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How To Do ESD Protection During SMT Assembly Process
How To Do ESD Protection During SMT Assembly Process
How To Do ESD Protection During SMT Assembly Process
Introduction
ESD events cause extremely fast transient spikes that can lead to multiple
People
Equipment
Reflow ovens
Hand tools
Materials
Solder materials
Cleaning chemicals
Workstation surfaces
Environment
To quantify ESD risks, some key standards and models are used:
discharge to device
rated for 250V HBM can get damaged by a 100V CDM pulse.
Figure 2. Key ESD models used for defining component sensitivity levels.
Equipment grounding
Personnel grounding
Handling procedures
Testing methods
Compliance verification
Corrective actions
following provisions:
EPA Requirements
points
Antistatic workstations
Material Handling
minimized.
Personnel Grounding
Safety Checks
Proper grounding straps and garments should become a habit for every
operator entering EPAs. This prevents ESD risk from human contact.
Equipment Grounding
All equipment, machines, workstations, and fixtures in the EPA must also
be grounded.
Key Guidelines:
Other Precautions:
risks and provides a safe path for charges to dissipate without discharge
through components.
by edges/sides.
Figure 5. Example of ESD safe handling using wrist strap and conductive
materials.
Signs to be displayed:
Grounding points
Color coding:
Labeling requirements:
Storage requirements:
Component Placement
Reflow Oven
In-Circuit Testing
Conformal Coating
Final Testing
covering:
effectiveness:
Compliance Verification
Process Assessment
Product Qualification
Conclusion
disciplines, handling devices safely, using only certified ESD safe material,
early.
What level of ESD control is needed for handling 1kV HBM sensitive devices?
1kV HBM sensitivity requires stringent ESD precautions like fully grounded
At very low humidity around 15%, electrostatic voltages can soar into the
owners. But formal third-party ESD audits should occur monthly to inspect
improvements.
Related Posts:
Environmental Protection
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