PCB Strain

Measurement

巨克富科技
Chief-SI Professional System Integrator
Agenda
„ Why need strain gages?
„ IPC/JEDEC-9702/9704 Standard
„ Fundamental of strain gauge
„ Strain measurement requirement
„ Report function
„ Demo
Why need strain gages?
„ Board flexure induced
solder ball cracking,
trace damage, pad
lifting
Trend of PCB
„ Finer pitch of chip
„ Thickness of PCB
„ Lead free (RoHS)
Brittle

BGA
CSP
Who should be concerned
„ Component suppliers
„ Test-fixture vendors
„ PCB assemblers
„ System manufactures
IPC Standard
„ IPC/JEDEC-9702
Monotonic Bend Characterization of
Board-Level Interconnects
June 2004

„ IPC/JEDEC-9704
Printed Wiring Board Strain Gage
Test Guideline
June 2005
IPC-9702
„ Topics
Monotonic Bend Test
„ Equipment
Universal tensile tester
Strain measurement instrument
Continuity monitoring strain & resistance instrument
„ Recording data
strain vs. time
strain-rate vs. time
strain vs. strain-rate
force vs. time
resistance vs. time
 IPC-9702
„ Universal tensile tester
Control board deflection rate

„ Measurement Instrument
500 Hz min.
Simultaneous recording strain
& resistance
2008 Q1 will ready

Copy from IPC

 IPC-9702
Daisy-Chain
„ Test board Daisy-chain
„ Uni-axial strain gage
1.5 mm*1.5 mm
Principal strain angle ~ longitudinal
Load span
„ Test speed
Strain rate:5000 με/s PCB

Package
type

Global PWB Strain Strain gage

IPC-9704 June 2005

„ Topics
Test setup and equipment
requirements
Strain measurement
Report format
„ Surface mount device
BGA (Ball Grid Array)
SOP (Small Outline Package)
CSP (Chip Scale Package)
IPC-9704
„ Process need strain measurement
SMT assembly
„ Component/connector install
Board test processes
„ ICT, Function test
Mechanical assembly
„ System assembly
Shipping Environment

Copy from IPC

IPC-9704
„ Strain Measurement Instrument
Simultaneous sampling
500 Hz min. for impulse event
„ ICT, Drop, …
100 Hz min. for assembly processes
3-wire gage with low level excitation
(typical 2V)
Low Pass filter
More than 3 channels
(12 or more recommend)
IPC-9704
„ Analysis
Principal strain
Peak value
Strain rate
Time history
„ Test Frequency
Before any test or assembly fixture is brought online.
Whenever there are modifications to a test fixture that might
alter the strain profile.
Whenever there are modifications to an assembly process
that might alter the strain profile.
In-process stiffener design validation.
Enclosure design validation prior to hard-tooling
Fundamental of strain gage

Copy from Vishay

What is strain?

＝μin/in Copy from TML

＝με
Principle of strain gage

Copy from TML

Strain gage types
Axis:
Measure direction

Uniaxial Rosette(Tee) Rosette(Rectangular)

Resistance：120Ω、350Ω、1000Ω
Material：Steel、Aluminum、Plastic、Compound…
Temperature：Room temperature、High temperature(500℃)
Application：Residual stress、Crack detection、Shear
Gage (IPC 9704)
„ Rosette
„ Stacked Rosette Strain Gages with pre-
attached wires
Planar Stacked
Gage position (IPC 9704)
Strain gage Attachment
Common question of Strain measurement

1. Strain要如何量？
2. Strain Gage要如何貼？
3. Noise如何克服？
4. 主應變如何計算及其物理意義？
5. 準不準？如何校正？
6. 要買那一家的設備？
How to measure strain?

„ Bridge
Four bridge arms
Excitation voltage
One Gauge system
„ Two-wire circuit
„ Three-wire circuit (Lead wire compensation)
The Wheatstone Bridge
„ Full Bridge
Loadcell
Strain type
Accelerometer
Torque Transducer
„ Half Bridge
Strain with Thermal
compensation
Weighting scale
„ Quarter Bridge
Strain
Optimum Excitation Voltage
„ Features Configuration Resistance Excitation
Large excitation, large Voltage
signal output 120Ω 0 to 6.250 V
Thermal consideration Quarter
2
V Bridge 350 Ω 0 to 10 V
Power = V × I =
R 1000 Ω 0 to 10 V
Optimum excitation
„ Gauge grid area 120 Ω 0 to 3.125 V
„ Gauge resistance
„ Mounting surface Full Bridge 350 Ω 0 to 10 V
+2.5 VDC for
1000 Ω 0 to 10 V
StrainMap
Strain vs. Ω
4167
ΔR
GF ≡ R
1Ω ~ ？ με ε

GF=2, R=120 Ω, △R=1 Ω

ΔR 1
ε= R = 1 / 120 = 0.004167 = 4167 μ 1με ≈ Ω = 0.00024Ω
GF 2 4167

GF=2, R=350 Ω, △R=1 Ω

ΔR 1
ε= R = 1 / 350 = 0.001429 = 1429μ 1με ≈ Ω = 0.0007Ω
GF 2 1429
Calibration(Shunt)

„ Add Large Resistor Shunt

„ Simulate Strain
predetermined
„ Example
Rgauge=120 Ω
Rshunt=100 kΩ
ΔR=0.1438 Ω
599.3 με
Principal strain and Mohr’s circle
εx +εy εx −εy γ xy
ε x′ = + cos 2θ + sin 2θ
2 2 2
εx +εy ⎛ ε x − ε y ⎞ ⎛ γ xy ⎞
2 2
γ
ε1, 2 = ± ⎜⎜ ⎟⎟ + ⎜⎜ ⎟⎟
2 ⎝ 2 ⎠ ⎝ 2 ⎠ 2 ⎛ ε x + ε y γ max ⎞
⎜⎜ , ⎟
⎝ 2 2 ⎟⎠
γ xy ⎛ − γ xy ⎞
⎜⎜ ε y , ⎟
tan 2θ p = ⎝ 2 ⎟⎠

εx −εy
(ε 2 ,0) (ε1 ,0)

ε1, 2 :Principal strain

⎛ εx +εy ⎞
⎜⎜ ,0 ⎟⎟
2θ p
ε
⎝ 2 ⎠

θp :Principal direction
⎛ γ xy ⎞
⎜⎜ ε x , ⎟
2 ⎟⎠
′
⎝

Known: ε x , ε y , ε x ,θ = 45ο
Example for 0-45-90 Rosette
ε 1 = 1434
ε a = 650
ε 2 = −304
y ε b = −300
γ max = 1739
ε c = 480
θ p = −42.2
εc
εb ε1 = 889
45ο ε a = 800 ε 2 = −539
45ο ε b = 520 γ max = 1428
εa x
ε c = −450 θ p = 14.4ο

ε1 = 551
unit : με ε a = 520 ε 2 = −111
ε b = 360 γ max = 662
ε c = −80 θ p = 12.5
Strain Measurement Solution
„ StrainMap
Simultaneous sampling
±3με noise level
2k/ch(5k/ch for PCI bus)
24~128 ch

„ StrainMap Enhanced
Simultaneous sampling
±5με noise level
50k/ch
USB
24~56 ch
Vibration Module (Option)
Our Customer
„ ASUS „ Intel
„ Compal „ Foxconn

„ Inventec „ CHIMEI

„ Lenovo „ PTI

„ TSMC
StrainMap advantage
„ Total solution
Integrate Gage、measure &
Training
„ Performance
accuracy：±3με
Simultaneous sampling： 2k
(5k for PCI bus）
Channel：up to 128 Chs
stability
„ Analysis & report function
Auto-calibration (Shunt)
Mohr’s circle analysis
Excel report
„ Easy wiring
„ Short lead time & lower price
„ Local service
Easy wiring
Software for IPC-9704
„ Graphical User Interface
„ Easy Wizar
„ Calculation
Diagonal strain = e1-e2+e3
Principal Strain
StrainRate
Report of StrainMap
StrainMap Enhanced
Demo
Thank you

Chief SI
何寬賢
03-5936268
0922855439