3D IC Technology

A 3d ic is a three – dimensional integrated circuit (IC) built by

vertically stacking different chip or wafer together into a single
package.

Advantages
There are three primary advantages of 3D intergrated circuit in terms
of power consumption , signal timing and mixing – signal integration

INCLUDES
3D ic
Integrated circuit design
Through silicon via
System on chip
Transistor count
Inter poser
Wafer
Wafer – level packaging
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3D IC Defination
A 3D IC composed of two or more layers of active electronic
components , integrated both vertically and horizontally.

3D-IC METHODS
Aggressive wafer thinning ,through wafer /chip connectivity , back
side metallization and patterning , oxide or metal bonding.

MOTIVATION
. Interconnect structure increasingly consume more of the power and
delay budgets in modern design
. PLAUSIBLE SOLUTION :- increases the number of “ nearest
neighbours “ such by each transistors by using 3D IC design
. smaller wire cross-sections , smaller wire pitch and longer lines
traverse large chips increase RC delay.
. RC delay is increasingly becoming the dominant factor
. At 250nm ca was introducted alteviate the adverse effect of
increasing interconnect delay .
. 130nm technology node , substantial interconnect delays with result

IMPROVEMENTS TO ACHIEVE USING 3D-IC

Reduced interconnect delays ( R,L,C )higher clock rodes

Reduced interconnect capacitance (I /O PADS) , lower power

dissipation
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Higher integration density may go heterogenous
High bandwidth u – processors .
Merging different process technologies , mixed materials , system
integration .
Advanced focal planes

THROUGH SILICON VIAS (TSV)

TSV is a vertical electrical connection that passes completely through
a silicon wafer . TSVs are currently considered to be high-
performance interconnect techniques and primary purpose of TSVs is
to create 3D ICS .

PERFORMANCE CHARACTERISTICS AND

CONCERNS IN 3D CIRCUITS
. Timing
. Energy
. with shorter interconnects in 3D ICs , both switching energy and
cycle time are expected to be reduced.
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