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P-19

Extensive Study on Effecct of Pinhole Induced Electric Fielld in Si CS-


TOPCon Solar Cell
Manish Verma1 Student Member, IEEE, S. Routray2 Member, IEEE, G. P. Mishra1 Me
Member, IEEE
1
National Instituute of Technology Raipur, Chhattisgarh- 492010, India
2
SRM Institute of Sciience and Technology, Chennai, Tamil Nadu-603203, India

Abstract²Si solar cell based on carrier selectiive contact and Previously, many researchers haave exploited higher
tunnel oxide passivated contact (TOPCon) show w great promise efficiency ranging 21.12% to 24.9% using TOPCon and/or
toward reaching the Shockly-Quiesser (SQ) lim mit. The carrier CS-Contact technology [12-18].
selective transport provides lower recombinattion and hence
increases the external Voc. In this work a thin n oxide layer is
introduced which will act as a carrier selecctive layer and
carriers will tunnel through it. The tunnel oxide provides
tunneling and transport through the pinholes. TThe electric field
effect in the oxide due to pinholes increasses the carrier
transport. The passivation reduces the recombination at the
contact which results in the reduced resistivity.. The optimized
design of CS-TOPCon solar cell results in achieving
a up to
29.03% due to high electric field.
Keywords—CS-TOPCon solar cell, electric ffield, efficiency, Fig. 1 Schematic of (a) simple Si (b) CS-TOPCon solar cell
ATLAS, pinholes
In this paper, a scope has been tak ken to investigate the
I. INTRODUCTION distribution of electric field in CS-TOPCon
C Si single
Growing demand of renewable energy, esppecially energy junction (SJ) solar cell (SC) in thee tunnel oxide region.
through photovoltaic (PV) cell, is having th he capability to Additionally, the thickness of oxide material is also varied
meet the world’s energy supply-demand chaiin. High power from 0 nm to 1.4nm and the effecct of thickness in the
conversion efficiency and improved module design are the electric field is studied intensiveely. The model was
scope which reduce cost of per watt peak ($/W Wp) ratio. Low simulated using ATLAS TCAD Sim mulation Tool [19] and
cost material like silicon (Si) with loower material standard global AM1.5G spectrum is used to investigate the
consumption is able to reach efficiency of oover 22%. The performance of the solar cell.
solar cell technologies like metal wrap throough Si hetero
junction has achieved 18.8% using selectiv ve emitter and II. DEVICE STRUCTURE AND PHYSICAL MODELS
23.1% using copper plating [1, 2]. Hybrid Si solar cell with The schematic of traditional solar ceell as well as proposed
rear hetero junction strip contact has achieved
a ideal CS-TOPCon Si solar cell is given in Fig. F 1. (a) and (b). The
efficiency of 25.8% and 22.9% experimentally [3]. N-type forward current is calculated by connsidering band to band
multi crystalline solar cell was fabricated wwith 19.6% and non local tunneling and non-local derivative. The photo
21.9% efficiency [4, 5]. P-type mono crysttalline module carrier and recombination current are measured using
was able to reach record efficiency of 20.6% [6]. The detail Shockley read hall (SRH), fermi-ddirac statistics, optical
balance limit for single junction solar cell has efficiency recombination (OPTR) and Auger mo odels are considered to
limit of 30% according to the Schockly-Quiiesser(SQ) and reflect different recombination prrocess of solar cell.
29.8% according to Tom Tiedje et al. considdering radiative Minority carrier life time for elecctrons and holes are
and non radiative recombination mechanism m respectively considered to be 1ns throughout the investigation. The band
[7,8]. Sun power IBC and Panasonic manufaccturing process gap narrowing is calculated considerring the Schenk model
has shown practical efficiency of 25% and 255.6% efficiency [19]. To ensure the proper tunneling g, a refined meshing is
[9]. However, achievable commercial efficiency till date is considered by incorporating the quanttum meshing in TCAD
around 15% and still laboratory efficiency y with lots of Tool [19]. The low field mobility iss calculated using field
structural improvement and light trapping prrocess couldn’t dependent concentration mobility (CO ONMOB) model which
reach SQ Limit. is valid for Si at 300ႏ7KHWXQQHOLQJ JWKURXJKWKHR[LGHDQG
TOPCon with carrier selective contact tecchnology (CS- electric field in the oxide region is caalculated using Fowler-
TOPCon ) is an upcoming advancement annd have ability nordhiem (FNORD) model [19].
towards reaching the efficiency limit of 30 0%. Here, the
additional ultrathin oxide layer provides barrier
b for the III. SIMULATION RESULTS AND
A DISCUSSIONS
minority carrier, which makes the rear juunction carrier The standard air mass (AM) 1.5G illu umination is considered
selective and enhance the collection efficienccy of the solar to study the performance of solar cell and the spectral
cell.Additionally, electric field is also extended with the intensity is given in Fig. 2 (a).Traditiional Si solar cell with
presence of oxide region and contributes more towards 200μm thick n-type layer as base witth 0.30μm thick p-type
collecting carriers from quasi neutral regionss. Furthermore, Window and 0.025μm thick n-type passiavtion
p layer [1, 9]
highly doped passivated layer increases th he passivation passivation layer is considered for coomparative analysis as
quality and decreases the recombination proceess. Ideally the shown in Fig. 1(a). Selection of n-typ pe base material is due
crystalline silicon can achieve 27.4% efficienncy with carrier to its higher mobility as compared to the p-type. Almost 2%
selective contact [10]. Analytical model sho ows efficiency of losses occur in the contact region ddue to the
exceeding 26% with low surface recom mbination [11].

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B. Transport through Tunneling and pinholes
p : Electric
field study
On the application of the tunnel oxidee, two type of transport
phenomenon of the carrier occurrs through the oxide
boundary. One is tunneling through tthe oxide material and
other is carrier transport through the ppinholes [1, 3, 5]. Some
articles have suggested the linear beh havior of the pinholes,
which are also considered to be micro o resistor [1]. The oxide
boundary is described by therm mionic field emission
Fig. 2 (a) AM1.5G Spectrum and (b) I-V curve off traditional SC
boundary. Oxide blocks one type of carrier
c and allows other
type of carrier providing carrier sellectivity. The impurity
recombination. As shown in fig. 1(b), highly doped
diffusion, high anealing temprature aand fabrication defects
passivation layer incorporated to reduce the recombination
in the ultrathin oxide layer causes the formation of the
at the contact which results in high implie d open circuit
pinholes or “weak insulating areas””. As the thickness of
voltage. Reducing the doping concentration of rear surface
SiO2 decreases from 1nm, these pinhholes density increases.
passivation layer increases the recombination n at the contact.
As the pinhole density increase wiith reduction in oxide
This causes reduction in the Jsc and slight degrradation in the
thickness, the number of transport ch hannels increases. This
performance parameter which can be seen in table 1. The
increases the carrier transport and increament in the
Silver contact is used to further enhance the abbsorption. The
characteristic parameters like efficieency ( ߟ ), Fill Factor
simulation results of simple Si Solarr cell shows
(FF), Conduction current density (J ( sc) and open circuit
Jsc=39.14mA/cm2 and Voc=512mV giving eefficiency ( ߟ )
voltage (Voc).
=15.17% as shown in I-V characteristic in fig.. 2(b).

Table 1: Effect of reducing doping concentrationn of passivation Table 2: Parameters with different SiO
O2 thickness.
layer Sio2 Jsc Voc FF % Efficiency
Doping Jsc Voc FF % Efficiency Thickness(nm) (mA/cm2) (V) (ࣁ) %
concentration (mA/cm2) (V) (ࣁ) % 0.0 39.14 0.512 79.8% 15.17%
(/cm3) 0.2 39.46 0.985 82.5% 29.03%
3ൈ1021 /cm3 39.14 0.512 79.800% 15.17% 0.3 39.39 0.905 70.72% 26.91%
3ൈ1019 /cm3 39.12 0.508 79.700% 15.07% 0.5 39.25 0.710 58.96% 19.90%
0.7 39.09 0.615 45.35% 13.55%
0.9 38.90 0.482 26.69% 6.94%
A. Si solar cell with TOPCon technology 1.1 36.98 0.318 9.65% 1.87%
In order to provide the carrier selectivity at thhe rear surface,
the Sio2 tunnel oxide is introduced of 0.00nm to 1.4nm These transpoprt through pinholes causesc increaes in the
thickness as shown in schematic fig. 1(b). The T oxide stops electric field through tunnel oxide, wh hich can be seen in fig.
one type of carrier at the oxide boundary annd allows other 3(a) . The electric field was found to be in decreasing order
type of carrier to pass through due to dielecttric property of from top of the cell to bottom i.e. fro
om window layer to the
the oxide. High doping provides good passsivation on the base layer. This electric field decreasees from the order of 10-
2
rear surface. This carrier selectivity ultimatelyy increases the V/cm to 10-7m /cm due to decrease in the photo generated
external Voc due to reduced recombination aas seen in fig. carrier and absorption through thee device length from
3(b) of I-V characteristic of CS-TOPCon ssolar cell. The window to base layer also seen in fiig. 4. The oxide layer
silver contact on the rear surface further enhances the due to pinholes causes the electric field.
f The electric field
absorption.The Simulation results of CS-TO OPCon Si SC statrts increasing and increases to thhe order of 106 V/cm.
with Jsc = 39.46mA/cm2 and Maximum Voc=985mV is The highest electric field is observed at the lowest thickness
obtained which gives maximum Efficiency ߟ = 29.03%. of oxide at 0.2nm.When the thicknesss is lowest,

Fig. 3: (a) Electric field


f and (b) I-V curve with variation in SiO2 thickness

2020 IEEE Electron Devices Technology and Manufacturing Conference Proceedings of Technical Papers
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efficiency of 29.03% is achieved at the oxide thickness of
0.2nm. the spectral reponce, I-V characteristic,
c EQE is
obtained. The high electric field accross the tunnel oxide
region is observed and plotted with thhe variation in the oxide
thickness. The linear behavior of tthe pinholes as micro
ressistor is observed. The linear behavvior is also observed in
The I-V chacteristic and electric field..

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2020 IEEE Electron Devices Technology and Manufacturing Conference Proceedings of Technical Papers
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