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    Angeles 03 eLMS Activity 1 - ARG

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    1. This document provides information to identify integrated circuit names and packages based on their part numbers. It then asks questions about datasheets to test understanding of technical specifications. 2. The part numbers given correspond to integrated circuits from manufacturers like Motorola, Texas Instruments, Fairchild, Toshiba, and National Semiconductor. The questions ask for details like maximum current, manufacturer, temperature ratings, device name and number, release date, dimensions, test conditions, and electrical characteristics. 3. The responses provide the requested specifications, such as maximum forward current of 200mA, manufacturer of Philips Semiconductors, maximum diameter of 1.85, number of performance curves as five, and forward recovery voltage of 2

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    Angeles 03 eLMS Activity 1 - ARG

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    semajsemaj07
    53 views2 pages
    1. This document provides information to identify integrated circuit names and packages based on their part numbers. It then asks questions about datasheets to test understanding of technical specifications. 2. The part numbers given correspond to integrated circuits from manufacturers like Motorola, Texas Instruments, Fairchild, Toshiba, and National Semiconductor. The questions ask for details like maximum current, manufacturer, temperature ratings, device name and number, release date, dimensions, test conditions, and electrical characteristics. 3. The responses provide the requested specifications, such as maximum forward current of 200mA, manufacturer of Philips Semiconductors, maximum diameter of 1.85, number of performance curves as five, and forward recovery voltage of 2

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    1. This document provides information to identify integrated circuit names and packages based on their part numbers. It then asks questions about datasheets to test understanding of technical specifications. 2. The part numbers given correspond to integrated circuits from manufacturers like Motorola, Texas Instruments, Fairchild, Toshiba, and National Semiconductor. The questions ask for details like maximum current, manufacturer, temperature ratings, device name and number, release date, dimensions, test conditions, and electrical characteristics. 3. The responses provide the requested specifications, such as maximum forward current of 200mA, manufacturer of Philips Semiconductors, maximum diameter of 1.85, number of performance curves as five, and forward recovery voltage of 2

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    © All Rights Reserved
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    53 views2 pages

    Angeles 03 eLMS Activity 1 - ARG

    Uploaded by

    semajsemaj07
    1. This document provides information to identify integrated circuit names and packages based on their part numbers. It then asks questions about datasheets to test understanding of technical specifications. 2. The part numbers given correspond to integrated circuits from manufacturers like Motorola, Texas Instruments, Fairchild, Toshiba, and National Semiconductor. The questions ask for details like maximum current, manufacturer, temperature ratings, device name and number, release date, dimensions, test conditions, and electrical characteristics. 3. The responses provide the requested specifications, such as maximum forward current of 200mA, manufacturer of Philips Semiconductors, maximum diameter of 1.85, number of performance curves as five, and forward recovery voltage of 2

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    of 2

    Angeles, James Kennedy L.

    BsCpE-501
    I. IC Nomenclature. Given the part numbers, identify the device names and package
    designators. (5 items x 5 points)

    1. MC74HCT365ADTR2G

    MOTOROLA Commercial High speed CMOS Logic Dual Gate


    2. SN54LS00FK

    Texas Instruments, TI (standard) Military Low Power Schottky Logic


    Leadless Ceramic Chip Carrier
    3. UA74LVT244N

    Fairchild Commercial Low Voltage BiCMOS Technology Noninverting Buffer


    Driver Plastic Dual-in-line Package (PDIP)
    4. TC74HC08AFN

    TOSHIBA Commercial High-Speed CMOS Logic Octal IEEE 1149.1 (JTAG)


    Plastic Leaded Chip Carrier (PLCC)
    5. LM321N

    National Widebus+ (32- and 36-bit) Plastic Dual-in-line Package (PDIP)


    II. Datasheets. Answer the following questions. (15 items x 1 point)
    1. What is the maximum continuous forward current that the device can handle?

    The device can handle 200 mA of maximum continuous forward current.


    2. Who is the manufacturer of the product?

    Philips Semiconductors
    3. When the ambient temperature is around 200oC, what is the maximum allowable
    continuous forward current?

    200 Ma is the maximum allowable continuous forward current


    4. What is the device name and device number featured in the datasheet?

    High-speed diodes 1N4148, 1N4448


    5. When is the release date of the product’s datasheet?
    25TH of January year 2002
    6. What is the maximum diameter of the featured diode?

    1.85 maximum diameter


    7. At what temperature was the device tested to obtain its electrical characteristics?

    25oC
    8. What is the forward voltage of the device 1N4148?

    1V
    9. What are the typical applications of these diodes?

    High-speed switching
    10. What is the maximum continuous reverse voltage that the device can handle?

    75V
    11. What is the minimum length of the diode leads?

    25.4
    12. How many performance curves are displayed in the datasheet?

    There five (5) performance curves in the datasheet.


    13. When the forward voltage is 1V and the temperature junction is 25OC at
    maximum values, what is the forward current of the diode?

    50mA
    14. What is the maximum forward recovery voltage of the device?

    2.5V
    15. What is the approximate diode capacitance at VR = 2.5V?

    4pF

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