Professional Documents
Culture Documents
LG 32lh4000
LG 32lh4000
LCD TV
SERVICE MANUAL
CHASSIS : LD91A
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CONTENTS
CONTENTS .............................................................................................. 2
SPECIFICATION ........................................................................................6
BLOCK DIAGRAM...................................................................................17
Copyright ©2009 LG Electronics. Inc. All right reserved. -2- LGE Internal Use Only
Only for training and service purposes
SAFETY PRECAUTIONS
Copyright ©2009 LG Electronics. Inc. All right reserved. -3- LGE Internal Use Only
Only for training and service purposes
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service unit under test.
manual and its supplements and addenda, read and follow the 2. After removing an electrical assembly equipped with ES
SAFETY PRECAUTIONS on page 3 of this publication. devices, place the assembly on a conductive surface such as
NOTE: If unforeseen circumstances create conflict between the aluminum foil, to prevent electrostatic charge buildup or
following servicing precautions and any of the safety precautions on exposure of the assembly.
page 3 of this publication, always follow the safety precautions. 3. Use only a grounded-tip soldering iron to solder or unsolder ES
Remember: Safety First. devices.
4. Use only an anti-static type solder removal device. Some solder
General Servicing Precautions removal devices not classified as "anti-static" can generate
1. Always unplug the receiver AC power cord from the AC power electrical charges sufficient to damage ES devices.
source before; 5. Do not use freon-propelled chemicals. These can generate
a. Removing or reinstalling any component, circuit board electrical charges sufficient to damage ES devices.
module or any other receiver assembly. 6. Do not remove a replacement ES device from its protective
b. Disconnecting or reconnecting any receiver electrical plug or package until immediately before you are ready to install it.
other electrical connection. (Most replacement ES devices are packaged with leads
c. Connecting a test substitute in parallel with an electrolytic electrically shorted together by conductive foam, aluminum foil
capacitor in the receiver. or comparable conductive material).
CAUTION: A wrong part substitution or incorrect polarity 7. Immediately before removing the protective material from the
installation of electrolytic capacitors may result in an leads of a replacement ES device, touch the protective material
explosion hazard. to the chassis or circuit assembly into which the device will be
installed.
2. Test high voltage only by measuring it with an appropriate high CAUTION: Be sure no power is applied to the chassis or circuit,
voltage meter or other voltage measuring device (DVM, and observe all other safety precautions.
FETVOM, etc) equipped with a suitable high voltage probe. 8. Minimize bodily motions when handling unpackaged
Do not test high voltage by "drawing an arc". replacement ES devices. (Otherwise harmless motion such as
3. Do not spray chemicals on or near this receiver or any of its the brushing together of your clothes fabric or the lifting of your
assemblies. foot from a carpeted floor can generate static electricity
4. Unless specified otherwise in this service manual, clean sufficient to damage an ES device.)
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable General Soldering Guidelines
non-abrasive applicator; 10% (by volume) Acetone and 90% (by 1. Use a grounded-tip, low-wattage soldering iron and appropriate
volume) isopropyl alcohol (90%-99% strength) tip size and shape that will maintain tip temperature within the
CAUTION: This is a flammable mixture. range or 500°F to 600°F.
Unless specified otherwise in this service manual, lubrication of 2. Use an appropriate gauge of RMA resin-core solder composed
contacts in not required. of 60 parts tin/40 parts lead.
5. Do not defeat any plug/socket B+ voltage interlocks with which 3. Keep the soldering iron tip clean and well tinned.
receivers covered by this service manual might be equipped. 4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
6. Do not apply AC power to this instrument and/or any of its bristle (0.5 inch, or 1.25cm) brush with a metal handle.
electrical assemblies unless all solid-state device heat sinks are Do not use freon-propelled spray-on cleaners.
correctly installed. 5. Use the following unsoldering technique
7. Always connect the test receiver ground lead to the receiver a. Allow the soldering iron tip to reach normal temperature.
chassis ground before connecting the test receiver positive (500°F to 600°F)
lead. b. Heat the component lead until the solder melts.
Always remove the test receiver ground lead last. c. Quickly draw the melted solder with an anti-static, suction-
8. Use with this receiver only the test fixtures specified in this type solder removal device or with solder braid.
service manual. CAUTION: Work quickly to avoid overheating the circuit
CAUTION: Do not connect the test fixture ground strap to any board printed foil.
heat sink in this receiver. 6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
Electrostatically Sensitive (ES) Devices (500°F to 600°F)
Some semiconductor (solid-state) devices can be damaged easily b. First, hold the soldering iron tip and solder the strand against
by static electricity. Such components commonly are called the component lead until the solder melts.
Electrostatically Sensitive (ES) Devices. Examples of typical ES c. Quickly move the soldering iron tip to the junction of the
devices are integrated circuits and some field-effect transistors and component lead and the printed circuit foil, and hold it there
semiconductor "chip" components. The following techniques only until the solder flows onto and around both the
should be used to help reduce the incidence of component component lead and the foil.
damage caused by static by static electricity. CAUTION: Work quickly to avoid overheating the circuit
1. Immediately before handling any semiconductor component or board printed foil.
semiconductor-equipped assembly, drain off any electrostatic d. Closely inspect the solder area and remove any excess or
charge on your body by touching a known earth ground. splashed solder with a small wire-bristle brush.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
Copyright ©2009 LG Electronics. Inc. All right reserved. -4- LGE Internal Use Only
Only for training and service purposes
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through Circuit Board Foil Repair
which the IC leads are inserted and then bent flat against the Excessive heat applied to the copper foil of any printed circuit
circuit foil. When holes are the slotted type, the following technique board will weaken the adhesive that bonds the foil to the circuit
should be used to remove and replace the IC. When working with board causing the foil to separate from or "lift-off" the board. The
boards using the familiar round hole, use the standard technique following guidelines and procedures should be followed whenever
as outlined in paragraphs 5 and 6 above. this condition is encountered.
Removal At IC Connections
1. Desolder and straighten each IC lead in one operation by gently To repair a defective copper pattern at IC connections use the
prying up on the lead with the soldering iron tip as the solder following procedure to install a jumper wire on the copper pattern
melts. side of the circuit board. (Use this technique only on IC
2. Draw away the melted solder with an anti-static suction-type connections).
solder removal device (or with solder braid) before removing the
IC. 1. Carefully remove the damaged copper pattern with a sharp
Replacement knife. (Remove only as much copper as absolutely necessary).
1. Carefully insert the replacement IC in the circuit board. 2. carefully scratch away the solder resist and acrylic coating (if
2. Carefully bend each IC lead against the circuit foil pad and used) from the end of the remaining copper pattern.
solder it. 3. Bend a small "U" in one end of a small gauge jumper wire and
3. Clean the soldered areas with a small wire-bristle brush. carefully crimp it around the IC pin. Solder the IC connection.
(It is not necessary to reapply acrylic coating to the areas). 4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
"Small-Signal" Discrete Transistor copper pattern. Solder the overlapped area and clip off any
Removal/Replacement excess jumper wire.
1. Remove the defective transistor by clipping its leads as close as
possible to the component body. At Other Connections
2. Bend into a "U" shape the end of each of three leads remaining Use the following technique to repair the defective copper pattern
on the circuit board. at connections other than IC Pins. This technique involves the
3. Bend into a "U" shape the replacement transistor leads. installation of a jumper wire on the component side of the circuit
4. Connect the replacement transistor leads to the corresponding board.
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder 1. Remove the defective copper pattern with a sharp knife.
each connection. Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
Power Output, Transistor Device 2. Trace along the copper pattern from both sides of the pattern
Removal/Replacement break and locate the nearest component that is directly
1. Heat and remove all solder from around the transistor leads. connected to the affected copper pattern.
2. Remove the heat sink mounting screw (if so equipped). 3. Connect insulated 20-gauge jumper wire from the lead of the
3. Carefully remove the transistor from the heat sink of the circuit nearest component on one side of the pattern break to the lead
board. of the nearest component on the other side.
4. Insert new transistor in the circuit board. Carefully crimp and solder the connections.
5. Solder each transistor lead, and clip off excess lead. CAUTION: Be sure the insulated jumper wire is dressed so the
6. Replace heat sink. it does not touch components or sharp edges.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Copyright ©2009 LG Electronics. Inc. All right reserved. -5- LGE Internal Use Only
Only for training and service purposes
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
4. Electrical specification
4.1 Module General Specification
No Item Specification Remark
1 Screen Device 32” wide color display module LCD
2 Aspect Ratio 16:9
3 LCD Module 32” TFT LCD FHD LGD
4 Storage Environment Temp. : -20 ~ 60 deg
Humidity : 10 ~ 90 %
5 Input Voltage AC100-240V~, 50/60Hz
6 Power Consumption Typ : 116.2, Max : 128.1 FHD
7 Module Size 760.0 (H) x 450.0 (V) x 48.0 (D)
8 Pixel Pitch 0.36375 mm(D)
9 Back Light 14EEFL
10 Display Colors 1.06Billion(FHD LGD),16.7M (others)
11 Coating 3H, AG
Copyright ©2009 LG Electronics. Inc. All right reserved. -6- LGE Internal Use Only
Only for training and service purposes
5. Chroma& Brightness
5.1 Module optical specification
No. Item Specification Min. Typ. Max. Remark
1. Viewing Angle<CR>10> Right/Left/Up/Down 178 Degree
2. Luminance Luminance (cd/m2) 400 500
Variation - 1.3 MAX /MIN
3. Contrast Ratio CR 900 1300
4. CIE Color Coordinates White WX 0.279
WY 0.292 Typ
RED Xr 0.638 ±0.03
Yr 0.334
Green Xg 0.291
Yg 0.607
Blue Xb 0.145
Yb 0.062
Copyright ©2009 LG Electronics. Inc. All right reserved. -7- LGE Internal Use Only
Only for training and service purposes
7. RGB (PC)
Specification
No Proposed Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1. 720*400 31.468 70.08 28.321 For only DOS mode
2. 640*480 31.469 59.94 25.17 VESA Input 848*480 60Hz, 852*480 60Hz
-> 640*480 60Hz Display
3. 800*600 37.879 60.31 40.00 VESA
4. 1024*768 48.363 60.00 65.00 VESA(XGA)
5. 1280*768 47.78 59.87 79.5 WXGA
6. 1360*768 47.72 59.8 84.75 WXGA
7. 1366*768 47.56 59.6 84.75 WXGA
8. 1280*1024 63.595 60.0 108.875 SXGA FHD model
9. 1600*1200 74.07 59.98 130.375 UXGA FHD model
10. 1280*720 45 60 74.25 720P DTV Standard
11. 1920*1080 66.647 59.988 138.625 WUXGA FHD model
(2) PC Mode
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1. 720*400 31.468 70.08 28.321 HDCP
2. 640*480 31.469 59.94 25.17 VESA HDCP
3. 800*600 37.879 60.31 40.00 VESA HDCP
4. 1024*768 48.363 60.00 65.00 VESA(XGA) HDCP
5. 1280*768 47.78 59.87 79.5 WXGA HDCP
6. 1360*768 47.72 59.8 84.75 WXGA HDCP
7. 1366*768 47.56 59.6 84.75 WXGA HDCP
8. 1280*1024 63.595 60.0 108.875 SXGA HDCP
9. 1600*1200 74.07 59.98 130.375 UXGA HDCP
10. 1920*1080 66.647 59.988 138.625 WUXGA HDCP
Copyright ©2009 LG Electronics. Inc. All right reserved. -8- LGE Internal Use Only
Only for training and service purposes
ADJUSTMENT INSTRUCTION
1. Application Range 4. Click “Connect” tab. If “Can’t” is displayed, check
connection between computer, jig, and set.
This specification sheet is applied to all of the LCD TV with
LD91A chassis.
(1) (4)
2. Designation
1) The adjustment is according to the order which is
designated and which must be followed, according to the plan
which can be changed only on agreeing.
2) Power Adjustment: Free Voltage
3) Magnetic Field Condition: Nil.
4) Input signal Unit: Product Specification Standard Please Check the Speed :
5) Reserve after operation: Above 5 Minutes (Heat Run) To use speed between
from 200KHz to 400KHz
Temperature : at 25±5ºC
Relative humidity : 65±10%
Input voltage : 220V, 60Hz 5. Click “Auto” tab and set as below
6) Adjustment equipments: Color Analyzer (CA-210 or CA- 6. Click “Run”.
110), DDC Adjustment Jig equipment, SVC remote 7. After downloading, check “OK” message.
controller
(5)
7) Push The “IN STOP KEY” - For memory initialization.
filexxx.bin
Case1 : Software version up (5)
1. After downloading S/W by USB, TV set will reboot
automatically (7) ……….OK
2. Push “In-stop” key
3. Push “Power on” key (6)
4. Function inspection
5. After function inspection, Push “I n-stop” key.
Case2 : Function check at the assembly line
1. When TV set is entering on the assembly line, Push
“In-stop” key at first. * USB DOWNLOAD
2. Push “Power on” key for turning it on. 1) Put the USB Stick to the USB socket
-> If you push “Power on” key, TV set will recover 2) Automatically detecting update file in USB Stick
channel information by itself. - If your downloaded program version in USB Stick is Low,
3. After function inspection, Push “In-stop” key. it didn’t work. But your downloaded version is High, USB
data is automatically detecting
3) Show the message “Copying files from memory”
(3)
fi lexxx.bin
Copyright ©2009 LG Electronics. Inc. All right reserved. -9- LGE Internal Use Only
Only for training and service purposes
4) Updating is staring. 3.1. ADC Process
(1) ADC
• Input signal : Component 480i
• Signal equipment displays.
Adjustment pattern
- Component 480I
MODEL: 209 in Pattern Generator(480i Mode)
PATTERN : 65 in Pattern Generator(MSPG-925 SERIES)
Copyright ©2009 LG Electronics. Inc. All right reserved. - 10 - LGE Internal Use Only
Only for training and service purposes
4. Total Assembly line process * Manual W/B process using adjusts Remote control.
• After enter Service Mode by pushing “ADJ” key,
4.1. Adjustment Preparation • Enter White Balance by pushing “ G ” key at “3. White
· W/B Equipment condition Balance”.
CA210 : CH 9, Test signal : Inner pattern (85IRE)
· Above 5 minutes H/run in the inner pattern. (“power on” key
of adjust remote control)
Cool 11,000k ºK X=0.276(±0.002)
Y=0.283(±0.002) <Test Signal>
Medium 9,300k ºK X=0.285(±0.002) Inner pattern
Y=0.293(±0.002) (216gray,85IRE)
Warm 6,500k ºK X=0.313(±0.002)
Y=0.329(±0.002)
* Connecting picture of the measuring instrument * After done all adjustments, Press “In-start” button and
(On Automatic control) compare Tool option and Area option value with its BOM, if
Inside PATTERN is used when W/B is controlled. Connect to it is correctly same then unplug the AC cable. If it is not
auto controller or push Adjustment R/C POWER ON -> same, then correct it same with BOM and unplug AC cable.
Enter the mode of White-Balance, the pattern will come out For correct it to the model’s module from factory JIG model.
* Push The “IN STOP KEY” after completing the function
inspection.
** Caution **
Color Temperature : COOL, Medium, Warm.
One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust other two lower than C0.
(when R/G/B Gain are all C0, it is the FULL Dynamic Range
of Module)
Copyright ©2009 LG Electronics. Inc. All right reserved. - 11 - LGE Internal Use Only
Only for training and service purposes
- Auto Download 1) Analog Data 128Byte (2Bi)
• After enter Service Mode by pushing “ADJ” key,
• Enter EDID D/L mode. a b
d e
a b
d e
f
Download A A 0 0 When transfer the ‘Mode In’,
‘Mode In’ Carry the command.
Download A E 00 10 Automatically Download
(The use of a internal pattern)
For Analog EDID For HDMI EDID ⓒ Month, Year: Controlled on production line:
D-sub to D-sub DVI-D to HDMI or HDMI to HDMI ex) Monthly : ‘09’ -> ‘09’
Year : ‘2006’ -> ‘10’
ⓔ Model Name(Hex):
MODEL MODEL NAME(HEX)
all 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20
Copyright ©2009 LG Electronics. Inc. All right reserved. - 12 - LGE Internal Use Only
Only for training and service purposes
4.5. V-COM Adjust(Only 37/42/47LH4000-ZA) 5. Serial number D/L
- Why need Vcom adjustment? • press “Power on” key of service remocon.
A The Vcom (Common Voltage) is a Reference Voltage of (Baud rate : 115200 bps)
Liquid Crystal Driving. • Connect RS232 Signal Cable to RS-232 Jack.
-> Liquid Crystal need for Polarity Change with every frame. • Write Serial number by use RS-232.
Circuit Block • Must check the serial number at the Diagnostics of SET UP
Data (R ,G,B ) & Ga mma
menu. (Refer to below).
Cont rol si gnal Re f e r e nce V o ltage
Data (R ,G,B ) & C ont ro l s ignal
Ti m i n g
S Co nt r o ll e r
Gamm a Reference
In t e r f a ce
E Power
Po w e rInput
I nput Po w e r V COM
Blo ck
M CLC CST
Liquid
Crys tal
V COM Row Li ne TFT
V COM
* Description
FOS Default write : <7mode data> write
Vtotal, V_Frequency, Sync_Polarity, Htotal, Hstart, Vstart, 0,
Phase
Data write : Model Name and Serial Number write in
EEPROM,.
(Visual Adjust and control the Voltage level) 5.3. method & notice
A. Serial number D/L is using of scan equipment.
· Push the store button by “OK” key in the ADJ remocon. B. Setting of scan equipment operated by Manufacturing
Technology Group.
4.6. Outgoing condition Configuration C. Serial number D/L must be conformed when it is produced
- When pressing IN-STOP key by SVC remocon, Red LED are in production line, because serial number D/L is mandatory
blinked alternatively. And then Automatically turn off. by D-book 4.0.
(Must not AC power OFF during blinking)
Copyright ©2009 LG Electronics. Inc. All right reserved. - 13 - LGE Internal Use Only
Only for training and service purposes
TROUBLESHOOTING
1. TV/CATV doesn’t display
NO Could you measure voltage of TU1200 & NO
Check TU1200. You should check power line
IIC lines? & IIC lines.
Can you see the normal signal?
Are they all normal?
YES
YES
You should replace Main Board.
NO
Check the output of TR(Q1201).
You should decide to replace TR (Q1201) or not.
Can you see the normal waveform?
YES
YES
YES
YES
Copyright ©2009 LG Electronics. Inc. All right reserved. - 14 - LGE Internal Use Only
Only for training and service purposes
3. AV 1/2 doesn’t display
NO
Check JK1100, JK1101 JK1100, JK1101 may have problem. Replace
Can you see the normal waveform? this Jack.
YES
YES
YES
YES
Copyright ©2009 LG Electronics. Inc. All right reserved. - 15 - LGE Internal Use Only
Only for training and service purposes
5. RGB PC doesn’t display
NO
Check P400 , P400
Can you see the normal waveform? may have problem. Replace this Jack.
YES
Check the output of Main IC(IC100). NO After checking the Power of Main IC(IC100) you
Especially you should check
The H,V sync and clock. should decide to replace Main IC or not.
Can you see the normal waveform?
YES
YES
NO
Check DDC communication lines(IC100, After checking the Power of this chip, you
IC107) should decide to replace this or not.
YES
NO
Check HDCP communication lines(IC107) After checking the Power of this chip, you
should decide to replace this or not.
YES
YES
Copyright ©2009 LG Electronics. Inc. All right reserved. - 16 - LGE Internal Use Only
Only for training and service purposes
BUF_TS_CLK/ERR/SYN/DATA[0]
IC502
Buffer
LVDS (10 bit) LCD Panel
74LVC541A
CI_TS_DATA[0:7]
Tun er
TU1200
CI Slot
(P500)
CI_ADDR[0:7] Serial Flash
PCM_A[0:7]
(TDFW-G235D)
IC103
IC501
Buffer
For Boot
74LCX244
FE_VMAIN
- 17 -
LGE3368A EEPROM
COMPONENT PCM_A[0:7] NAND Flash M24512-WMW6
COMP_Y/Pb/Pr
HYNIX (IC105)
RGB DSUB_ R/G/B
(IC100) IC102
EEPROM
I2C
DSUB_H/VSYNC CAT24WC08W-T
(HDCP)IC107
BLOCK DIAGRAM
400
521
A10
540
805
530
806
804
801
550
803
900
802
LV1
A2
200
120
510
121
122
500
300
310
Copyright LG Electronics. Inc. All right reserved. - 18 - LGE Internal Use Only
Only for training and service purposes
IC102
+3.3V HY27US08121B-TPCB +3.3V
NAND FLASH MEMORY VOLTAGE DETECTOR
C105
10uF 6.3V *Mstar reset:Active high reset
NC_1 NC_28
1 48
/PF_CE0
NC_2 NC_27
H : Serial Flash 2 47
L : NAND Flash PCM_A[0-7]
NC_3 NC_26 +3.3V_ST
/PF_CE1 3 46
H : 16 bit
NC_4 NC_25
1K
L : 8 bit 4 45
3.9K
AR102
NC_5 I/O7 PCM_A[7]
5 44
470
R107
NC_6 I/O6 PCM_A[6]
6 43
R111
R105 OPT 1K
R1540
R/B I/O5 PCM_A[5] IC100
/F_RB 7 42
080923_Time Delay
1386 WON X100
RE I/O4 PCM_A[4] C102 10uF 0 R116 LGE3368A (Saturn6 No-DivX) 12MHz C111
/PF_OE 8 41
CE NC_24 22 6.3V
/PF_CE0 9 40 R193 20pF
PCM_D[0-7]
NC_7 NC_23 1M
IC101 D4 B3
1K
10 39 HWRESET XIN C112
NC_8 PRE KIA7427F A3 R172 0
OUT XOUT
OPT
C103 11 38 VCC 1 3 AC16
PCM_D[0] 20pF
0.1uF VCC_1 VCC_2 PCMD0/CI_D0
2 PCM_D[1] AA15 E6 R173 0
R112
12 37 C101 R115 PCMD1/CI_D1 TESTPIN/GND
VSS_1 VSS_2 C106 0.1uF 0.022uF GND 10K PCM_D[2] AA16
13 36 16V PCMD2/CI_D2
PCM_D[3] AC6
NC_9 NC_22 PCMD3/CI_D3
14 35 PCM_D[4] Y10 AE11 R1524 33 SPI_DI G12
PCMD4/CI_D4 SPI_DI
NC_10 NC_21 PCM_D[5] Y11 AF12 SPI_DO
15 34 PCMD5/CI_D5 SPI_DO
PCM_D[6] Y12 AE12 R1525 33 SPI_CS
CLE NC_20 PCMD6/CI_D6 /SPI_CS
16 33 PCM_A[0-14] PCM_D[7] Y13 AD11 R1526 33 SPI_CK
/PF_CE1 AR103 PCMD7/CI_D7 SPI_CK
ALE I/O3 PCM_A[3] REAR_USB
PF_ALE 17 32 PCM_A[0] AB16 REAR_USB_DP4:AJ6
WE I/O2 PCM_A[2] PCM_A[1] PCM_A0/CI_A0
18 31 AC15 REAR_USB_DM4:AJ5
R1539
1K
20 29 AC12 B5 R174 0 OPT OPT
PCM_A[5] PCM_A4/CI_A4 USB_DP_1
NC_12 NC_19 22 AB8 A5 R175 0
21 28 PCM_A[6] PCM_A5/CI_A5 USB_DM_1
AC13 AC10 R178 0
NC_13 NC_18 PCM_A[7] PCM_A6/CI_A6 USB_DM_2 SIDE_USB_DM 4:AJ6
AA9 AB10 R179 0
10K
22 27
R103
PCM_A[8] PCM_A7/CI_A7 USB_DP_2 SIDE_USB_DP 4:AJ5
R151 NC_14 NC_17 AB5
0 PCM_A8/CI_A8 R132 R133 SIDE_USB
PF_WP 23 26 PCM_A[9] AA4 15K 15K
C NC_15 NC_16 PCM_A[10] PCM_A9/CI_A9 OPT
24 25 V4 OPT
R1509 PCM_A[11] PCM_A10/CI_A10
0 B Q100 Y4
KRC103S PCM_A[12] PCM_A11/CI_A11 +3.3V_ST
OPT AB9
OPT PCM_A[13] PCM_A12/CI_A12
E AA7
PCM_A[14] PCM_A13/CI_A13
AD6
PCM_A14/CI_A14 PM GPIO Assignment Recommended by MStar
10K
R195
R1510 33 AA14 E5
PCM_RST PCM_RST/CI_RST GPIO_PM0/GPIO134 8:B11
WARM_LED_ON/LED_W
R1511 33 AB18 F5 R1520 100
+3.3V /PCM_CD PCM_CD/CI_CD GPIO_PM1/GPIO135 DBG_TX
+3.3V IC103 Y5 G5 R184
EEPROM IC105: EAN43352801(ATMEL SHRINK) R1512 33 100 INV_CTL
W25X32VSSIG /PCM_OE /PCM_OE GPIO_PM2/GPIO136 8:M10
Serial FLASH MEMORY R1513 33 AB15 H5 R185 100 PANEL_CTL
/PCM_REG PCM_REG/CI_CLK GPIO_PM3/GPIO137 8:Q8
for BOOT IC105 0IMMRMP008A(MICROCHIP) R1514 33 AA10 F6 R186 100 R182 OPT100 POWER_DET
+3.3V /PCM_WAIT POWER_ON/OFF1
R1533
4.7K
PCM_WAIT/CI_WACK GPIO_PM4/GPIO138 8:P5
L102
M24512-WMW6 R1515 33 AC8 G6
CS VCC /PCM_IRQA DBG_RX
SPI_CS 1 8 /PCM_IRQA GPIO_PM5/INT1/GPIO139
R1516 33 AC7 H6 R1523 100 POWER_DET
0.1uF
$0.418 AR100 PCM_IOR/CI_RD GPIO130/LCK FE_BOOSTER_CTL 10:AA4
E1 WC
C104
R1519 33 T4 AF11 R159 100 R187 OPT 100
2 7
10K
33 Flash_WP_1 A11 ISP_TXD
R104
/PCM_CE /PCM_CE GPIO132/LHSYNC/SPI_WPn
WP CLK /PF_CE0 AE6 AA18 R1535 0 SDA1
R101 0 3 6 SPI_CK C4 /PF_CE0 GPIO60/PCM2_RESET/RX1 T22
E2 SCL 22 AF6 AA17
3 6 R110 /PF_CE1 R1536 0 SCL1
EEPROM_SCL
Flash_WP_1
C E19;T19;Y13 D6 /PF_CE1 GPIO62/PCM2_CD_N/TX1 T22
R100 /PF_OE AA12
0 GND DIO SDA
C4 22 /PF_OE
R102 B 4 5 SPI_DI 0 VSS 4 5 /PF_WE AR101 AA11
EEPROM_SDA E20;T19;Y14 D7 /PF_WE
OPT C107 C108 R113 22 PF_ALE AC9
Q101 8pF 8pF D6 PF_ALE
E PF_WP Y14
KRC103S OPT OPT A7 PF_AD15
OPT /F_RB AB11 E7 R1537 22 FE_TUNER_SCL
C3 22 F_RBZ LHSYNC2/I2S_OUT_MUTE/RX1
AC18 R1534 100 V4 OPC_EN
LVSYNC/GPIO133 11:N20
EEPROM_SCL R162 0 F8 C6 R1538 22 FE_TUNER_SDA
E16;E19;T19 UART2_TX/SCKM GPIO79/LVSYNC2/TX1
EEPROM_SDA R163 0 D11 F9
E16;E20;T19 UART2_RX/SDAM UART2_RX/GPIO84
R164 0 AB21 F10
SDA0 DDCR_DA UART2_TX/GPIO85 USB_OCD 4:AG3
R165 0 AC21 A6 R169 22
HDCP EEPROM +3.3V MCU BOOT STRAP DIMMING SCL0 DDCR_CK UART1_RX/GPIO86 5V_HDMI_1
Addr:10101-- B6 R170 22
10 : BOOT 51 UART1_TX/GPIO87 5V_HDMI_2
R140 22 J1 AF5
11 : BOOT RISC ISP_RXD DDCA_CLK GPIO42/PCM2_CE_N PCM_5V_CTL 5:D24
R141 22 J2 AF10 R127 100 CI_TS_DATA[0-7]
+3.3V ISP_TXD DDCA_DA GPIO43/PCM2_IRQA_N AV_CVBS_DET 4:M4
R142 22 W5
DBG_RX UART_RX2
IC107 R1545 100 R143 22 V5 AA8 CI_TS_DATA[0]
CAT24WC08W-T A_DIM PWM0 DBG_TX
C114 UART_TX2 TS0_D0
R158 Y8 CI_TS_DATA[1]
4.7K 0.1uF R1544 TS0_D1
A0 VCC R198 R1501 100 PWM2 Y9 CI_TS_DATA[2]
1 8 1K PWM_DIM
1K TS0_D2
- 27 -
AB7 CI_TS_DATA[3]
A1 $0.199 WP R109 4.7K PWM0 TS0_D3
2 7 E16;T19;Y13 AA6 CI_TS_DATA[4]
EEPROM_SCL PWM1 TS0_D4
A2 3 6 SCL R161 22 C1500 C1501 AB6 CI_TS_DATA[5]
1uF TS0_D5
MAIN 1
2.2uF U4
SDA R199 R1500 OPT CI_TS_DATA[6]
VSS 4 5 OPT TS0_D6
1K 1K AC5 CI_TS_DATA[7]
R171 22 EEPROM_SDA TS0_D7
OPT OPT AC4 CI_TS_SYN
E16;T19;Y14 TS0_SYNC 5:D10
AD5 CI_TS_VAL
TS0_VLD 5:D10
AB4 CI_TS_CLK
TS0_CLK 5:D10
AB19 BUF_TS_DATA[0]
TS1_D0 5:V22
AA20 BUF_TS_SYN
TS1_SYNC 5:V22
PWM0 AB13 AC19
I2C +3.3V_TUNER PWM0 TS1_VLD BUF_TS_VAL_ERR 5:V21
+5V_GENERAL AB12 AA19
+3.3V PWM1 BUF_TS_CLK
PWM1 TS1_CLK 5:V21
AD12
11:AE17 PWM2 PWM2
R150 100 AA13 C10 R154 100
PWM3 ET_TXD0 SCART2_DET
OPT B11 R177 100
ET_TXD1 SC_RE2 9:N25
A4 A9 R183 100
11:Y9 KEY1 SAR0 ET_TX_CLK SC_RE1 9:N24
R1505
4.7K
R1504
4.7K
R1506
1.2K
R1507
1.2K
R1503
2.2K
R1502
2.2K
R124
4.7K
B4 C11
R125
4.7K
11:Y10 KEY2 SAR1 ET_RXD0 SIDE_HP_MUTE 7:G26
F4 C9
LED_ON/LED_R SAR2 ET_RXD1 HP_DET
FE_TUNER_SDA R1550 100 E4 B10 R190 100 EDID_WP
AI13;10:I9 EEPROM_SDA E16;E20;Y14 7:G25;7:R15;9:AI24;9:AI25 SB_MUTE SAR3 ET_TX_EN 9:AI24
SCHEMATIC DIAGRAM
FRC/LVDS_B
R1603 R1605 R1607 R1609
3.3K 3.3K 3.3K 3.3K
FHD LED_NORMAL
+24V/+15V +12V/+15V +3.3V_ST
MODEL_OPT_0
19~32
37~47 R1543 MEMC_RESET R1600 100 MODEL_OPT_1
R1521
R1528 10K FRC/LVDS_B
3.6K IC1500
2.7K MODEL OPTION
1% KIA7042AF
I 1 3 O
POWER_DET +3.3V
FE_AGC_SPEED_CTL R1601 100 MODEL_OPT_2 PIN NAME PIN NO. HIGH LOW
2
26~32
R1508 R1527 R1529 G MODEL_OPT_0
1.8K /FE_RESET R1611 100 MODEL_OPT_3 D6 LCD PDP R152
19~22 1K 1.8K 4.7K
1% 37~47 NO_FRC/LVDS_A B9(FHD) FRC NO_FRC
MODEL_OPT_1 D7 OPT
R1604 R1606 R1608 R1610 B9(HD) LVDS_B LVDS_A
3.3K 3.3K 3.3K OPT MODEL_OPT_2 E11 LED_NORMAL LED_MOVING
HD LED_MOVING A7 R192 100
GPIO67 USB_CTL 4:AL4
MODEL_OPT_3 B9 FHD HD B8 R155 100
GPIO68 SCART1_MUTE 9:AI25
C2043 C2044 C243 C246 C249 C252 C257 C264 C275 C281 C289 C294 C297 C2000 C2001 C2003 C2005 C2031 C2032 C2033 C2034 C2035 C2036 C2037 C2038 C2039 C2040 C2041 C2042
10uF 10uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF
+1.8V_DDR
C2027 C242 C245 C248 C251 C254 C259 C266 C277 C283 C291 C296
10uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF
+3.3V
+3.3V_VDDP
L210
BLM18PG121SN1D
C2004 C2026 C276 C265 C258 C253 C250 C247 C244 C241
0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF
LVDS OUT
6:K20 D0-_HDMI2 LVB0M 11:Q16;11:Q10 VDDC_13 P7
D2 RXB1P AD19 22 R278 GND_12
6:K21 D1+_HDMI2 LVB1P LVB_1P 11:J10;11:M16 L16 VDDC_14 R7
D3 RXB1N AF20 22 R279 GND_13
HDMI
6:K21 D1-_HDMI2 LVB1M LVB_1M 11:Q16;11:Q10 L17 GND_14 VDDC_15 T7
E3 RXB2P AF19 22 R280
6:K22 D2+_HDMI2 LVB2P LVB_2P 11:J9;11:M15 L18 GND_15 T22
D1 RXB2N AE19 22 R281 VDDC_16
6:K22 D2-_HDMI2 LVB2M LVB_2M 11:Q15;11:Q10 M9 GND_16 U7
R201 0 E1 DDCD_B_DA AD17 22 R282 VDDC_17
6:K18;6:AL19 DDC_SDA_2 LVB3P LVB_3P 11:J9;11:M15 U20
R202 0 F3 DDCD_B_CK AF18 22 R283 VDDC_18
6:K18;6:AL18 DDC_SCL_2 LVB3M LVB_3M 11:Q15;11:Q9 M10 GND_17 U22
R203 100 E2 HOTPLUG_B AF17 22 R262 VDDC_19
6:J16 HPD2 LVB4P LVB_4P 11:J9;11:M15 M11 GND_18 V7
AE17 22 R263 VDDC_20
LVB4M LVB_4M 11:Q15;11:Q9 M12 V22
M
- 28 -
AD10 RXC2N
6:X17 D2-_HDMI3 AUL0 SC1_L_IN 9:J10 N4
R248 0 AE7 DDCD_C_DA AE1 C2006 2.2uF GND_26
6:X13;6:AL14 DDC_SDA_3 AUR1 N9 H9
R249 0 AF7 DDCD_C_CK AF3 C2007 2.2uF GND_27 VDDP_1
6:X13;6:AL13 DDC_SCL_3 AUL1 N10 H10
R200 100 AD7 HOTPLUG_C AE3 C2008 2.2uF GND_28 VDDP_2
6:W11 HPD3 AUR2 SC2_R_IN 9:AE11 N11 H11
R204 100 J3 CEC AUL2 AE2 C2009 2.2uF GND_29 VDDP_3
6:AM25 HDMI_CEC SC2_L_IN 9:AE10 N12 H12
AA1 C2011 2.2uF GND_30 VDDP_4
AUR3 AV_R_IN 4:M6 N13 N20
AB1 C2012 2.2uF GND_31 VDDP_5
AUL3 AV_L_IN 4:M5 N14 P20
AB2 C2013 2.2uF GND_32 VDDP_6
AUR4 COMP_R_IN 4:K15 W9
AUDIO IN
N2 HSYNC0/SC1_ID AC2 C2014 2.2uF VDDP_7 +3.3V
9:P8 SC1_ID AUL4 COMP_L_IN 4:K13 N15 W10 +3.3V_S6
R210 47 N1 VSYNC0/SC1_FB AB3 C2015 2.2uF GND_33 VDDP_8
9:O6 SC1_FB AUR5 PC_R_IN 4:Z5 N16
AVDD_AU : 36.11mA
R211 47 C200 0.047uF P2 RIN0P/SC1_R AC3 C2016 2.2uF GND_34
9:J6 SC1_R AUL5 PC_L_IN 4:Z6 N17 L209
R212 47 C201 0.047uF R3 GIN0P/SC1_G GND_35 BLM18PG121SN1D
9:J8 SC1_G FE_SIF 10:P13 N18 W7
R213 47 C202 0.047uF R1 BIN0P/SC1_B GND_36 AVDD_AU
9:J9 SC1_B P4 +1.8V_DDR
R214 470 C203 1000pF P3 SOGIN0/SC1_CVBS GND_37
E21;9:O4 SC1_CVBS_IN P9 C284 C293
SCART_RGB
R215 47 C204 0.047uF P1 RINM W3 C231 0.1uF R241 47 GND_38
SIF0P P10 G12
R216 47 C205 0.047uF T3 BINM W2 C232 0.1uF R242 47 GND_39 AVDD_DDR_1 0.1uF 0.1uF
SIF0M G13
R217 47 C206 0.047uF R2 GINM AVDD_DDR_2
H13
AVDD_DDR_3
R243 R244 P11 H14
F11 R266 100 GND_40 AVDD_DDR_4
10K 10K SPDIF_IN 5V_HDMI_3 P12 H15
R246 22 K3 HSYNC1/DSUB_HSYNC E9 R230 100 GND_41 AVDD_DDR_5
4:C22 DSUB_HSYNC SPDIF_OUT SPDIF_OUT 4:T11 P13 H16
R245 22 K2 VSYNC1/DSUB_VSYNC GND_42 AVDD_DDR_6
4:C22 DSUB_VSYNC P14 W14
R218 47 C212 0.047uF L1 RIN1P/DSUB_R GND_43 AVDD_DDR_7
4:C26 DSUB_R P15 W15
R219 47 C207 0.047uF L3 GIN1P/DSUB_G GND_44 AVDD_DDR_8
4:C24 DSUB_G P16 W16
R220 47 C213 0.047uF K1 BIN1P/DSUB_B GND_45 AVDD_DDR_9
DSUB
4:C23 DSUB_B P17 W17
R221 470 C208 1000pF L2 SOGIN1 AF1 R237 100 GND_46 AVDD_DDR_10 +3.3V_S6 AVDD_MEMPLL : 23.77mA
AUOUTR0/HP_ROUT HP_ROUT 7:G21 P18 W18
AF2 R238 100 GND_47 AVDD_DDR_11
AUOUTL0/HP_LOUT HP_LOUT 7:G19
AD3 R239 100
AUOUTR1/SC1_ROUT SCART1_Rout 9:T14 R4 H17
R222 47 C214 0.047uF V1 RIN2P/COMP_PR+ AD1 R240 100 SCART1_Lout GND_48 AVDD_MEMPLL_1
4:K13 COMP_Pr AUOUTL1/SC1_LOUT 9:S12 R9 T20
R223 47 C215 0.047uF V2 GIN2P/COMP_Y+ AC1 R250 100 SCART2_Rout GND_49 AVDD_MEMPLL_2 C262 C269 C273
4:K11 COMP_Y AUOUTR2/SC2_ROUT 9:AN15 R10 V20
R224 47 C216 0.047uF U1 BIN2P/COMP_PB+ AD2 R251 100 SCART2_Lout GND_50 AVDD_MEMPLL_3
4:K12 COMP_Pb AUOUTL2/SC2_LOUT 9:AM13 R11 0.1uF 0.1uF
COMP
R225 470 C209 1000pF V3 SOGIN2 GND_51 0.1uF
R12
AUDIO OUT
R252
22K
R253
22K
R254
22K
R255
22K
R256
22K
C2017
0.01uF
C2018
0.01uF
C2020
0.01uF
C2021
0.01uF
C2022
0.01uF
C2023
0.01uF
R257
22K
GND_53
R14
A8 R231 22 GND_54
I2S_OUT_MCK AUDIO_MASTER_CLK 7:F7 R15 R20
B7 R232 22 GND_55 AVDD_LPLL
R205 47 C210 0.047uF U3 CVBS1/SC1_CVBS I2S_OUT_WS MS_LRCK 7:F12 +3.3V_AVDD_MPLL
E17;9:O4 SC1_CVBS_IN C7 R233 22
R206 47 C211 0.047uF U2 CVBS2/SC2_CVBS I2S_OUT_BCK MS_SCK 7:F12 R16 C279
9:AE2 SC2_CVBS_IN D8 R234 22 GND_56
R226 47 C217 0.047uF T1 CVBS3/SIDE_CVBS I2S_OUT_SD MS_LRCH 7:F12 R17 H7
4:M2 AV_CVBS_IN C8 R274 100 GND_57 AVDD_MPLL 0.1uF
R227 47 C218 0.047uF T2 I2S_IN_SD C236 C237 C238 C239 R18
CVBS
VCOM1
OPT 22pF 22pF 22pF 22pF GND_58 C2025
T5 C2029
OPT OPT OPT OPT GND_59 0.1uF 10uF
T9 6.3V
M1 CVBS4/S-VIDEO_Y GND_60
C235 0.1uF T10 AVDD_33 : 281mA
M2 CVBS6/S-VIDEO_C K4 C223 0.1uF GND_61
VCLAMP T11 +3.3V_AVDD
H4 C233 GND_62
REFP T12 L206
R235 47 C2024 0.047uF N3 CVBS5 J4 GND_63 BLM18PG121SN1D
REFM 0.1uF J7
R236 47 C2019 0.047uF M3 CVBS7 G4 R229 390 AVDD_33_1
REXT C234 0.1uF T13 K7
1% +3.3V GND_64 AVDD_33_2 C263 C271 C274 C260 C267 C286
T14 L7
R228 100 C221 0.047uF W1 CVBS0/RF_CVBS Check GND_65 AVDD_33_3
10:AA8 FE_VMAIN T15 M7 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF
R209 100 C222 0.047uF Y3 VCOM0 AE5 C224 0.1uF GND_66 AVDD_33_4
AUCOM T16 N7
AE4 GND_67 AVDD_33_5 +3.3V_S6
AUVRM T17
Y2 CVBSOUT0/SC2_MNTOUT AF4 C225 10uF 6.3V GND_68
9:AL4 DTV/MNT_VOUT AUVRP T18
TV/MNT
AA2 CVBSOUT1 AD4 C226 0.1uF GND_69
FE_VSCART_OUT AUVAG U5 W8
C227 1uF GND_70 AVDD_DM
W13 +3.3V_S6
C228 4.7uF GND_71 C2030
Y21
GND_72
AA23 H8 AVDD_DM : 0.03mA
GND_73 AVDD_USB 0.1uF
C256
0.1uF
Close to IC
as close as possible
AVDD_OTG : 22.96mA
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+1.8V_DDR +1.8V_DDR
C302 C323
0.1uF 0.1uF
C325
C327
C329
0.1uF
C330
C331
C332
C334
C336
C337
C338
C339
C340
C341
C324
C326
C328
C342
C314
10uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
C303
10uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
C304
C305
C306
C307
C308
C310
C312
C313
C315
C316
C317
C318
C319
C320
0.1uF
0.1uF
Close to DDR Power Pin Close to DDR Power Pin
+1.8V_DDR
+1.8V_DDR +1.8V_DDR
R301
R321
1K 1%
1%
C333 C335
0.1uF
0.1uF
IC300 0.1uF 0.1uF IC301
1%
R322
R343
1K
0.1uF
IC100
1K
HY5PS1G1631CFP-S6 LGE3368A (Saturn6 No-DivX) H5PS5162FFR-S6C
R302 1K 1%
C311
C301
C309
C300 0.1uF
SDDR_D[0] DQ0 G8 J2 VREF AR300 D15 VREF J2 G8 DQ0 TDDR_D[0]
SDDR_A[5] ADDR2_A[5] A_MVREF
SDDR_D[1] DQ1 G2 AR303 G2 DQ1 TDDR_D[1]
SDDR_A[3] ADDR2_A[3] BDDR2_A[9] TDDR_A[9]
SDDR_D[2] DQ2 H7 H7 DQ2 TDDR_D[2]
M8 A0 SDDR_A[0] SDDR_A[1] ADDR2_A[1] ADDR2_A[0] C13 T26 BDDR2_A[0] BDDR2_A[3] TDDR_A[3] TDDR_A[0] A0 M8
SDDR_D[3] DQ3 H3 A_DDR2_A0 B_DDR2_A0 H3 DQ3 TDDR_D[3]
A1 SDDR_A[1] SDDR_A[10] 56 56 ADDR2_A[10] ADDR2_A[1] A22 AF26 BDDR2_A[1] BDDR2_A[1] TDDR_A[1] TDDR_A[1] A1
DQ4 M3 A_DDR2_A1 B_DDR2_A1 M3 DQ4
SDDR_D[4] H1 H1 TDDR_D[4]
SDDR_A[0-12]
TDDR_D[0-15]
SDDR_D[0-15]
ADDR2_A[0-12]
P8 A8 SDDR_A[8] ADDR2_A[8] B12 R25 BDDR2_A[8] TDDR_A[8] A8 P8
SDDR_D[11] DQ11 D3 SDDR_A[4] ADDR2_A[4] A_DDR2_A8 B_DDR2_A8 BDDR2_A[2] TDDR_A[2] D3 DQ11 TDDR_D[11]
P3 A9 SDDR_A[9] ADDR2_A[9] C23 AC22 BDDR2_A[9] TDDR_A[9] A9 P3
TDDR_A[0-12]
SDDR_D[12] DQ12 D1 SDDR_A[6] 56 ADDR2_A[6] A_DDR2_A9 B_DDR2_A9 BDDR2_A[4] TDDR_A[4] D1 DQ12 TDDR_D[12]
BDDR2_A[0-12]
M2 A10/AP SDDR_A[10] ADDR2_A[10] B22 AD23 BDDR2_A[10] TDDR_A[10] A10/AP M2
SDDR_D[13] DQ13 SDDR_A[11] R319 56 ADDR2_A[11] A_DDR2_A10 B_DDR2_A10 BDDR2_A[6] 56 TDDR_A[6] DQ13 TDDR_D[13]
D9 A11 R24 BDDR2_A[11] A11 D9
P7 SDDR_A[11] ADDR2_A[11] A12 TDDR_A[11] P7
SDDR_D[14] DQ14 B1 SDDR_A[8] R320 56 ADDR2_A[8] A_DDR2_A11 B_DDR2_A11 BDDR2_A[11] R325 56 TDDR_A[11] B1 DQ14 TDDR_D[14]
R2 A12 SDDR_A[12] ADDR2_A[12] A24 AE22 BDDR2_A[12] TDDR_A[12] A12 R2
SDDR_D[15] DQ15 B9 A_DDR2_A12 B_DDR2_A12 BDDR2_A[8] R326 56 TDDR_A[8] B9 DQ15 TDDR_D[15]
+1.8V_DDR +1.8V_DDR
L2 BA0 SDDR_BA[0] 56 R303 ADDR2_BA[0] C24 AC23 BDDR2_BA[0] R327 56 TDDR_BA[0] BA0 L2
A_DDR2_BA0 B_DDR2_BA0
L3 BA1 SDDR_BA[1] 56 R304 ADDR2_BA[1] B24 AC24 BDDR2_BA[1] R328 56 TDDR_BA[1] BA1 L3
VDD5 A1 A_DDR2_BA1 B_DDR2_BA1 A1 VDD5
L1 BA2 SDDR_BA[2] 56 R305 ADDR2_BA[2] D24 AB22 BDDR2_BA[2] OPT R329 56 TDDR_BA[2] NC4 L1
VDD4 E1 A_DDR2_BA2 B_DDR2_BA2 E1 VDD4
22 R306 ADDR2_MCLK B14 V25 BDDR2_MCLK R330 22
VDD3 J9 A_DDR2_MCLK B_DDR2_MCLK J9 VDD3
VDD2 CK SDDR_CK TDDR_MCLK CK VDD2
M9 J8 J8 M9
- 29 -
OPT
OPT
150
R300
R344
150
VDD1 R1 K8 CK /SDDR_CK 22 R307 /ADDR2_MCLK A14 V24 /BDDR2_MCLK R331 22 /TDDR_MCLK CK K8 R1 VDD1
/A_DDR2_MCLK /B_DDR2_MCLK
DDR2
K2 CKE SDDR_CKE 56 R308 ADDR2_CKE D23 AB23 BDDR2_CKE R332 56 TDDR_CKE CKE K2
A_DDR2_CKE B_DDR2_CKE
OPT +1.8V_DDR +1.8V_DDR
R346 4.7K R348 OPT 4.7K
0
0
OPT
R350
R351
VDDQ10 A9 K9 ODT OPT SDDR_ODT56 R309 ADDR2_ODT D14 U26 BDDR2_ODT R333 56 ODT K9 A9 VDDQ10
R347 4.7K A_DDR2_ODT B_DDR2_ODT
VDDQ9 C1 L8 CS R349 OPT 4.7K CS L8 C1 VDDQ9
VDDQ8 C3 K7 RAS /SDDR_RAS 56 R310 /ADDR2_RAS D13 U25 /BDDR2_RAS R334 56 /TDDR_RAS RAS K7 C3 VDDQ8
/A_DDR2_RAS /B_DDR2_RAS
VDDQ7 C7 L7 CAS /SDDR_CAS 56 R311 /ADDR2_CAS D12 U24 /BDDR2_CAS R335 56 /TDDR_CAS CAS L7 C7 VDDQ7
/A_DDR2_CAS /B_DDR2_CAS
VDDQ6 C9 K3 WE /SDDR_WE 56 R312 /ADDR2_WE D22 AB24 /BDDR2_WE R336 56 /TDDR_WE WE K3 C9 VDDQ6
/A_DDR2_WE /B_DDR2_WE
VDDQ5 E9 E9 VDDQ5
VDDQ4 G1 G1 VDDQ4
F7 LDQS SDDR_DQS0_P 56 R313 ADDR2_DQS0_P B18 AB26 BDDR2_DQS0_P R337 56 TDDR_DQS0_P LDQS F7
VDDQ3 G3 A_DDR2_DQS0 B_DDR2_DQS0 G3 VDDQ3
B7 UDQS SDDR_DQS1_P 56 R314 ADDR2_DQS1_P C17 AA26 BDDR2_DQS1_P R338 56 TDDR_DQS1_P UDQS B7
VDDQ2 G7 A_DDR2_DQS1 B_DDR2_DQS1 G7 VDDQ2
VDDQ1 G9 G9 VDDQ1
F3 LDM SDDR_DQM0_P 56 R315 ADDR2_DQM0_P C18 AC25 BDDR2_DQM0_P R339 56 TDDR_DQM0_P LDM F3
A_DDR2_DQM0 B_DDR2_DQM0
B3 UDM SDDR_DQM1_P 56 R316 ADDR2_DQM1_P A19 AC26 BDDR2_DQM1_P R340 56 TDDR_DQM1_P UDM B3
A_DDR2_DQM1 B_DDR2_DQM1
VSS5 A3 A3 VSS5
VSS4 E3 E8 LDQS SDDR_DQS0_N 56 R317 ADDR2_DQS0_N A18 AB25 BDDR2_DQS0_N R341 56 TDDR_DQS0_N LDQS E8 E3 VSS4
A_DDR2_DQSB0 B_DDR2_DQSB0
VSS3 J3 A8 UDQS SDDR_DQS1_N 56 R318 ADDR2_DQS1_N B17 AA25 BDDR2_DQS1_N R342 56 TDDR_DQS1_N UDQS A8 J3 VSS3
A_DDR2_DQSB1 B_DDR2_DQSB1
VSS2 N1 N1 VSS2
AR306 AR310
VSS1 P9 SDDR_D[11] ADDR2_D[11] ADDR2_D[0] B15 W25 BDDR2_D[0] BDDR2_D[11] TDDR_D[11] P9 VSS1
R3 NC5 A_DDR2_DQ0 B_DDR2_DQ0 NC5 R3
SDDR_D[12] ADDR2_D[12] ADDR2_D[1] A21 AE26 BDDR2_D[1] BDDR2_D[12] TDDR_D[12]
R7 NC6 A_DDR2_DQ1 B_DDR2_DQ1 NC6 R7
SDDR_D[9] ADDR2_D[9] ADDR2_D[2] A15 W24 BDDR2_D[2] BDDR2_D[9] TDDR_D[9]
A_DDR2_DQ2 B_DDR2_DQ2
SDDR_D[14] 56 ADDR2_D[14] ADDR2_D[3] B21 AF24 BDDR2_D[3] BDDR2_D[14] TDDR_D[14]
VSSQ10 B2 A_DDR2_DQ3 B_DDR2_DQ3 AR311 B2 VSSQ10
NC1 AR307 ADDR2_D[4] C21 AF25 BDDR2_D[4] 56 NC1
VSSQ9 A2 SDDR_D[4] ADDR2_D[4] A_DDR2_DQ4 B_DDR2_DQ4 BDDR2_D[4] TDDR_D[4] A2 VSSQ9
B8 NC2 C14 V26 NC2 B8
E2 SDDR_D[3] ADDR2_D[3] ADDR2_D[5] BDDR2_D[5] BDDR2_D[3] TDDR_D[3] E2
VSSQ8 A7 A_DDR2_DQ5 B_DDR2_DQ5 A7 VSSQ8
R8 NC3 ADDR2_D[6] C20 AE25 BDDR2_D[6] NC3 R8
VSSQ7 SDDR_D[1] ADDR2_D[1] A_DDR2_DQ6 B_DDR2_DQ6 BDDR2_D[1] TDDR_D[1] VSSQ7
D2 C15 W26 D2
SDDR_D[6] 56 ADDR2_D[6] ADDR2_D[7] BDDR2_D[7] BDDR2_D[6] 56 TDDR_D[6]
VSSQ6 D8 A_DDR2_DQ7 B_DDR2_DQ7 D8 VSSQ6
AR308 ADDR2_D[8] C16 Y26 BDDR2_D[8] AR312
VSSQ5 E7 VSSDL SDDR_D[15] ADDR2_D[15] A_DDR2_DQ8 B_DDR2_DQ8 BDDR2_D[15] TDDR_D[15] VSSDL E7 VSSQ5
J7 ADDR2_D[9] C19 AD25 BDDR2_D[9] J7
VSSQ4 F2 SDDR_D[8] ADDR2_D[8] A_DDR2_DQ9 B_DDR2_DQ9 BDDR2_D[8] TDDR_D[8] +1.8V_DDR F2 VSSQ4
+1.8V_DDR ADDR2_D[10] B16 Y25 BDDR2_D[10]
VSSQ3
BDDR2_D[0-15]
ADDR2_D[0-15]
ADDR2_D[11] AE24 BDDR2_D[11]
VSSQ2 H2 SDDR_D[13] 56 ADDR2_D[13] A_DDR2_DQ11 B_DDR2_DQ11 BDDR2_D[13] TDDR_D[13] H2 VSSQ2
AR309 ADDR2_D[12] A20 AD26 BDDR2_D[12] AR313
VSSQ1 VDDL A_DDR2_DQ12 B_DDR2_DQ12 56 VDDL VSSQ1
H8 J1 SDDR_D[7] ADDR2_D[7] A16 Y24 BDDR2_D[7] TDDR_D[7] J1 H8
ADDR2_D[13] BDDR2_D[13]
SDDR_D[0] ADDR2_D[0] A_DDR2_DQ13 B_DDR2_DQ13 BDDR2_D[0] TDDR_D[0]
ADDR2_D[14] B19 AD24 BDDR2_D[14]
SDDR_D[2] ADDR2_D[2] A_DDR2_DQ14 B_DDR2_DQ14 BDDR2_D[2] TDDR_D[2]
ADDR2_D[15] A17 AA24 BDDR2_D[15]
SDDR_D[5] ADDR2_D[5] A_DDR2_DQ15 B_DDR2_DQ15 BDDR2_D[5] 56 TDDR_D[5]
56
0.1uF
C423
[WH]U_CAN 7A B_TERMINAL1
2B
1
PC_R_IN 2:S16
D421 R451 R455
JK404
R413 R_SPRING C422 15K 0
4C [RD]O_SPRING 10K 4 AMOTECH R449
100pF
2
AV_L_IN 5.6V 470K R453 REAR_USB_DM 1:AL8
50V 10K
[RD]CONTACT AMOTECH 5 T_SPRING OPT
5C R410 C413
D404
470K
UB01123-4HHS-4F
R415
12K
5.6V 100pF
3
R452 REAR_USB_DP 1:AL7
[RD]U_CAN 50V 7B B_TERMINAL2 15K
2C PC_L_IN 2:S16 D401
R414 R456 D402
4
6B T_TERMINAL2 C424 R450 0
AV_R_IN AMOTECH 5.6V CDS3C05HDMI1
100pF 470K 5.6V
AMOTECH 5.6V 50V
5
R454
D405 8 SHIELD_PLATE OPT 10K
R408 C412
R417
12K
5.6V
470K 100pF
50V
COMPONENT
R418
SPDIF OPTIC JACK
4.7K
R425
AMOTECH 1K
COMP_DET 1:AA22 +5V_GENERAL +5V_GENERAL
D412
JK400
5.6V
PPJ229-01
R462
SIDE USB (OPT:SIDE_USB)
2A [GN]1P_CAN
1K
JK403 IC402
4A [GN]CONTACT MP6211DH
JST1223-001 +5V_USB_SIDE
R419 SPDIF_OUT OUT_3 GND
8 1
3A [GN]O_SPRING AMOTECH0 GND
COMP_Y 2:E20
Fi b e r
OPT VCC 0.1uF 10uF
2
FLAG EN
ZD403 OPT 5 4
0.1uF
C403
ADMC5M03200L_AMODIODE
5B [BL]C_LUG_L
AMOTECH COMP_Pb 2:E20 C406 USB_CTL R420
D408 R427 0.1uF
Op t i c
VINPUT 1:AI26 10K
3
2C [RD]1P_CAN1 75 16V
30V
4
5C [RD]C_LUG_L FIX_POLE R403
AMOTECH COMP_Pr 2:E20 47 USB_OCD
D409 R428
2D [WH]1P_CAN 30V 75 1:AI14
R432 R435
5D [WH]C_LUG_L 10K 0
COMP_L_IN 2:S16
1
470K
R434
12K
5.6V 50V
2
R431 R436
10K 0
KJA-UB-4-0004
3E [RD]O_SPRING
3
470K
R433
12K
50V 5.6V CDS3C05HDMI1
- 30 -
5.6V
5
INTERFACE
+5V_ST
D400
ENKMC2838-T112
A1
C
A2
IC400
CAT24C02WI-GT3 C400 RS232C
0.1uF +5V_ST
A0 VCC
16V
1 8 R412
C425
R406 10K EDID_WP 0.33uF
A1 WP R404 1:AJ19 16V
2 7 4.7K R416
4.7K 100
A2 SCL
3 6 ISP_RXD
[ PC ] C429
VSS SDA
0.33uF
4 5 ISP_TXD C428 16V
0.33uF
16V C430
C401 C402 0.047uF
18pF 18pF 25V
50V 50V
R444 R445
22
RI N2
DOUT2
V-
C2 -
C2 +
C1 -
V+
C1 +
22
8
7
6
5
4
3
2
1
D413 IC403
30V
MAX3232CDR
D414
30V
ADUC30S03010L_AMODIODE
0 R437 D419
2:E18 DSUB_VSYNC ADMC5M03200L_AMODIODE
9
10
11
12
13
14
15
16
5.6V
0 R440
2:E18 DSUB_HSYNC
D418
OPT
+3.3V
GND
VCC
ADMC5M03200L_AMODIODE
DI N2
DI N1
RI N1
5.6V +5V_ST
ROUT2
ROUT1
DOUT1
OPT
C431
DSUB_B R447 0.1uF
2:E19
D415 4.7K 16V
C418 ADUC30S03010L_AMODIODE JP414 R448
OPT 30V DSUB_DET IR_OUT
R443
75
JP412 D420 1K
R446 ADMC5M03200L_AMODIODE
0 R461
5.6V R457 R458 D423 OPT
6.2K 6.2K 0
OPT R459 OPT ADUC30S03010L_AMODIODE
100
OPT
30V
R460
100
2:E19 DSUB_G
JP413
C419 D416 DBG_TX
@maker
OPT ADUC30S03010L_AMODIODE
30V DBG_RX
R441
75
D424 OPT
11
12
13
14
15
ADUC30S03010L_AMODIODE
C426 220pF 50V 30V
16
6
7
8
9
10
C427 220pF 50V
1
2
3
4
5
2:E18 DSUB_R
C420 D417 P400 P401
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
OPT ADUC30S03010L_AMODIODE KCN-DS-1-0089
KCN-DS-1-0088
R442
75
30V SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
6
7
8
9
CI_DATA[0-7] AR506
33 FE_TS_DATA[7]
CI_MDI[7] FE_TS_DATA[6]
CI_MDI[6] FE_TS_DATA[5]
CI_MDI[5] FE_TS_DATA[4]
CI_MDI[4]
+5V_GENERAL AR507 FE_TS_DATA[3]
C505 33
CI_MDI[3] FE_TS_DATA[2]
10uF
10V CI_MDI[2] FE_TS_DATA[1]
EAG41860101 CI_MDI[1] FE_TS_DATA[0]
FE_TS_DATA[0-7]
10K
R505
P500 CI_MDI[0]
CI_DATA[0-7]
/CI_CD1
C501 10067972-050LF
FE_TS_DATA[0-7]
0.1uF
16V 35 AR513
33
R511 100 36 CI_DATA[3] D14 CI_MISTRT FE_TS_SYN
37 3 CI_DATA[4] FE_TS_VAL_ERR
AR500 CI_MIVAL_ERR
33 38 4 CI_DATA[5]
R517
10K
CI_TS_DATA[4]
39 5 CI_DATA[6] FE_TS_CLK
CI_TS_DATA[5] CI_MCLKI
40 6 CI_DATA[7]
CI_TS_DATA[6]
CI_TS_DATA[7] 41 7 R515 47
/PCM_CE
42 8 CI_ADDR[10]
R508 10K 43 9 CI_OE
44 10 CI_ADDR[11]
CI_IORD
45 11 CI_ADDR[9] +5V_GENERAL
CI_IOWR
46 12 CI_ADDR[8]
47 13 CI_ADDR[13]
10K
R518
CI_MDI[1] 48 14
DVB-CI HOST I/F
CI_MDI[2] 49 15 CI_WE
50 16 R516 100
CI_MDI[3] /PCM_IRQA
C503 0.1uF 51 17
R513 0 R514 0 C509
52 18 C508 CI_DET
GND 0.1uF
OPT 53 19 OPT 0.1uF
CI_MDI[4] 16V
GND
CI_MDI[5] 54 20
55 21 CI_ADDR[12]
CI_MDI[6]
CI_ADDR[7] GND
CI_MDI[7] 56 22 IC501 +3.3V_CI
R509 10K 57 23 CI_ADDR[6]
C511
R503 47 58 24 CI_ADDR[5] 0.1uF
PCM_RST
R500 47 59 25 CI_ADDR[4] 1OE VCC 16V
/PCM_WAIT 1 20
AR503 60 26 CI_ADDR[3] TOSHIBA
REG
33 61 27 CI_ADDR[2]
CI_TS_CLK 1A1 2OE
62 28 CI_ADDR[1] PCM_A[0] 2 19
CI_TS_VAL
63 29 CI_ADDR[0] 0ITO742440D
CI_TS_SYN
64 30 CI_DATA[0] 2Y4 1Y1
CI_ADDR[7] 3 18 CI_ADDR[0]
CI_DATA[1]
0
G2
2 G1
1 CI_ADDR[6] 5 16 CI_ADDR[1]
AR504
OPT
R510 100 1A3 2A3
/CI_CD2 6 15
R512
PCM_A[2] PCM_A[6]
+5V_GENERAL GND
10K
R507
TC74LCX244FT
2Y2 1Y3
GND CI_ADDR[5] 7 14 CI_ADDR[2]
1A4 2A2
PCM_A[3] 8 13 PCM_A[5]
R506 GND
10K C502
2Y1 1Y4
0.1uF 9 12
CI_ADDR[4] CI_ADDR[3]
16V
GND 2A1
10 11 PCM_A[4]
CI_MISTRT
CI_MIVAL_ERR
- 31 -
CI_MCLKI
PCMCIA
A 2
CI_DATA[7] PCM_D[7]
/CI_CD1 16V
10K
R520
GND 3 4 Y
C5 1 0
D4
0. 1uF
AB9 PCM_D[0-7]
GND
R519 CI_DATA[0-7]
CI_DET IC502
47
R521
1:AA10 74LVC541A(PW)
/PCM_CD
47
AR510
OE1 VCC 33
1 20 CI_ADDR[8] PCM_A[8]
C512
CI_ADDR[9] PCM_A[9]
0.1uF
S D 10K A4 Y3 47
6 15 BUF_TS_DATA[0]
C C 5V_HDMI_3
R615 R616
10K Q602 B 10K
Q601 B
2SC3052 HPD1 2SC3052 HPD2
22 22
E C
E JACK_GND R617
C600 C601 10K
19 19 Q603 B
0.1uF 0.1uF
2SC3052 HPD3
16V 16V 20
18 18 R613
R612 1K E
2K
1K JP602
2K
17 C602
R601
17 2:E12;AL19 19
R600
R603 22 0.1uF
JP600
R610 22
DDC_SDA_1 16 DDC_SDA_2 16V
16 2:E12;AL18 18 R614
2:E10;AL9 1K
2K
DDC_SCL_1 15 22 DDC_SCL_2
R604 17
R602
15 R611 22 22
JP604
2:E10;AL9
JP601
14 JP603 K8;X14;AH25 16 DDC_SDA_3
14 K19;X14;AH25 R605 2:E15;AL13
R607 0 0
CEC_REMOTE CEC_REMOTE DDC_SCL_3
13 15
JP605
13 2:E11 R606 22
2:E8
CK-_HDMI1 CK-_HDMI2 $0.26
12 14 K19;K8;AH25
12
R609 0
11 CEC_REMOTE
11 2:E8 CK+ 2:E10 13
CK+ 10 2:E13
10 CK+_HDMI1 CK+_HDMI2 CK-_HDMI3
D0- 2:E11 12
D0- 2:E9 9
9 D0-_HDMI1 D0-_HDMI2
D0_GND 11
CK+
EAG39789402
D0_GND 8 2:E13
EAG39789402
8 10
CK+_HDMI3
D0+ 2:E8 D0+ 2:E11 D0- 2:E13
7 7 D0+_HDMI2 9
D0+_HDMI1 D0-_HDMI3
D1- 2:E9 D1- 2:E11 D0_GND
6 8
EAG42463001
6 D1-_HDMI1 D1-_HDMI2
D1_GND D1_GND D0+ 2:E13
5 5 7
D0+_HDMI3
D1+ 2:E9 D1+ 2:E11 D1- 2:E14
4 4 D1+_HDMI2 6
D1+_HDMI1 D1-_HDMI3
D2- 2:E9 D2- 2:E12 D1_GND
3 3 D2-_HDMI2 5
D2-_HDMI1
GND
JK600 JK601 GND
JK602
GND
A2
A1
A2
A1
ENKMC2838-T112 ENKMC2838-T112
A2
A1
- 32 -
D600 ENKMC2838-T112 D601
C
C
HDMI
D602
C
IC602 IC601
IC600
EDID_WP 1:AJ20;AI16;AL12 EDID_WP CAT24C02WI-GT3
CAT24C02WI-GT3 CAT24C02WI-GT3 EDID_WP
JP606 JP611
JP607
A0 VCC A0 VCC
A0 VCC 1 8 1 8
1 8
R640 R619
R618 A1 WP R649 A1 WP 0
A1 WP 0 0 R646 2 7 C604 R6 2 8 R630
2 7 R626 R629 2 7 C607 0.1uF 4. 7K
C603 4.7K 4.7K 4.7K
0.1uF 4.7K 4.7K 0.1uF
A2 SCL A2 SCL R620 0
A2 SCL 3 6 3 6
3 6 DDC_SCL_2 DDC_SCL_3
DDC_SCL_1 2:E10;K7 R645 0
R623 0
VSS SDA VSS SDA
VSS SDA 4 5 4 5
4 5 DDC_SDA_2
2:E10;K7 R622 0 DDC_SDA_3
R621 0 DDC_SDA_1 R642 0
GND
HDMI_CEC +3.3V_ST
R627 R631
120K OPT
Q600 MMBD301LT1G
SSM6N15FU D603
30V
SOURCE1 DRAIN1
HDMI_CEC 1 6 CEC_REMOTE
GATE1 GATE2
2 OPT 5
R625 0 GND
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
C727
0.1uF
R704 16V
100
1:AA21 AMP_RST
PGND1A_2
PGND1A_1
OUT1A_2
OUT1A_1
PVDD1A_2
PVDD1A_1
PVDD1B_2
PVDD1B_1
OUT1B_2
OUT1B_1
PGND1B_2
PGND1B_1
BST1B
VDR1B
56
55
54
53
52
51
50
49
48
47
46
45
44
43
50V R740 C7 1 3 C7 3 0
0 0. 1uF BST1A 42 NC R727 R716
2:X21 AUDIO_MASTER_CLK 16V 1 0. 1uF C732 SPK_R+ AB11
VDR1A VDR2A 16V D706 12
2 41 22000pF 12
1N4148W
RESET 40 BST2A 50V
+1.8V_AMP +3.3V 3 100V L705 C757
AD 4 39 PGND2A_2 OPT C743 DA-8580
+1.8V_AMP 1000pF 0.01uF
DVSS_1 38 PGND2A_1 50V EAP38319001 C751 R732
C709 5 50V
2S 2F 0.1uF 4.7K R736
0.1uF VSS_IO 6 IC701 37 OUT2A_2
C746 50V 3.3 SPEAKER_R
CLK_I 7 36 OUT2A_1 C744
L701 0.47uF
C708 VDD_IO PVDD2A_2 1000pF 50V
8 35 50V 1S 1F R737
C705 1000pF EAN60664001
L700 50V DGND_PLL 9 34 PVDD2A_1
3.3
R703
0
100pF
R708 AGND_PLL 33 PVDD2B_2 D707 C752 R733
50V 10 R728
1N4148W R719 0.1uF 4.7K C758
3.3K LFM 11 NTP-3100L 32 PVDD2B_1 0.01uF
BLM18PG121SN1D
100V 12 12 50V
AVDD_PLL OUT2B_2 OPT 50V
12 31 SPK_R- AB12
BLM18PG121SN1D
DVDD_PLL 13 30 OUT2B_1
C728 C720
TEST0 14 29 PGND2B_2 0.1uF 0.1uF
50V 50V
C700 C702
1uF 0.1uF C704 C706 AMP_VCC
10V 1uF
15
16
19
20
21
22
23
24
25
26
27
28
16V 0.1uF
10V 16V
DVDD
SDATA 17
FAULT
VDR2B
BST2B
C734 C735 C736
DVSS_2
10uF
0.1uF 0.1uF
PGND2B_1
35V
MONITOR_0
MONITOR_1
MONITOR_2
50V 50V
MCLK SDATA WCK BCK TP is necessory C760 C715
0.1uF C7 2 4
1uF 0. 1uF
10V 16V C731
16V
22000pF
50V
R722 100 +3.3V_ST
2:X21 MS_LRCH
R720 100
2:X21 MS_LRCK C721
R721 100 0.1uF
2:X21 MS_SCK
16V R724
R709 100 10K
1:L22;11:AG10 SDA_SUB/AMP R718 100 D709
R710 100 ENKMC2838-T112
1:L22;11:AG9 SCL_SUB/AMP C A1
R729 SB_MUTE 1:AA19;G25;9:AI24;9:AI25
C712 Q701 B C
C714 R717
33pF 33pF 33K OPT 2SC3052 10K A2
50V NTP_MUTE 1:AA22
50V E WAFER-ANGLE
L706
120-ohm
AE3 SPK_L+
4
- 33 -
AMP
L707
120-ohm
AE5 SPK_L-
3
Monitor0_1_2 TP is necessory L709
120-ohm
AE7 SPK_R+
2
L708
120-ohm
AE9 SPK_R-
1
P700
2A => 5A
EARPHONE AMP HP_LOUT IC700
TPA6110A2DGNRG4
2:X19 +3.3V
+5V_EARPHONE
R711 C717
R712 0.22uF
BYPASS IN1- 20K 20K
1 8
BOTTOM_EARPHONE
DJ-S3600LM
C701 16V R707
R701 1uF C718 10K JK700
10K GND VO1 100uF 16V
6.3V 2 7
4
R714 C723 D710
SHUTDOWN VDD 0.1uF 5.6V
3 6 C719 1K AMOTECH
100uF 3
C703 C710
HP_ROUT 0.22uF R702 16V HP_DET
16V 20K IN2- VO2 0.1uF
4 5 2
16V
BREAK[L] 4
C-LUG-EL 5
C-LUG-ES 6
BREAK[R] 8
TOP_EARPHONE_out_of_stock
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.