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What is Rogers Ro3003g2 PCB?

Rogers ro3003g2 is a glass reinforced hydrocarbon/ceramic laminate material
made by Rogers Corporation specifically for high frequency, radio frequency
(RF) printed circuit board (PCB) applications that require a low dielectric
constant and tight thickness control.

Some key things to know about Rogers ro3003g2 PCB material:

 ro3003g2 has a dielectric constant (Dk) of 3.00 at 10 GHz, which helps

provide better impedance control and insertion loss for high frequency
signals

 It has a low dissipation factor (Df) of 0.0013 at 10 GHz resulting in

lower signal loss

 Excellent dimensional stability with a z-axis thermal coefficient of

expansion (CTE) of 30 ppm/°C

 Compatible with common PCB fabrication methods like lithography,

drilling, etching, etc.

With its electrical and physical characteristics, ro3003g2 is well-suited for

wireless communications applications like:

 ro3003g2

 5G NR base stations and remote radio heads

 Satellite communications

 Radar and autonomous/connected vehicles

 Aerospace and defense electronics

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Next, we’ll take a deeper look at the composition and properties of this Roger’s
high frequency laminate.

Composition and Properties

The basic composition of Rogers ro3003g2 laminates consists of glass fabric

reinforcements impregnated with a hydrocarbon/ceramic thermoset resin
system.

Glass fabric reinforcements provide dimensional stability and mechanical

rigidity while the resin system gives electrical insulating properties. The
standard glass fabric for ro3003g2 is 1037 style glass which refers to the weave
pattern and fiber size.

Here are some key properties and characteristics:

Electrical Properties

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Physical Properties

Key Highlights

 Stable electrical properties over frequency, temperature, and humidity

 Tight dielectric thickness control (±2 mils)

 High Tg over 280°C provides wide operating temperature range

 Low moisture absorption reduces electrical losses

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 Excellent dimensional stability with 30 ppm/°C CTE

This unique combination of electrical, mechanical, and thermal properties

makes Rogers ro3003g2 well suited for performance demanding RF PCB
designs.

Common PCB Stackups with ro3003g2 Cores

ro3003g2 laminates are available in a variety of dielectric thicknesses to

accommodate different circuit layout requirements. Here are some common
PCB stackup configurations using ro3003g2 cores:

2-Layer Board

A simple 2-layer PCB with ro3003g2 dielectric and 1⁄2 oz copper on both sides
of the board. The thinner dielectrics (2 to 10 mils) are ideal for impedance
matched transmission lines:

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[copper layer 1] → (ro3003g2 dielectric) → [copper layer 2]

4-Layer Board

A low cost 4-layer board with double-sided circuitry sandwiched between two
ro3003g2 cores pressed together as a composite. This provides good isolation
between the inner and outer layer circuits:

[copper layer 1] → (ro3003g2 core 1) → [copper layer 2] → (ro3003g2 core 2)

→ [copper layer 3]

6-Layer Board

High performance 6-layer board with ground planes for shielding and isolation.
The stackup also incorporates low loss laminates like RO4350B for inner layer
circuitry:

[copper layer 1] → (ro3003g2 outer core) → [copper layer 2] → (RO4350B

core 1) → [copper layer 3] → (RO4350B core 2) → [copper layer 4] →
(ro3003g2 outer core) → [copper layer 5]

8-Layer Board

Advanced HDI 8-layer board with complex power distribution, high-speed

signals, and RF circuits integrated together. Embedded passives can also be
incorporated by staggered removal of dielectric layers:

[copper layer 1] → (ro3003g2 + R/F ground vias) → [copper layer 2] → (core 1

+ staggered removal for embedded passives) → [copper layer 3] → (core 2) →
[copper layer 4] → (core 3 + staggered removal) → [copper layer 5] →
(ro3003g2 + filled vias) → [copper layer 6]

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These are just a few examples of the laminate stackup designs that are possible
with Rogers ro3003g2 cores. Thicker cores can provide increased isolation
while thinner cores enable finer lines and spaces.

PCB Fabrication with ro3003g2

Rogers ro3003g2 can be fabricated into printed circuit boards using standard
PCB processes used widely in the industry:

Inner Layer Processing

 Photolithography — ro3003g2 laminates can be coated with

standard liquid and film photoresists and exposed to UV light to define
circuit patterns

 Developing — the PCB panels are developed after light exposure which
chemically dissolves the unexposed photoresist

 Etching — the copper foil not protected by photoresist is etched away

by a chemical etchant leaving only the desired circuit pattern

 Stripping — the remaining photoresist is removed after etching to

complete the imaging process

Outer Layer Processing

 Lamination — individual cores are stacked up in the proper sequence

and laminated under heat and pressure to form a multilayer board

 Mechanical Drilling — high speed CNC drills make thousands of

holes through the stack to interconnect layers

 Desmear/Etchback — the hole walls are chemically cleaned of debris

before metallization

 Copper Plating — conductive copper is plated onto the hole walls and
board surfaces

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 Photolithography — same as the inner layer process to define the

outer layer circuits

Final Surfaces and Finishes

 Solder mask — epoxy based coatings are applied and cured to protect
metal surfaces and prevent solder bridges

 Silkscreen — legends and markers are printed using epoxy/ceramic

inks

 Surface Finishes — different metal surfaces finishes like ENIG,

immersion tin, OSP, etc. provide solderability and protect against
oxidation.

Rogers ro3003g2 is engineered to be fully compatible with these PCB

fabrication processes used globally by reputable manufacturers.

Applications for Rogers ro3003g2 PCBs

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The stable electrical performance, tight impedance control, low loss, and high
frequency capabilities of Rogers ro3003g2 make it an ideal choice for
numerous wireless and high speed digital applications including:

5G NR Base Station Antennas

Next generation 5G base stations with active antenna arrays demand extremely
stable radio frequency PCBs for beamforming networks. ro3003g2 with its low
loss, close thickness tolerance, and thermal reliability allows these
Beamformers to achieve high beam steering accuracy.

Satellite Communication Modules

On-board control electronics in satellites experience wide temperature swings

from solar radiation during orbits. ro3003g2’s high glass transition
temperature (>280°C ) and low Z-axis CTE provides reliable performance
under challenging space environments.

Automotive RADAR Circuitry

Vehicle safety applications like blind spot detection, collision avoidance, and
self-driving require very precise, low latency radar sensors. The stable
electrical properties vs. frequency and temperature minimizes signal
distortions in these high resolution 77/79GHz radar modules.

###Defense Phased Array Antennas

Precision beam steering and targeting relies on phase coherence between the
radiating elements. ro3003g2 allows these defense electronics to maintain
phase alignment despite harsh conditions during tactical deployments.

In addition to RF designs, the stable Dk of ro3003g2 also benefits multi-gigabit

digital systems used in data communications, computation, medical imaging,
and testing equipment.

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Rogers Corporation partners directly with OEMs and CEMs to create next
generation wireless systems leveraging their unique high frequency materials
expertise.

Summary Table of Key Application Areas

Rogers ro3003g2 PCB Buying Considerations

Here are some important factors that RF and microwave engineers should
consider when specifying Rogers ro3003g2 PCB laminates:

Frequency Range

 ro3003g2 electrical properties are characterized up to 70 GHz so

suitable for most microwave applications below this frequency

 Df, Dk, Tg and other parameters are very stable over a wide band
making it suitable for multi-band or wideband designs

Dielectric Thickness

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 Available dielectric thickness range from 2 mils to 62 mils

 Thinner dielectrics better for fine line applications like mmWave

frequencies

 Thicker dielectrics provide better isolation for mixed signal designs

Copper Foils

 1⁄2, 1 and 2 ounce rolled copper foil available

 RTF (Reverse Treat Foil) improves high frequency losses

 Very low profile copper foil reduces conductor losses at mmWave

frequencies

Lead Times

 Lead times from Rogers Corporation currently range from 4 to 14 weeks

 Work closely with Rogers sales team for accurate lead time forecast

Qualified Manufacturers

 Verify PCB fabricators are qualified by Rogers to properly process their

materials

 Rogers Corporation keeps list of approved circuit board manufacturers

Third Party Testing

 Independent lab qualification of critical RF/microwave PCB

characteristics is highly recommended

 This includes Dk/Df testing, impedance, insertion loss, VSWR, etc.

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Carefully evaluating these criteria will help ensure your Rogers ro3003g2 PCB
design achieves optimal electrical performance from start to finish.

FAQs

What is the dielectric constant of ro3003g2 at 5 GHz?

At the common wireless frequency of 5 GHz, Rogers ro3003g2 has a dielectric

constant of 3.00 which helps provide wider line widths and spacing for this
mid-range RF signal.

Can Rogers ro3003g2 laminates be used in multilayer designs?

Yes, ro3003g2 is fully compatible with multilayer PCB processing to produce

high layer count boards (up to 20+ layers reported). The tighter dielectric
thickness control helps achieve reliable impedance control across same layer
transitions.

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Is Rogers ro3003g2 suitable for analog and mixed signal

boards?

With its stable electrical properties vs frequency, consistent dielectric thickness,

and availability of different copper weights, ro3003g2 can accommodate layout
of sensitive analog circuits along with higher speed digital signals on the same
PCB substrate.

What is the maximum operating temperature for Rogers

ro3003g2?

Rogers ro3003g2 maintains stable electrical performance up to 170°C. The

high glass transition temperature >280°C gives a wide margin before reaching
thermal degradation. This high Tg makes it suitable for many wide
temperature military and aerospace applications.

Where can I find a PCB fabricator qualified to build Rogers

ro3003g2 boards?

Rogers Corporation keeps a searchable database of circuit board

manufacturers across the world that are formally qualified and meet their
stringent process requirements to reliably fabricate boards with Rogers high
frequency materials.

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