RAYMING PCB & ASSEMBLY

Top 5 Ceramic PCB Manufacturers

in The World
Ceramic printed circuit boards (PCB) offer unique benefits like high heat
resistance, electrical insulation and robust mechanical strength making
them suitable for demanding applications in industries such as aerospace,
defense, medical, energy exploration etc. This article provides an
overview of the top 5 global manufacturers of ceramic PCBs based on
factors like technology leadership, revenue scale, customer base and
application reach.

1. Rayming Technology

Headquarters: Shenzhen, China

Founded: 2005

PCB Manufacturing & Assembly Services https://www.raypcb.com/

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Core Capabilities:

 High density interconnect PCBs

 High frequency/high speed PCBs

 Metal core PCBs

 Ceramic PCBs

 Flex-rigid PCBs

Industry Segments Served:

 Aerospace and Defense

 Healthcare

 Automotive

 5G Infrastructure

Key Highlights:

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 Possesses end-to-end design, fabrication and testing capabilities for

ceramic PCBs leveraging cutting edge manufacturing technology

 Caters to customers globally through manufacturing facilities in

China along with sales support across Americas, Europe and Asia

 Specializes in ceramic substrates such as aluminum oxide and

aluminum nitride PCBs finding applications in sectors like defense
systems, satellite equipment, medical diagnostics etc.

 Strong R&D culture focused on next generation PCB fabrication

techniques involving embedded passives integration along with high
density interconnects

With annual revenues exceeding $250 Million supported through large

global talent pool and multi-site infrastructure, Rayming has emerged
as the top ceramic PCB manufacturer through technology
leadership across domains like high precision PCBs for aerospace and
automobile electronics.

2. TTM Technologies

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Headquarters: California, USA

Founded: 1998

Core Capabilities:

 Rigid PCBs

 RF/Microwave PCBs

 Flexible PCBs

 Rigid-Flex PCBs

 Ceramic PCBs

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 IC Substrates

Industry Segments Served:

 Data Networking

 Telecommunications

 Defense and Aerospace

 Medical, Industrial

 Automotive

Key Highlights:

 Leading American PCB manufacturer providing ceramic, silicon and

quartz substrates

 Possesses specialized manufacturing technology for ceramic multi

layer boards required in high frequency applications

 Caters to major defense electronics and aerospace customers with

demanding PCB performance requirements

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 Development of next generation radar, communications and

navigation systems driving adoption of TTM ceramic PCBs

With strategic acquisitions and sustained R&D investments, TTM

continues to expand ceramic PCB capabilities making it a dominant
American player.

3. Kyocera

Headquarters: Kyoto, Japan

Founded: 1959

Core Capabilities:

 LTCC (Low Temperature Co-fired Ceramic) boards

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 High thermal conductivity ceramic boards

 High frequency signal transmission boards

 Ceramic BGA/LGA interposers

Industry Segments Served:

 Industrial machinery and automation

 Automotive electronics

 Medical devices

 Smart energy systems

Key Highlights:

 Completely vertically integrated production systems from ceramic

material formulation to fabrication, inspection and testing

 Possesses unmatched expertise in high performance ceramic PCB

technology reflected in qualification credentials across industries

 Deep rooted reliablity culture through quality control traceability

across entire production environment

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 Continuous innovation in advanced ceramic materials along with

precision manufacturing technology upgradation

Drawing from six decades of electronics miniaturization experience,

Kyocera sets the benchmark in ceramic PCB technology
commercialization.

4. Maruwa

Headquarters: Nagoya, Japan

Founded: 1947

Core Capabilities:

 Multilayer ceramic PCBs

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 High thermal conductivity ceramic boards

 Metal based circuit boards

 Thick film printed boards

Industry Segments Served:

 Automotive electronics

 Industrial equipment

 Office automation

 Semiconductor manufacturing

Key Highlights:

 High precision thick film printing technology perfected over 8

decades of electronics fabrication experience

 Early adopter and developer of glass ceramic PCBs finding increased

acceptance across automotive sector

 Strategic investments towards expanding ceramic PCB production

capacity using fully automated manufacturing lines

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 Process innovations to minimize environmental impact through

reduced water consumption and recycling measures

Leveraging operational excellence reflecting in industry leading quality

certification credentials, Maruwa delivers 1 billion+ ceramic PCBs
annually to a global customer base.

5. Micro Systems Engineering (MSE)

Headquarters: Colorado, USA

Founded: 1969

Core Capabilities:

 Thick film ceramic PCBs and substrates

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 Multi layer low temperature co-fired ceramic (LTCC) boards

 High density small form factor PCBs

 Flex to install capable boards

Industry Segments Served:

 Aerospace and defense

 Telecommunications

 Medical electronics

 Test and measurement

Key Highlights:

 High mix low volume flexible manufacturing set up amenable for

quick turnaround of prototypes and small pilot builds

 Possesses know how of materials ranging from aluminum to quartz

and glass offering one stop test vehicle platform

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 Adept at board level bonding and attachment mechanisms including

ball grid arrays, gold stud bumping along withSequential Build Up
(SBU) and Sequential Lamination Assembly (SLA) processes

Thereby MSE leverages ceramic PCB fabrication expertise to support

defense and industrial electronics across product realization continuum
from NPI to sustenance builds.

Evaluation Criteria

The top ceramic PCB manufacturers are characterized through:

1. Materials and Processes Mastery: Ability to work with substrate

choices like Alumina, Aluminum Nitride or LTCC ceramics
complemented through optimizations across thick film printing,
laminating, firing, machining and assembly practices.

2. Quality and Reliability: Possesses end-to-end process control

combined with intensive validation following established benchmarks.
Availability of reliability test data.

3.Customizability: Equipped to customize parameters like layer count,

feature sizes, finishes and form factors as per specific applications across
industries and loading conditions.

4. Cost Leadership: Leverage operational scale, supply chain

partnerships, yield focused manufacturing and technology investments
towards delivering solution value.

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Thereby basis consistent technology and servicing excellence, above

players continue advancing ceramic PCB fabrication ecosystem pushing
electronics performance limits.

Growth Outlook for Ceramic PCBs

Key Trends Driving Adoption

 Miniaturization needs arise from making electronic systems smaller,

lighter and efficient

 Growing prominence of wide bandgap materials like SiC and GaN

requiring compatible carrier boards

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 Temperature tolerance requirements for automotive electronics

located in close proximity to engines

 High isolation mandatory for sensitive circuits involved in

instrumentation, healthcare

 Signal integrity retention across high frequency defense

communication links

Market Projections

As per leading analysts, ceramic PCB market poised to grow at 9%+

CAGR during 2023–2030 timeframe spanning:

1. Telecom infrastructure for 5G and data centers

2. Next generation defense electronics including radar and imaging

systems

3. Expanding application across high temperature automotive

electronics involving ADAS, Powertrain, Battery Management
systems

4. Medical electronics for implants, surgical robots

5. Industrial automation

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Thereby sustained innovation in semiconductor fabrication especially

power devices and RF communications would fuel volume adoption of
ceramic boards providing ideal carrier substrate.

Frequently Asked Questions

Q1. Why opt for ceramic PCBs despite higher costs over
conventional boards?

Ceramic PCBs handle higher temperature loads preventing warping

deformation risks with FR4 material. Also benefits like dimensional
stability across thermal cycles, moisture absorption resilience, electrical
insulation make ceramics suitable for defense systems involving extreme
dynamic range loading.

Q2. What are the key differences when comparing aluminum

nitride and aluminum oxide ceramic PCBs?

Aluminum nitride ceramics possess higher thermal conductivity helping

heat dissipation, making them popular for managing thermal rise in
power electronic modules. On the other hand, aluminum oxide offers
relatively lower loss tangent at high frequencies suiting microwave
systems.

Q3. What process innovations are happening in ceramic PCB

fabrication area?

Advances span integrating passive components through printing saving

real estate, additive manufacturing using 3D micro-dispensing,

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sequential laminating and reduced firing to enable embedding actives.

These help achieving further miniaturization and improved functionality.

Q4. Which application segments are driving majority of

ceramic PCB market growth?

Key growth contributors are communications infrastructure for 5G

networks, radar and satellite payloads in defense sector and expanding
electronics in aerospace along with automotive ADAS and battery
management systems.

Q5. How does demand-supply environment look like for

ceramic PCBs presently?

Healthy capacity expansion is underway by existing manufacturers along

with newer players entering leveraging overseas partnerships to cater to
growing defense, industrial, medical and telecom sector volume
requirements, though average lead times still range 8–12 weeks for
complex builds.

PCB Manufacturing & Assembly Services https://www.raypcb.com/