials. Differentiate between them based on their property. (8)
(ii) Describe the working principle of membrane piezoelectric 1
accelerometer and its fabrication process. (8)
4. (i) Discover the need of flow rate sensor. Demonstrate the Apply
working and fabrication process of piezoelectric flow rate sensor.
3
(8) 3
(ii) Demonstrate the working principle of tactile sensor array with
neat diagram. (8)
5. (i) Describe the fabrication process of cantilever type piezoelectric 1 Remember
microphone. (8)
(ii) Summarize the fabrication steps involved in the design of
silicon proof mass with cantilever. (8) 5
Evaluate
6. Explain the stress analysis following mechanical elements: Remember
(i) Stress in flexural cantilevers. (8) 4
(ii) Stress and deformation in membrane. (8) Analyze
7. (i) Demonstrate the working and fabrication process of surface 3 Apply
micro machined piezoresistive pressure sensor. (8)
Remember
(ii) Define piezoresistivity. Discuss on a multi-axis piezoresistive
tactile sensor. (8) 1
8. (i) Formulate the fabrication steps to design an artificial hair cell 6 Create
element. (8) Understand
2
(ii) Give the comparison between various sensing methods. (8)
9. (i) Summarize the advantages and disadvantages of various 2 Evaluate
5
actuation methods. (8)
(ii) List the applications of piezoresistive sensors. Explain the
fabrication process of piezoresistive shear-stress sensor. (8) 1 Remember
10. (i) Formulate the fabrication steps to design a bulk micro 6 Create
machined single crystal silicon accelerometer. (8)
Apply
(ii) Illustrate the mathematical description of piezoelectric effect
with relevant diagrams. (8) 3
11. Summarize the properties of representive PZT materials. (16) 2 Understand
12. Describe about piezoelectric flow rate sensor. (16) 1 Remember
13. In brief explain about PZT piezoelectric Microphone. (16) 4 Analyze
14. With neat sketch explain about cantilever piezoelectric Analyze
accelerometer. (16) 4
 VALLIAMMAI ENGINEERING COLLEGE
SRM Nagar, Kattankulathur – 603 203.

DEPARTMENT OF ELECTRICAL AND ELECTRONICDS ENGINEERING

QUESTION BANK
SUBJECT : EE6007 MICRO ELECTRO MECHANICAL SYSTEMS
SEM / YEAR: VII / IV

UNIT IV- MICROMACHINING

Silicon Anisotropic Etching – Anisotrophic Wet Etching – Dry Etching of Silicon – Plasma
Etching – Deep Reaction Ion Etching (DRIE) – Isotropic Wet Etching – Gas Phase
Etchants – Case studies - Basic surface micro machining processes – Structural and
Sacrificial Materials – Acceleration of sacrificial Etch – Striction and Antistriction methods –
LIGA Process - Assembly of 3D MEMS – Foundry process.
PART - A
Q.No Questions BT Level Competence
1. 3 Apply
Illustrate about Anisotrophic Wet Etching.
2. Define Native Oxide. 1 Remember
3. Explain about Plasma Etching. 4 Analyze
4. Name the substrate materials for LIGA process. 1 Remember
5. Define Photoresist materials. 1 Remember
6. Describe Electroplating in LIGA process. 2 Understand
7. Explain the Principle of SLIGA process. 5 Evaluate
8. Name the major Categories of processes for Bulk Silicon 1 Remember
Etching.
9. Discuss the term TMAH. 2 Understand
10. Define Sputtering. 1 Remember
11. Tell about the unit process required in Surface 1 Remember
Micromachining.
12. Give the applications of DRIE. 2 Understand
13. Express about SOI Wafer. 2 Understand
14. Illustrate about DRIE process. 3 Apply
15. Design the Electrochemical Etch Stop Layer. 6 Create
16. Develop the points about Surface Micromachining. 6 Create
17. Explain the term Bulk Micromachining. 4 Remember
18. Classify the types of Etching process. 3 Apply
19. Explain about Etching process. 4 Analyze
20. Summarize the advantages in Surface Machining. 5 Evaluate
PART - B
1. (i) Describe about the rules of Anisotrophic Etching in 2 Understand
Simplest Case. (8)
2
(ii) Describe about the rules of Anisotrophic Etching in
Complex Structures. (8)
2. Demonstrate the chemicals for wet anisotrophic etching. 3 Apply
(16)
3. Explain about materials selection criterion for two layer 3 Apply
process. (16)
4. Discuss in detail about the thin film by low pressure 2 Understand
chemical vapour deposition. (16)
5. Rewrite short notes on: 6 Create
(i) Gas phase etchants. (8)
(ii) Acceleration of sacrificial etch. (8)
6. Explain in detail about LIGA process. (16) 4 Analyze
7. (i) Deduce the limitations in micromachining. (8) 4 Analyze
(ii) Summarize the advantages in surface machining. (8)
4
8. Explain in detail about surface micromachining 4 Analyze
cantilever beam. (16)
9. Discuss in detail about micro motor fabrication process 3 Apply
in first pass and second pass. (16)
10. Describe about: Remember
(i)Three dimensional structure with surface 1
micromachining. (8)
(ii) Stiction and anti-stiction methods. (8)
11. (i) Describe the Working principle of Sputtering. (8) 1 Remember
(ii) With an example show where and how Deep 1
Reactive Ion Etching (DRIE) is done. (8)
12. With neat sketches, describe the principle the following 1 Remember
micromachining techniques.
i.Bulk micromachining. (8)
ii.Surface micromachining. (8)
13. Discuss in detail about the Assembly of 3D MEMS with 2 Understand
any one Applications. (16)

14. Describe about a Modular CMOS foundary process for 1 Remember

Integrated Piezoresistive Pressure Sensor. (16)
 VALLIAMMAI ENGINEERING COLLEGE
SRM Nagar, Kattankulathur – 603 203.

DEPARTMENT OF ELECTRICAL AND ELECTRONICDS ENGINEERING

QUESTION BANK
SUBJECT : EE6007 MICRO ELECTRO MECHANICAL SYSTEMS
SEM / YEAR: VII / IV
UNIT V - POLYMER AND OPTICAL MEMS
Polymers in MEMS– Polimide - SU-8 - Liquid Crystal Polymer (LCP) – PDMS – PMMA –
Parylene – Fluorocarbon - Application to Acceleration, Pressure, Flow and Tactile
sensors- Optical MEMS – Lenses and Mirrors – Actuators for Active Optical MEMS.

PART - A
Q.No Questions BT Level Competence
1. How the polymers are being classified? 4 Analyze
2. Explain about polymer material. 3 Apply
3. Differentiate thermo plastic polymer and thermal setting 4 Analyze
polymer.
4. Define polymide. 1 Remember
5. Give the mechanical properties of polymers differ from 2 Understand
metal and semiconductor.
6. Express about SU-8. 2 Understand
7. Describe about LCP. 1 Remember
8. Illustrate about PDMS. 3 Apply
9. Define the term PMMA. 1 Remember
10. Rewrite about fluorocarbon. 6 Create
11. Point out the term bio degradable polymer material. 4 Analyze
12. Generalize the term polycarbonate. 6 Create
13. Define pressure sensor in polymer MEMS. 1 Remember
14. Give the principle behind multimodal polymer based 2 Understand
tactile sensor.
15. Express the term viscoelastic creep. 2 Understand
16. Deduce the maximum tensile strength for polymers. 5 Evaluate
17. Classify the families of polymers. 3 Apply
18. Summarize the properties of Teflon. 3 Apply
19. List the actuators for optical MEMS. 1 Remember
20. Define optical mirrors. 1 Remember
PART - B
1. Describe the short notes on 1 Remember
(i) Polymide. (8)
(ii) LCP. (8)
2. (i) Explain in detail about PDMS with case study. (8) 4 Analyze
(ii) Write short notes SU-8 and Parylene. (8) 6 Create
3. (i) Describe about the fabrication process of silicon 2 Understand
accelerometer with Parylene beams. (8)
(ii) Explain in detail about schematic diagram of LCP
polymer flow sensors. (8) 5
Evaluate
4. Give the fabrication steps in Parylene surface micro 2 Understand
machined pressure sensor. (16)
5. Discuss the catergories and Sources in Optical MEMS. 2 Understand
(16)
6. Describe about Optical MEMS from Micromirrors to 1 Remember
Complex Systems. (16)
7. kDeduce the role of MEMS as Secondary Storage in 5 Evaluate
Computer System. (16)
8. Demonstrate the Active Micro-Actuators for Optical 3 Apply
Modulation based on a Planar Sliding Triboelectric
Nanogenerator. (16)
9. Illustrate about Optical Applications of MEMS Devices. 3 Apply
(16)
10. Explain the Principle of Operation of a Typical 4 Analyze
Micromirror. State how micromirror technology is
applied in Scanning Electron Micrograph. (16)
11. Discuss about pneumatic controlled PDMS valve. (16) 2 Understand
12. (i) Describe about fabrication process for a parylene 2 Remember
channel. (8) 1
(ii) Write short notes on Fluorocarbon and PMMA. (8)
13. Explain the top and cross-sectional view of Parylene surface 4 Analyze
micromachined membrane with integrated metal resistors.
(16)
14. Describe the following as applied to DNA chip: 1 Remember
i. Basic microarray. (3)
ii. Principle of microarray. (4)
iii. Uses and Types of microarray. (4)
iv. Any one fabrication Technology for microarray. (5)