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Sikadur - 42 MP Slow
Sikadur - 42 MP Slow
Sikadur®-42 MP Slow
3-PART, MULTI PURPOSE EPOXY GROUTING SYSTEM
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PRODUCT INFORMATION
Composition Epoxy resin
Packaging Standard unit: 28 kg, 24 kg and 70 kg
Component: A Component: B Component: C Component:
A+B+C
3.34 kg 0.66 kg 24 kg 28 kg
3.34 kg 0.66 kg 20 kg 24 kg
8.35 kg 1.65 kg 2 x 30 kg 70 kg
Bulk packaging: 140 kg and 120 kg unit
Component: A Component: B Component: C Component:
A+B+C
16.7 kg 3.3 kg 5 x 24 kg = 120 140 kg
kg
16.7 kg 3.3 kg 5 x 20 kg = 100 120 kg
kg
Storage conditions Stored properly in original, unopened, sealed and undamaged packaging in
dry conditions at temperatures between +5 °C and +30 °C. Protect from dir-
ect sunlight, heat and moisture.
Density ~2 130 kg/m3 (A+B+C)
TECHNICAL INFORMATION
Compressive Strength Curing time Curing temperature (ASTM C579)
+23 °C +30 °C +40 °C
1 day ~74 N/mm2 ~80 N/mm2 ~89 N/mm2
3 days ~80 N/mm2 ~87 N/mm2 ~94 N/mm2
7 days ~95 N/mm2 ~96 N/mm2 ~99 N/mm2
28 days ~100N/mm2 ~103N/mm2 ~105N/mm2
Product cured and tested at temperatures indicated.
Test specimen size: 50 * 50 * 50 mm
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Elongation at Break ~1.6 % (ASTM D638)
0.1 ± 0.05 % (7 d at +23 °C) (ISO 75)
Tensile Adhesion Strength > 36 N/mm2 (concrete failure) (slant shear) (ASTM C882)
~11 N/mm2 (on steel) (ISO 4624, EN 1542,
> 3.5 N/mm2 (concrete failure) EN 12188)
Creep 0.9 % at 4.14 N/mm2 (600 psi) / 31 500 N (+60 °C) (ASTM C1181)
0.11 % at 2.76 N/mm2 (400 psi) / 21 000 N (+60 °C)
API requirements: ≤ 0.5 % with 2.76 N/mm2 load
Thermal Compatibility No delamination / pass (ASTM C884)
Coefficient of Thermal Expansion 2.1 x 10–5 [1/°C] or [1/K], (-30 °C to +30 °C) (ASTM C531)
3.8 x 10–5 [1/°C] or [1/K], (+24 °C to +100 °C)
2.6 x 10–5 [1/°C] or [1/K], (-20 °C to +60 °C) (EN 1770)
APPLICATION INFORMATION
Mixing Ratio 28 kg unit, 70 kg unit and 140 kg unit
Component A : B : C = 5 : 1 : 36 by weight
Liquid (A+B) / solid (C) = 1 : 6 by weight
24 kg unit and 120 kg unit
Component A : B : C = 5 : 1 : 30 by weight
Liquid (A+B) / solid (C) = 1 : 5 by weight
Layer Thickness Minimum grout depth: 10 mm
Maximum grout depth: 150 mm
Temperature Layer thickness max.
20 °C – 30 °C 150 mm
30 °C – 40 °C 100 mm*
* no reduction of fillers; apply only with Mixing Ratio A : B : C = 5 : 1 : (30 - 36)
Product Temperature Sikadur®-42 MP Slow must be applied at temperatures between +20 °C and
+35 °C
Condition the material by also storing at this temperature for 48 hours be-
fore use.
Ambient Air Temperature +20 °C min. / +40 °C max.
Dew Point Substrate temperature during application must be at least 3 °C above dew
point to avoid condensation.
Substrate Temperature +20 °C min. / +40 °C max.
Substrate Moisture Content ≤ 4 % pbw
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Pot Life (200 g, adiabatic testing)
+23 °C +40 °C
5 : 1 : 30 100 – 110 min 45 – 50 min
The potlife begins when the resin and hardener are mixed. It is shorter at
high temperatures and longer at low temperatures. The greater the quant-
ity mixed, the shorter the potlife. To obtain longer workability at high tem-
peratures, the mixed adhesive may be divided into portions. Another meth-
od is to chill components A+B and C before mixing them (i.e. only when ap-
plication temperatures are above +20 °C).
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CLEANING OF EQUIPMENT LOCAL RESTRICTIONS
Sweep excess grout into appropriate containers for Note that as a result of specific local regulations the
disposal before it has hardened. declared data and recommended uses for this product
Dispose of in accordance with applicable local regula- may vary from country to country. Consult the local
tions. Uncured material can be removed with Sika Product Data Sheet for the exact product data and
Colma Cleaner. Cured material can only be removed uses.
mechanically.
Sikadur-42MPSlow-en-AE-(07-2019)-2-4.pdf
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