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Rogers RO4350B Datasheet and Dielectric Constant for PCB Use

Rogers RO4350B is a popular high frequency circuit board laminate

designed for performance-demanding wireless and radar applications

from 500 MHz to 77 GHz. This guide provides a detailed overview of

RO4350B material properties, key datasheet parameters, design

considerations, and dielectric constant specifications that engineers need

to know when designing with this high speed PCB substrate.

Table of Contents

Rogers RO4350B Overview

RO4350B is a ceramic-filled PTFE composite laminate reinforced with

woven glass fabric. It was engineered by Rogers Corporation specifically to

meet the needs of high frequency and high data rate PCB applications.

Some key attributes that make RO4350B suitable for RF and microwave

boards include:

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 Stable dielectric constant of 3.48

 Low loss tangent of 0.0037

 Tight εr and Dk tolerances

 Low Z-axis CTE for reliability

 High thermal conductivity

 Lead-free compatible processing

 Excellent mechanical strength

 Good chemical resistance

 UL 94 V-0 flame rating

RO4350B achieves an optimal balance of electrical, thermal, and

mechanical properties for precision RF circuit fabrication. Let’s look closer

at the RO4350B datasheet specs.

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RO4350B Datasheet Parameters

Here are some of the most important characteristics and parameters from

the Rogers RO4350B datasheet for PCB design and fabrication:

Parameter Value
Dielectric Constant (εr) 3.48
Loss Tangent 0.0037
Dielectric Tolerance ±0.05
Dk Tolerance ±0.002 (up to 10 GHz)
Z-Axis CTE 41 ppm/°C
XY CTE 17 ppm/°C

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Parameter Value
Tg 280°C
Td 340°C
Dissipation Factor 0.0019 (10 GHz)
Breakdown Voltage 1.5 kV/mil
Thermal Conductivity 0.69 W/m/K
Moisture Absorption <0.2%
Copper Peel Strength 1.3 lb/in
Surface Resistivity 1.5 x 10^13 ohm
Volume Resistivity 1 x 10^15 ohm-cm
Lead-Free Process 260°C Max

These parameters highlight why RO4350B is advantageous for controlled

impedance RF boards. Let’s look deeper at some key material properties.

Dielectric Constant and Loss Tangent

The dielectric constant (Dk) indicates how much capacitance a material

generates relative to air. Loss tangent quantifies signal loss.

RO4350B provides a stable Dk of 3.48 from 500MHz to over 40GHz with

minimal variation versus frequency. This allows engineers to design

controlled impedance transmission lines and matching networks that

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work consistently across the entire frequency range with excellent loss

characteristics.

The low loss tangent of 0.0037 ensures minimal signal attenuation as RF

energy propagates through the board. It remains under 0.004 up to

77GHz.

Tight Dielectric Tolerances

In addition to stable Dk over frequency, RO4350B also provides tight

lot-to-lot dielectric constant tolerances of ±0.05. The variance in Dk from

panel to panel is very consistent.

This makes it easier for designers to account for material variations during

layout and ensures stable performance across fabricated boards. Tighter

εr tolerance provides more margin for meeting impedance targets.

Low Z-Axis CTE

RO4350B has a low coefficient of thermal expansion (CTE) along the z-axis

of 41 ppm/°C. This provides reliability by minimizing dimensional changes

and movement of dielectric layers during thermal cycling.

High z-axis CTE can lead to copper cracking on inner signal layers which

limits board lifetimes. RO4350B resists plating separations and electrical

opens caused by excessive z-axis expansion and contraction.

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High Thermal Conductivity

With a thermal conductivity of 0.69 W/m/K, RO4350B provides good heat

spreading in the dielectric layers to prevent component hot spots. This

helps maintain signal fidelity and component lifetime at high

RF power levels.

Lead-Free Compatibility

RO4350B is compatible with lead-free soldering processes up to 260°C,

meeting the processing needs for modern electronics assembly and

manufacturing.

The stable dielectric and low expansion minimizes electrical and physical

changes even through multiple reflow cycles at high temperatures.

Excellent Mechanical Strength

The woven glass fabric reinforcement in RO4350B gives the laminate

excellent dimensional stability and flexural strength while maintaining low

CTE and loss. It also resists microcracking or fracturing during fabrication

and assembly handling.

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RO4350B Material Grades

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Rogers offers several grades of RO4350B for applications ranging from

low cost commercial usage to high reliability aerospace and defense:

 RO4350B High Reliability (HR) – For mission-critical aerospace apps

 RO4350B High Frequency (VF) – For 77GHz mmWave designs

 RO4350B Low Dk – Minimizes loss tangent

 RO4350B Bondply – Adhesiveless multilayers

 RT/duroid 5870 – Low cost version

Consult Rogers to determine the optimal RO4350B variant for your

specific RF performance, cost and reliability requirements.

RO4350B Design Considerations

Here are some key design practices engineers should follow when working

with RO4350B material:

 Use impedance calculators like Saturn PCB Toolkit to

determine stripline dimensions

 Account for frequency-dependent Dk in models

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 Include pad and anti-pad shapes in impedance calculations

 Model discontinuities like stubs, vias, and bends

 Use teardrop pads on vias for reliability

 Minimize dielectrically exposed copper for lowest loss

 Watch for resin starvation, voids and thickness variations

 Limit glass weave skew to under 5 degrees

 Allow for Dk and etch tolerances in impedance budgets

Paying attention to these factors when designing on RO4350B ensures

stable electrical performance that matches simulations and

measurements.

Typical RO4350B PCB Applications

Some common applications leveraging Rogers RO4350B laminate include:

 5G NR base stations and user equipment

 Radio transceivers and receivers

 Satellite communication systems

 Wireless infrastructure

 Radar and automotive sensors

 Test and measurement equipment

 Aerospace and defense electronics

 High speed data links and backplanes

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 Medical diagnostic devices

Its stable dielectric properties and low loss make RO4350B a top choice for

reliable wireless and high frequency boards.

Comparing RO4350B to Other Popular RF Laminates

Parameter RO4350B RO4835 RO4003C

Dielectric Constant 3.48 3.38 3.55 3.
Loss Tangent 0.0037 0.0031 0.0027 0.
Dk Tolerance ±0.05 ±0.05 ±0.079 ±
Z-Axis CTE 41 ppm/°C 52 ppm/°C 60 ppm/°C 20
Lead-Free Process 260°C 288°C 260°C 28
Cost Medium Low Medium Hi

RO4350B provides the best overall balance at moderate cost. But

alternative laminates may be optimal for specific applications.

Availability of RO4350B Material

Rogers Corporation partners with authorized laminators worldwide to

stock various thicknesses of RO4350B cores and prepregs. Common

offerings include:

 0.005′′ – 0.062′′ dielectric thicknesses

 Prepregs with 106-211 glass styles

 Copper foil bonds from 0.5 to 3 oz.

 Isola 370HR resin system

 Panels and cut sheets

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 Quick-turn lead times

Work with your PCB manufacturer to ensure availability and consistent

supply of RO4350B material tailored to your board thickness and copper

weight needs.

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FQA about Rogers RO4350B Laminates

What is the z-axis CTE of RO4350B?

RO4350B has a low z-axis CTE of 41 ppm/°C which minimizes dimensional

changes through temperature excursions to avoid reliability risks.

Can Rogers RO4350B be used at frequencies above 10 GHz?

Yes, RO4350B provides stable dielectric performance up to at least 40 GHz.

The VF version extends the upper frequency range to 77GHz and beyond.

Does Rogers RO4350B meet UL flammability ratings?

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RO4350B achieves a UL 94 V-0 rating for flame resistance meeting safety

requirements for consumer and industrial electronics.

What is the breakdown voltage of Rogers RO4350B?

RO4350B has a high breakdown voltage of 15 kV/mil minimizing risk of

electrical punch-through in thin dielectric layers.

Can Rogers RO4350B laminates withstand lead-free soldering?

Yes, RO4350B remains stable through lead-free reflow profiles up to

260°C and multiple soldering cycles.

Conclusion

Rogers RO4350B circuit board laminate provides an ideal microwave

substrate solution for precision RF circuits up to 77GHz needing stable

dielectric properties and low loss. Its tight tolerances, high thermal

conductivity, lead-free process capability, and strong mechanical

properties make RO4350B a versatile high frequency PCB material. Careful

modeling of impedances and discontinuities when designing on RO4350B

results in repeatable RF performance across fabricated boards. For

wireless systems requiring precision electrical properties at microwave

frequencies, RO4350B delivers.

Related Posts:

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1. 12 Layer Rogers Laminate + FR4 Hybrid Dielectric Constant PCB

2. What is Dielectric Constant in PCB?

3. Why you need to Consider the PTFE Dielectric Constant in your

Application

4. Assembly of RO4350B PCBs for Military High Frequency Products

https://www.raypcb.com/rogers-4350-pcb/

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