Security Level:

HiSilicon Wireless Chipset Presentation

Tokyo, 25th Jun., 2012 www.hisilicon.com

HISILICON TECHNOLOGIES CO., LTD.

Contents
• HiSilicon Overview

• Strategy & Roadmap

• Balong Cases Sharing

HISILICON TECHNOLOGIES CO., LTD. Page 2

HiSilicon Profile
• Founded in 2004 • 4000+ staffs
• IC fables company

Chipset Portfolio
Worldwide R&D Centers
Cellular Modem …
Shenzhen, China
• ABB/PMU/SOC platform Balong
• IP/Backend design/Package
USB Dongle Mobile WiFi CPE Wireless Dongle
* Balong is the family name of Modem
Shanghai, China
• G/U chipset solution
• RFIC/RF subsystem App Processor
• Application processor …
K3 Tablet DPF
Beijing, China
Smart Phone
• GUL chipset solution * K3 is the family name of application processor

USA
• RF technology Multimedia …
• RFIC Video Surveillance IPTV STB TV

Sweden
• Wireless algorithm
• Advanced wireless technology Infrastructure 2G/3G/LTE …
Optical Datacom Access

HISILICON TECHNOLOGIES CO., LTD. Page 3

HiSilicon Solution Serving Customers all over the World

Portfolio
Device Type
 GSM/GPRS/EDGE
 HSDPA / HSUPA  USB Dongle
 HSPA+  Mobile WiFi
 LTE 100+ countries, 200+ Operators  CPE

HISILICON TECHNOLOGIES CO., LTD. Page 4

Contents
• HiSilicon Overview

• Strategy & Roadmap

• Balong Cases Sharing

HISILICON TECHNOLOGIES CO., LTD. Page 5

 Challenges Wireless Chipset Platform is Facing

• Wireless technology evolution • Multimode for legacy • Powerful CPU/GPU

technology

• Smaller and thinner terminals • Lower Power consumption and lower

eBOM
<8mm

20*20 mm2 65*24.5 mm2

HISILICON TECHNOLOGIES CO., LTD. Page 6

HiSilicon Wireless Chipset Strategy

Key Technologies Variety of Devices

Wireless Terminal Chipset Solution
Tablet
 Advanced wireless technology

 Processor technology and

Smart Phone
Application
architecture(DSP, GPU, SDR, etc）
Processor
 RFIC&RF Subsystem technology
USB Dongle
Smart Phone
 Connectivity（WIFI, GPS/BT, FM、NFC） Solution
 High performance ADC/DAC Mobile WiFi
MBB MODEM
 Low power circuit and system design

 Semiconductor process and package CPE

technology
Module

HISILICON TECHNOLOGIES CO., LTD. Page 7

 HiSilicon Wireless Chipset Roadmap

TD-LTE/LTE FDD/TD-SCDMA/WCDMA/EDGE/GPRS/GSM
TD-LTE/LTE FDD  USB Dongle Smartphone
Solution  CPE  MiFi Tablet
 USB dongle  CPE PC Module

 LTE TDD 1.9G/2.3G/2.6G/3.5G
RFIC
 LTE FDD 800M/2.6G/1.8G
 TD-LTE 1.9G/2.3G/2.6G/3.5G
 LTE FDD 2.6G/1.8G/900/800/700/AWS
 GSM 850/900/1800/1900
 UMTS 2.1G/1.9G/900M/1.7G/1.5G
TD-SCDMA 1.9G/2.1G/2.3G

Balong 700 Balong 710

 TD-LTE/LTE FDD R9
Modem  TD-LTE/LTE FDD R8 CS: 2010Q4  TD-SCDMA  40nm
 65nm  UMTS/DC-HSPA+MIMO CS :2012Q2
GSM/GPRS/EDGE

2010 2011 2012

HISILICON TECHNOLOGIES CO., LTD. Page 8

The Fastest Chipset Solution released in MWC 2012

Multi-Mode
 LTE FDD/LTE TDD/WCDMA/TD-SCDMA/GSM

High Performance
 Cat4(150M/50M)
K3V2 Balong 710  DC+MIMO(84M/23M)
 4 Core @1.5GHz
160 150
 16 Core Super GPU/64-bit Memory System
140
120 112

100 84 Low Power Consumption

80 DL(Mbps)
60 50 UL(Mbps)
40 30
23
20 Global Band
0
 200M~6GHz
TD-LTE Cat4@20MHz LTE FDD Cat4@2*20MHz DC+MIMO@2*10MHz

LTE Cat4/3G DC+MIMO

HISILICON TECHNOLOGIES CO., LTD. Page 9

Balong 710-1st Platform to Support LTE Cat4 and 3G DC+MIMO

DC+MIMO Downlink demonstration

Downlink 82Mbps at Shanghai with
Huawei network

Mode Balong 710

LTE FDD@2*20MHz 150/50M

LTE FDD@2*10MHz 75/25M

LTE TDD(2:2)@20MHz 82/20M

LTE FDD: Downlink 148Mbps with LTE TDD: Downlink 109Mbps with Uplink
LTE TDD(3:1)@20MHz 112/10M
Uplink 45Mbps simultaneously with 8Mbps simultaneously with Band
Band 7@20MHz 38@20MHz

HISILICON TECHNOLOGIES CO., LTD. Page 10

View of VoLTE Market Window

Target LTE mobile voice

VoIMS/SRVCC Commercial LTE VoIMS Handset

• IMS based VoLTE

• Single Radio Voice continuity(SRVCC) support handover to 2G/3G

Initial LTE voice Solution

LTE Data with CS Voice, 2011H2
Early LTE Handset
• Simultaneous Voice and LTE
• CS Fallback (CSFB )

Initial LTE Solution

Data Only Devices, 2011H1
LTE CPE/USB Dongle

• No Voice or VoIP

2011 2012 2013 2014

HISILICON TECHNOLOGIES CO., LTD. Page 11

LTE Voice Solution

CSFB Dual Radio SRVCC

VoCS VoCS
2G/3G 2G/3G 2G/3G
CS CS CS
CSFB VoLTE
2G/3G 2G/3G UE 2G/3G
UE

IMS
SGs Sv
Core
Dual Radio UE HO

VoIP
LTE LTE LTE
EPC EPC EPC
CSFB VoLTE
PS
UE LTE LTE UE LTE

Balong 710 can support CSFB, SRVCC and Dual Radio with different software release

HISILICON TECHNOLOGIES CO., LTD. Page 12

Contents
• HiSilicon Overview

• Strategy & Roadmap

• Balong Cases Sharing

HISILICON TECHNOLOGIES CO., LTD. Page 13

 TD-LTE demonstration in EXPO Shanghai
Expo Area Covered by TD-LTE

Applications demonstrated in EXPO

Conference Conference
Video Broadcast Video Surveillance A B
Video Conference
The First TD-LTE CPE Solution

HISILICON TECHNOLOGIES CO., LTD. Page 14

E398s: World’s 1st LTE TDD Device Certified by GCF

Fukuoka FT, 12th – 26th Sep.

E398s

4 moths Testing
E398s
Jul., 2011 Oct., 2011

• E398s, powered by Balong 700, was the 1st TD-LTE • Softbank uses E398s to do both driver test
device certified by GCF and stationary test before launching their
LTE network commercially.

HISILICON TECHNOLOGIES CO., LTD. Page 15

Balong LTE Solution Accelerated German DD800 Market

Shanghai
B1000 Expo CPE

Balong LTE B700

HUAWEI
Another Vendor

• LTE 800MHz / GSM modernization • 1st LTE deployment on DD800

B390s

• For LTE FDD, Balong-based LTE devices have been commercially launched in German TOP3 operators.
• Shipped more than 120K units since 2011.

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