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A Japan

T Asia
ELCB Power Coordinating
or Reactor 1
*
Three-
MCCB U X *5 R/L1
Phase V Y
Power
Supply W Z
S/L2
*2
T/L3 Motor
Current U/T1
Suppression V/T2 M

X
*R
Reactor 1
W/T3
R/L1
*5 Y S R1000 *4
S/L2
*2 + + 1
Z T T/L3 Regenerative Ground

Fuse
* 1 Unit - -
Drive
r1/ 11
(A1000/Varispeed G7)
1/ 21
t1/ 31
*3
Ground
Option card
connectors Multi-function relay
M1
CN5-C output (During MC on)
M2 250 Vac, max. 1 A
30 Vdc, max 1 A
CN5-B (min. 5 Vdc, 10 mA)

CN5-A
Control Circuit

Forced operation command S1


S2 P1
Automatic operation command Multi-function photocoupler output 1
(Power Regenerative Unit Ready)
External fault S3
48 Vdc, max 50 mA
Fault reset S4
Multi-function
digital inputs (Reserved) S5 P2
(default setting)
S6 Multi-function photocoupler output 2
(Reserved) (During Run1)
(Reserved) S7 PC 48 Vdc, max 50 mA
External S8
Baseblock
SC

+24 V
*6 Sinking/sourcing jumper (S3) (Sinking mode)
E(G) MA Fault relay output
250 Vac, max. 1 A
MB 30 Vdc, max 1 A
Shield ground terminal
(min. 5 Vdc, 10 mA)
MC
Power supply
+V +10.5 Vdc, max. 20 mA

(Reserved) A1 Analog Input 1


(Reserved) A2 Analog Input 2
DIP Switch S1
(Reserved) A3 Analog Input 3
V I
AC

-V
Power supply, -10.5 Vdc,
max. 20 mA
FM
Termination resistor
- FM +
Multi-function analog output 1 7
-10 to +10 Vdc, 2 mA
*
(120 Ω, 1/2 W) (Power Supply Side Power 0 to +10 Vdc)
DIP
Switch S2
R+
AM
MEMOBUS/ R- AC -AM +
Multi-function analog output 2
-10 to +10 Vdc, 2 mA *7
Modbus comm. S+ (Power Supply Side Current 0 to +10 Vdc)
RS-422/RS-485 S- 0V
max. 115.2 kbps IG E(G )
Flywheel diode

Coil
External power
48 V max. (50 mA max.)
W1 4-d t2
H1
H

t1
D1
W D
H2

10 max. 10 max.
W1 W1

1. 5
W1
1. 5

4-d 4-d 4-d t2

H1

H0
H
H1
H1

H0
H
H

H2

H3
t1 t1
t1 D1
D1

H2
D1

H3
8 max. 8 max.
H2

W D W D W D
Terminal × 6 (M) Nameplate

U V W
C

X Y Z
I

D H
F E
A B
Mtg. hole × 4 (J) B1
L
K

Mounting hole
specifications

A
D D
40 Nameplate

U V W
4
C

X Y Z
I
L E
K

Mounting hole H
specifications
B
B1

A
M4 Nameplate
UXVYWZ
C

D E
F H
B
L
K

Mounting hole
specifications

Terminal × 6 (M) Terminal × 6 (M) Terminal × 6 (M)


Nameplate Nameplate
XRYSZT
29

Nameplate
R S T
X Y Z
X Y Z
C

C
C

R S T
I

D H D H D H
F E F E F E
A B A B A B
B1 B1
Mtg. hole × 4 (J) Mtg. hole × 4 (J) Mtg. hole × 4 (J)
L L L
K
K
K

Mounting hole Mounting hole Mounting hole


specifications specifications specifications
Top cover * Side Clearance Top/Bottom Clearance
Fully-enclosed panel
Top cover* 50 mm min. 120 mm min. Airflow
60˚C Air temperature
at top of panel
−10 to +60° C
Heatsink
Heatsink
IP00/IP20
R1000 Attachment for
Bottom cover external heatsink
R1000 Intake air (Option)
temperature
50˚C −10 to +50˚C
50 mm min. 120 mm min. Airflow
Ambient temperature 50˚C
30 mm min.
H1
H

W1
W
D1 D2

Drill hole × 4 (d1) 2-5 dia. mtg. hole


H4

Drill hole × 4 (d1)


H3

a b a
a a
H2

H2
H1
H
B

H1
H
B

W3 A W3
W3 A W3
H3

W2 W2
H4

b W2 W2

a a
a a
H4

W1
H5

W1
W
W
24 V power R1000
supply option

CN1 CN19

+24 V power supply 24


(UL-listed class 2) 0
FE
12. 2 1.6 Mtg. hole, M3 × 2 screw ( depth 5)

78
90

15
60 7. 9 44

50 min. Communication cable connector

M4 × 10
truss head
screw
M3 × 6
pan head
screw

13.9
min.50

M4 nut

M3 × 6
pan head
screw

13.9
min.50

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