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All about TACONIC material RF-35 PCB Manufacturing

Introduction

Taconic RF-35 is a popular high frequency laminate material designed for

performance-driven RF PCB applications. With a dielectric constant of 3.5,

low loss, and tight material uniformity, RF-35 enables excellent signal

integrity for today’s high speed digital and analog circuits.

This article provides an in-depth look at RF-35 material properties,

performance capabilities, design considerations, and applications. We’ll

explore everything engineers need to know about specifying and working

with this versatile RF material.

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RF-35 Overview

Taconic RF-35 is a PTFE composite laminate comprised of:

 Woven fiberglass reinforcement

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 Ceramic filler particles

 PTFE (polytetrafluoroethylene) resin system

With a dielectric constant of 3.5, it provides:

 Excellent high frequency signal performance

 Very low loss characteristics

 Tight dielectric constant tolerance

RF-35’s properties make it suitable for a wide range of radio frequency,

microwave, millimeter-wave, and multi-gigabit digital applications. It

strikes an optimal balance between cost and high frequency signal

integrity.

Some key traits of Taconic RF-35 include:

 Dielectric constant of 3.5 +/- 0.05

 Low loss with tight uniformity

 Excellent thermal stability

 Good CTE for reliability

 Lead-free compatible

 US laminator source

 ITAR free

 RoHS compliant

 Cost-effectiveness

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For designs from 10+ Gbps digital to Ku band RF, RF-35 delivers proven

results across countless commercial and defense programs.

Material Properties

RF-35 is formulated from PTFE reinforced with ceramic particles to

achieve:

Dielectric Constant – The k-value determines velocity of signal propagation

and affects many circuit parameters. RF-35 provides an Er of 3.5 with very

tight +/- 0.05 tolerance for consistent performance. This enables excellent

impedance control compared to typical FR-4 (Er=4.5).

Loss Tangent – With a loss tangent of just 0.0019, RF-35 provides very low

loss for high frequency energy. This maximizes Q factors in resonant

circuits and insertion loss in transmission lines. Wide range of tested Dk

from DC to Ku band.

Moisture Absorption – At just 0.02% moisture absorption, RF-35 resists

detrimental effects of humidity and water ingress far better than

conventional FR-4 material. This enhances long term reliability.

Thermal Performance – With a Z-axis CTE of 82 ppm/C, close PCB/laminate

CTE matching reduces stresses under temperature cycling for excellent

reliability. Good thermal conductivity (0.71 W/mK) spreads heat.

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Lead-Free Assembly – RF-35 achieves high Tg (>280C) allowing

compatibility with lead-free solder profiles of up to 260C for modern

assembly.

Available Forms

RF-35 laminate allows flexibility through different standard offerings:

Copper Cladding

 1⁄2, 1, and 2 oz ED copper foil

 Standard HTE copper and rolled copper available

 Double-sided cladding enables signal layers

Core Thicknesses

 From 0.005 inches to 0.125 inches

 Typical stackups use multiple 0.005″ cores

 Thicker cores provide rigidity when needed

Panel Sizes

 18” x 24”, 18” x 36”, and 24” x 36” standard panels

 Custom panel sizes possible

Prepreg

 106 and 1067 styles available

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 Enables bonding multilayer board stackups

 Matching resin system

Rod and Plate

 For machined parts, spacers, and non-PCB applications

 Reduces PIM in RF assemblies

 Ideal for fixtures and testing

This range covers the needs of most RF-35 PCB implementations from

prototyping to production.

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PCB Performance Capabilities

RF-35 laminate provides excellent RF and high speed digital performance

when designed properly:

Frequency Range

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 Usable continuous range from DC to Ku band (18 GHz)

 Material characterizations up to 40+ GHz

 Q factors exceeding 300 above 8 GHz

Loss

 Low loss tangent of 0.0019

 Insertion loss < 0.016 dB/inch at 20 GHz in 50Ω stripline

VSWR

 Tight dielectric constant tolerance enables excellent impedance

control

 VSWR < 1.2 up to 15 GHz achievable

Propagation Delay

 Delay = 1.7 ns/inch typical at 50Ω

 Enables high data rates and rise time performance

Pulse Response

 TDR shows minimal discontinuities and reflections

 Clean time domain performance for ultra high-speed digital

Leveraging these attributes allows RF-35 PCBs to deliver highly repeatable

RF and high speed digital operation.

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Design Considerations

To obtain maximum benefit from RF-35 laminates, engineers should

follow best design practices:

Stackup Planning

 Use multiple thinner cores instead of one thick core

 Alternating grain direction improves dimensional stability

 Model expected performance in solver

Impedance Control

 Leverage precise Er of 3.5 to maintain target impedance

 50Ω striplines for RF and high-speed routing

 Controlled line width, dielectric height, trace geometry

Skin Effect

 Consider skin effect depth above ~ 8-10 GHz

 Utilize surface treatments like micro-etching

Signal Coupling

 Careful gap/spacing rules between traces

 Ground plane isolation techniques

 Avoid 90 bends; use arc/tapered geometries

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Thermal Management

 Ensure sufficient thermal ground plane spreading

 Efficient component layout to avoid hotspots

 Consider thermal vias for heat transfer

Paying attention to these guidelines helps achieve first-pass PCB

layout success with RF-35.

Recommended Stackups

Typical RF-35 PCB stackups may use configurations like:

Show Image

 Multiple thin dielectric cores

 Signal routing on surface layers

 Dedicated ground planes near signals

 Buried capacitance within stackup

 Component cavities in ground planes

The thin cores and smooth copper foils of RF-35 enable tight impedance

tolerance and high performance interconnects between ICs, filters,

amplifiers, control logic, and other components.

Benefits vs. FR4

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Compared to conventional FR-4 laminates, RF-35 provides:

Superior Loss Characteristics

 Lower loss tangent: 0.0019 vs 0.02 for FR-4

 Much flatter loss vs. frequency curve

 Maintains low loss to > 10 GHz

Tighter Dielectric Constant Tolerance

 Tolerance +/- 0.05 vs +/- 0.25 for FR-4

 Enables consistent impedance across PCBs

Improved Moisture Resistance

 0.02% moisture absorption vs 0.2% for FR-4

 Far less susceptible to humidity effects

Higher Frequency Support

 Usable range to Ku band vs drop-off around 5 GHz with FR-4

 Significantly better Q factors at high microwave bands

For peak signal integrity at microwave and mmWave frequencies, RF-35 is

a clear choice over FR-4 material.

Typical RF-35 Applications

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The capabilities of RF-35 make it a frequent choice for products including:

 Satellite communications

 Radar and remote sensing

 5G telecom infrastructure

 Automotive radar

 Wireless networking

 Microwave radio/links

 Defense electronics

 Mobile devices

 High speed digital design

 Aerospace and avionics

Any application where optimizing signal integrity, reducing loss, and

maintaining consistent performance over frequency are critical

requirements will benefit from RF-35 PCB material.

Pros and Cons

Like any material, RF-35 has both advantages and disadvantages:

Pros

 Excellent high frequency signal integrity

 Low loss PTFE material

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 Tight dielectric constant tolerance

 Lead-free assembly compatible

 Good thermal conductivity

 Reduced moisture absorption

Cons

 Higher cost than FR-4

 Lower flexural strength than glass-reinforced laminates

 Requires advanced fabrication processes

 Limited global supply chain

Conclusion

With its precise dielectric constant of 3.5 and low loss PTFE composition,

Taconic RF-35 delivers proven performance for today’s emerging RF,

microwave, and multi-gigabit digital designs. When engineered properly,

RF-35 PCBs provide consistent behavior across fabrication lots and

excellent high frequency response. For designers pursuing every last dB of

loss or GHz of bandwidth, RF-35 remains an enabling material.

Frequently Asked Questions

Q: What are the key differences between RF-35 and common FR-4

laminates?

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A: RF-35 provides much lower loss, tighter dielectric tolerance, lower

moisture absorption, and extended high frequency range versus

economical FR-4.

Q: What are some tips for working with thinner RF-35 cores?

A: Use dedicated layer alignment equipment, employ smaller component

sizes, plan sufficient panelization spacing, and minimize handling to avoid

cracking thin cores.

Q: Does RF-35 require special PCB fabrication processes?

A: RF-35 benefits from advanced PTFE processes for via formation, hole

walls, and drilling. It also requires lamination processes tailored to thinner

cores.

Q: What are typical finished RF-35 PCB thicknesses?

A: High frequency designs aim for overall PCB thickness under 0.030

inches. This requires precision lamination of multiple 0.005 inch dielectric

cores.

Q: Are there lead-free soldering implications with RF-35 material?

A: RF-35 achieves high Tg (>280C) for compatibility with lead-free profiles

up to 260C peak temperatures. Thermal relief in multilayers is

recommended.
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Do you know RF-35 (TACONIC material)?

Performance:

(1) low cost;

(2) Excellent peel strength;

(3) Extraordinary low loss factor;

(4) low water absorption rate;

(5) Enhanced surface smoothness.

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Application:

(1) power amplifier;

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(2) filters and connectors;

(3) Passive components.

1)RF-35 is an organic-ceramic laminate material in the ORCER

of TACONIC products.

2)It is a reinforced glass material based on woven glass cloth, and a

combination of TACONIC’s ceramic filling technology and glass fiber

coated PTFE technology.

3)RF-35 is the best choice for low cost, high volume commercial

microwave and wireless frequency applications.

3)RF-35 of 1/20Z and 10Z copper foil boards, even with standard epoxy

materials, have excellent peel strength and provide rework at any time.

4)The glass transition temperature of RF -35 exceeds 315 ℃.

5)The ultra-low water absorption and low loss factor of RF-35 minimizes

phase shift in the frequency range of use.

6)The dimensional stability of RF-35 is due to the use of woven glass cloth

in its design development.

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7)RF-35 laminate material, generally with single or double-sided 1/20Z,

10Z and 20Z thickness of electrolytic copper foil. Different sizes of sheets

can be selected according to requirements.

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8)For the RF-35 microwave material, the relationship between the thermal

expansion rate in the Z-axis direction and the temperature is shown in the

figure below:

9)RF-35 dielectric constant changes with temperature:

10)RF-35 dielectric loss changes with temperature:

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10)The relationship between the dielectric constant and frequency of

RF-35 microwave materials is shown in the figure below:

11)The relationship between the dielectric loss of RF and the frequency of

microwave materials is shown in the figure below:

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