DMX9114/RHU9114 Computational Tools in Energy Systems

Simulation Project Assignment No.03

CFD Analysis of Thermal Management of a Desktop Computer

Background

CFD is a powerful tool in optimizing engineering applications involving heat transfer.

The cooling of electronic components within a computer has recently become an
important issue due to very large integration of electronics devices. Particularly,
increased processing power tends to generate more heat, which may cause hardware
damage or failure.
Objectives

The aims of this simulation are to:

1) Create a domain suitable for the problem.

2) Understand the requirements for cooling electronic components within the
system.
3) Design the system by placing the components in optimal positions which
allow operation within the safety range through understanding of the thermal
and flow behavior.
4) Determine the best position of the electronic components.
5) Prepare a concise and well written professional Report.

Problem Description

2D domain of the system is shown in Figure 01 below and all dimensions are given in
millimeters. There are two exhaust opening (50 mm wide) and one air intake (80 mm
wide). Assume that the flow arte and the temperature of air at inlet are 0.15 m 3/s and
20℃, respectively. The turbulent intensity is assumed to be 5%. The walls of the system
are adiabatic and smooth. Locate the following items within the system.

 01 processor with dimensions 25 mm x 25 mm with a heat output of 800 W/m2

 03 RAM modules with dimensions 140mm x 30mm with a heat output of 65 W/m2
 03 other components of dimensions 100mm x 50mm with a heat output of
120W/m2
 Use the SST model to simulate the flow turbulence.

Discussion
1) Arrange the components listed above within the system casing with the given
boundary conditions.
2) Analyze the fluid flow and thermal characteristics to determine the most optimum
locations for your components.
3) The surface temperature of the components are not exceeding 80℃

Figure 01 2D Domain of the system