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HP 655
HP 655
HP 655
HP655 ls a toughened BMI structura adhes ve des gned for meta to metal, composite to composlte and
honeycomb sandwich bonding for both co cured and precured corf]poslte skins. HP655 comb nes high
fracture toughness and h gh shear w¡th good peel strengths. Recomrnended service temperature rs up to
T Bo'C wet and 240"C dry. HP655 was deve oped to be compat b e with Hcxce 's ent re BN4l prepreg
product llne.
Featules
r Good co-cure potentia wth Hexcel's BN/l prepreg range
r r\, éllón hot ,r,q"¡ pe/o'-r d1. e
"p
r Good fracture toughness
r Low volatile content and low out gassing properties
r Ar¿rl"b p lr th o' wrlhouL d $/o.-1 g ¿. . cd'r Fr
Appl¡cations
r l,,4etal to meta bond ng
r Composite to aomposite bond ng
r Sandwichconstructrons
Form
Product Descr¡ption Areal Weights g/m' Support Roll Width mm Standard Roll m'z
lf there s to be a delay between the pretreatment and bond ng of a um nrum, the pretreated surface should
be protected wlth Redux HP655P, a tough. solvent-based adhes ve primer for improved bond ng to
Aluminium and T tan um substrates. to conserve the opt mum bonding surface. Th s will enable bonding to
be delayed lor up to 2 weeks without deteriorat¡on of the pretreated surface. The correct app icat on of
Redux HP655P shouLd not alter the bond ng performance of Redux HP655 (for fu I app cat on details
consult the re evanl data sheel).
Redux HP655PP is a BMll-based peel p y which prov des a superior surface lor pre-cured cornposite
facings for secondary bonding applicat ons lt can be used at temperatures up to 250'C.
F'E<cEL§§
Appl¡cation
1 Allow sufl c ent time for the adhesive to warrn to room temFerature (15"C to 27"C) before removtng the protect ve polythcne
2. Cut the f m to the shape and s ze requ red
3. Remove the re ease paper and poslt on the adheslve on tne preoared bonding surface.
4. Remove the poilhene backing sheet
5. Complete the jointassemby and apply prcssure while lhe odhesve s llelng cured at T40-700kN/m, For Sandwich structures
the pressure app cation shou d be selected to su t the type of core used Afte¡ the adhesive has cured ¡t s advisab e to
ma ntain pressure on the bonded asser¡ bly until t has coo ed suflic ently to be handied w thout discomfod.
Cur¡ng
Redux HP655 shou d be cured accord ng to the schedules on pages 5 and 6 to obtain optimum properties Enough t me shou¡d
be a owed for heat to penetrate through the assembled parts to ensure that the adhesive reaches that temperature before t ming
starts
Mechanical Propefties
All the performance values glven in th s data sheet are based on exper¡menta resu ts obta ned dur ng testing under laboratory
condltions. They are typ cal va ues expected for Redux HP655 prepared and cured as recommended and under the conditions
ind cated. They do not and should not constitute speciiicat on m nlma.
Na<ee§§
Compos¡te Honeycomb Sand!v¡ch Fetjormance
F atwise tens e strength us ng precured pla n weave carbon f lbre Bl\I I aminates with '1581 g ass pee -ply surf ace preparation pr or
tobondlng Honeycomb core was HFT-G 327 3/16'cell s ze (3 6 kg). Tested per ASTM C 297.
Thermal Cycl¡ng
Flatw se tensile strength us ng 6p es co'cu Ted plain weave carbon f abric BII I prepreg. Honeycomb core was H FT-G 327 3/1 6
cell slze, 3.6 kg. Adhesrve was 106/HP655 at a fi r¡ we ghi of 300gsm.
CTE,mrn/mnry''C
Temperature Range: -43 B to '163'C 35.0 x 106
163 to 250'C 39.3 x 106
250 to 302'C 11.4 x 10s
Densty g/cm3 1 249
T, Ory 2BO'C
T Wet 215'C
(DMTA,s"C/min E peak)
Storage
Red ux H P655 has been iormulated for maxlmum storage ife consistent w th ls high pelormance. Certain precautions,
however, w I heLp to enhance that storage fe as follows.
1. When stored at room te¡¡perature ( ess than 27'C) it should be kept on a hor zontal mandrel passed through the lube
core on which the rollis wound. This avoids the r sk of loca th nning ofthefilm underthewe ght ofthe ro
When stonng under refrigerat on the or glna packaging should be reta ned f poss ble When returnlng to the reir¡gerator
after use it is essentia to protect the lilm w th a water vapour barr er packaglng materlal such as polythene
On w thdrawal from the refrigerator the water vapour barr er packaglng should not be rer¡oved unt the roll of adhes ve
has reached room temperature This may take up to 24 hours depend ng on lhe size of the roll and the temperature
involved (f a ure to observe this will result in the f ilm becom ng damp).
Thef nr should be handled w th care whrist n thefrozen states¡nce twl be brittleandeas lycracked
On rece pt, Redux HP655willhave astorage fe of at leasl 6 months at -18'C plus an addlt ona shop life of 2 weeks at be ow
23r
Volatile content
Red ux H P655 has a very low volat le contenl, usually well below 1 % ln practice, the oss in weight when cured is neglig b e
and erniss on of vo atiLe products s nol of practicajs gn flcance.
Assoc¡ated products
PrimerApp cat on
App y thin, unilorrn coat of prlmer to prepare meta surface using brush or spray (recomr¡end phosphoric acid anod ze
treaimentto rneta prortoprmng) Dry n310i 10"F a r forced oven for 1 5 - 30 m nutes Once plates are cool, apply
HP655 adhesive and assenrble parts to be bonded. Best resu ts will be found with a pr¡mer thickness of approximately 10
micron
H'."EL§§
Handl¡ng and safety precautions
lncornmonwlthal Redux adheslves ¡n fiim for"n. Redux H P655 is pafticularly free from hand nghazardsforthe
fo owrng reasons:
Fllm is covered on both s des by protect vc ¡eLease paperand polythene sheetwh ch are nol removed until
fina cornponent assembly. lt shoulcl be cut to shape before rernoving the ptotect ve coverinOs and v rtually
no handl ngof thefilmts necessary.
However, ihe usual precautions necessary when handling synthetic resins should beobserved. A lVaterial
Safety Data Sheet for Redux HP655 is available on request.
Raise temperature from ambient to 191'C at a rate of 3 - 6'C/m nute and a rate of 2 - 3'C/m nute above 191'C.
Reloase Certiflcatioñ
The Quality System at Hexcel Composites Duxford has been certified to ISO 9O0l by Lloyd's Reglster
Quality Assurance, and is approved by the UK Civil Aviation Authority and Ministry of Defence. Certificates
of Conformity and Test Reports can be issued for batches of Bedux HP655 on request.
lmporlant
A I nformat on is be ieved to be accurate but s g ven wthoul acceptance of liabil ly Users should make their own
assessment ol the suilabrl¡ty of any producl for the purposes required. All sales are made subjecl to our standard terms
of sale whích include limitations on liability and other rmportant terms.
"'CopyrightHexcc Composiles
Pubiicalion RTA 076b (March 2007)
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