Les défis de l’industrialisation des MEMS

Olivier VANCAUWENBERGHE

Formation EuroSAE Septembre 2017

Outline

! MEMS Applications & Markets

! MEMS vs. IC

! MEMS Business models

! MEMS: from Concept to Commercialization

MEMS & Sensors Roadmap
 Source: Yole

MEMS Maturity
MEMS in SmartPhone

Source: Mems Journal

Source: Yole
 MEMS: Medical Applications
Drug Delivery Medical Diagnostic

MEMS: Health & Sports ! Wearables

MEMS: Health & Sports ! Wearables
 Applications for High Perf. Inertial MEMS

MEMS Market Growth

Source: Yole
MEMS Market Growth

MEMS cost breakdown

MEMS Market Motor

Source: Yole

Source: Yole
 MEMS Technology
IC Technology + Micro-Machining

IC Technology
! Silicon Wafers
! Photolithography
! Doping
! Thermal Oxidation
! Thin Film Deposition
! Thin Film Etching
MEMS Specific Processes
! Micro-Machining + New substrates
+ New materials
! Wafer Bonding
+ New processes
! MEMS Packaging
+ New tests

Sensonor TPMS: Tire Pressure Monitoring System

New Substrates
Glass

Quartz

Plastic
 New Materials
Mechanical
• LS-PolySi

• LSN
• Metal (Ni)
• a-Si

• Su8, PDMS, …

Active
• PiezoElec: AlN, PZT,
• Magnetic

New Processes
Double sided Photolitho Anti-Stiction Release

→ HF vapor etch

→ Supercritical CO2 drying

MEMS µMachining Roadmap

DRIE - Evolution
DRIE - ARDE
ARDE: Aspect Ratio Dependent Etching

Design dependent
⇒ Each new design involves
process adjustment or complete
development

Wafer Bonding
 Alignment for Bonding

MEMS Packaging
MEMS Chip Level Packaging

MEMS Waver Level Packaging

Wafer Level Packaging WLP

Through Silicon Vias (TSV)

TSV for MEMS

Source: Yole
Advanced WLP

Source: Murata Fi (VTI)

Getters

a) Trapped molecules
b) Desorption
c)! SAES by getter
Absorption

!NanoGetters
MEMS Assembly

MEMS Accelerometer MEMS Gyro

Sensonor TPMS: Tire Pressure Monitoring System

Complex Assembly
 Source: Yole

MEMS Testing
Static (under environment)
Structural (e.g. stress)

Dynamic
MEMS Foundry Toolbox

MEMS Process Adoption

 The MEMS law

One product, One process, One Package

 Top 30 MEMS Players: Positioning

Source: Yole

MEMS Business Models

Evolving Models and Examples:

• In-house – Bosch, Kionix, STMicroelectronics

• Fablite – Analog Devices, Knowles

• Fabless – InvenSense

• Specialty MEMS Fabs – Silex, IMT...

• CMOS-MEMS Hybrid – TSMC, GLOBALFOUNDRIES

MEMS Makers Business Models

Fabless: MEMS vs. IC

MEMS: Fabless vs. IDM

Example: MEMS Gyro

MEMS in Mobile

MEMS: Standardization (or lack of)

Two Challenges to Tackle

MEMS Development
 MEMS Development Time Line

MEMS Development Time

Entrepreneurs can now leverage industry specialization and

infrastructure to shorten time to market

Source: A.M. Fitzgerald

MEMS Law … changing
TDP for MEMS

MEMS TDP Template

Development phases

MEMS examples of TDP

The Existing MEMS Foundry Model

The Emerging MEMS Foundry Model

MEMS Standard Process Platforms

Silex
IMT

But many others …

ST - Thelma

But some others …

 “Two Universal MEMS process”
MIDIS from Teledyne DALSA

M&NEMS from LETI

Electronic Engineering Journal

August 26, 2013

But many others …

RocketMEMS
 RocketMEMS Philosopy

As a few others …

Conclusion
• Today, MEMS fabrication is still very diversified without standarization:

→ The Yole MEMS rule “one product, one process”

still is the predominant rule

• MEMS has a different story and do not follow a roadmap as the IC industry does.

• After 50 years of development, the MEMS industry keeps innovating in

processes and the MEMS equipment & materials market will keep growing.

• MEMS take typically 20-30 years from research to commercialization

MEMS standardization will never happen (only partially),

but MEMS players are continuously optimizing their own
technological platforms, so as to speed up time-to-market.
Main Sources
• Yole development
• IHS iSuppli

• MEMS Industry Group

• iNemi

• MEMS Journal Inc.

• Silex
• A.M. Fitzgerald
• Teledyne Dalsa

• SPP Complete references

• Suss available upon request