www.sunon.

com

Headquarters
Sunonwealth Electric Machine Industry Co., Ltd.
TEL : +886-7-8135888
E-mail : sunon@sunon.com

Sunon Inc. (U.S.A.)

TEL : +1-714-255-0208
E-mail : info@sunon.com

Sunon SAS (Europe)

TEL : +33-1-46154515
E-mail : europe@sunon.com

2022/09/26 (268-W)

© 2022 SUNONWEALTH Electric Machine Industry Co., Ltd.

*All products are RoHS compliant.
 Reduce Cost SUNON’s Total Solution
ABOUT SUNON Increases product profitability
Save Ti m e
Over 41 years, SUNON has specialized in various types of
thermal solutions related to motors, fans, and ventilators for a Reduces development costs and increases profits
wide range of applications. We offer optimal thermal solutions
Cost- e f f e c t i v e
and prompt responses to clients’ needs, with customer service Decreases prototype development time
and technical support networks all around the world.
Stron
g Technical S e r v i c
e Provides the most economic design solution

Thermal Module Applications

5G 07

Automotive 11

Industrial 13

Entertainment 15

1 2
 C C o-Design

Customer's
Cooling
SUNON Comprehensive Request

Thermal Solution and Technical Support Service M M odel Building

SUNON is an original cooling product manufacturer. We are 100% research-based, designing and
manufacturing a variety of fans, vapor chambers and heat pipes and more, We can configure both
active and passive cooling components to provide our clients a full range of cooling solutions
through the use of scientific simulation and equipment. SUNON aims to give excellent service in
thermal solutions, satisfying clients’ thermal requirements for any function, sizes, and budget.
SUNON
CMSEM S S imulation&
Optimization

SUNON Optimal Cooling Solution

E E stimation
Validation
&

New Product
Launch

M M ass Production

Product Air Cooling Liquid Cooling Passive Cooling

Info
Fan Heat Sink Heat Pipe Vapor Chamber
Cold Plates
Cooling Module (HS) (HP) (VC)

Integral
Extrusion Mesh CMSEM One-Stop
Thermal Solution Service
Die Casting Grooved Mesh
Custom Design Pipelining
Skived Fin Sintered Powder Sintered Powder
Embedded
Stacked Fin Composite
SUNON provides a set of CMSEM services, designing thermal solutions from
scratch. We work together with our clients to design the best thermal
•The most efficient •Compact design •High reliability •Various pipe •Better isothermal modules for their individual needs. Then, we create a model to simulate
heat dissipation system and optimize each module’s thermal performance, which is passed through
•Large power carrier •Economic thermal design
Features solution various estimation and mass-production phrases. Through collaboration,
•Effective space solution •Flexible •High Qmax
the highest quality of service, and a timesaving process of solving heat
utilization configuration •High power density problems, SUNON provides our clients with optimal thermal solutions. 4
 Application

Industrial Equipment

Cold Plates Inverter Drive

ADAS ECU

Greater thermal efficiency, suitable for applications with high power

density and in need of quick power transfer.

Compact design for limited spaces and flexible customization of our

liquid cold plates to suit your needs.

2 pass 4 pass 6 pass Leaking safety and high reliability assured based on the strong thermal
design and stimulation analysis on request.
CM036-20001N CM036-20002N CM036-20003N

Copper Tube Embedded in Aluminum Base | Tube Dim.(mm) 9.50 O.D x7.02 I.D

Description Flow Rate Performance

1 GPM 1.5 GPM 2 GPM 2.5 GPM

# of Weight Plate Dim. Overall Length Power Watt
Part Tube Passes (g) (mm) (mm) (W) R PD R PD R PD R PD
(℃/W) (psi) (℃/W) (psi) (℃/W) (psi) (℃/W) (psi)

CM036-20001N 2 180 57.20 57.20 14.00 133.40 500 0.0580 0.80 0.0442 1.80 0.0400 3.20 0.0380 4.80

CM036-20002N 4 940 152.40 127.00 15.20 228.00 1000 0.0140 2.00 0.0112 4.00 0.0100 6.00 0.0093 9.20

CM036-20003N 6 1230 177.80 172.50 14.00 233.40 1000 0.0116 3.20 0.0096 5.00 0.0087 7.00 0.0080 11.00

5 6
 10.000
8.7500
7.5000
6.2500
5.0000

Air Cooling Vapor Chamber & Cold Plate

3.7500
2.5000
1.2500

Solution Solution
0.0000
Speed (m/s)
Performance
Before After 2.5432
2.2252

Customized air cooling configuration design : Slim-shaped design and suitable for limited system spaces.
1.9073
1.5895
Fin Fin
ADC and AL and fan die-casting techniques. Flexible and customized design that sustains high thermal effectiveness.
1.2716
0.95367

Space utilization and maximal thermal effectiveness. Steady and fast thermal uniformity that ensures better system function.
0.63578
Inlet Outlet 0.31789
Flow Flow
0.0000
Speed (m/s)

5G Passive CPU Cooler Thermal Resistance Passive CPU Cooler Thermal Resistance
0.30 1.20 0.30 1.00
Rth Pressure Drop Rth Pressure Drop 0.90
Whitley(Ice Lake) Eagle Stream (Sapphire
pphire Rapids) 0.25
Therrmal Resistance (℃/W)

Therrmal Resistance (℃/W)

0.25 1.00 0.80

Pressure Drop (in-H2O)

Pressure Drop (in-H2O)

0.70
0.20 0.80 0.20
0.60
Product Name ICX 1U ICX 2U Product Name EST 1U EST 2U 0.15 0.50
0.15 0.60
0.40
Sunon P/N SM316-20001Y SM420-20001Y 0.10 0.40 Sunon P/N SM320-21001Y SM421-21002Y 0.10
0.30
0.20
Dimensions (mm) 113 x 78 x 24.7 113 x 78 x 64 0.05 0.20 Dimensions (mm) 118 x78 x 30.43 118 x 78 x 64 0.05
0.10
ICX 1U EST 1U
0.00 0.00
Weight (g) 250 435
0.00
5 10 15 20 25 30 35
0.00
Weight (g) 270 450 10 12 14 16 18 20 22 24 26
Air Flow (CFM) Air Flow (CFM)
TDP (W) 205 300 TDP (W) 205 350 0.5
0.25 0.35 0.20
Rth Pressure Drop Rth Pressure Drop
Material Aluminum, Copper, ADC10 Material Aluminum, Copper, ADC10
Therrmal Resistance (℃/W)

Therrmal Resistance (℃/W)

0.4

Pressure Drop (in-H2O)

Pressure Drop (in-H2O)

0.20 0.28 0.15
Surface Treatment Nickle Plating Surface Treatment Nickle Plating
0.15 0.21 0.3
0.10
TIM SHIN-ETSUX23-7921 TIM SHIN-ETSUX23-7921
0.10 0.14 0.2

CPU Support Intel® Ice Lake / Cooper Lake Processor CPU Support Intel® Eagle Stream Processor 0.05
0.05 0.07 0.1

CPU Socket FCLGA 4189-4/5 (Socket P4/P5) ICX 2U CPU Socket LGA4677 EST 2U
0.00 0.00 0 0
5 10 15 20 25 30 35 10 15 20 25 30 35 40 45 50

7 Air Flow (CFM) Air Flow (CFM) 8

 High Power Heat Pipe Solution
AIR FLOW : 100 CFM
> Higher level thermal conductivity : 92~100w TDP. 0.1

R (C/W)
5G Networking
> Excellent thermal equilibrium, 80% plus increase in 0.09
thermal effectiveness. 0.08
> Can be configured with other components for high 0.07
Qmax
powered applications to reduce thermal resistance. 550~600W
We customize a full range of cooling solutions to offer 0.06
the best thermal solutions, meeting clients’ goals and 0.05

needs for any function, sizes, and budget. 0.04

0.03
0.02
200
20 300 400 500 600 700 800

Power (W)

Immersion Cooling Solution

E d g e a n d Storage Water Block Solution
tel CPU C o olers and
For In d develops
the latest thermal specif
ication for
oling modul
es,
> Low vibration and power-saving module
> Low maintenance and enhanced system effectiveness
ss
troduces an ign co
> SUNON in custom-des
PU co olers and various needs. > High reliability
C ermal
Intel server plications’ th
fy netw orking ap
odules Cold Plates
to fully satis
Customized M
EVAC
2U
1U

2000W
witch a n d Router
For S e of thermal
design pow
er
1000W~
h a wide rang
> Cooling so
lutions wit
w depending on
systems’ ne
eds.
400W~
2000
from 20w to
200W~
100W~
20W ~

Cold Plates / Customized

Extrusion / Stacked Fin / Customized Fan / Heat Pipes / AL Fin Fan / Heat Pipes / AL Fin Heat Pipes / AL Fin Heat Pipes / AL Fin

9 10

*G
ZPV
OFFE
TQFDJBM
TQFDJDBUJPO
1MFBTF
DPOUBDU
4VOPO
TBMFT

4QFDJDBUJPOT
BSF
TVCKFDU
UP
DIBOHF
XJUIPVU
OPUJDF
4QFDJDBUJPOT
JO
UIJT
DBUBMPH
BSF
GPS
SFGFSFODF



.PSF
4VOPO
QSPEVDUT
JOGPSNBUJPO
QMFBTF
WJTJU
46/0/
XFCTJUF
BU
XXXTVOPODPN

Automotive

~20W
20W 50W 200W
200 1000W~
W~

Heat Sink+Fan Heat Pipe 5PUBM
4PMVUJPO $PME
1MBUF

˙ &DPOPNJD
EFTJHO
TPMVUJPO ˙ 0WFSDPNF
TQBDF
MJNJUBUJPO ˙ &DJFOU
DPPMJOH
TPMVUJPO ˙ )JHI
QPXFS
EFOTJUZ
˙ .JOBUVSF
NPEVMF
TJ[F ˙ &DJFOU
IFBU
USBOTGFS ˙ 0QUJNJ[FE
NPEVMF
XFJHIU ˙ )JHI
QFSGPSNBODF
EFTJHO
˙ &DJFOU
IFBU
EJTTJQBUJPO ˙ 'MFYJCMF
EFTJHO
GFBTJCJMJUZ ˙ 4IPSUFO
BOE
TJNQMJGZ
UIF
QVSDIBTJOH ˙ .VMUJ
IFBU
TPVSDF
DPPMJOH
TPMVUJPO

Application -&%
IFBE
MJHIU
"NCJFOU
MJHIUJOH
Application )6%
"%"4
&7
DBS
DIBSHFS Application 4UFSFP
"NQMJFS
&$6
"QQMJDBUJPO $BS
#BUUFSZ

"%"4
&$6
#FBN
MJHIU POCPBSE
DIBSHFS "%"4
BOE
PUIFST

11 12
 Industrial

High-Efficiency Transfer Heat

IPC
Power watt: 40+6+8, total 54W
Module size: 200x100x20mm
CPU : 40W
Ta: 50℃
T-CPU <80℃,
T1<110 ℃
T2<110 ℃

T2 : 8W T1 : 6W

10~100W
10~100 100~200W
200W 200~1000W
200~10 1000W~
Original SUNON
Aluminum Heatsink Heat Pipe Integral / Embedded
d Heat
Heat Exchanger
Cooper Heatsink Vapor Chamber Cold Plate ˙ Efficient Heat Dissipation
Die-casting Heatsink Air Cooling Module ˙ Compact Design
Space Utilization "QQMJDBUJPO 1PXFS
4VQQMZ
˙
˙ Thermal Reliability ˙ Better Isothermal System &NCFEEFE
4ZTUFN
Economical Cooling Solutions Excellent Cooling Effectiveness
80.5 ℃ 75.5 ℃ ˙ ˙ Application Drive, IGBT modules

75.5 ℃ 74.5 ℃
Application IPC, Embedded System Application Drive, IPC

73.0 ℃ 72.9 ℃
*G
ZPV
OFFE
TQFDJBM
TQFDJDBUJPO
1MFBTF
DPOUBDU
4VOPO
TBMFT

13
4QFDJDBUJPOT
BSF
TVCKFDU
UP
DIBOHF
XJUIPVU
OPUJDF
4QFDJDBUJPOT
JO
UIJT
DBUBMPH
BSF
GPS
SFGFSFODF 14



.PSF
4VOPO
QSPEVDUT
JOGPSNBUJPO
QMFBTF
WJTJU
46/0/
XFCTJUF
BU
XXXTVOPODPN
 Heat Sink

Thermal Pad (TIM)

SSD Chip

Thermal Pad (TIM)

Heat Sink

SSD Chip Temperature Distribution 80.371

available *PS5 available Solid Temperature (℃)

76.998

73.626

Slot Machine
e Gaming PC Solid State Disk (SSD)) Before 70.253

66.881

TDP 30W TDP 250W Product Name SD-2280 63.509

Dimensions (mm) 48 x 88 x 23.5 Dimensions (mm) 135.33 x138 x 164 Sunon P/N SA007-21001S
60.136

56.764
Materials Heat Sink + Fan Module Materials Heat pipe modules+12025 Fan Dimensions (mm) 80 x 22 x 11.5 53.391
After
Materials Aluminum, Thermalpad 50.019

46.646

*G
ZPV
OFFE
TQFDJBM
TQFDJDBUJPO
1MFBTF
DPOUBDU
4VOPO
TBMFT

4QFDJDBUJPOT
BSF
TVCKFDU
UP
DIBOHF
XJUIPVU
OPUJDF
4QFDJDBUJPOT
JO
UIJT
DBUBMPH
BSF
GPS
SFGFSFODF
Application Suitable for 2280 SSD ( 1TB, 2TB, 4TB capacity ) 43.273

.PSF
4VOPO
QSPEVDUT
JOGPSNBUJPO
QMFBTF
WJTJU
46/0/
XFCTJUF
BU
XXXTVOPODPN 39.901

Entertainment
15 16