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Bup 307
Bup 307
IGBT
Preliminary data
Maximum Ratings
Parameter Symbol Values Unit
Collector-emitter voltage VCE 1200 V
Collector-gate voltage VCGR
RGE = 20 kΩ 1200
Gate-emitter voltage VGE ± 20
DC collector current IC A
TC = 25 °C 35
TC = 90 °C 23
Pulsed collector current, tp = 1 ms ICpuls
TC = 25 °C 70
TC = 90 °C 46
Avalanche energy, single pulse EAS mJ
IC = 15 A, VCC = 50 V, RGE = 25 Ω
L = 200 µH, Tj = 25 °C 23
Power dissipation Ptot W
TC = 25 °C 310
Chip or operating temperature Tj -55 ... + 150 °C
Storage temperature Tstg -55 ... + 150
Maximum Ratings
Parameter Symbol Values Unit
DIN humidity category, DIN 40 040 - E -
IEC climatic category, DIN IEC 68-1 - 55 / 150 / 56
Thermal Resistance
IGBT thermal resistance, chip case RthJC ≤ 0.4 K/W
Static Characteristics
Gate threshold voltage VGE(th) V
VGE = VCE, IC = 0.1 mA 4.5 5.5 6.5
Collector-emitter saturation voltage VCE(sat)
VGE = 15 V, IC = 15 A, Tj = 25 °C - 2.8 3.3
VGE = 15 V, IC = 15 A, Tj = 125 °C - 3.8 4.3
VGE = 15 V, IC = 15 A, Tj = 150 °C - 4 4.5
Zero gate voltage collector current ICES µA
VCE = 1200 V, VGE = 0 V, Tj = 25 °C - 1 250
VCE = 1000 V, VGE = 0 V, Tj = 125 °C - - 1000
Gate-emitter leakage current IGES nA
VGE = 20 V, VCE = 0 V - 0.1 100
AC Characteristics
Transconductance gfs S
VCE = 20 V, IC = 15 A 5.5 8 -
Input capacitance Ciss pF
VCE = 25 V, VGE = 0 V, f = 1 MHz - 2000 2700
Output capacitance Coss
VCE = 25 V, VGE = 0 V, f = 1 MHz - 160 240
Reverse transfer capacitance Crss
VCE = 25 V, VGE = 0 V, f = 1 MHz - 65 100
320 36
W A
Ptot IC
28
240
24
200
20
160
16
120
12
80
8
40 4
0 0
0 20 40 60 80 100 120 °C 160 0 20 40 60 80 100 120 °C 160
TC TC
10 2 t = 3.5µs
10 0
p
10 µs
A K/W
IC ZthJC
100 µs
10 1 10 -1
1 ms
D = 0.50
10 ms 0.20
10 0 10 -2 0.10
0.05
10 -1 10 -3
0 1 2 3 -5 -4 -3 -2 -1 0
10 10 10 10 V 10 10 10 10 10 s 10
VCE tp
20
VGE 16
400 V 800 V
14
12
10
0
0 20 40 60 80 100 120 140 nC 180
Q Gate
Package Outlines
Dimensions in mm
Weight: 8 g