AOI PACKAGE REGISTRATION

July 2013
TS TEAM - Training part
CONFIDENTIALITY
The information contained in this file may be confidential and legally
privileged. If you are not the intended recipient, don’t proceed further
and delete this file and destroy any copies. Any dissemination or use
of this information by a person other than the intended recipient is
unauthorized and may be illegal.

CONFIDENTIAL
REVISION INFORMATION

Revision Description Date By

01 Initial release Mar 5, 2013 Hanjin Cho
02 Simpler Explanation Mar 20, 2013 Hanjin Cho
03 Editorial and enhanced info May 30, 2013 David Suh
04 Editorial and enhanced info July 17, 2013 Ian

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Package Registration
PACKAGE TYPES - APPLICABLE PACKAGE LIST

Multi Leaded Tantal

Resistor • SoIC • Tantal Diode
• TSOP / PSOP / SOP • Tantal Capacitor

Capacitor QFP Arrays

SOT DPAK Inductor

BGA Type
Aluminum
• BGA QFN
• PGA Capacitor

Connector Crystal LED

CONFIDENTIAL
PACKAGE REGISTRATION - INFORMATION OF BODY AND LEAD

T T Lead

This is the first step of job programming.

Input correct Body & Lead information. (Length, Width, Thickness)
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PACKAGE REGISTRATION – AOIGUI S/W : PACKAGE EDIT TAB
Set the Proper size for Body and Lead

We can get the thickness result

from Inspection(Manual/Auto)

Body Thickness

Lead Thickness

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PACKAGE REGISTRATION – EASY ADJUSTMENT FUNCTION
• It is easy to adjust package size in the defect view.
• Click the check box to set as a recommended size of Width,
Length, Height based on the inspection result. (*Short key : CTRL+D)

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Thank You !