[CONTENTS]

❍ SECTION 1. SUMMARY
• SERVICING PRECAUTIONS .......................................................................................................... 1-2

• ESD PRECAUTIONS....................................................................................................................... 1-3

• SPECIFICATIONS ........................................................................................................................... 1-4

❍ SECTION 2. ELECTRICAL
• ELECTRICAL TROUBLESHOOTING GUIDE ................................................................................. 2-1

• INTERNAL BLOCK DIAGRAM of ICs .............................................................................................. 2-7

• BlOCK DIAGRAM .......................................................................................................................... 2-32

• MAIN SCHEMATIC DIAGRAM ...................................................................................................... 2-34

• CDP SCHEMATIC DIAGRAM ....................................................................................................... 2-36

• PRINTED CIRCUIT DIAGRAM ...................................................................................................... 2-38

❍ SECTION 3. CABINET MAIN CHASSIS & MECHANISM

• EXPLODED VIEW ........................................................................................................................... 3-1

❍ SECTION 4. REPLACEMENT PARTS LIST ................................................................... 4-1

- 1-1 -
 SECTION 1. SUMMARY
❏ SERVICING PRECAUTIONS
➊ Always disconnect the power source before:
1) Removing or reinstalling any component, circuit board, module or any other instrument assembly.
2) Disconnecting or reconnecting any instrument electrical plug or other electrical connection.
3) Connecting a test substitute in parallel with an electrolytic capacitor in the instrument.

CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in
an explosion hazard.

➋ Do not defeat any plug/socket B+ voltage interlocks with which instruments covered by this service
manual might be equipped.

❸ Do not apply power to this instrument and or any of its electrical assemblies unless all solid-state
device heat sinks are correctly installed.

❹ Always connect a test instrument’s ground lead to the instrument chassis ground before
connecting the test instrument positive lead. Always remove the test instrument ground lead last.
1) The service precautions are indicated or printed on the cabinet, chassis or components. When servicing,
follow the printed or indicated service precautions and service materials.

2) The Components used in the unit have a specified conflammability and dielectric strength. When
replacing any components, use components which have the same ratings. Components marked in
the circuit diagram are important for safety or for the characteristics of the unit. Always replace with the
exact components.

3) An insulation tube or tape is sometimes used and some components are raised above the printed writing
board for safety. The internal wiring is sometimes clamped to prevent contact with heating components.
Install them as they were.

4) After servicing always check that the removed screws, components and wiring have been installed
correctly and that the portion around the service part has not been damaged. Further check the insulation
between the blades of attachment plug and accessible conductive parts.

- 1-2 -
❏ ESD PRECAUTIONS
[Electrostatically Sensitive Devices (ESD)]
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such omponents
commonly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are
integrated circuits and some field-effect transistors and semiconductor chip components. The following
techniques should be used to help reduce the incidence of component damage caused by static electricity.
1) Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain
off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and
wear a commercially available discharging wrist strap device, which should be removed for potential
shock reasons prior to applying power to the unit under test.
2) After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive
surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3) Use only a grounded-tip soldering iron to solder or unsolder ESD devices.
4) Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static”
can generate electrical charges sufficient to damage ESD devices.
5) Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESD
devices.
6) Do not remove a replacement ESD device from its protective package until immediately before you are
ready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together
by conductive foam, aluminum foil or comparable conductive material).
7) Immediately before removing the protective material from the leads of a replacement ESD device, touch
the protective material to the chassis or circuit assembly into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8) Minimize bodily motions when handling unpackaged replacement ESD devices. (Otherwise harmless
motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor
can generate static electricity sufficient to damage an ESD device).

[CAUTION. GRAPHIC SYMBOLS]

THE LIGHTNING FLASH WITH APROWHEAD SYMBOL. WITHIN AN EQUILATERAL
TRIANGLE, IS INTENDED TO ALERT THE SERVICE PERSONNEL TO THE PRESENCE
OF UNINSULATED “DANGEROUS VOLTAGE” THAT MAY BE OF SUFFICIENT
MAGNITUDE TO CONSTITUTE A RISK OF ELECTRIC SHOCK.

THE EXCLAMATION POINT WITHIN AN EQUILATERAL TRIANGLE IS INTENDED TO

ALERT THE SERVICE PERSONNEL TO THE PRESENCE OF IMPORTANT SAFETY
INFORMATION IN SERVICE LITERATURE.

- 1-3 -
SECTION 2. ELECTRICAL
❏ ELECTRICAL TROUBLESHOOTING GUIDE

(1) No Power

ANY KEY POWER ON

YES

NO Check power supply circuitry.

Is power turned on?
Q505, Q506, IC201 Pin 39, Pin 87.

YES

NO Check Loading supply circuitry.

DISC loading?
Q402, Q404, Q406, Q409.
CW001 pin17, pin 4 IC201 pin21.
YES

NO Check laser circuitry.

Does initial reading occur?
CDP : Q30, IC30, IC31, IC34, IC35.

YES
Check focusing circuitry.
CDP PCB: IC30, IC34, IC35.

Check DISC.

NO Check tracking servo circuitry.

Can disc be played?
CDP PCB : IC30, IC34, IC35.

YES

NO Check audio circuitry.

Is audio output supplied?
IC201, IC302 CDP PCB: IC30~IC34.

YES

OK

- 2-1 -
(2) LCD light abnormal

ANY KEY POWER ON

(without DISC)

NO Check voltage in the power NO Power supply circuitry defective.

Do display LCD then light?
supply circuitry. Q501, Q502, Q506, IC201

YES

Is u-com IC201 reset circuit

normal? Pin86
NO Reset circuit defective.
4.8V IC201, Q505, Q506.

0V
YES

Is u-com IC201 Xin,Xout terminal NO

Pin 1,100 input? CT201, CC201, CC202 defective.
OSC : 4.5MHz

YES

Is u-com IC201 keyin Pin7 Pin45 NO CN201,front PCB pattern

0volt input? defective.

YES

Is u-com IC201 Pin46, 47, 48

output waveform normal? NO IC201 pin46~48,front PCB
5V pattern defective.

YES

Is IC701 com1, com2, com3

output waveform normal? NO IC701 Surrounding circuit PCB
5V pattern defective.

Display LCD connector defective.

- 2-2 -
(3) Initial reading is not carried out (with disc)

NO Check voltage in the power

DISC loading? supply circuitry .
Q505, R506, IC201 pin39, pin87
CDP PCB: IC34, IC35.

NO Is IC201 pin14 input waveform

Does disc motor rotate?
normal? NO Leaf SW contact defective.
Connector defective.
IC201 Pattern short.
open close
pin14

YES

Does laser light? NO

(A)
CDP PCB: CN30 pin12(LD)

YES
Is RF wave output?

RF
(B)

NO

Is tracking servo operating? Is signal output at TEO? NO

Is signal output at IC30 IC30(CDP PCB) defective.
Is the lower envelope of RF
NO NO Pin21 (CDP PCB)?
waveform flat?

YES YES
Pattern defective.

Is signal output at tracking

output IC30 Pin 34 (CDP PCB)? NO
IC30 (CDP PCB) defective.

YES Connector defective.

Pick-up defective.

Is rotation normal? Does IC31 Pin16(LKFS)

Is there any irregularity in as figure?
frequency? NO NO
IC31(CDP PCB) defective.

YES

Is RF signal normal without

dropout? NO Disc initial reading damaged or
defective.

YES
Disc defective.

- 2-3 -
(A) when laser does not light.

Is below signal “L” at IC30

Pin 37 (CDP PCB)?

NO

Has Pick-up returned to the NO Are data transferred from NO

IC31 defective.
innermost position? IC31 Pin 18, 20, 27?

YES YES

Is below signal output at IC31

Pin 18(CDP PCB)?
NO
IC30,31(CDP PCB) defective.

YES

Slide motor defective.

Connector defective.

Does pick-up stop after having Are detect output input at IC30
moved to the innermost position? Pin17 (CDP PCB)?
NO NO
IC31 Pin 16 Reset SW defective
Connector defective.

YES
YES

IC35 defective.

IC30 defective.

Has laser power source returned

to the Q30 (CDP PCB)? NO IC30 (CDP PCB) defective.
(Q30 collector voltage about Surrounding circuitry defective
1.8V)

YES

Flow laser current? NO NO TR (CDP PCB) defective.

Both voltage of Q30(CDP PCB) R37 (CDP PCB) Connector defective.
is about 1.0V? Laser defective

YES
NO Connector defective.
R37 (CDP PCB)
Laser defective

- 2-4 -
(B) when laser light.

NO Is signal output at focus search

Do lenses move up and down?
terminal? IC30 Pin31 (CDP PCB) NO
IC30(CDP PCB) defective.
YES

YES

Is signal output at IC35

Pin26, 27 (CDP PCB)? NO
IC30 defective.

YES

Insert disc and Actuator short.

in the case of Connector short.
check of initial
leading.

Is RF(HF) signal waveform

output? NO IC30(CDP PCB) defective.
Connector short.

YES

The waveform of RF(HF) is

below figure? NO IC30(CDP PCB) defective.
Q30, IC30(CDP PCB)
Amplitude surrounding circuitry defective.
0.4~1.0V

YES

Is FOK signal output? RF(HF)

0.2V over OK. NO
IC30(CDP PCB) defective.

FRSH

YES

Is FOK signal to IC201 Pin41?

NO
Pattern defective.

FRSH

YES

(C)

- 2-5 -
- 2-6 -
❏ INTERNAL BLOCK DIAGRAM of ICs
■ IC201 LC723700 (Micro-processor IC)

1) PORT ASSIGNMENT

SUBPD (IN)

HCTR (IN)
LCTR (IN)

PH2/ADI2
PH1/ADI1

PH3/ADI3
PH0/ADI0

VSSADC
EO3 (IN)
VDDPLL
VSSPLL

/RESET
TEST1

/HOLD
XOUT

AMIN
FMIN

/SNS
EO1
EO2

82 T PULSE DN
96 GNDPLL

93 VDDPLL
100 XOUT

86 RESET
92 SUBP
95 FMIN
94 AMIN

90 FMIF
89 AMIF
99 GND

81 GND
88 SNS
67 ACC
98 EO1
97 EO2

91 EO3

85 SM

83 SD
84 ST
XIN XIN 1 80 NC PI0/ADI4
TEST2 GND 2 79 E-PULSE DN PI1/ADI5
VREG VREG 3 78 RDS DATA PI2/ADI6
VSSCPU VSSCPU 4 77 LEVEL METER PI3/ADI7
SI0/PG3 NC 5 76 LOC/DX PJ0
SO0/PG2 NC 6 75 NC PJ1
SCK0/PG1 FRONT CHK 7 74 CDC ON PJ2
PG0 EJECT KEY 8 73 CDC DATA PJ3
SI1/PF3 LCD SI 9 72 CDC IN PK0INT0
SO1/PF2 LCD SO 10 71 RDS CLK PK1/INT1
SCK1/PF1 LCD CLK 11 70 NC PK2 INT2
PF0 LCD CE 12 69 NC PK3/INT3
SI2/PE3 NC 13 68 IF RQST PL0
SO2/PE2 CD INSERT 14 67 BAND1 PL1
SCK2/PE1 NC 15 LC723700 66 BAND2 PL2
PE0 /M_SRO 16 (SANYO) 65 A-MUTE PL3
PD3 M_D 17 64 T-MUTE PM0
PD2 W-LED 18 63 NC PM1
PD1/INT5 T-PULSE UP 19 62 NC PM2
PD0/INT4 E-PULSE UP 20 61 NC PM3
PC3 ACC_ON 21 60 BEEP PN0/BEEP
PC2 M-CLK 22 59 NC PN1
PC1 M_DO 23 58 NC PN2
PC0 M-CS 24 57 NC PN3
PB3 MRESET 25 56 NC PO0
PB2 NC 26 55 NC PO1
PB1 NC 27 54 NC PO2
PB0 NC 28 53 NC PO3
PA3 OPTION IN 29 52 NC PP0
PA2 OPTION IN 30 51 NC PP1
OPTION IN 31
OPTION IN 32
OPTION OUT 33
OPTION OUT 34
OPTION OUT 35
OPTION OUT 36
NC 37
NC 38
VDD 39
GND 40
NC 41
NC 42
NC 43
NC 44
DIAGNOSTIC 45
ECE 46
EC0 47
ECL 46
POWER ON 49
NC 50
VSSPORT
VDDPORT

PQ3
PQ2
PQ1
PQ0
PR3
PR2
PR1
PR0
PA1
PA0

PS3
PS2
PS1
PS0

PP3
PP2
PT1
PT0

- 2-7 -
2) PIN DESCRIPTION

- 2-8 -
- 2-9 -
- 2-10 -
■ IC301 LC75421M (Electronic Volume controller IC)

1) PORT ASSIGNMENT

- 2-11 -
■ IC302 TDA8571J

1) PORT ASSIGNMENT
MODE VP1 VP2 VP3 VP4

15 1 8 16 23

10
IN1 +
2
OUT1+
-
30 K•
+ 4
OUT1-
-

Vref
11
IN2 + 7
OUT2+
-
30 K•
+ 5
OUT2-
-
12
SGND 9
DIAGNOSTIC VDIAG

13
IN3 + 17
OUT3+
-
30 K•
+ 19
OUT3-
-

Vref
14
IN4 + 22
OUT4+
-
30 K•
+ 20
OUT4-
-

3 6 18 21

PGND1 PGND2 PGND3 PGND4 MGG153

- 2-12 -
■ IC701 LD4104 (LCD Driver IC)

1) Block Diagram

2) PORT ASSIGNMENT

- 2-13 -
■ IC30 S1L9226X (RF AMP IC)

1) Block Diagram

- 2-14 -
2) PIN DESCRIPTION

Pin No. Symbol I/O Description

1 RFM I RF summing amp. inverting input
2 RFO O RF summing amp. output
3 EQI I RFO DC eliminating input(use by MIRROR, FOK ,AGC & EQ terminal)
4 EQO O RF equalizer output
5 EFMI I EFM slice input. (input impedance 47K)
6 VCC P Main power supply
7 FRSH I Capcitor connection to focus search
8 FSET I Filter bias for focus,tracking,spindle
9 FLB I Capacitor connection to make focus loop rising band
10 FGD I Terminal to change the hign frequency gain of focus loop
11 FSI I Focus servo input
12 TGU I Connect the component to change the high frequency of tracking Loop
13 ISTAT O Internal status output
14 MCK I Micom clock
15 MDATA I Data input
16 MLT I Data latch input
17 RESET I Reset input
18 CLVI I Input the spindle control output from DSP
19 WDCK I 88.2KHz input terminal from DSP
20 LOCK I Sled run away inhibit pin (L: sled off & tracking gain up)
21 EFM O EFM output for RFO slice(to DSP)
22 ASY I Auto asymmetry control input
23 SPM I Spindle amp. inverting input
24 SPO O Spindle amp. output
25 SLM I Sled servo inverting input
26 SLO O Sled servo output
27 SLP I Sled servo noninverting input
28 TEM I Tracking servo amp.inverting input
29 TEO O Tracking servo amp. output
30 FEM I Focus servo amp. inverting input
31 FEO O Focus servo amp. output pin

- 2-15 -
Pin No. Symbol I/O Description
32 GND P Main ground
33 TZC/ I Tracking zero crossing input & Check the position of pick-up wherther inside or
SSTOP not
34 TEIO B Tracking error output & Tracking servo input
35 LPFT I Tracking error integration input (to automatic control)
36 ATSC I Anti-shock input
37 LD O APC amp. output
38 PD I APC amp. input
39 PDAC I Photo diode A & C RF I/V amp. inverting input
40 PDBD I Photo diode B & D RF I/V amp. inverting input
41 PDF I Photo diode F & tracking(F) I/V amp. inverting input
42 PDE I Photo diode E & tracking(E) I/V amp. inverting input
43 DCB I Capacitor connection to limit the defect detection
44 MCP I Capacitor connection to mirror hold
45 DCCI O Output pin to connect the component for defect detect
46 DCCO I Input pin to connect the component for defect detect
47 VREF O (VCC+GND)/2 Voltage reference output
48 EQC I AGC_equalize level control terminal & capacitor terminal to input in to VCA

- 2-16 -
■ IC31 S5L9290X (DSP FOR CDP)

1) Block Diagram

- 2-17 -
2) PIN DESCRIPTION

NO. NAME I/O Pin Description

1 VSSA_PLL - Analog Ground for DPLL
2 VCO1LF O Pump out for VCO1
3 VSSD_PLL - Digital Ground Separated Bulk Bias for DPLL
4 VDDD_PLL - Digital Power Separated Bulk Bias for DPLL (3V Power)
5 VDDD1-5V - Digital Power (5V Power, I/O PAD)
6 XIN I X'tal oscillator input (16.9344MHz)
7 XOUT O X'tal oscillator output
8 VSSD1 - Digital Ground (I/O PAD)
9 EFMI I EFM signal input
10 LOCK O CLV Servo locking status output
11 SMEF O LPF time constant control of the spindle servo error signal
12 SMDP O Phase control output for Spindle Motor drive
13 SMDS O Speed control output for Spindle Motor drive
14 WDCK O Word clock output (Normal Speed : 88.2KHz, Double Speed : 176.4KHz)
15 TESTV I Various Data/Clock Input
16 LKFS O The Lock status output of frame sync
17 C4M O 4.2336MHz clock output
18 RESETB I System Reset at 'L'
19 MLT I Latch signal input from Micom
20 MDAT I Serial data input from Micom
21 MCK I Serial data receiving clock input from Micom
22 ISTAT O The internal status output to Micom
23 S0S1 O Subcode sync signal(S0+S1) output
24 SQCK I Subcode-Q data transfering bit clock input

- 2-18 -
NO. NAME I/O Function Description
25 SQDT O Subcode-Q data serial output
26 MUTE I System mute at 'H'
27 VDDD2-3V - Digital Power (3V Power, Internal Logic)
28 VSSD2 - Digital Ground (Internal Logic)
28 VDDD3-5V - Digital Power (5V Power, I/O PAD)
30 SBCK I Subcode data transfering bit clock
31 JITB O Internal SRAM jitter margin status output
32 C2PO O C2 pointer output
33 DATX O Digital audio data output
34 SADTO O Serial audio data output (48 slot, MSB first)
35 LRCKO O Channel clock output
36 BCKO O Bit clock output
37 BCKI I Bit clock input
38 LRCKI I Channel clock input
39 SADTI I Serial audio data input (48 slot, MSB first)
40 VSSD_DAC - Digital Ground for DAC
41 VDDD_DAC - Digital Power for DAC (3V Power)
42 RCHOUT O Right-Channel audio output through DAC
43 VSSA_DAC - Analog Ground for DAC
44 VREF O Referance Voltage output for bypass
45 VHALF O Referance Voltage output for bypass
46 VDDA_DAC - Analog Power for DAC (3V Power)
47 LCHOUT O Left-Channel audio output through DAC
48 VDDA_PLL - Analog Power for PLL (3V Power)

- 2-19 -
■ IC32 TMD2101 (MP3 DECODER IC)

1) PORT ASSIGNMENT

- 2-20 -
2) BLOCK DIAGRAM

- 2-21 -
2) PIN DESCRIPTION

- 2-22 -
- 2-23 -
■ IC33 K4S641632D (CMOS SDRAM)

1) Block Diagram

- 2-24 -
2) PORT ASSIGNMENT

- 2-25 -
■ IC34 S3C825A (CMOS MICROCONTROLLER)

1) Block Diagram

- 2-26 -
2) PIN ASSIGNMENT

- 2-27 -
3) PIN DESCRIPTION

- 2-28 -
- 2-29 -
■ IC35 FAN8039D (MOTOR DRIVER IC)

1) PIN ASSIGNMENT

2) PIN DESCRIPTION

- 2-30 -
3) BLOCK DIAGRAM

- 2-31 -
❏ BlOCK DIAGRAM

2-32 2-33
❏ MAIN SCHEMATIC DIAGRAM

2-34 2-35
❏ CDP SCHEMATIC DIAGRAM

2-36 2-37
❏ PRINTED CIRCUIT DIAGRAM

1. FRONT PCB BOTTOM 1. FRONT PCB TOP 2. TRIM PCB BOTTOM 2. TRIM PCB TOP

2-38 2-39
3. MAIN PCB BOTTOM

2-40 2-41
3. MAIN PCB TOP

2-42 3-43
4. CDP BOTTOM

2-44 2-45
4. CDP TOP

2-46 2-47
 SECTION 3. CABINET MAIN CHASSIS & MECHANISM
■ EXPLODED VIEW
NOTE) Refer to “SECTION 4 REPLACEMENT CAUTION
PARTS LIST” in order to look for the
part number of each part.
Exposed blade will cause
severe injury

290

288

450
A26 304
A42 458

A41 450 459

A40
458

303
265

253
264
459
458
305
301
255 451 458

A44
253

254
250 323
325 456
322 456 452 306
324 326 A43 456
A46
333
321
327
328
329
330 459
310
331
332 330 459

320 309

3-1 3-2