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How to Design a 2 Layer Flexible PCB

Ultrasound probe 2 layer soft board

Name:Ultrasonic probe soft board

Number of layers: 2L Flexible PCB

Material: PI

Board thickness: 0.09mm

Copper thickness: 6um±1um

Minimum aperture: 50um

Size: 84mm*168mm

Surface treatment: electroplating soft gold

Application: Medical

Features: ultra-thin copper, micro-holes, appearance of zero defects FPC

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Introduction

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Flexible printed circuit boards (PCBs) allow circuitry to bend and flex to

accommodate different shapes and motions. A 2 layer flex PCB contains a

single flexible dielectric layer sandwiched between 2 conductive copper

layers.

Compared to rigid boards, flexible PCBs require some unique design

considerations regarding the materials used, layout techniques,

manufacturability and reliability. This article provides a step-by-step guide

on how to design a 2 layer flexible PCB covering the key aspects to

consider.

Design Process Overview

The typical workflow for designing a 2 layer flex PCB is:

 Define circuit requirements and interfaces

 Select flexible material stackup

 Create circuit schematic

 Plan layout and component placement

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 Route traces and vias

 Specify flexible outline and bend areas

 Add text callouts and markings

 Review design rules and margins

 Verify electrical constraints

 Export Gerber and CAD files

Flexible Materials

The main materials used in a 2 layer flex PCB include:

Flexible Dielectric

The most common flexible dielectric material is polyimide (PI). It provides

excellent flexibility along with thermal and chemical resistance. Typical

thickness is 25μm to 100μm. Other polymers like PEEK, PET, PC etc. are

also used.

Copper Foil

Rolled annealed copper with 18μm to 35μm thickness allows flexibility

while carrying required current.

Bonding Adhesive

Acrylic or epoxy adhesive bonds the copper foil to the dielectric. Should

withstand flexing.
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Coverlay

A polyimide or acrylic coverlay coats the circuits for protection

and insulation. Cutouts are provided at bonding pads.

Solder Mask

LPI solder mask additionally insulates exposed copper traces from

environmental factors and accidental contacts.

Stackup Selection

For a 2 layer flex PCB:

 Core: 25μm-100μm flex dielectric film

 Layer 1: 18μm-35μm rolled copper foil

 Layer 2: 18μm-35μm rolled copper foil

 Coverlay: 25μm-50μm polyimide or acrylic

Using thinner cores allows smaller bend radii but requires narrower

trace/space. Thicker copper improves current capacity but reduces

flexibility.

Schematic Design

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A schematic defines the circuit connectivity. Considerations for flex:

 Show all interfaces like connectors

 Define component placements

 Call out any rigid sections

 Note high speed signals

 Mark all testpoints

Layout Considerations

Key aspects for 2 layer flex PCB layout:

Component Placement

Only low profile surface mount devices should be used. Place components

in the rigid areas only. Avoid placing parts across bends. Distribute

components evenly to balance stresses.

Trace Routing

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Use 45° angle traces instead of 90° turns. Avoid traces crossing bend

perforations. Leave extra trace length for flexing movement. Run critical

traces on inner layers.

Cutouts

Allow cutouts for connectors, buttons and other mechanical parts to be

mounted.

Bend Areas

Define by outlines/perforations where the board will bend. Allow sufficient

bend radius. Consider stresses when routing across bends.

Stiffeners

Add stiffeners made of rigid sections or covers near narrow flexible

segments for support.

Testpoints

Include testpoints to access key nets for debugging.

Critical Design Rules

Key design criteria for 2 layer flex PCBs:

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 Minimum Bend Radius: Inside bend radius should exceed minimum

specified for materials to prevent cracking

 Minimum Trace Width: Thinner traces allow tighter bends but

handle less current

 Minimum Spacing: Adequate spacing prevents shorts and crosstalk

 Annular Rings: Sufficient pad clearance from thru-hole walls to

avoid opens

 Testpoint Size: Must allow safe probing access

 Via Tenting: All vias should be fully capped/tented for protection

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Manufacturing and Assembly

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Fabricating and assembling flex PCBs involves:

 Imaging: Photolithography transfers the layout onto copper layers.

 Etching: Removes unwanted copper to form traces.

 Die Cutting: Cuts board outline and bend perforations.

 Coverlay Lamination: Bonds protective coverlay onto circuits.

 Solder Mask: LPI solder mask applied for additional insulation.

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 Route/Fold: Boards are routed apart and folded along bends if

needed.

 Component Mounting: Parts assembled only on rigid sections using

adhesive or fixing points.

 Debugging: Provides testpoints for easy probing access.

 Conformal Coating: Optional coating increases reliability.

Design Verification

Prior to release for fabrication, the flex PCB layout must be thoroughly

verified:

 Confirm minimum electrical clearances

 Check trace widths can carry required current

 Verify impedance of high speed traces

 Validate bend radii exceed minimum material and manufacturing

capabilities

 Review component placement near bends and edges

 Confirm all design rules and margins

 Test board flexibility and dynamic durability through prototyping

Conclusion

Designing reliable 2 layer flexible PCBs requires understanding the

materials, layout techniques, manufacturability limitations and reliability

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factors involved. With the growing use of flex circuits in consumer and

industrial products, rigid-flex PCBs and 3D packaging, understanding

robust flexible PCB design principles is becoming imperative for engineers.

The guidelines provided in this article can serve as a starting framework

when developing a 2 layer flexible PCB design to achieve a board that

successfully meets the functional, mechanical and quality needs of the

application.

FAQs

What are some typical applications of 2 layer flex PCBs?

Wearable devices, medical sensors, robotic arms, electronic display

interconnections, wire harness replacement in equipment.

What design software is used for flex PCBs?

Cadence Allegro PCB Editor, Mentor Xpedition, Altium, Zuken CR-8000

offer flex and rigid-flex design capabilities.

Can surface mount components be assembled on the flex section?

It is not recommended since soldering stresses can crack the thin flex

laminate and traces. Components should only be assembled on rigid

sections.

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What thickness of polyimide is typically used as the flexible dielectric?

12 micron to 50 micron polyimide films are commonly used. Thinner

material allows smaller bend radius but requires narrower trace/space.

What are some key tests performed to qualify flex PCB durability?

Flex PCBs are dynamically tested for bend cycles, torsion, flexion, twist,

vibration, shock, temperature cycling and bend radius verification.

Related Posts:

1. How to Design a Flexible PCB ?

2. Why design 100 layer PCB ?

3. 28 Layer PCB: An Integrated Multi-Layer PCBs

4. 4 Layer PCB Layout Tutorial,Stack-up design,and Cost of

manufacturing

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