A

SEMINAR REPORT(Review-1)

ON

SURFACE MOUNT TECHNOLOGY

BACHELOR OF TECHNOLOGY

In

Electrical & Electronics Engineering

By

NITIN PANWAR

Enrolment No. 02311504920

BHARATI VIDYAPEETH’S COLLEGE OF ENGINEERING,

A-4, Paschim Vihar, Main Rohtak Road, New Delhi – 110063

 INTRODUCTION
The present methods of manufacturing conventional electronic assemblies have essentially
reached their limits as far as cost, weight, volume, and reliability are concerned. Surface
mount technology (makes it possible to produce more reliable assemblies at reduced weight,
volume, and cost. SMT is used to mount electronic components on the surface of printed
circuit boards or substrates. Conventional technology, by contrast, inserts components
through holes in the board. This deceptively simple difference changes virtually every aspect
of electronics: design, materials, processes, and assembly of component packages and
substrates.

The surface mount concept isn't new. Surface mounting has its roots in relatively old
technologies such as flat packs and hybrids. But the design and manufacturing technologies
used previously generally are not applicable to the surface mounting done today. The current
version of SMT requires a complete rethinking of design and manufacturing, along with a
new SMT infrastructure to develop and sustain it. Electronics assembly originally used point-
to-point wiring and no substrate at all. The first semiconductor packages used radial leads,
which were inserted in through holes of the single-sided circuit boards already used for
resistors and capacitors. Then Fairchild invented dual inline packages (DIPs) with two rows
of leads. These packages could be wave-soldered along with other components such as
resistors, capacitors, vacuum tubes, or vacuum tube socket leads.

In the 1950s, surface mount devices called flat packs were used for high-reliability military
applications. They can be considered the first surface mount packages to be mounted on
printed circuit boards. However, the flat-pack devices had to be mounted too close to the
board surface, required gold-plated leads, were very costly, and required discrete soldering.
 Current Technologies and Trends

SMT, short for surface mount technology, is a method that attaches electronic components to
the surface of a PCB. Basically, it solders SMC (surface mount components) onto the boards
through reflow soldering.

Process of SMT manufacturing

Flow chart of SMT process

1. Material preparation and examination

Prepare the SMC and PCB and exam if there’s any flaws. The PCB normally has flat, usually
tin-lead, silver, or gold plated copper pads without holes, called solder pads.

2. Stencil preparation

Stencil is used to provide fixed position for solder paste printing. It’s produced according to
the designed positions of solder pads on PCB.

3. Solder paste printing

Solder paste, usually a mixture of flux and tin, is used to connect the SMC and solder pads on
PCB. It’s applied to PCB with the stencil using a squeegee on a angle range from 45°-60°.

4. SMC placement

The printed PCB then proceed to the pick-and-place machines, where they are carried on a
conveyor belt and the electronic components are placed on them.

5. Reflow soldering

Soldering oven: after SMC was placed, the boards are conveyed into the reflow soldering
oven.

Pre-heat zone: the first zone in oven is a pre-heat zone, where the temperature of the board
and all the components is raised simultaneously and gradually. Temperature ramp up rate in
this section is 1.0℃-2.0℃ per second until it reaches 140℃-160℃.

Soak zone: the boards will be kept in this zone on temperature from 140 ℃-160 ℃ for 60-90
seconds.

Reflow zone: the boards then enter a zone where the temperature ramp up at 1.0 ℃-2.0 ℃ per
second to the peak of 210℃-230℃ to melt the tin in the solder paste, bonding the component
leads to the pads on the PCB. The surface tension of the molten solder helps keep the
components in place.

Cooling zone: a section to ensure solder freezes at exit of heating zone to avoid joint defect.

If the circuit board is double-sided then this printing, placement, reflow process may be
repeated using either solder paste or glue to hold the components in place.

6. Clean and inspection

Clean the boards after soldering, and check if there’s any flaws. Rework or repair the defects
and store the products. Common equipment related to SMT include magnifying lens, AOI
(Automated Optical Inspection), flying probe tester, X-ray machine, etc.
 Market Trends of Surface Mount Technology Industry
Passive Components to Hold Significant Growth

Smaller passive component assemblies made possible by SMT make electrical devices that
are portable and lightweight possible. The trend toward further downsizing is focused mainly
on passive components (resistors and capacitors), where component sizes of 01005 and 0201
(metric) with dimensions of 400 x 200 mm and 300 x 150 mm will be addressed. Due to this,
there is a significant demand for research to assist the industry in incorporating these
components into their product designs.

Moreover, when used in PCB manufacturing with passive components, SMT helps to save
more space. Additionally, this technique allows for placing more components on a PCB.
SMT has enabled PCB producers to create tiny and intricate boards. Advanced electrical
gadgets are then produced using these boards.

Regarding PCB design and material, the surface mount technique offers more flexibility.
Additionally, surface-mount passive electrical parts are soldered directly to the PCB surface.
As a result, this gives PCB boards a lot of versatility.

However, the market for passive and connecting electronic sound components have been
negatively impacted by the growing complexity of passive and interconnecting sound
components, the decline in global commodity costs, and the most recent COVID-19
epidemic. But for the anticipated term, the growing need for networking and storage devices
in data centers, demand for security cameras, robots in industrial applications, and sensor-
based devices would create enormous potential for the Surface Mount Technology
Equipment Market.

For the lowest possible production cost, it is essential to mass-produce electrical circuit
boards in a very mechanical way. Surface mount technology (SMT) offers the advantages of
increased package densities, greater reliability, and lower cost for the passive components
than the plated through-hole insertion procedure. The most frequently utilized process for
low-cost, high-production consumer electronic assemblies is SMT, which is fueling market
expansion.

SMD capacitors and resistors make up the majority of passive surface mount components. As
technology has made it possible to produce and use smaller components, there are now fewer
standard sizes. Because the leading figures are substantially lower than most leaded resistors,
caution must be taken when utilizing surface mount resistors to prevent power dissipation
levels from being exceeded.

Surface-mount resistors and surface-mount capacitors are two of the most used components.
These SMD resistors and capacitors are housed in tiny, small-format rectangular packages.
Billions of small surface-mount capacitors are used in all mass-produced electronic devices.
Surface mount capacitors often come in the form of tiny rectangular cuboids with dimensions
created according to industry norms. Numerous technologies, including multilayer ceramic,
tantalum, electrolytic, and some less popular types, may be utilized in SMCD capacitors.

Asia Pacific is Expected to Witness Fastest Growth

The market for surface mount technology is growing significantly in the Asia-Pacific region,
mainly due to the presence of various PCB production facilities in the region. China is home
to many PCB production facilities. AT&S's most significant production unit is located in
Shanghai, focusing on multi-layer PCBs. This is because the company focuses on large
volumes of mobile communications customers in China.

Due to increasing urbanization, industrialization, more significant investment in innovative &

efficient technologies, and rising per capita income, the Asia Pacific area is anticipated to
increase throughout the forecast period, with India, China, and Japan contributing the
majority of the growth.

Additionally, the APAC region's consumer electronics market is growing significantly due to
technological advancements and developments that give customers access to increasingly
sophisticated features like fingerprint sensors in smartphones and smart televisions, among
others. Smaller electrical components that take up less space have been developed in response
to the growing need for downsized devices. This is only achievable if the device's physical
components, such as the PCB, are compact and have smooth operation even when combining
multiple features. Creating an electrical device is complex since numerous elements must be
considered, especially with surface mount technology.

Increasing smartphone adoption rates have made Asia-Pacific one of the largest mobile
markets in the world. This is due to increasing population growth and urbanization. As per
the GSM Association, more than 4 out of 5 connections will be smartphones by 2025. This
trend is expected to increase the adoption of surface mount technology among consumer
electronics in the region.

The increasing wireless communication standards and the rising demand for 3G/4G networks
are boosting the demand for SMT in the telecommunications sector. China is one of the
world's fastest-growing economies, and its market for SMT is expected to grow primarily
because of the vast number of SMT manufacturing companies. The growth of the SMT
market is also driven by the development of electric vehicles in the automotive sector in the
APAC region.

Additionally, due to the semiconductor industry's cyclical return of growth and the expansion
of equipment manufacturers operating in the region, the Asia-Pacific semiconductor
manufacturing equipment market is anticipated to have strong growth. The development of
the electronics and semiconductor industries, particularly in China, can be blamed for the
regional market expansion. SMT process demand rose due to the established electronics
manufacturing hubs in China, South Korea, and Taiwan.
 Problems Faced in Surface Mount Technology

Solder Bridging

Soldering that causes bridging across two electrical conductors that should not otherwise be
connected results in electrical shorts. The main issue arises in the solder paste printing
process where it generates excess solder. Print or stencil arrangements can get off sometimes
and cause wrong soldering on the PCB pad.

High temperatures, moisture and cold slump also build the bridge on the pad. Solder paste in
the pre-heat stage can cause bridging as well. Therefore, incorrect positioning of stencils,
component placement pressure and an extra moist environment must be avoided. The solution
to this is to reduce stencil aperture dimensions by 10-15%. You could also try reducing the
thickness of the stencil to see if it makes any difference.

Solder Balling

The first step to prevent this issue is to create a coarse powder rather than fine powder
because the latter can slump easily. Any humidity and moisture in the facility should also be
reduced so that the manufacturing process yields maximum quantity and quality. Once these
factors are in check, clean the bottom of the stencil as the smear may also build solder balls.

Tombstoning

Solder balling is the development of tiny ball-like particles on the board. These particles
isolate from the main solder body and may cause electrical disruptions. Big-sized solder balls
can make a bridge between two components and lead to functional issues in the circuit.
Moisture is the biggest culprit in this case because it saturates during the reflow process and
creates these solder balls.This error is also known as the “Manhattan Effect.” Tombstoning
happens when the component rises from one end as if it’s rising from the dead. This typically
occurs when the chip is partially or completely off the board. Only one end of the chip is
soldered, which causes vertical or horizontal lift.Uneven heat distribution is one of the causes
behind the lift as the solder melts at different rates. One side reflows quicker while the other
takes longer to melt. Temperature and humidity differences in the solder paste can also cause
component misalignment. Improper placement of components before heat reflow can also
cause unbalanced soldering.Ideally, the component must touch 50% of both sides to avoid
imbalance. Minimizing exposure to heat and humidity should also help.
Insufficient Solder

When the amount of solder paste is less than operating design, it creates a fillet on the
component leads. Also, stencil apertures sometimes accumulate dried solder paste which
blocks the aperture. All of this leads to insufficient pressure being applied during the printing
process. It may also result in the scooping of the paste on the pads. The low viscosity of
solder paste is another cause of this issue.

If there is a large stencil aperture, consider dividing it into smaller apertures and keep tabs on
it to avoid pressure buildup. Clean the stencils at intervals and ensure that there’s adequate
support on the board.

De-Wetting and Poor Wetting

De-wetting is a solder joint condition where the “fluid solder” is not properly adhered with
one of the available components. One of the reasons for this is a lengthy soaking time in the
reflow process. Reducing the overall profiling time before the reflow process can help
prevent de-wetting.

Some solder materials can also cause poor wettability when placed on copper. This is why
surface finishes mostly go on conductors. Silver, tin and ENIG surfaces respond the best and
help avoid wettability. When peak soldering temperature is in the right range, wettability
further decreases. The temperature must be checked with a test sample before full-scale
production kicks off.

Circuit Board Damage

The movement of nozzles might build electrostatic charges on their tips, which can damage
the circuit board. It is a common error that damages the components when they’re being
placed. Manufacturers have to take caution when using these nozzles and during the pick-
and-place step.Choosing the right nozzle supplier can put an end to this mess and enable
smooth manufacturing. However, with so many manufacturers out there, it can be challenging
to choose the right one. Ask about the materials they use and how they react with electrostatic
charges. Check reviews from past customers. Consider other factors like warranty, exchanges
and production capacity as well. If your supplier is not stocked ahead of a big order, it might
be best to contact another company.
 Social And Environment Problems Of SMT Technology
Surface Mount Technology (SMT) has brought about significant advancements in electronics
manufacturing, but it is not without its social and environmental challenges. Here are some of
the key problems associated with SMT technology:

Social Problems:

1. Job Displacement and Skill Requirements:

 Automation in SMT can lead to job displacement for workers who are skilled
in traditional assembly methods. The shift towards automation also requires a
workforce with specialized training in operating and maintaining SMT
equipment.

2. Worker Health and Safety:

 The use of certain chemicals, such as fluxes and cleaning agents, can pose
health risks to workers if not handled properly. Adequate safety measures and
training are essential to mitigate these risks.

3. Labor Rights and Working Conditions:

 In some regions, especially in low-cost manufacturing hubs, there have been

concerns about inadequate labor rights and working conditions in SMT
facilities. Issues such as long hours, low wages, and lack of worker protections
may arise.

4. Supply Chain Exploitation:

 The demand for cost-effective components can sometimes lead to exploitation

of labor in the supply chain, particularly in countries with less stringent labor
regulations.

Environmental Problems:

1. Chemical Usage and Disposal:

 SMT processes involve the use of various chemicals, including fluxes, solder
pastes, and cleaning agents. Improper disposal or mishandling of these
chemicals can lead to environmental contamination.
2. Waste Generation:

 Electronic manufacturing, including SMT, generates electronic waste (e-

waste) when products reach the end of their lifecycle. Inadequate recycling
and disposal of e-waste can lead to environmental pollution.

3. Energy Consumption:

 The energy-intensive nature of SMT processes, particularly during reflow

soldering, contributes to overall energy consumption. Manufacturers may not
always use energy-efficient practices.

4. Resource Depletion:

 The production of electronic components requires the extraction of raw

materials, including metals and rare earth elements. This can lead to resource
depletion and environmental degradation, particularly in regions with lax
environmental regulations.

5. Carbon Footprint:

 The carbon footprint of electronic devices, including those produced using

SMT, encompasses the entire lifecycle from manufacturing to usage and
disposal. Efforts to reduce this footprint are crucial for sustainable electronics
production.

6. Eco-Toxicity:

 Some of the materials used in SMT, such as certain types of lead-free solder,
may pose environmental risks if not handled or disposed of properly.

7. Transportation Impact:

 The global nature of electronics manufacturing can lead to significant

transportation-related emissions due to the movement of components and
finished products across regions.