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Senior Design Final Project Presentation
Senior Design Final Project Presentation
Audio
Processing Unit
Presented by: Dustin Funk and
Dustin Pegalee
1
Dustin Pegalee
• A.S. in Audio Engineering
• B.S. in ECET – Electrical Systems
Candidate
• Music Producer
• Pro Tools Certified
• Music Festival Enthusiast
2
DP
Dustin Funk
• Audio Engineering Technical
Certification
• Professional Sound Technician
• IT Professional
• Wedding DJ
• BSECET Candidate
3
DF
OBJECTIVES COVERED IN TODAY’S PRESENTATION
▪ Introduction ▪ Breadboard Testing
▪ Our System ▪ PCB Design
▪ Engineering Requirements ▪ Soldering
4
DP
5
INTRODUCTION
DP
Introduction (cont.)
Some examples of equipment
include:
◦ Laptops
◦ Speaker systems
◦ Lighting
◦ Etc.
Other things they worry about
◦ Flights
◦ Venue Rentals
◦ Space and Setup
DP
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7
Current Trends
Preamps
Primary function
Limited filtering
Filters
DAW plugins
Rackmount Studio gear
Built-in filters with specific center
frequencies
Compressors
Rackmount Studio gear
DAW plugin
DF Guitar gear
Our System
3-in-1 Audio Signal Processing
Compact Design
The device shall:
◦ Amplify microphone output
◦ Compress audio signal
◦ Filter out low and high
frequency noise
◦ Shape sound using adjustable
equalizer
DF
8
Engineering Requirements
Priority “The device shall have …” Verification
Audio preamplification with a Input and Output waveforms on
max of 70dB with a 30 Hz HPF oscilloscope
Noise-filtering low-pass/high-pass
filter with fixed 20kHz LPF and AC Sweep using Spectrum
selectable 70Hz/100Hz HPF Analyzer
Dynamic range compression with
a threshold up to 6V, ratio from Real-time signal analysis on
1:1 to inf, attack time from 3ms oscilloscope
to 25ms, and release time from
95ms to 180ms.
High Sound-shaping bandpass filter
with a ± 12dB adjustable gain AC Sweep using Spectrum
with center frequencies from 100 Analyzer
Hz to 1k Hz.
Medium Input and Output gain VU meters Visual inspection
DF Low Compact footprint Can be held in one hand and fit
into a bag
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BLOCK
DIAGRAM
DP 10
FLOWCHART
DP 11
Engineering Specifications
Engineering
Block Type Components Justifications Responsibility
Specifications
12 Dual Power Convert 120VAC to Biasing Voltage for
Power Module Dustin F
Supply 12VDC active elements
70dB maximum Amplify low-level
Pre-Amplifier Op-amps,
amplification 5Hz microphone input Dustin P
Module capacitors, resistors
HPF signal
Op-amps, switch, 20kHz LPF, 70/100Hz Selective cutoff
Filter Module Dustin P
caps, resistors HPF HPF,
Op-amps, diodes,
6V max threshold, Audio compression
potentiometers,
Compressor Module 10dB max gain with adjustable Dustin F
resistors, capacitors
reduction parameters
13
DF
Power Module: Jameco Dual Power Supply Kit
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REQUIREMENT 1:
“AUDIO
AMPLIFICATION OF
70DB WITH A 30 HZ
HP”
𝑣𝑝𝑝 𝑜𝑢𝑡 23.2𝑉
𝐴= =
𝑣𝑝𝑝 (𝑖𝑛) 23.2𝑚𝑉
= 1000
𝐴𝑑𝐵 = 20 log 𝐴 = 60𝑑𝐵
• Potentiometer was
turned at about 30% to
40%.
• If gone further than
50%, signal would’ve
saturated because of
DP bias voltages. 15
Requirement 1 (cont.)
16 DP
REQUIREMENT 2: “NOISE-
FILTERING LOW-PASS/HIGH-
PASS FILTER WITH FIXED
20KHZ LPF AND SELECTABLE
70HZ/100HZ HPF”
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DP
AC SWEEP OF BOTH HPFS
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DP
AC Sweep of LPF
• Not 20k Hz
• Frequency response from preamp
(noninverting amplifier) causing an issue.
• LPF response changes depending how
much gain is coming from preamp.
DP 19
DF
Simulation testing
Initial bench test for
continuity
Oscilloscope testing
Troubleshooting
Late timeline testing of:
Attack and release testing
Audio gain reduction 20
Threshold
verification
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Compressor attack/release Verification
Peak Detector
Compressor/EQ Combined
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REQUIREMENT 4: "SOUND-
SHAPING BANDPASS Concept
FILTER WITH A ±
Simulation
12DB ADJUSTABLE
GAIN WITH CENTER Bench testing
FREQUENCIES FROM 100 HZ Dual
TO 1K HZ." Potentiometers
Troubleshooting
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24
EAGLECAD
SCHEMATIC
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PCB DESIGN
• EagleCAD was used
• Printed from JLCPCB
• Lab tech, Sabrina Hurst, assisted
us on how to use EagleCAD
• Easy to input schematic on
software
• Main concern was finding the
right footprint for each
component.
• Mostly through-hole soldering
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SOLDERING
• Majority of soldering was done at
Dustin P’s jobsite
• First step: solder all surface-
mounted parts
• Soldered in sections (module by
module)
• Soldered and wired all pots and
peripherals afterwards.
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• Checking for continuity
• Troubleshooting
• Verifying Requirements
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29
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Proposed vs. Actual Budget
Item Proposed Actual
Switches - 9.00
32
33 SUMMARY AND CONCLUSION
• What we learned
• Goals
• Limitations
• Considerations for improvement
34
THANK YOU!