A 3.2fJ C.-S. 0.35V 10b 100KS S SAR ADC in 90nm CMOS

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A 3.2fJ/c.-s. 0.

35V 10b 100KS/s SAR ADC in 90nm CMOS


Hung-Yen Tai, Hung-Wei Chen and Hsin-Shu Chen
Graduate Institute of Electronics Engineering and Department of Electrical Engineering
National Taiwan University, Taipei, Taiwan
Email: hschen@cc.ee.ntu.edu.tw

Abstract manages the AWCA output for the next comparison. After the
A low-voltage energy-efficient SAR ADC is presented in AWCA settles, RES becomes high again. This procedure
this paper with four techniques. Arbitrary weight capacitor repeats until the conversion is completed. The non-binary
array tolerates errors to reduce conversion time. To operate technique [2] allows errors in MSB comparisons. Therefore,
under low voltage, DAC common mode level shift and the DAC settling and the signal-dependent dynamic offset of
leakage reduction sample switch with a charge pump are comparator have less effect on performance. The AWCA
proposed. Differential control logic is used to save its digital capacitance weight is {224, 128, 72, 40, 23, 12, 6, 4, 2, 1}.
power. The prototype ADC consumes 170nW at 100KS/s Arbitrary weight for each bit and radix less than 2 are utilized
from a 0.35V supply. It achieves an SNDR of 56.3dB at in the AWCA. Our work does not need a thermometer code
Nyquist rate and its FOM is 3.2fJ/c.-s. DAC and a complex logic controller for the next comparison.
Keywords: Low voltage, low power, SAR ADC The set-and-down technique [3] conserves switching
energy and decreases the conversion time. However, its DAC
Introduction output common mode voltage (Vocm) starts at the middle of
Wireless sensor networks are frequently used to monitor the supply voltage and it cannot operate at a low supply
environmental conditions. Because power sources are often voltage. To ensure that the comparator with NMOS input pair
limited in the field, energy efficiency is essential. The sensor resolves bits, the DCMLS technique is used to level-shift the
typically requires a 10b 100KS/s ADC to convert a natural AWCA Vocm to a higher voltage during conversion. The
signal. Among various architectures, SAR has better energy AWCA waveform with the DCMLS technique is illustrated in
efficiency [1] and it can only dissipate dynamic power. Since Fig. 2. During sampling, the bottom plates of capacitors are
supply voltage and capacitance loading affect the dynamic connected to the input, and the top plates are connected to
power, decreasing the supply voltage and simplifying Vrefn. At Phase1, all top plates of capacitors switch from
controller logic can enhance energy efficiency. However, a Vrefn to Vrefp, except for the MSB capacitor. Cp+ and Cp-
low supply voltage decreases the gate-source voltage (Vgs) are both level-shifted by (288/512)Vref where Vref is equal to
and it causes design challenges. The S/H switch is hardly Vrefp-Vrefn. Hence, Vocm is level-shifted by the same
turned on during sampling, for example. In addition, it results amount higher than the input signal common mode voltage
in a long conversion time because the comparator is activated (Vicm). At Phase2, the AWCA associated with the lower
by a low input voltage. Hence, a leakage from the DAC voltage between Cp+ and Cp- switches its MSB capacitor
capacitor array deteriorates the accuracy and it cannot be from Vrefn to Vrefp. Vocm is then level-shifted to
neglected. This work adopts an arbitrary weight capacitor (400/512)Vref higher than Vicm. At Phase3, the AWCA
array (AWCA), which allows comparator errors in MSB. The associated with the higher voltage switches from Vrefp to
DAC common mode level shift (DCMLS) technique is Vrefn. Vocm is level-shifted to (336/512)Vref higher than
proposed to increase Vgs of the comparator input pair; thus, Vicm. For the remaining phases, the AWCA associated with
the comparator can operate at low voltage. Above two the higher voltage switches from Vrefp to Vrefn. Thus, as the
techniques can reduce the conversion time and alleviate the conversion proceeds, Vocm reaches the voltage
leakage effect. The leakage reduction sample switch (LRSS) approximately Vref/2 higher than Vicm.
combined with the charge-pump improves the sample switch Fig. 3 shows the LRSS with the charge-pump circuit. It
performance under low voltage. It decreases drain-source increases the ratio of switch turn-off and turn-on resistance. In
voltages to further minimize the leakage. For more digital addition, it decreases the leakage and input disturbance. The
power saving purpose, the differential control logic is applied. cross-coupled charge-pump generates SA and SAb with a
This paper presents a 10b 100KS/s SAR ADC that achieves a 180° phase difference for the sample switch. During sampling,
FOM of 3.2fJ/c.-s. at a 0.35V supply. SA reaches the double of the supply voltage and is used to
turn on NMOS, M1-M2. However, the NMOS turn-on
Architecture and Circuit Implementation resistance is augmented when the input level is close to Vrefp
The block diagram of the proposed ADC is shown in Fig. 1. because the body effect increases the NMOS threshold, and
It consists of a charge-pump circuit, an LRSS, an AWCA, a the leakage current reduces the SA voltage. Hence, PMOS is
dynamic comparator, a SAR controller, and a clock generator. added to ensure low turn-on resistance for rail-to-rail input
When CLK is high, the input signal is sampled into the range. During conversion, SA is connected to ground. SAb
AWCA by the LRSS circuit. The conversion starts when CLK reaches the double of the supply voltage, and NET1 connects
becomes low. Then, RES changes to high and enables the to Vrefp. The LRSS with NET1 connecting to Vrefp can
dynamic comparator. By asynchronous technique, the prevent the input signals from coupling through device
comparator sends a flag, DONE, to the clock generator once a drain-source capacitors. As the conversion continues, the
bit is resolved. The clock generator then resets RES to low. AWCA outputs approach Vrefp. NET1 connecting to Vrefp
The SAR controller latches the comparator result and also reduces M2-M3 drain-source voltages; therefore, the

978-1-4673-0849-6/12/$31.00 ©2012 IEEE 2012 Symposium on VLSI Circuits Digest of Technical Papers 92
Authorized licensed use limited to: National Chung Cheng University. Downloaded on May 02,2022 at 00:13:30 UTC from IEEE Xplore. Restrictions apply.
leakage is decreased. Moreover, since the M2 gate is at
ground and the M3 gate is at the highest voltage, M2 and M3
are in strong turn-off state to enlarge resistance.
The differential control logic for the AWCA in the SAR
controller is illustrated in Fig. 4. At the start of sampling, its
outputs are reset to Vrefn by setting LA to low. Once the
comparator outputs are ready to be sampled, the
corresponding LA becomes high. Then, either M1 or M2 is
turned on, and positive regeneration changes one of the latch
outputs to high. M3 and M4 are used to latch the output state, Fig. 2 AWCA waveform with DCMLS
even if the comparator outputs change afterward. Our
approach reduces the control logic device count by around
60% compared with the set-and-down work [3].

Experimental Results
The chip micrograph of the ADC fabricated in 90nm
CMOS process is shown in Fig. 5. The core circuit occupies
Fig. 3 Charge-pump and LRSS
an area of 0.03mm2 (128μm×252μm). The ADC, including
output synchronous registers, consists of 402 NMOS and 375
PMOS. Fig. 6 shows the DNL and INL with a 100KS/s 50%
duty clock at 0.35V, which are +0.2/-0.3 LSB and +0.6/-0.6
LSB, respectively. The FFT plot is illustrated in Fig. 7. At the
Nyquist rate input, the SFDR, THD, SNR, and SNDR are
71.0dB, 64.5dB, 57.0dB, and 56.3dB, respectively. The
measured total power dissipation is 170nW. It is broken down
as follows: the AWCA uses 40% of the power; the comparator
uses 23%; the charge-pump, the LRSS, the clock generator, Fig. 4 AWCA differential control logic
and the SAR controller use 37%. The FOM is 3.2fJ/c.-s. and
its standard deviation is 0.19fJ/c.-s. with all available 8 test
chips. The ADC achieves the lowest reported FOM result,
which is 27% less than [1].

Acknowledgment
The authors thank Taiwan Chip Implementation Center for
chip fabrication and National Science Council for supporting Fig. 5 Chip micrograph
of this work.

References
[1] M. V. Elzakker, et al., “A 1.9μW 4.4fJ/conversion-step 10b
1MS/s charge-redistribution ADC,” IEEE ISSCC Dig. Tech.
Papers, pp. 244-245, Feb. 2008.
[2] F. Kuttner, “A 1.2V 10b 20MSamples/s non-binary successive
approximation ADC in 0.13μm CMOS,” IEEE ISSCC Dig. Tech.
Papers, pp. 176-177, Feb. 2002.
[3] C. C. Liu, et al, “A 10-bit 50-MS/s SAR ADC with a monotonic
capacitor switching procedure,” IEEE Journal of Solid-State
Circuits, vol. 45, no.4, pp. 731-740, April 2010.

Fig. 6 Measured DNL and INL

Fig. 1 Proposed ADC architecture Fig. 7 FFT plot

978-1-4673-0849-6/12/$31.00 ©2012 IEEE 2012 Symposium on VLSI Circuits Digest of Technical Papers 93
Authorized licensed use limited to: National Chung Cheng University. Downloaded on May 02,2022 at 00:13:30 UTC from IEEE Xplore. Restrictions apply.

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