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How To Design A PCB For High Frequency
How To Design A PCB For High Frequency
unintended radiation.
Thermal Stability
Moisture Resistance
The first step in any successful high frequency PCB layout is component
Getting the right components in the right locations from the start enables
optimum routing.
Impedance Control
Minimize Vias
Symmetric Routing
Shielding
Bypass Capacitors
Bypass Capacitors
Decoupling Capacitors
Voltage Regulators
EMI Filters
must be scrutinized.
PCB Anten
na Layout
are mandatory:
Partitioning
Symmetrical Architecture
Short Interconnections
Termination
Layer Usage
Test Points
Every layout technique applied should serve the singular goal of signal
integrity.
For high frequency boards, the layer stackup itself requires special
attention:
Thinner Dielectrics
More Layers
Dielectric Selection
Differential Routing
Embedded Passives
EMI/EMC Analysis
Consider a dual channel 10Gbps serial link PCB operating at 6.25 GHz:
Stackup
Partitioning
Materials
Routing
Bypassing
Termination
Validation
Prototyping Recommendations
PCB Anten
importance:
Coaxial Connectors
Test Points
Probe Pads
Boundary Scan
Built-In Instrumentation
troubleshooting is straightforward.
Q: What are some good stackup guidelines for data rates above 5Gbps?
Use at least 6 layers. Route critical nets on inner layers with thick cores
and thin dielectrics. Enclose nets between ground planes. Include 10-20%
planes.
Q: What PCB finishes provide the best high frequency signal integrity?
boards?
instead if possible.
Conclusion
MHz, and the circuit operating above this frequency already accounts for a
very complex design process, and its wiring is critical to the overall design!
wiring density. The use of multi-layer pcb boards is both necessary for
number of layers can make full use of the intermediate layer to set the
shielding, better achieve the near grounding, and effectively reduce the
and at the same time All of these methods are advantageous for the
According to the data, the four-layer board is 20dB lower than the noise of
the double-panel. However, there is also a problem. The higher the PCB
process and the higher the unit cost. This requires us to select the
The lead wire of the high-frequency circuit wiring is preferably a full line,
circular arc. This requirement is only used to improve the fixing strength
The radiant intensity of the signal is proportional to the length of the trace
of the signal line. The longer the high-frequency signal lead, the easier it is
lines, USB lines, and HDMI lines are required to be as short as possible.
The so-called “the least alternating between the layers of the leads is
better” means that the fewer vias (Via) used in the component connection
process, the better. According to the side, a via can bring about a
can significantly increase the speed and reduce the possibility of data
errors.
introduced by the parallel lines of the signal lines. Crosstalk refers to the
transmission line in the form of electromagnetic waves, the signal line acts
The parameters of the PCB layer, the spacing of the signal lines, the
the signal line all have a certain impact on crosstalk. Therefore, in order to
crosstalk can allow isolation and reduce crosstalk under the conditions
can be placed on the reverse side of the parallel signal line to greatly
between adjacent signal lines, reduce the parallel length of the signal lines,
and the clock lines should be perpendicular to the key signal lines and not
parallel.
If the parallel traces in the same layer are almost unavoidable, in the
each other.
In digital circuits, the usual clock signals are signals with fast edge changes,
and the external crosstalk is large. Therefore, in the PCB design, the clock
differential clock signal and cover the ground. You need to pay attention
Do not leave the unused input terminal, but ground it or connect it to the
effective immediately.
capacitor of the power supply pin can effectively suppress the high
When analog ground lines, digital ground lines, etc. are connected to the
certain voltage difference between the two directly. Moreover, the ground
and the analog signal ground are directly connected, the harmonics of the
ground-line coupling.
the ground of the analog signal are to be isolated, and the method of
During the transmission of the signal, when the impedance does not
match, the signal will reflect in the transmission channel, and the
of the transmitted signal match well. Since the difference between the
the transmission line on the PCB should not be abrupt or corner, try to
USB Wiring Rules: USB signal differential routing is required. The line
width is 10 mils, the line spacing is 6 mils, and the ground and signal lines
is 10mil, line spacing is 6mil, and the spacing between each pair of HDMI
The LVDS routing rules require LVDS signal differential traces with a
linewidth of 7 mils and a line pitch of 6 mils. The purpose is to control the
rules. The DDR1 routing requires that the signal should not pass through
the hole as much as possible. The signal line is equal in width and the line
is equidistant from the line. The line must meet the 2W principle to reduce
crosstalk between signals. For high-speed devices with DDR2 and above,
Related Posts:
https://www.raypcb.com/10-ways-for-high-frequency-pcb-layout/