What Is Outer Layer Etching

RAYMING PCB & ASSEMBLY
What is Outer Layer Etching?
Printed circuit boards (PCBs) form the backbone of electronics. They provide
the mechanical structure and electrical connections between components. To
create the conductive copper traces on a PCB, a subtractive process called
etching is used.
Etching involves removing unwanted copper from the outer layers of a PCB
using chemicals to leave only the desired conductive pattern behind. This
article provides an in-depth look at PCB outer layer etching.
The PCB etching process
PCB Manufacturing & Assembly Services https://www.raypcb.com/

PCB layer stackup
A typical PCB consists of multiple layers stacked up to form the board. The core
layers provide mechanical support and are usually FR4 or some other dielectric
material. On the top and bottom of the board are the outer copper layers
which will be etched to form the traces.
Figure 1 shows a simple 2-layer board with top and bottom copper cladding
surrounding an FR4 core.
┌────────────────────────┐
│ Top │
│ Copper │
│ │
│ FR4 │
│ │
│ Copper │

│ Bottom │
└────────────────────────┘
Figure 1: Simple 2-Layer PCB Stackup
Additional layers can be added in complex designs by including more
core/copper sets. But the etching process focuses specifically on the top and
bottom outer copper layers.
Photolithography
Before etching, the desired conductive pattern needs to be defined on the
outer copper layers. This is achieved using a process called photolithography.
A light-sensitive chemical called photoresist is applied to the copper surfaces.

Next, a film containing the desired circuit pattern blocks light during exposure
of the photoresist. Where light hits the photoresist, a chemical reaction occurs
making those areas susceptible to etching. Where light was blocked, the
photoresist remains intact protecting the underlying copper.
After exposure, the board is submerged in a chemical developer solution which
removes the exposed photoresist while leaving resist covering parts which will
become traces. This leaves a board with bare copper traces surrounded by
photoresist mask.
Etchant chemicals
With the conductive pattern defined using photoresist, the actual subtractive
etching can occur. This requires an etching chemical which can dissolve copper
but leaves the photoresist mask intact.
Common PCB etchants include:
 Ferric chloride - An iron chloride solution which aggressively etches copper.

 Ammonium persulfate - An oxidizing salt that dissolves copper.
 Hydrogen peroxide/sulfuric acid - Removes copper by oxidation reaction.
The specific etchant chemistry impacts parameters like etch rate, sidewall angle,
mask compatibility and more.
Etching process

The PCB sample enters the etching chamber where fresh etchant solution flows
evenly across both outer copper surfaces simultaneously. The temperature and
flow is controlled to achieve the target etch rate.
As the etchant contacts exposed copper traces, it begins dissolving the metal
away. Protected areas remain intact to become the desired conductive circuit
paths.
Gentle agitation helps expose fresh copper to the solution as etching
progresses. After a controlled duration, all unwanted copper will be dissolved
leaving only the thin copper traces.
Figure 2 illustrates how the etching process removes copper to form the
intended conductive pattern:
Before Etching:

┌────────────────────────┐
│ Uniform Copper │
│ │
│ FR4 │
│ │
│ Uniform Copper │
└────────────────────────┘
After Etching:
┌────────────────────────┐
│ Desired Copper Traces │
│ │
│ FR4 │
│ │
│ Desired Copper Traces │
└────────────────────────┘
The etched PCB can now undergo other fabrication processes like plating,
solder mask application, silkscreening and more.
Key process parameters
Several key parameters influence the etching process and quality of the final
boards:

Etchant temperature
Etchant temperature directly impacts the copper etch rate. The general
guideline is that rate doubles for every 18°F (10°C) increase. Faster etching
reduces production time but can decrease precision.
Agitation
Constant gentle agitation helps expose fresh copper surfaces to etchant as
etching progresses. Stagnant conditions slow etching in hard to reach areas.
Etchant concentration

As copper dissolves into the etching solution, it dilutes the active chemical
concentration lowering etch rate. Maintaining proper concentration is key.
Nozzle design
The spray nozzle design influences fluid flow across the boards. Uniform,
consistent flow helps achieve even etching without isolated slow spots.
+--------------------------+-------------------+
| Parameter | Typical Values |
+--------------------------+-------------------+
| Etchant Temperature | 100-140°F |
+--------------------------+-------------------+
| Agitation | 50-100 RPM |
+--------------------------+-------------------+
| Etchant Concentration | Per Manufacturer |
+--------------------------+-------------------+
| Nozzle Flow Rate | 0.5 GPM |
+--------------------------+-------------------+
Table 1: Key etching parameters and typical values
Understanding and controlling these parameters allows optimizing the etching
process for cost, precision and throughput tradeoffs.

Etching challenges
While etching itself is conceptually simple, several common challenges can
impact results:
Overetching
Undercut traces having insufficient copper thickness for conductivity and
attachment. Caused by excess etching beyond desired depth.
Undercutting
Reduced trace width from etchant attacking copper under photoresist edges.
Impacts conductance and precision.
Pitting
Rough copper surface with cavities form making subsequent PCB fabrication
steps like plating difficult.
Mask lifting
Etchant works under photoresist mask lifting it from copper surface leading to
undercutting.
+-------------+------------------------------------------------+
| Challenge | Root Causes |
+-------------+------------------------------------------------+

| Overetching | Excess etching time, high etchant temperature |
+-------------+------------------------------------------------+
| Undercutting| Etchant seeping under mask |
+-------------+------------------------------------------------+
| Pitting | Contaminants in etchant solution |
+-------------+------------------------------------------------+
| Mask lifting| Poor mask adhesion |
+-------------+------------------------------------------------+
Table 2: Common etching defects and potential root causes
Careful process control is required to achieve target etch depth without these
defects occurring.
Multi-step etching

For maximum precision and efficiency, a multi-step spray etching approach is
often used:
1. Bulk etching - High flow rate rapidly etches most of copper away.
2. Final etching - Reduced flow with precise control removes last bit of copper to target
depth.
3. Targeted etching - Special nozzle focuses on isolated spots needing additional etching.
4. Validation - Optical measurement or cross-sectioning confirms target depth reached
uniformly.
This strategy offers a great balance of throughput and accuracy in etching
outer layers.
Environmental considerations
Like most industrial processes, PCB etching has environmental impacts from
production waste and chemical use. Responsible disposal of depleted etchant
solution and rinse water is required.
Transitioning to more eco-friendly etching chemicals can reduce
environmental footprint:
 Sodium Persulfate is biodegradable etchant

 Hydrogen Peroxide is neutralized into water
 Carbon dioxide etchant is reusable
Implementing closed-loop systems with distillation recovery units also
decreases chemical waste.
Overall there are multiple improvement opportunities as newer etchant
chemistries and equipment emerge.

Conclusion
Etching of the outer copper layers is a crucial PCB fabrication process to form
the desired conductive traces. It employs a subtractive approach using
chemicals to remove unwanted copper after the trace pattern has been
defined with photolithography process.
Controlling parameters like etchant temperature, concentration and flow
uniformity is critical to achieve precision etching without defects. Multi-step
spray etching further optimizes the process. Environmental impact can be
minimized with responsible chemical handling and recovery procedures.
Understanding the etching mechanisms and process nuances allows
fabrication of high-quality PCBs cost-effectively. This enables producing the

interconnected boards that power countless electronic devices we use
everyday.
Frequently Asked Questions
What are the main types of etchants used?
The most common PCB etchant solutions are:
 Ferric chloride - Iron chloride salt that aggressively etches copper.

 Ammonium persulfate - Oxidizing chemical that dissolves copper.
 Cupric chloride - More concentrated copper chloride etchant.
Newer options like carbon dioxide and hydrogen peroxide lowering
environmental impact also exist.
How is overetching prevented?
Overetching undercuts traces by removing too much copper. This is prevented
by:
 Controlling etching time closely based on etch rates

 Frequent optical measurement of copper thickness
 Using multi-step reduced flow etching in final stages
Together these help stop the process before overetching occurs.
What causes undercutting of traces?

As etchant seeps under the protective photoresist mask it starts attacking the
sides of copper traces. This undercutting reduces conductor width and
precision.
Proper photoresist processing to avoid cracks and enhance copper adhesion
prevents the problem. Etchant temperature also impacts undercutting rate.
When are solder masks applied on PCBs?
Solder masks are protective coatings applied after etching and several other
fabrication steps have completed. This includes hole drilling/plating and a
thorough PCB cleaning.
Applying mask too early seals in contaminants causing issues with subsequent
processes. The final stages after etching are ideal.
How often is etchant solution replaced?
The etchant baths require replenishment after 1-2 weeks of continual etching
depending on volume. As copper accumulates, the concentration drops
slowing etch rate.
Frequent testing and topping off etchant tanks extends bath life. But periodic
full solution replacement is unavoidable.

What Is Outer Layer Etching

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RAYMING PCB & ASSEMBLY

What is Outer Layer Etching?

the mechanical structure and electrical connections between components. To

create the conductive copper traces on a PCB, a subtractive process called

article provides an in-depth look at PCB outer layer etching.

The PCB etching process

PCB Manufacturing & Assembly Services https://www.raypcb.com/

PCB layer stackup

which will be etched to form the traces.

surrounding an FR4 core.

PCB Manufacturing & Assembly Services https://www.raypcb.com/

Figure 1: Simple 2-Layer PCB Stackup

Additional layers can be added in complex designs by including more

bottom outer copper layers.

Before etching, the desired conductive pattern needs to be defined on the

outer copper layers. This is achieved using a process called photolithography.

A light-sensitive chemical called photoresist is applied to the copper surfaces.

PCB Manufacturing & Assembly Services https://www.raypcb.com/

photoresist remains intact protecting the underlying copper.

After exposure, the board is submerged in a chemical developer solution which

but leaves the photoresist mask intact.

Common PCB etchants include:

 Ferric chloride - An iron chloride solution which aggressively etches copper.

mask compatibility and more.

PCB Manufacturing & Assembly Services https://www.raypcb.com/

flow is controlled to achieve the target etch rate.

Gentle agitation helps expose fresh copper to the solution as etching

progresses. After a controlled duration, all unwanted copper will be dissolved

leaving only the thin copper traces.

intended conductive pattern:

PCB Manufacturing & Assembly Services https://www.raypcb.com/

│ Desired Copper Traces │

│ Desired Copper Traces │

solder mask application, silkscreening and more.

Key process parameters

PCB Manufacturing & Assembly Services https://www.raypcb.com/

reduces production time but can decrease precision.

Constant gentle agitation helps expose fresh copper surfaces to etchant as

etching progresses. Stagnant conditions slow etching in hard to reach areas.

PCB Manufacturing & Assembly Services https://www.raypcb.com/

concentration lowering etch rate. Maintaining proper concentration is key.

| Parameter | Typical Values |

| Etchant Temperature | 100-140°F |

| Agitation | 50-100 RPM |

| Etchant Concentration | Per Manufacturer |

| Nozzle Flow Rate | 0.5 GPM |

Table 1: Key etching parameters and typical values

Understanding and controlling these parameters allows optimizing the etching

process for cost, precision and throughput tradeoffs.

PCB Manufacturing & Assembly Services https://www.raypcb.com/

While etching itself is conceptually simple, several common challenges can

Undercut traces having insufficient copper thickness for conductivity and

attachment. Caused by excess etching beyond desired depth.

Impacts conductance and precision.

steps like plating difficult.

| Challenge | Root Causes |

PCB Manufacturing & Assembly Services https://www.raypcb.com/

| Overetching | Excess etching time, high etchant temperature |

| Undercutting| Etchant seeping under mask |

| Pitting | Contaminants in etchant solution |

| Mask lifting| Poor mask adhesion |

Table 2: Common etching defects and potential root causes