RAYMING PCB & ASSEMBLY

What’s the Difference Between SMD and NSMD in BGA Footprint?

Correct PCB pad design is crucial to effectively weld components to the

circuit board. For bare pad prototype pcb assembly , there are two

common welding methods — SMD (Solder Mask Defined) and NSMD

(Non-Solder Mask Defined), each with its own characteristics and

advantages.

Table of Contents

SMD:

SMD refers to the resistance layer opening is less than the metal pad

welding process. This process reduces the possibility of the welding plate

falling off during welding or dewelding. However, the disadvantage is that

the method reduces the copper surface area that can be used for solder

joint connections and reduces the space between adjacent pads. This

limits the thickness of the trace lines between the pads and may affect the

use of through-hole.

NSMD:

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NSMD refers to the welding plate process in which the opening of the

resistance layer is larger than that of the welding plate. This process

provides greater surface area for solder joint connections and greater

clearance between solder pads (compared to SMD), allows for wider line

width and more through-hole flexibility, but NSMD pads are more likely to

fall off during welding and disassembly. Even so, NSMD still has a better

welding firm performance and is suitable for solder joint sealing pads.

Introduction

Ball grid array (BGA) packages are widely used for integrated circuits as

they provide a high density of interconnections beneath the package. BGA

packages connect to the PCB through an array of solder balls that serve as

the leads. When defining the PCB land patterns or footprint for the BGA

package, the solder mask design requires special consideration for

reliability. The solder mask can either cover the copper pad completely,

known as solder mask defined (SMD), or have openings larger than the

pad diameter, called non-solder mask defined (NSMD).

This article explains what SMD and NSMD BGA footprints are, their

differences, key design considerations, assembly process impacts and

applications.

Solder Mask Defined (SMD) BGA Footprints

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In an SMD BGA footprint, the openings in the solder mask layer fully cover

and intersect the underlying copper pads. This results in the solder mask

itself defining the final land dimensions and controlling the volume

of solder paste printed. Hence the name solder mask defined (SMD)

footprint.

With SMD footprint, the copper pad size is typically 20 to 60 μm greater

than the solder mask opening based on registration tolerances. The key

characteristics of SMD BGA land patterns are:

 Solder mask opening equals the intended land diameter for the

BGA balls. This controls the amount of solder.

 Excellent registration is needed between layers to keep the pad

centered in the mask opening.

 The pad shape is not critical and there is no risk of exposed copper.

 Allows smaller pad and pitch dimensions since solder mask dams

prevent bridge formation.

 Solder voiding can occur more easily due to smaller paste volumes.

Here is an illustration of solder mask defined (SMD) BGA footprint:

The tight alignment between copper pad and solder mask opening

required for SMD footprint necessitates use of the tightest manufacturing

tolerances.

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Non-Solder Mask Defined (NSMD) BGA Footprints

In a non-solder mask defined (NSMD) footprint, the openings in the solder

mask layer are larger than the diameter of the copper pads. This exposes

the entire copper pad allowing the pad size and shape to define the final

land dimensions rather than the solder mask.

In NSMD footprint, the mask openings exceed the copper pad size by at

least 150 μm based on registration tolerances. Key features are:

 The pad diameter determines the solder volume. Solder mask does

not restrict soldering.

 Requires greater clearance between pads to prevent mask bridging

since mask does not dam solder flow.

 Copper pad can be dog-bone or dumbbell shaped to allow solder

filleting.

 Pad registration to mask opening is non-critical. Mask just needs to

expose pad.

 Allows larger paste deposit area so less prone to solder voids.

Here is an illustration of non-solder mask defined (NSMD) footprint:

The NSMD design provides more tolerance for pad positioning within the

mask opening but demands greater spacing between adjacent pads.

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Comparison Between SMD and NSMD Footprints

Here is a summary comparison of some key differences between the

solder mask defined (SMD) and non-solder mask defined (NSMD)

footprints for BGA packages:

Parameter SMD Footprint NSMD Footprint

Mask opening vs. pad Equal to pad diameter At least 150 μm greater than pad

Solder volume control Defined by mask opening Defined by pad diameter

Pad shape Limited by mask opening Can use dogbone, dumbbell shapes

bridging risk Lower – mask dams prevent solder spread Higher – no mask dams so needs more spacing

Registration needs Tight mask to pad registration essential Pad registration non-critical

Solder voiding Higher risk due to small volumes Lower risk thanks to larger paste deposits

Design and assembly cost Generally higher Lower cost

In summary, SMD design works best for fine pitch parts where the solder

mask yields precise solder volumes, while NSMD is preferable for larger

packages needing greater process and registration tolerances.

SMD Footprint Design Guidelines

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When designing an SMD footprint for a BGA package, here are some

guidelines to follow:

 Pad diameter should be 20 to 60 μm less than mask opening based

on registration capabilities

 A minimum web of 50 to 75 μm is required between adjacent mask

openings

 Laser cut mechanically drilled (LCMD) vias can be placed within pad

area if space is tight

 1:1 pad to ball ratio should be used for perimeter balls

 Non-perimeter pads can utilize area array patterns to

increase routing space

 Pad shapes are largely non-critical since mask controls shape and

volume

 Thermal reliefs in pad are not beneficial due to small paste volumes

 For dense footprint, use tighter mask to pad tolerances for web

reduction

 Reduce pad spacing further by shifting adjacent rows/columns by

50% pitch

 Use thicker mask of at least 150 μm to prevent tacky solder damage

NSMD Footprint Design Guidelines

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For non-solder mask defined BGA footprints, following guidelines are

recommended:

 Pad diameter should be smaller than mask opening by at least 150

μm

 Minimum web of 225 μm should be kept between mask openings

 Dogbone, dumbbell pad shapes can be used to improve solder

filleting

 LCMD vias must be placed clear of extended pad edges

 1:1 pad assignment preferred on package perimeter

 Thermal reliefs can be incorporated in pad shapes

 Increased spacing required between pads due to lack of solder

dams

 Thinner solder mask down to 75 μm can suffice if bridging risks are

low

 Tighter mask to pad registration not needed allowing faster

assembly

 Can shift adjacent rows/columns by 25% pitch only due to bridging

risks

 Suitable for footprint sizes above 15mm × 15mm

Assembly Process Impacts

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The choice between SMD or NSMD footprints for a BGA package

influences various aspects of the assembly process:

Stencil Design

For SMD pads, stencil openings equal the pad size as mask defines shape.

For NSMD pads, stencil openings must be smaller than pad area to control

solder volume.

Solder Paste Printing

NSMD pads allow larger print deposits reducing voids. SMD pads need

tighter print process control to prevent solder balls.

Pad Tolerance Changes

SMD needs tight mask to pad registration. NSMD relaxes this requirement

allowing cheaper PCB fabrication.

Spacing and Routing

NSMD needs more clearance between pads forcing larger pitch. This

consumes more PCB area but eases routing.

Voiding Risks

The smaller paste deposits of SMD make it more prone to voids versus

NSMD pads.

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Bridging Risks

Lack of mask dams means NSMD has higher bridging risks requiring

careful paste volume control.

Fillet Formation

NSMD allows pad shapes to improve solder side filleting. SMD shape is

restricted by mask aperture.

Rework Concerns

SMD pads limit where heat can be applied during rework. Mask restricts

access to NSMD pads less.

SMD vs NSMD Applications

SMD footprints are preferred for:

 Fine pitch BGA packages ≤ 0.8mm pitch

 Small BGAs with pitch ≤ 0.5mm

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 Packages with high pin counts

 Portable consumer electronics where space is critical

NSMD footprints suit:

 Lower density BGA packages with >1mm pitch

 Larger package sizes above 15mm x 15mm

 Automotive grade parts needing greater process tolerances

 Corner ball cases requiring dogbone pads for sufficient solder

volume

 Boards with fewer routing layers where pad spacing is less critical

 Applications where solder voiding risks need minimization

Summary

In summary, solder mask defined (SMD) BGA footprints provide precision

solder control by limiting paste volumes but demand tight fabrication

tolerances. Non-solder mask defined (NSMD) pads relax tolerances but

occupy more space on the PCB unless carefully designed. Making the right

choice based on pitch, pad count, size constraints and process capabilities

is key to designing a reliable and manufacturable BGA footprint.

FAQs

Can SMD or NSMD be used for any BGA pitch?

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SMD is preferred for fine pitch below 0.65mm due to solder control.

NSMD is unsuitable below 0.5mm because of bridging risks from lack of

dams.

Which provides better resistance to shock and vibration?

NSMD allows larger fillets so can withstand mechanical stresses better.

SMD may crack more easily at the package edges and corners.

Is NSMD also called extended pad in some datasheets?

Yes, extended pad is another term used to indicate NSMD footprint where

pad extends beyond the solder mask opening.

Does NSMD increase the risk of thermomechanical fatigue?

Slightly – the larger pad size leads to higher shear stresses at the pad

periphery which must be considered in reliability testing.

Can thermal vias be incorporated in BGA pads?

For SMD pads thermal vias will reduce solder volume further increasing

void risks. In NSMD thermal vias can be safely placed provided they do not

infringe on the extended pad area.

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