When andwhere does creep occur?

Components subjected to high stress

at high temperature

Power Plants
Steam Turbine
Gas Turbine

Aerospace Engines
Oil Refinery
Chemical Plants
What does high temperature do?
Atoms move faster to affect all diffusion-controlled processes
Increased amount of vacancies
Related to dislocations
Climb
Decrease in dislocation density
Related to grains
V Grain boundary sliding
Grain boundary migration
Recrystallization/grain growth
Metallurgical changes: phase transformation, precipitation, oxidation
 Creep
What is Creep ?
Creep is time-dependent plastic deformation at constant load (or stress),
which is usually significant only at high temperatures
Can occur below tensile yield stress

What does it mean by high temperature ??

Homologous temp = Testing temperature >0.3

Melting temperature
***
Think about lead and tungsten... Lead can creep at RT, but W can't ***

hde 4 of 50
PowsPoint Slide Show-[MBM Crop M00C]-PowcrPoint

Roles of GB in plastic deformation

Equi-Cohesive Temperature (ECT): Temperature at which GB and grain have same strength
ECT ~ 0.5Tm (in K)

At low temperature (T « 0.5 Tm, in K) At high temperature (T> 0.5 Tm).

GBs act as a barrier (obstacle) to GBs gets weaker than the bulk (GB sliding)
dislocation motion. Dislocations pile up GBs can act as sources and sinks for
against the GBs. vacancies (Nabarro-Herring creep)
V Fine grain materials are stronger Coarser grains are stronger
(Think about Hall-Petch l)
This is why single crystal nickel based super
alloys are used in tyrbine blades !

Strength
relative Grain

Grain boundary

ECT Temp
Transgranular Intergranular
fracture fracture
 MEMCrup Mooj-PoPot

Schematicof Creep Set-up

Lo

AL

t=0
23
2022
Courtesy: Prof. Gouthama Constant load or constant stress or both?
Shde 6 o 50
Creep Testing
Temperature
Controlfer Side View

Furnace

Sample
Furnace Pin
Fürnace
Weight

Constant load

The creep test measures the dimensional

Support changes which occur when subjected to
frames high temperature at constant
Oo0o o load/stress

Measure strain from the

Furnace measured extension
Weight
Creep Curve
Three distinct stages with different
A creep rates.
I(Primary) I(Secondary)
B
Strain
(e) Primary creep/ transient creep (1) -
decreasing creep rate
deldt
= constant
Secondary creep (I) - constant creep rate
II(Tertiary)
Tertiary creep (1) - rapid creep rate till
failure.

&
Creep
Rate First Third
Instantaneous strain
stage Second stage
Time (t) () (III)
stage
()
Instantaneous strain ([,): Strain as soon as
sample is loaded (Elastic or plastic?)

Total Strain [
Stages of Creep
Primary Creep:
Work hardening more than recovery
I (Primary) II(Secondary) Structure evolution same as work hardening
Strain
(e) (dislocation density increases --- dislocation
subgrain structure --- cell size decreases with
strain)
constant

de/dt
III (Tertiary)
Secondary Creep:
Work hardening equal to recovery (or
softeningeffect) --- non conservative motion

Time (t) Tertiary Creep:

(Rupture time) Creep damage accumulation: Formation of
internal cracks, voids, grain boundary
separation, necking etc.

Steady State Creep rate

V Also called secondary or steady state creep rate
V Longest duration: most important for design
 Stress Rupture Test
Test is done in similar fashion as creep test

Rupture life: Time to fracture

VImportant for short-life situations
Stress Rupture
Creep Test
Creep Test

Creep is time-dependent plastic Duration

May be carried out till Always carried out
deformation at constant load (or stress),
failure tillfailure
which is usually significant only at high Load Low Load High Load
temperatures
Creep Low High
Measures dimensional changes in the rates
component
Test 2000-10000 h 1000 h
Creep rate is important parameter Period
Total
0.5% 50%
strain
Stress Rupture
Test is carried in similar way as creep test, but always upto failure
Measures effect of temperature on long time load bearing characteristics
Rupture life (Time to fracture) is important parameter
 Design consideration
Two parameters are generally used:

Steady state creep rate

Steady state creep rate is used when the II stage constitutes a significant
fraction of the total creep strain

Ifamaterial is designed for hundred/thousands of hours (for example, jet engine

turbine blade) or for many years (e.g., boler tubing), steady state creep rate
becomes more important.

Rupture time

v Ifa material is designed for short duration (for example, one-shot" rocket engine
component), fracture (rupture time) becomes more important
 Effect of temperature and stress on creep curves
Constant o

T,> T,>T, With increasing stress

([)
Strain
Creep or temperature
ConstantT The instantaneous
T,or O,
E3 strain increases
T, or O,
The steady-state
creep rate increases
T, or O, / The time to rupture
decreases (actually all
T<0.3Tm regions decrease)
3
t t? tr
Time (t)
Competition between work hardening and softening (recovery)
Work-hardening (due to plasticstrain) h=

Recovery (due to high temperature) r=

Ot

da/ot
=aconstant

At steady state, rate of recovery is fast enough and equal to

rate of strain hardening so that a balance is reached between
them
Creep mechanismsof crystalline materials
O Stress and temperature are the two important variables, which not only affect the creep rate,
but also the mechanism operative. Two kinds of mechanisms operative in creep:
1º Dislocation controlled
2> Diffusion controlled
These and their sub-classes are shown in the next slide

OAcombination of these mechanisms could also be responsible for the creep strain.
O Depending on the stress and temperature other mechanisms of plastic deformation or
microstructural changes may occur concurrently with creep. These include plastic
deformation by slip and dynamic recrystallization.
Deformation mechanism maps can be drawn with homologous temperature (T/T) and
normalized shear stress (t/G) as the axis (other combination of variables may also be chosen
for these plots)
Creep Mechanisms of crystalline materials
Harper-Dorn creep
Creep can be classified based on Phenomenology Power Law creep

Mechanism Related to dislocation

creep
Cross-slip

Dislocation related Climbe

Glide

Coble creep
Grain boundary diffusion controlled
Creep Diffusional Nabarro-Herring creep
Lattice diffusion controlled

Dislocation core diffusion creep

Diffusion rate through core of edge dislocation

Grain boundary sliding

Courtesy: Prof. A. Subramaniam
Empirical Relation
Empirical relationship between steady state creep rate with
stress, temperature and grain size
Mukherjee-Bird-Dorn Equation
A- const.

4-a(7)) D-Diffusion Coeff.

D= Dyexp)
Qo:activation energy for creep
o- stress
n- stress exponent
G- shear modulus
b- Burgers vector
d- grain size
p- inverse grain size exponent
k- Boltzmann's const.

Remember the Arrhenius dependence on temperature for

thermally activated processes?
é, =A No change in
Slope is the stress mechanism
In, exponent (n)
D= DoeR)
In o
Constant grain
size

Slope
DGb\ n nË n 3-8 Change in
mechanisms
Iné, n2
n1(low o)
In o
At const.
Temp

E, =B'()n
Power law Creep
n: Stress exponent
B': Constants
 (DGb
Calculation of Activation Energy
É, = A

D= DoeR) Valid if mechanism doesn't change

At const.
Stress

É,= ADo

Q=Rin.
 Relationship Between Activation Energy for Lattice Diffusion
(Q) and Activation Energy for Creep (Q)
Energy,
QoActivation
12
w
1

(mJ/mol) Fe
Q=
AI Al

Diffusion Ca 0.5
Sn

Na

Self
0
0.5 10

0.1
Homologous Temperature (T/T)
0.01

Creep Activation Energy. Qc (mJ/mol)

At elevated temperature, almost all elements show Qc=Q0 At lower temperatures, diffusion may take place
along other routes leading to lower values of Q.
(Qc~ 0.5Q)
 Diffusional Creep: Only diffusion and no relation to dislocation

Dislocation Creep: Diffusion +Dislocation (climb controlled)

Dislocation (Glide controlled)

Grain Boundary Sliding: Result of Diffusional creep and Dislocation creep

Diffusion Creep: (o/G «104 )

Temperature Required Stress
dependence increases
increases Dislocation (or Power Law) Creep:
(10-4 <a/G« 102)

Dislocation Glide: (o/G> 102)