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CPE 311 LABORATORY EXPERIMENT #01

BASIC LOGIC FUNCTIONS
OBJECTIVES:
At the end of the exercise, the students should be able to:
▪ Understand how to use the breadboard to patch up, test your logic design and debug it.
▪ Wire and operate logic gates such as AND, OR, NOT, NAND, NOR, XOR.
▪ Understand how to implement simple circuits based on a schematic diagram using logic
gates.

MATERIALS AND EQUIPMENT:

▪ breadboard ▪ IC Type 7432 Quadruple 2-input OR
▪ multimeter (digital or analog) gates
▪ battery power supply (5V) ▪ IC Type 7404 Hex Inverters
▪ battery holder ▪ IC Type 7486 Quadruple 2-input XOR
▪ 3pcs LED gates
▪ 3pcs 390 ohm resistor ▪ IC Type 7400 Quadruple 2-input NAND
▪ 2pcs switch or dip switches gates
▪ alligator clips ▪ IC Type 7402 Quadruple 2-input NOR
▪ connecting wires (2-gauge solid copper gates
wire) ▪ IC Type 74266 Quadruple 2-input
▪ IC Type 7408 Quadruple 2-input AND XNOR gates
gates

PRINCIPLES:

INTRODUCTION
Logic functions can be implemented in several ways. In the past, vacuum tube and relay circuits
performed logic functions. Presently logic functions are performed by tiny integrated circuits (ICs).
These ICs are small silicon semiconductors sheets called chips, containing the electronic
components for the logic gates. The chip is mounted in a plastic container, and connections are
welded to external pins may range from 14 in a small IC package to 64 or more in a large one.

LOGIC FAMILIES
The types of logic devices are classified in "families", of which the most important are TTL and
CMOS. The main families are:
• TTL (Transistor-Transistor Logic) made of bipolar transistors.
• CMOS (Complementary Metal Oxide Semiconductor) made from MOSFETs
• ECL (Emitter Coupled Logic) for extremely high speeds
• NMOS, PMOS for VLSI large scale integrated circuits.

SUBFAMILIES OF TTL FAMILY

There are subfamilies or series of the TTL. Commercial TTL ICs has a number designation that
starts with 74 and follows with a suffix that identifies the series type. These subfamilies are:
Standard: 74xx, High speed 74hxx, low power 74Lxx, Shottky TTL 74Sxx, Low power shottky
74LSxx, Advanced shottky 74ASxx, Advanced low-power shottky 74ALSxx.
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PRACTICAL TTL LOGIC GATES

A popular type of IC is illustrated in the figure. IC manufacturers refer to this case style as a dual-
inline package (DIP).This particular IC is called a 14-pin DIP IC. Just counterclockwise from the
notch on the IC is pin 1. A dot (optional) on the top of the IC is another method used to locate pin
1.

Part number is divided into three sections:

• The prefix: the manufacturer's code.
• Core part number: This determines the technology
"TTL or CMOS", the device series and
the function of a digital IC.
• The trailing letter(s) "the suffix" which is a code used
by several manufacturers to design the DIP.

For example, the part number of SN74LS08J

SN: stands for the manufacturer "Texas Instruments"
74: 7400 TTL series
LS: low shottky type
08: function of a digital IC
J: Ceramic dual-in-line Package

USING ICs WITH A BREADBOARD

To use an IC, you refer to its datasheet. The pin layout is an essential part of any datasheet that
specifies the function of each pin. As an IC contains electronic circuits, it needs to be powered by
connecting an external power source, such as a battery, to the IC power terminals (pins). These
pins are usually called Vcc (or Vdd) and GND (or Vss). An IC also has input and output pins.

SUMMARY OF INTERNAL ARCHITECTURE OF EACH IC

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The example circuit on a breadboard figure below shows how components can be interconnected
using a breadboard.
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CIRCUIT ASSEMBLY TECHNIQUES

You will be using a breadboard to assemble and test your hands-on circuits. The breadboard
provides a convenient and organized way of implementing circuits, making quick component
changes and providing trouble-free circuit connections.

To make the experience of assembling a working circuit more enjoyable:

1. Be sure that the power is OFF;
2. verify by direct measurement the values of all the circuit components;
3. minimize the use of jumper wires by connecting components directly to one another;
4. verify that the jumper wires used are not broken (test for 0 Ω resistance);
5. assemble the circuit in a systematic and organized fashion;
6. check off each component as you add it to your circuit;
7. verify that your assembled circuit connections correspond to those of the schematic
diagram;
8. turn ON the power and test the circuit for proper operation.

PROCEDURES:
NOTE: Please observe safety precautions and proper handling while conducting the laboratory experiment. This experiment
is to be performed under an instructor’s supervision.

For each logic gate do the following steps:

1. Setup below the circuit.
2. Place the IC in the proper location in a breadboard.
3. Give biasing to the IC (i.e. wire the IC to ground (0V) and power supply (+5 V).
4. Control connections. With the help of IC’s datasheet, connect the input pins of the gate to
data switches and the output pin to LED indicator.
5. Power up the circuit. Apply the indicated voltage.
6. Make voltage measurements at the points indicated to complete the table.
7. Use switch to determine the truth table for the circuits.
8. Write down in the truth table the output logic levels for every possible combination of input
levels, with help of LED indicator.
9. Repeat for all other gates.

A. AND gate

PIN 1 PIN 2 PIN 3

0 0
0 5
5 0
5 5
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B. OR gate

PIN 1 PIN 2 PIN 3

0 0
0 5
5 0
5 5

C. NOT gate

PIN 1 PIN 2
0
5

D. NAND gate

PIN 1 PIN 2 PIN 3

0 0
0 5
5 0
5 5
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E. NOR gate

PIN 1 PIN 2 PIN 3

0 0
0 5
5 0
5 5

F. EX-OR gate

PIN 1 PIN 2 PIN 3

0 0
0 5
5 0
5 5

G. EX-NOR gate

PIN 1 PIN 2 PIN 3

0 0
0 5
5 0
5 5