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ILNAS-EN ISO 11553-1:2020

Safety of machinery - Laser processing

machines - Part 1: Laser safety
requirements (ISO 11553-1:2020)

Sicherheit von Maschinen -

Laserbearbeitungsmaschinen - Teil 1:
Anforderungen an die Sicherheit von
Lasern (ISO 11553-1:2020)

Sécurité des machines - Machines à laser

- Partie 1 : Exigences générales de
sécurité laser (ISO 11553-1:2020)

04/2020
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ILNAS-EN ISO 11553-1:2020

National Foreword

This European Standard EN ISO 11553-1:2020 was adopted as Luxembourgish

Standard ILNAS-EN ISO 11553-1:2020.

Every interested party, which is member of an organization based in Luxembourg, can

participate for FREE in the development of Luxembourgish (ILNAS), European (CEN,
CENELEC) and International (ISO, IEC) standards:

- Participate in the design of standards

- Foresee future developments
- Participate in technical committee meetings

https://portail-qualite.public.lu/fr/normes-normalisation/participer-normalisation.html

THIS PUBLICATION IS COPYRIGHT PROTECTED

Nothing from this publication may be reproduced or utilized in
any form or by any mean - electronic, mechanical, photocopying
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ILNAS-EN ISO 11553-1:2020
 EN ISO 11553-1
 
2
"    ’”‹ŽʹͲʹͲ

ͳ͵ǤͳͳͲǢ͵ͳǤʹ͸Ͳ —’‡”•‡†‡• ͳͳͷͷ͵ǦͳǣʹͲͲͺ

‰Ž‹•Š‡”•‹‘

 ƒˆ‡–›‘ˆƒ Š‹‡”›Ǧƒ•‡”’”‘ ‡••‹‰ƒ Š‹‡•Ǧƒ”–ͳǣ

ƒ•‡”•ƒˆ‡–›”‡“—‹”‡‡–•ȋ ͳͳͷͷ͵ǦͳǣʹͲʹͲȌ
± —”‹–±†‡•ƒ Š‹‡•Ǧƒ Š‹‡•Žƒ•‡”Ǧƒ”–‹‡ͳǣ  ‹ Š‡”Š‡‹–˜‘ƒ• Š‹‡Ǧ
š‹‰‡ ‡•†‡•± —”‹–±Žƒ•‡”ȋ ͳͳͷͷ͵ǦͳǣʹͲʹͲȌ ƒ•‡”„‡ƒ”„‡‹–—‰•ƒ• Š‹‡Ǧ‡‹Žͳǣˆ‘”†‡”—‰‡
ƒ†‹‡‹ Š‡”Š‡‹–˜‘ƒ•‡”ȋ ͳͳͷͷ͵ǦͳǣʹͲʹͲȌ

Š‹•—”‘’‡ƒ–ƒ†ƒ”†™ƒ•ƒ’’”‘˜‡†„›‘ͳ͵ ƒ—ƒ”›ʹͲʹͲǤ

‡„‡”•ƒ”‡„‘—†–‘ ‘’Ž›™‹–Š–Š‡Ȁ –‡”ƒŽ‡‰—Žƒ–‹‘•™Š‹ Š•–‹’—Žƒ–‡–Š‡ ‘†‹–‹‘•ˆ‘”‰‹˜‹‰–Š‹•
—”‘’‡ƒ–ƒ†ƒ”†–Š‡•–ƒ–—•‘ˆƒƒ–‹‘ƒŽ•–ƒ†ƒ”†™‹–Š‘—–ƒ›ƒŽ–‡”ƒ–‹‘Ǥ’Ǧ–‘Ǧ†ƒ–‡Ž‹•–•ƒ†„‹„Ž‹‘‰”ƒ’Š‹ ƒŽ”‡ˆ‡”‡ ‡•
‘ ‡”‹‰•— Šƒ–‹‘ƒŽ•–ƒ†ƒ”†•ƒ›„‡‘„–ƒ‹‡†‘ƒ’’Ž‹ ƒ–‹‘–‘–Š‡Ǧƒƒ‰‡‡–‡–”‡‘”–‘ƒ›
‡„‡”Ǥ

Š‹•—”‘’‡ƒ–ƒ†ƒ”†‡š‹•–•‹–Š”‡‡‘ˆˆ‹ ‹ƒŽ˜‡”•‹‘•ȋ‰Ž‹•Šǡ ”‡ Šǡ ‡”ƒȌǤ˜‡”•‹‘‹ƒ›‘–Š‡”Žƒ‰—ƒ‰‡ƒ†‡„›
–”ƒ•Žƒ–‹‘—†‡”–Š‡”‡•’‘•‹„‹Ž‹–›‘ˆƒ‡„‡”‹–‘‹–•‘™Žƒ‰—ƒ‰‡ƒ†‘–‹ˆ‹‡†–‘–Š‡Ǧƒƒ‰‡‡–
‡–”‡Šƒ•–Š‡•ƒ‡•–ƒ–—•ƒ•–Š‡‘ˆˆ‹ ‹ƒŽ˜‡”•‹‘•Ǥ

‡„‡”•ƒ”‡–Š‡ƒ–‹‘ƒŽ•–ƒ†ƒ”†•„‘†‹‡•‘ˆ—•–”‹ƒǡ‡Ž‰‹—ǡ—Ž‰ƒ”‹ƒǡ”‘ƒ–‹ƒǡ›’”—•ǡœ‡ Š‡’—„Ž‹ ǡ‡ƒ”ǡ•–‘‹ƒǡ
‹Žƒ†ǡ ”ƒ ‡ǡ ‡”ƒ›ǡ ”‡‡ ‡ǡ —‰ƒ”›ǡ ‡Žƒ†ǡ ”‡Žƒ†ǡ –ƒŽ›ǡƒ–˜‹ƒǡ‹–Š—ƒ‹ƒǡ—š‡„‘—”‰ǡƒŽ–ƒǡ‡–Š‡”Žƒ†•ǡ‘”™ƒ›ǡ
‘Žƒ†ǡ‘”–—‰ƒŽǡ‡’—„Ž‹ ‘ˆ‘”–Šƒ ‡†‘‹ƒǡ‘ƒ‹ƒǡ‡”„‹ƒǡŽ‘˜ƒ‹ƒǡŽ‘˜‡‹ƒǡ’ƒ‹ǡ™‡†‡ǡ™‹–œ‡”Žƒ†ǡ—”‡›ƒ†
‹–‡†‹‰†‘Ǥ





    

    2       2                 
 
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CEN-CENELECManagement Centre: Rue de la Science 23, B-1040 Brussels

̹ʹͲʹͲ ŽŽ”‹‰Š–•‘ˆ‡š’Ž‘‹–ƒ–‹‘‹ƒ›ˆ‘”ƒ†„›ƒ›‡ƒ•”‡•‡”˜‡† ‡ˆǤ‘Ǥ ͳͳͷͷ͵ǦͳǣʹͲʹͲ

™‘”Ž†™‹†‡ˆ‘”ƒ–‹‘ƒŽ‡„‡”•Ǥ
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EN ISO 11553-1:2020 (E) ILNAS-EN ISO 11553-1:2020

Contents Page

European foreword....................................................................................................................................................... 3

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ILNAS-EN ISO 11553-1:2020 EN ISO 11553-1:2020 (E)

European foreword

This document (EN ISO 11553-1:2020) has been prepared by Technical Committee ISO/TC 172 "Optics
and photonics" in collaboration with Technical Committee CEN/TC 123 “Lasers and photonics” the
secretariat of which is held by DIN.

This European Standard shall be given the status of a national standard, either by publication of an
identical text or by endorsement, at the latest by October 2020, and conflicting national standards shall
be withdrawn at the latest by October 2020.

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN shall not be held responsible for identifying any or all such patent rights.

This document supersedes EN ISO 11553-1:2008.

This document has been prepared under a mandate given to CEN by the European Commission and the
European Free Trade Association, and supports essential requirements of EU Directive(s).

For the relationship with EU Directive(s) see informative Annex ZA, which is an integral part of this
document.

According to the CEN-CENELEC Internal Regulations, the national standards organizations of the
following countries are bound to implement this European Standard: Austria, Belgium, Bulgaria,
Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland,
Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Republic of
North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the
United Kingdom.

Endorsement notice

The text of ISO 11553-1:2020 has been approved by CEN as EN ISO 11553-1:2020 without any
modification.

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EN ISO 11553-1:2020 (E) ILNAS-EN ISO 11553-1:2020

Annex ZA
(informative)

Relationship between this European Standard and the essential

requirements of Directive 2006/42/EC aimed to be covered

This European Standard has been prepared under a Commission’s standardization request M/396
(Machinery) "Mandate to CEN and CENELEC for standardisation in the field of machinery" to provide
one voluntary means of conforming to essential requirement 1.5.12 of Directive 2006/42/EC of the
European Parliament and of the Council of 17 May 2006 on machinery, and amending Directive
95/16/EC (recast).
Once this standard is cited in the Official Journal of the European Union under that Directive,
compliance with the normative clauses of this standard given in Table ZA.1 confers, within the limits of
the scope of this standard, a presumption of conformity with the corresponding essential requirements
of that Directive, and associated EFTA regulations.
Table ZA.1 — Correspondence between this European Standard and Directive 2006/42/EC

Essential Requirements Clause(s)/sub-clause(s) Remarks/Notes

of Directive 2006/42/EC of this EN
1.5.12 Clause 5, 6, 7 and 8.
1.7.4.2, m, Related to the aspect of
radiation and emission.
WARNING 1 — Presumption of conformity stays valid only as long as a reference to this
European Standard is maintained in the list published in the Official Journal of the European
Union. Users of this standard should consult frequently the latest list published in the Official
Journal of the European Union.
WARNING 2 — Other Union legislation may be applicable to the product(s) falling within the
scope of this standard.

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INTERNATIONAL
ILNAS-EN ISO 11553-1:2020
ISO
STANDARD 11553-1

Second edition
2020-04

Safety of machinery — Laser

processing machines —
Part 1:
Laser safety requirements
Sécurité des machines — Machines à laser —
Partie 1: Exigences de sécurité laser

Reference number
ISO 11553-1:2020(E)
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ISO 11553-1:2020(E) ILNAS-EN ISO 11553-1:2020

COPYRIGHT PROTECTED DOCUMENT

© ISO 2020
ŽŽ”‹‰Š–•”‡•‡”˜‡†ǤŽ‡••‘–Š‡”™‹•‡•’‡ ‹ϐ‹‡†ǡ‘””‡“—‹”‡†‹–Š‡ ‘–‡š–‘ˆ‹–•‹’Ž‡‡–ƒ–‹‘ǡ‘’ƒ”–‘ˆ–Š‹•’—„Ž‹ ƒ–‹‘ƒ›
„‡”‡’”‘†— ‡†‘”—–‹Ž‹œ‡†‘–Š‡”™‹•‡‹ƒ›ˆ‘”‘”„›ƒ›‡ƒ•ǡ‡Ž‡ –”‘‹ ‘”‡ Šƒ‹ ƒŽǡ‹ Ž—†‹‰’Š‘–‘ ‘’›‹‰ǡ‘”’‘•–‹‰
‘–Š‡‹–‡”‡–‘”ƒ‹–”ƒ‡–ǡ™‹–Š‘—–’”‹‘”™”‹––‡’‡”‹••‹‘Ǥ‡”‹••‹‘ ƒ„‡”‡“—‡•–‡†ˆ”‘‡‹–Š‡” ƒ––Š‡ƒ††”‡••
„‡Ž‘™‘” ǯ•‡„‡”„‘†›‹–Š‡ ‘—–”›‘ˆ–Š‡”‡“—‡•–‡”Ǥ
 ‘’›”‹‰Š–‘ˆϐ‹ ‡
CP 401 • Ch. de Blandonnet 8
 ǦͳʹͳͶ‡”‹‡”ǡ ‡‡˜ƒ
Phone: +41 22 749 01 11
ƒšǣΪͶͳʹʹ͹ͶͻͲͻͶ͹
ƒ‹Žǣ ‘’›”‹‰Š–̷‹•‘Ǥ‘”‰
Website: www.iso.org
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ILNAS-EN ISO 11553-1:2020 ISO 11553-1:2020(E)

Contents Page

Foreword ........................................................................................................................................................................................................................................ iv
Introduction..................................................................................................................................................................................................................................v
1 Scope ................................................................................................................................................................................................................................. 1
2 Normative references ...................................................................................................................................................................................... 1
͵ ‡”•ƒ††‡ϐ‹‹–‹‘• ..................................................................................................................................................................................... 2
4 Hazards generated by laser radiation ............................................................................................................................................ 5
ͶǤͳ ‡‡”ƒŽ ........................................................................................................................................................................................................... 5
4.2 Laser radiation hazards/sources of laser radiation emission ....................................................................... 6
ͶǤ͵ ƒ•‡””ƒ†‹ƒ–‹‘Šƒœƒ”†•‹†— ‡†„›‡š–‡”ƒŽ‡ˆˆ‡ –•ȋ‹–‡”ˆ‡”‡ ‡•Ȍ ...................................................... 7
4.4 Characteristics of laser radiation ............................................................................................................................................ 7
5 Safety requirements and measures .................................................................................................................................................. 8
ͷǤͳ ‡‡”ƒŽ”‡“—‹”‡‡–• ....................................................................................................................................................................... 8
5.2 Risk assessment with regard to laser radiation hazards .................................................................................... 8
5.3 Implementation of risk reduction measures................................................................................................................. 9
ͷǤ͵Ǥͳ ‡‡”ƒŽ...................................................................................................................................................................................... 9
ͷǤ͵Ǥʹ ƒˆ‡–›‡ƒ•—”‡•ƒ‰ƒ‹•–Žƒ•‡””ƒ†‹ƒ–‹‘Šƒœƒ”†•‹†‡’‡†‡ ‡‘ˆ–Š‡Ž‘ ƒ–‹‘• .. 9
ͷǤ͵Ǥ͵ ƒˆ‡–›‡ƒ•—”‡•ƒ‰ƒ‹•–Žƒ•‡””ƒ†‹ƒ–‹‘Šƒœƒ”†•.............................................................................. 10
5.3.4 Engineering control measures .......................................................................................................................... 13
͸ ‡”‹ϐ‹ ƒ–‹‘‘ˆ–Š‡•ƒˆ‡–›”‡“—‹”‡‡–•ƒ†”‹•”‡†— –‹‘‡ƒ•—”‡• .....................................................14
7 Information for use......................................................................................................................................................................................... 15
8 Labelling..................................................................................................................................................................................................................... 16
Annex A (informative) Potential hazards .....................................................................................................................................................18
Bibliography ............................................................................................................................................................................................................................. 21

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ISO 11553-1:2020(E) ILNAS-EN ISO 11553-1:2020

Foreword
ISO (the International Organization for Standardization) is a worldwide federation of national standards
„‘†‹‡• ȋ  ‡„‡” „‘†‹‡•ȌǤ Š‡ ™‘” ‘ˆ ’”‡’ƒ”‹‰ –‡”ƒ–‹‘ƒŽ –ƒ†ƒ”†• ‹• ‘”ƒŽŽ› ƒ””‹‡† ‘—–
–Š”‘—‰Š  –‡ Š‹ ƒŽ ‘‹––‡‡•Ǥ ƒ Š ‡„‡” „‘†› ‹–‡”‡•–‡† ‹ ƒ •—„Œ‡ – ˆ‘” ™Š‹ Š ƒ –‡ Š‹ ƒŽ
committee has been established has the right to be represented on that committee. International
‘”‰ƒ‹œƒ–‹‘•ǡ ‰‘˜‡”‡–ƒŽ ƒ† ‘Ǧ‰‘˜‡”‡–ƒŽǡ ‹ Ž‹ƒ‹•‘ ™‹–Š ǡ ƒŽ•‘ –ƒ‡ ’ƒ”– ‹ –Š‡ ™‘”Ǥ
 ‘ŽŽƒ„‘”ƒ–‡• Ž‘•‡Ž› ™‹–Š –Š‡ –‡”ƒ–‹‘ƒŽ Ž‡ –”‘–‡ Š‹ ƒŽ ‘‹••‹‘ ȋ Ȍ ‘ ƒŽŽ ƒ––‡”• ‘ˆ
electrotechnical standardization.
The procedures used to develop this document and those intended for its further maintenance are
†‡• ”‹„‡†‹–Š‡ Ȁ ‹”‡ –‹˜‡•ǡƒ”–ͳǤ ’ƒ”–‹ —Žƒ”ǡ–Š‡†‹ˆˆ‡”‡–ƒ’’”‘˜ƒŽ ”‹–‡”‹ƒ‡‡†‡†ˆ‘”–Š‡
†‹ˆˆ‡”‡––›’‡•‘ˆ †‘ —‡–••Š‘—Ž†„‡‘–‡†ǤŠ‹•†‘ —‡–™ƒ•†”ƒˆ–‡†‹ƒ ‘”†ƒ ‡™‹–Š–Š‡
‡†‹–‘”‹ƒŽ”—Ž‡•‘ˆ–Š‡ Ȁ ‹”‡ –‹˜‡•ǡƒ”–ʹȋ•‡‡www.iso.org/directives).
––‡–‹‘‹•†”ƒ™–‘–Š‡’‘••‹„‹Ž‹–›–Šƒ–•‘‡‘ˆ–Š‡‡Ž‡‡–•‘ˆ–Š‹•†‘ —‡–ƒ›„‡–Š‡•—„Œ‡ –‘ˆ
’ƒ–‡–”‹‰Š–•Ǥ •ŠƒŽŽ‘–„‡Š‡Ž†”‡•’‘•‹„Ž‡ˆ‘”‹†‡–‹ˆ›‹‰ƒ›‘”ƒŽŽ•— Š’ƒ–‡–”‹‰Š–•Ǥ‡–ƒ‹Ž•‘ˆ
ƒ›’ƒ–‡–”‹‰Š–•‹†‡–‹ϐ‹‡††—”‹‰–Š‡†‡˜‡Ž‘’‡–‘ˆ–Š‡†‘ —‡–™‹ŽŽ„‡‹–Š‡ –”‘†— –‹‘ƒ†Ȁ‘”
on the ISO list of patent declarations received (see www.iso.org/patents).
›–”ƒ†‡ƒ‡—•‡†‹–Š‹•†‘ —‡–‹•‹ˆ‘”ƒ–‹‘‰‹˜‡ˆ‘”–Š‡ ‘˜‡‹‡ ‡‘ˆ—•‡”•ƒ††‘‡•‘–
constitute an endorsement.
‘” ƒ ‡š’Žƒƒ–‹‘ ‘ˆ –Š‡ ˜‘Ž—–ƒ”› ƒ–—”‡ ‘ˆ •–ƒ†ƒ”†•ǡ –Š‡ ‡ƒ‹‰ ‘ˆ  •’‡ ‹ϐ‹  –‡”• ƒ†
‡š’”‡••‹‘• ”‡Žƒ–‡† –‘ ‘ˆ‘”‹–› ƒ••‡••‡–ǡ ƒ• ™‡ŽŽ ƒ• ‹ˆ‘”ƒ–‹‘ ƒ„‘—– ̵• ƒ†Š‡”‡ ‡ –‘ –Š‡
World Trade Organization (WTO) principles in the Technical Barriers to Trade (TBT) see www.iso.org/
iso/foreword.html.
Š‹•†‘ —‡–™ƒ•’”‡’ƒ”‡†„›‡ Š‹ ƒŽ‘‹––‡‡ Ȁͳ͹ʹǡOptics and photonicsǡ—„ ‘‹––‡‡
ͻǡLaser and electro-optical systemsǡ‹ ‘ŽŽƒ„‘”ƒ–‹‘™‹–Š Ȁ͹͸ǡOptical radiation safety and laser
equipment.
Š‹••‡ ‘†‡†‹–‹‘ ƒ ‡Ž•ƒ†”‡’Žƒ ‡•–Š‡ϐ‹”•–‡†‹–‹‘ȋ ͳͳͷͷ͵ǦͳǣʹͲͲͷȌǡ™Š‹ ŠŠƒ•„‡‡–‡ Š‹ ƒŽŽ›
revised with the following main changes:
Ȅ –Š‡–‡”•̶„‡ƒ†‡Ž‹˜‡”›•›•–‡•̶ǡ̶„‡ƒ’ƒ–Š ‘’‘‡–•̶ǡ̶„‡ƒ•Šƒ’‹‰ ‘’‘‡–•̶ǡ̶„‡ƒ
•™‹– Š‹‰ ‘’‘‡–•̶ƒ†̶ϐ‹„”‡‘’–‹  ƒ„Ž‡̶ƒ†̶ϐ‹„”‡ ‘‡ –‘”̶™‡”‡ƒ††‡†Ǣ
Ȅ –Š‡†‘ —‡–™ƒ•”‡•–”— –—”‡†Ǣ
Ȅ –Š‡‹–Ž‡™ƒ•ƒ†ƒ’–‡†Ǣ
— other hazards than laser radiation hazards are not considered in this document but are described
in ‡šǢ
Ȅ ‘’‡”ƒ–‹‰‘†‡•ȋƒ—–‘ƒ–‹ ‘†‡ǡ•‡––‹‰‘†‡ǡƒ—ƒŽ‹–‡”˜‡–‹‘‘†‡ǡ•‡”˜‹ ‡‘†‡Ȍƒ†–Š‡
‘’‡”ƒ–‹‰‘†‡•‡Ž‡ –‘”•™‹– Š™‡”‡ƒ††‡†Ǣ
— Clause 5 ‹• •‡’ƒ”ƒ–‡† ‹ ”‡“—‹”‡‡–• ”‡‰ƒ”†‹‰ †‹ˆˆ‡”‡– Ž‘ ƒ–‹‘• ƒ† –Š‡ †‹ˆˆ‡”‡– ‘†‡• ‘ˆ
‘’‡”ƒ–‹‘Ǣ
— in Clause 6–Š‡˜‡”‹ϐ‹ ƒ–‹‘’”‘ ‡†—”‡•™‡”‡†‡• ”‹„‡†‹‘”‡†‡–ƒ‹ŽǢ
Ȅ ‡š™ƒ•†‡Ž‡–‡†Ǥ
A list of all the parts of ISO 11553 can be found on the ISO website.
›ˆ‡‡†„ƒ ‘”“—‡•–‹‘•‘–Š‹•†‘ —‡–•Š‘—Ž†„‡†‹”‡ –‡†–‘–Š‡—•‡”ǯ•ƒ–‹‘ƒŽ•–ƒ†ƒ”†•„‘†›Ǥ
complete listing of these bodies can be found at www.iso.org/members.html.

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ILNAS-EN ISO 11553-1:2020 ISO 11553-1:2020(E)

Introduction
Š‡ƒ Š‹‡”›ƒˆ‡–›‹”‡ –‹˜‡‹••—‡†„›–Š‡—”‘’‡ƒƒ”Ž‹ƒ‡–ƒ†–Š‡‘— ‹Ž‘ˆ–Š‡‘—–Ž‹‡•
‡••‡–‹ƒŽƒ†ƒ†ƒ–‘”›”‡“—‹”‡‡–•–Šƒ–—•–„‡‡–‹‘”†‡”–‘‡•—”‡–Šƒ–ƒ Š‹‡”›‹••ƒˆ‡Ǥ 
”‡•’‘•‡ǡ Ȁ ‹‹–‹ƒ–‡† ƒ ’”‘‰”ƒ‡ –‘ ’”‘†— ‡ •ƒˆ‡–› •–ƒ†ƒ”†• ˆ‘” ƒ Š‹‡• ƒ† –Š‡‹”
applications. This document is one in that series.
–Šƒ•„‡‡’”‡’ƒ”‡†ƒ•ƒŠƒ”‘‹œ‡†•–ƒ†ƒ”†–‘’”‘˜‹†‡ƒ‡ƒ•‘ˆ ‘ˆ‘”‹‰–‘–Š‡‡••‡–‹ƒŽ•ƒˆ‡–›
”‡“—‹”‡‡–•‘ˆ–Š‡ƒ Š‹‡”›‹”‡ –‹˜‡ƒ†ƒ••‘ ‹ƒ–‡† ‡‰—Žƒ–‹‘•Ǥ
Š‹•†‘ —‡–‹•ƒ–›’‡•–ƒ†ƒ”†ƒ••–ƒ–‡†‹ ͳʹͳͲͲǤŠ‡’”‘˜‹•‹‘•‘ˆ–Š‹•†‘ —‡–ƒ›„‡
•—’’Ž‡‡–‡†‘”‘†‹ϐ‹‡†„›ƒ–›’‡•–ƒ†ƒ”†Ǥ
‘”ƒ Š‹‡•™Š‹ Šƒ”‡ ‘˜‡”‡†„›–Š‡• ‘’‡‘ˆƒ–›’‡•–ƒ†ƒ”†ƒ†™Š‹ ŠŠƒ˜‡„‡‡†‡•‹‰‡†ƒ†
„—‹Ž–ƒ ‘”†‹‰–‘–Š‡’”‘˜‹•‹‘‘ˆ–Šƒ–•–ƒ†ƒ”†ǡ–Š‡’”‘˜‹•‹‘•‘ˆ–Šƒ––›’‡•–ƒ†ƒ”†–ƒ‡’”‡ ‡†‡ ‡
‘˜‡”–Š‡’”‘˜‹•‹‘•‘ˆ–Š‹•–›’‡•–ƒ†ƒ”†Ǥ
Š‡’—”’‘•‡‘ˆ–Š‹•†‘ —‡–‹•–‘’”‡˜‡–‹Œ—”‹‡•–‘’‡”•‘•„›
Ȅ Ž‹•–‹‰’‘–‡–‹ƒŽŽƒ•‡””ƒ†‹ƒ–‹‘Šƒœƒ”†•‰‡‡”ƒ–‡†„›ƒ Š‹‡• ‘–ƒ‹‹‰Žƒ•‡”•ǡ
Ȅ •’‡ ‹ˆ›‹‰ •ƒˆ‡–› ‡ƒ•—”‡• ƒ† ˜‡”‹ϐ‹ ƒ–‹‘• ‡ ‡••ƒ”› ˆ‘” ”‡†— ‹‰ –Š‡ ”‹• ƒ—•‡† „› •’‡ ‹ϐ‹ 
Šƒœƒ”†‘—• ‘†‹–‹‘•ǡ
Ȅ ’”‘˜‹†‹‰”‡ˆ‡”‡ ‡•–‘’‡”–‹‡–•–ƒ†ƒ”†•ǡƒ†
Ȅ •’‡ ‹ˆ›‹‰–Š‡‹ˆ‘”ƒ–‹‘™Š‹ Š‹•–‘„‡•—’’Ž‹‡†–‘–Š‡—•‡”••‘–Šƒ––Š‡› ƒ‡•–ƒ„Ž‹•Š’”‘’‡”
procedures and precautions.

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ILNAS-EN ISO 11553-1:2020

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ILNAS-EN ISO 11553-1:2020

INTERNATIONAL STANDARD ISO 11553-1:2020(E)

Safety of machinery — Laser processing machines —

Part 1:
Laser safety requirements

1 Scope
Š‹•†‘ —‡–†‡• ”‹„‡•Žƒ•‡””ƒ†‹ƒ–‹‘Šƒœƒ”†•ƒ”‹•‹‰‹Žƒ•‡”’”‘ ‡••‹‰ƒ Š‹‡•ǡƒ•†‡ϐ‹‡†‹3.7.
–ƒŽ•‘•’‡ ‹ϐ‹‡•–Š‡•ƒˆ‡–›”‡“—‹”‡‡–•”‡Žƒ–‹‰–‘Žƒ•‡””ƒ†‹ƒ–‹‘Šƒœƒ”†•ǡƒ•™‡ŽŽƒ•–Š‡‹ˆ‘”ƒ–‹‘
–‘„‡•—’’Ž‹‡†„›–Š‡ƒ—ˆƒ –—”‡”•‘ˆ•— Š‡“—‹’‡–ȋ‹ƒ††‹–‹‘–‘–Šƒ–’”‡• ”‹„‡†„› ͸ͲͺʹͷȌǤ
‡“—‹”‡‡–• †‡ƒŽ‹‰ ™‹–Š ‘‹•‡ ƒ• ƒ Šƒœƒ”† ˆ”‘ Žƒ•‡” ’”‘ ‡••‹‰ ƒ Š‹‡• ƒ”‡ ‹ Ž—†‡† ‹
ISO 11553-3:2013.
This document is applicable to machines using laser radiation to process materials.
–‹•‘–ƒ’’Ž‹ ƒ„Ž‡–‘Žƒ•‡”’”‘†— –•ǡ‘”‡“—‹’‡– ‘–ƒ‹‹‰•— Š’”‘†— –•ǡ™Š‹ Šƒ”‡ƒ—ˆƒ –—”‡†
•‘Ž‡Ž›ƒ†‡š’”‡••Ž›ˆ‘”–Š‡ˆ‘ŽŽ‘™‹‰ƒ’’Ž‹ ƒ–‹‘•ǣ
Ȅ ’Š‘–‘Ž‹–Š‘‰”ƒ’Š›Ǣ
Ȅ •–‡”‡‘Ž‹–Š‘‰”ƒ’Š›Ǣ
Ȅ Š‘Ž‘‰”ƒ’Š›Ǣ
Ȅ ‡†‹ ƒŽƒ’’Ž‹ ƒ–‹‘•ȋ’‡” ͸Ͳ͸ͲͳǦʹǦʹʹȌǢ
— data storage.

2 Normative references
Š‡ ˆ‘ŽŽ‘™‹‰ †‘ —‡–• ƒ”‡ ”‡ˆ‡””‡† –‘ ‹ –Š‡ –‡š– ‹ •— Š ƒ ™ƒ› –Šƒ– •‘‡ ‘” ƒŽŽ ‘ˆ –Š‡‹” ‘–‡–
‘•–‹–—–‡• ”‡“—‹”‡‡–• ‘ˆ –Š‹• †‘ —‡–Ǥ ‘” †ƒ–‡† ”‡ˆ‡”‡ ‡•ǡ ‘Ž› –Š‡ ‡†‹–‹‘ ‹–‡† ƒ’’Ž‹‡•Ǥ ‘”
—†ƒ–‡†”‡ˆ‡”‡ ‡•ǡ–Š‡Žƒ–‡•–‡†‹–‹‘‘ˆ–Š‡”‡ˆ‡”‡ ‡††‘ —‡–ȋ‹ Ž—†‹‰ƒ›ƒ‡†‡–•Ȍƒ’’Ž‹‡•Ǥ
͵ͺ͸ͶȋƒŽŽ’ƒ”–•ȌǡGraphical symbols — Safety colours and safety signs
ͳͳͳͶͷǣʹͲͳͺǡOptics and photonics — Lasers and laser-related equipment — Vocabulary and symbols
ͳʹͳͲͲǣʹͲͳͲǡSafety of machinery — General principles for design — Risk assessment and risk reduction
 ͳ͵ͺͶͻǦͳǣʹͲͳͷǡ Safety of machinery — Safety-related parts of control systems — Part 1: General
principles for design
ͳ͵ͺͶͻǦʹǣʹͲͳʹǡSafety of machinery — Safety-related parts of control systems — Part 2: Validation
ͳ͵ͺͷͲǣʹͲͳʹǡSafety of machinery — Emergency stop function — Principles for design
͸ͲʹͲͶǦͳǣʹͲͳ͸ǡSafety of machinery — Electrical equipment of machines — Part 1: General requirements
͸ͲͺʹͷǦͳǣʹͲͳͶǡƒˆ‡–›‘ˆŽƒ•‡”’”‘†— –•Ȅƒ”–ͷǣ“—‹’‡– Žƒ••‹ϔ‹ ƒ–‹‘ƒ†”‡“—‹”‡‡–•
͸ͲͺʹͷǦͶǣʹͲͲ͸ǡSafety of laser products — Part 4: Laser guards
 ͸ʹͲ͸ͳǣʹͲͲͷǡ Safety of machinery — Functional safety of safety-related electrical, electronic and
programmable electronic control systems
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ISO 11553-1:2020(E) ILNAS-EN ISO 11553-1:2020

͵ ‡”•ƒ††‡ϐ‹‹–‹‘•
‘”–Š‡’—”’‘•‡•‘ˆ–Š‹•†‘ —‡–ǡ–Š‡–‡”•ƒ††‡ϐ‹‹–‹‘•‰‹˜‡‹ ͳͳͳͶͷǣʹͲͳͺǡ ͳʹͳͲͲǣʹͲͳͲǡ
͸ͲͺʹͷǦͳǣʹͲͳͶƒ† ͸ͲͺʹͷǦͶǣʹͲͲ͸ƒ†–Š‡ˆ‘ŽŽ‘™‹‰ƒ’’Ž›Ǥ
ISO and IEC maintain terminological databases for use in standardization at the following addresses:
— ISO Online browsing platform: available at http://www.iso.org/obp.
— IEC Electropedia: available at http://www.electropedia.org/
3.1
beam delivery system
•›•–‡ ‘’”‹•‡†‘ˆƒŽŽ ‘’‘‡–•ǡ‹ Ž—†‹‰ƒŽŽ‘’–‹ ƒŽ„‡ƒ ‘’‘‡–•ƒ†’‘–‡–‹ƒŽ„‡ƒ’ƒ–Š•
ƒ† ‡ Ž‘•—”‡•ǡ ™Š‹ Š ™Š‡ ‘„‹‡†ǡ –”ƒ•ˆ‡” Žƒ•‡” ”ƒ†‹ƒ–‹‘ ‡‹––‡† ˆ”‘ –Š‡ Žƒ•‡” ȋƒ ‘”†‹‰ –‘
†‡ϐ‹‹–‹‘‹ ͸ͲͺʹͷǦͳǣʹͲͳͶȌ–‘–Š‡™‘”’‹‡ ‡ǤŠ‡„‡ƒ†‡Ž‹˜‡”›•›•–‡ ƒ‹ Ž—†‡ƒŽŽ‡Ž‡‡–•
ˆ‘”‰—‹†‹‰ǡ•Šƒ’‹‰ƒ†•™‹– Š‹‰–Š‡Žƒ•‡”„‡ƒ•ƒ•™‡ŽŽƒ•–Š‡‡ Ž‘•—”‡‘ˆƒ†•—’’‘”–ˆ‘”–Š‡„‡ƒ
path components
[SOURCE: IEC 60825-4:2006ȀʹǣʹͲͳͳǡ ǤʹǤͳǡ‘†‹ϐ‹‡†Ȅ”‡’Žƒ ‡†̶™‘”’‹‡ ‡ǤŠ‡•‡ ‘’‘‡–•ƒ›
‹ Ž—†‡̶„›̶™‘”’‹‡ ‡ƒ†™Š‡”‡–Š‡ ‘’‘‡–• ƒ‹ Ž—†‡̶ƒ† Šƒ‰‡†Žƒ•‡”„‡ƒ–‘Žƒ•‡”„‡ƒ•ǤȐ
3.2
beam path component
‘’–‹ ƒŽ ‘’‘‡–™Š‹ ŠŽ‹‡•‘ƒ†‡ϐ‹‡†„‡ƒ’ƒ–Š
‘–‡ͳ–‘‡–”›ǣ‡‡ ͸ͲͺʹͷǦͳǣʹͲͳͶǡ͵Ǥͳ͸Ǥ

 „‡ƒ•–‡‡”‹‰‹””‘”ǡƒˆ‘ —•Ž‡•ǡƒϐ‹„”‡‘’–‹  ƒ„Ž‡‘”ƒϐ‹„”‡‘’–‹  ƒ„Ž‡ ‘‡ –‘”Ǥ

3.3
beam shaping component
‘’–‹ ƒŽ ‘’‘‡– ‹–‡‰”ƒ–‡†‹ –Š‡„‡ƒ ’ƒ–Š–‘–”ƒ•ˆ‘”–Š‡ ’”‘ϐ‹Ž‡‘” ”‘••Ǧ•‡ –‹‘ ‘ˆ–Š‡Žƒ•‡”
„‡ƒ„›‡ƒ•‘ˆƒ’‡”–—”‡•ǡ”‡ϐŽ‡ –‹˜‡ǡ”‡ˆ”ƒ –‹˜‡‘”†‹ˆˆ”ƒ –‹˜‡‘’–‹ ƒŽ ‘’‘‡–•
EXAMPLE Lens or integrating optical element for hardening applications.

3.4
beam switching component
‘’–‹ ƒŽ ‘’‘‡–‘”ƒƒ••‡„Ž›‘ˆ ‘’‘‡–•‹–”‘†— ‡†‹–Š‡„‡ƒ’ƒ–Š–‘†‹”‡ –‘”†‹˜‡”–ǡ—†‡”
‡š–‡”ƒŽ ‘–”‘Žǡ–Š‡„‡ƒ’ƒ–ŠƒŽ‘‰ȋƒȌ’”‡†‡–‡”‹‡††‹”‡ –‹‘ȋ•Ȍ
‘–‡ͳ–‘‡–”›ǣŠ‡‡š–‡”ƒŽ ‘–”‘ŽƒŽŽ‘™•–Š‡„‡ƒ’ƒ–Š–‘„‡•™‹– Š‡†ˆ”‘‘‡’”‡†‡–‡”‹‡††‹”‡ –‹‘–‘
another.

3.5
ϐ‹„”‡‘’–‹  ƒ„Ž‡
optical beam guiding component that enables the transfer of laser radiation along a transparent medium
‘–‡ͳ–‘‡–”›ǣŠ‡ϐ‹„”‡‘’–‹  ƒ„Ž‡ ƒ„‡‡“—‹’’‡†™‹–Š•‡•‘”•–‘‘‹–‘”„”‡ƒƒ‰‡ƒ†Ȁ‘”–‡’‡”ƒ–—”‡Ǥ

‘–‡ ʹ –‘ ‡–”›ǣ  ϐ‹„”‡ ‘’–‹  ƒ„Ž‡ ƒ Šƒ˜‡ ƒ ‰Žƒ•• ‘” ƒ‘–Š‡” ‘”‡ –Šƒ– ƒ””‹‡• –Š‡ Žƒ•‡” ”ƒ†‹ƒ–‹‘ ƒ†
‹• •—””‘—†‡† „› Žƒ††‹‰Ǥ Š‡ ‘—–•‹†‡ ‘ˆ –Š‡ ϐ‹„”‡ ‹• ’”‘–‡ –‡† „› Žƒ††‹‰ ƒ† ƒ „‡ ˆ—”–Š‡” ’”‘–‡ –‡† „›
ƒ††‹–‹‘ƒŽŽƒ›‡”•‘ˆ‘–Š‡”ƒ–‡”‹ƒŽ••— Šƒ•’‘Ž›‡”‘”ƒ‡–ƒŽ–‘’”‘–‡ ––Š‡ϐ‹„”‡ˆ”‘‡ Šƒ‹ ƒŽ†‡ˆ‘”ƒ–‹‘ǡ
‹‰”‡•• ‘ˆ ™ƒ–‡”ǡ ‡– Ǥ  –Š‹• †‘ —‡–ǡ –Š‹• –‡” ƒŽ•‘ ‹ Ž—†‡• ‘–Š‡” ˆ‘”• ‘ˆ –”ƒ•‹••‹‘ †‡˜‹ ‡• •— Š ƒ•
waveguides.

3.6
ϐ‹„”‡ ‘‡ –‘”
ϐ‹„”‡ ‘’‘‡–ǡ–Šƒ– ‘‡ –•–Š‡ϐ‹„”‡‘’–‹  ƒ„Ž‡™‹–Š‘–Š‡” ‘’‘‡–•‹–Š‡„‡ƒ’ƒ–Š
‘–‡ ͳ –‘ ‡–”›ǣ Š‡ ϐ‹„”‡ ‘‡ –‘” ƒ „‡ ‡“—‹’’‡† ™‹–Š •‡•‘”• –‘ ‘‹–‘” ‹–• ’‘•‹–‹‘ ȋ ‘‡ –‡†Ȁ
disconnected). Licensed to TÜV Media GmbH/TÜV Rheinland Group
ILNAS eShop 2020 08737 / Max. Networking : 3 / downloaded : 2020-10-21
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2 © ISO 2020 – All rights reserved
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ILNAS-EN ISO 11553-1:2020 ISO 11553-1:2020(E)

‘–‡ʹ–‘‡–”›ǣ›’‹ ƒŽŽ›ǡϐ‹„”‡ ‘‡ –‘”• ‘‡ ––Š‡ϐ‹„”‡™‹–Š–Š‡Žƒ•‡”ƒ†–Š‡Žƒ•‡”’”‘ ‡••‹‰Š‡ƒ†Ǥ

3.7
laser processing machine
ƒ Š‹‡ ‹ ™Š‹ Š ȋƒȌ ‡„‡††‡† Žƒ•‡”ȋ•Ȍ ’”‘˜‹†‡ȋ•Ȍ •—ˆϐ‹ ‹‡– ‡‡”‰› ‘” ’‘™‡” –‘ ‡Ž–ǡ ‡˜ƒ’‘”ƒ–‡ǡ ‘”
ƒ—•‡ƒ’Šƒ•‡–”ƒ•‹–‹‘‹ƒ–Ž‡ƒ•–ƒ’ƒ”–‘ˆ–Š‡™‘”’‹‡ ‡ǡƒ†™Š‹ Š‹•”‡ƒ†›–‘—•‡‹ˆ— –‹‘ƒ†•ƒˆ‡–›
3.8
hazard area
danger zone
•’ƒ ‡™‹–Š‹ƒ†Ȁ‘”ƒ”‘—†ƒ Š‹‡”›‹™Š‹ Šƒ’‡”•‘ ƒ„‡‡š’‘•‡†–‘ƒŠƒœƒ”†
‘–‡ͳ–‘‡–”›ǣƒ•‡”Šƒœƒ”†ƒ”‡ƒǡ™‹–Š‹™Š‹ Š–Š‡„‡ƒ‹””ƒ†‹ƒ ‡‘””ƒ†‹ƒ–‡š’‘•‡‡š ‡‡†•–Š‡‹ Ž—†‹‰
–Š‡’‘••‹„‹Ž‹–›‘ˆƒ ‹†‡–ƒŽ‹•†‹”‡ –‹‘‘ˆ–Š‡Žƒ•‡”„‡ƒȋ•‡‡†‡ϐ‹‹–‹‘ƒ ‘”†‹‰–‘ ͸ͲͺʹͷǦͳǣʹͲͳͶȌǤ

3.9
process zone
<laser processing machines> area where the laser beam interacts with the material of the workpiece
3.10
location with controlled access
Ž‘ ƒ–‹‘ ™Š‡”‡ –Š‡ Šƒœƒ”† ‹• ‹ƒ ‡••‹„Ž‡ ‡š ‡’– –‘ ƒ—–Š‘”‹œ‡† ’‡”•‘• ™Š‘ Šƒ˜‡ ”‡ ‡‹˜‡† ƒ†‡“—ƒ–‡
–”ƒ‹‹‰‹Žƒ•‡”•ƒˆ‡–›ƒ†•‡”˜‹ ‹‰‘ˆ–Š‡•›•–‡‹˜‘Ž˜‡†
‘–‡ͳ–‘‡–”›ǣŠ‡ƒ ‡••–‘–Š‡Ž‘ ƒ–‹‘‹• ‘–”‘ŽŽ‡†„›ƒ—–Š‘”‹œƒ–‹‘•›•–‡•ǡ‡Ǥ‰Ǥ‡›•ǡ’ƒ••™‘”†Ǥ

‘–‡ʹ–‘‡–”›ǣ‡‡Table 1.

 ‡”˜‹ ‡ ‡‰‹‡‡”• –Šƒ– ‡‡† –‘ ™‘” ‹ ƒ ‰—ƒ”†‡† Žƒ•‡” Šƒœƒ”† ƒ”‡ƒǡ ‘” ‹ ‡š ‡•• ‘ˆ –Š‡ 
”‡•’‡ –‹˜‡Ž›Ǥ ”‘–‡ –‹˜‡ ‡ƒ•—”‡• ‹ Ž—†‡ǡ „‡•‹†‡• –‡ Š‹ ƒŽ ƒ† ƒ†‹‹•–”ƒ–‹˜‡ ‡ƒ•ǡ ƒ†‡“—ƒ–‡ ’‡”•‘ƒŽ
’”‘–‡ –‹˜‡‡“—‹’‡–ȋŽƒ•‡”’”‘–‡ –‹˜‡‡›‡™‡ƒ”ǡ’”‘–‡ –‹˜‡ Ž‘–Š‹‰ȌǤ

3.11
location with restricted access
Ž‘ ƒ–‹‘™Š‡”‡–Š‡Šƒœƒ”†‹•‹ƒ ‡••‹„Ž‡–‘–Š‡’—„Ž‹ „—–ƒ›„‡ƒ ‡••‹„Ž‡–‘‘–Š‡”‘„•‡”˜‡”•‘”‘–Š‡”
’‡”•‘‡Ž—–”ƒ‹‡†‹Žƒ•‡”•ƒˆ‡–›
‘–‡ͳ–‘‡–”›ǣŠ‡Ž‘ ƒ–‹‘™‹–Š”‡•–”‹ –‡†ƒ ‡••ǡˆ‘”™Š‹ Š’‡”•‘‡Žƒ”‡‡’–ˆ”‘„‡‹‰‡š’‘•‡†–‘–Š‡Žƒ•‡”
”ƒ†‹ƒ–‹‘Šƒœƒ”†•„›‰—ƒ”†•Ȁ™ƒŽŽ•ǡ„ƒ””‹‡”•‘”‘–Š‡”‡–Š‘†•Ǥ

‘–‡ʹ–‘‡–”›ǣ‡‡Table 1.

 ‡”ˆ‘”‹‰•‡”˜‹ ‡ƒ–ƒŽƒ•‡”’”‘ ‡••‹‰ƒ Š‹‡Ž‘ ƒ–‡†‹ƒ•Š‘’ϐŽ‘‘”ǡ™Š‹ Š‹•–Š‡”‡•–”‹ –‡†

ƒ”‡ƒǤŠ‡Žƒ•‡”Šƒœƒ”†ƒ”‡ƒ‹•• ”‡‡‡†„›‡ƒ•‘ˆ˜‡”–‹ ƒŽ‘„‹Ž‡Žƒ•‡”‰—ƒ”†•Ȁ™ƒŽŽ•ǡ™Š‹ Šƒ”‡Žƒ„‡ŽŽ‡†™‹–Š
•ƒˆ‡–›•‹‰•”‡•’‡ –‹˜‡Ž›Ǥ‡ϐŽ‡ –‡†Žƒ•‡””ƒ†‹ƒ–‹‘ ƒ’”‘’ƒ‰ƒ–‡–‘—’’‡”ϐŽ‘‘”•‘”• ƒˆˆ‘Ž†’Žƒ–ˆ‘”•Ǥ‡”•‘‡Ž
Šƒ˜‹‰ ƒ ‡•• –‘ –Š‡ •Š‘’ ϐŽ‘‘” ‹• –”ƒ‹‡† ‹ ‘”‰ƒ‹œƒ–‹‘ƒŽ ‡ƒ•—”‡•ǡ •‘ –Šƒ– –Š‡› ˆ‘ŽŽ‘™ –Š‡ ‘”‰ƒ‹œƒ–‹‘ƒŽ
•ƒˆ‡–›‡ƒ•—”‡•ȋ’”‘Š‹„‹–‹‘•Ȁ™ƒ”‹‰•ȌǤ

3.12
location with unrestricted and uncontrolled access
location where access is not limited or controlled
‘–‡ͳ–‘‡–”›ǣŽŽ’‡‘’Ž‡ǡ‹ Ž—†‹‰–Š‡’—„Ž‹  ƒŠƒ˜‡ƒ ‡••–‘–Š‡Ž‘ ƒ–‹‘Ǥ

‘–‡ʹ–‘‡–”›ǣ‡‡Table 1.

‘–‡͵–‘‡–”›ǣ ˆ–Š‡ƒ Š‹‡‹•—•‡†—†‡”’—„Ž‹ ƒ ‡••ǡ•‡”˜‹ ‹‰ ƒ–ƒ‡’Žƒ ‡„›‰‡‡”ƒ–‹‰Ž‘ ƒ–‹‘•™‹–Š

restricted access or locations with controlled access.

 ›’‹ ƒŽŽ›ǡ–Š‡•‡ƒ Š‹‡•ƒ”‡‡šŠ‹„‹–‡†‘”†‡‘•–”ƒ–‡†‘ˆƒ‹”•ƒ†‡šŠ‹„‹–‹‘•Ǥ‹ ‡–Š‡’—„Ž‹ 

ƒŠƒ˜‡ƒ ‡••–‘–Š‡Ž‘ ƒ–‹‘ǡ‘Šƒœƒ”†•ƒ›‡ƒƒ–‡ˆ”‘–Š‡Žƒ•‡”’”‘ ‡••‹‰ƒ Š‹‡Ǥ

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Table 1 — Description of locations

Location Controlled Restricted Unrestricted and uncontrolled
Authorized and trained Personnel untrained in laser
People ŽŽǡ‹ Ž—†‹‰–Š‡’—„Ž‹
‹Žƒ•‡”•ƒˆ‡–› •ƒˆ‡–›„—–‘––Š‡’—„Ž‹

3.13
automatic mode
production
δŽƒ•‡”’”‘ ‡••‹‰ƒ Š‹‡•ε‘’‡”ƒ–‹‰‘†‡ǡ†—”‹‰™Š‹ Š–Š‡ƒ Š‹‡‹•—•‡†ƒ•‹–‡†‡†ȋ‘”ƒŽ
—•‡Ȍǡ‹ Ž—†‹‰
Ȅ Ž‘ƒ†‹‰ƒ†—Ž‘ƒ†‹‰‘ˆ’ƒ”–•ƒ†Ȁ‘”ƒ–‡”‹ƒŽ•–‘„‡’”‘ ‡••‡†ǡ
Ȅ ’”‘ ‡••‹‰†—”‹‰™Š‹ Š–Š‡Žƒ•‡”„‡ƒ™‘”•ƒŽ‘‡‘”‹ ‘Œ— –‹‘™‹–Š‘–Š‡”–‘‘Ž•
‘–‡ͳ–‘‡–”›ǣ—”‹‰ƒ—–‘ƒ–‹ ‘†‡ȋ‘”ƒŽ—•‡Ȍ•ƒˆ‡‰—ƒ”†‹‰‡“—‹’‡–‹• Ž‘•‡†Ǥ

‘–‡ʹ–‘‡–”›ǣŠ‡Ž‘ƒ†‹‰Ȁ—Ž‘ƒ†‹‰ ƒ–ƒ‡’Žƒ ‡ˆ—ŽŽ›‘”’ƒ”–Ž›ƒ—–‘ƒ–‡†‘”ƒ—ƒŽǤ

3.14
setting mode
δŽƒ•‡”’”‘ ‡••‹‰ƒ Š‹‡•ε‘’‡”ƒ–‹‰‘†‡ǡ†—”‹‰™Š‹ ŠŽƒ•‡”ƒ†Œ—•–‡–•‘”•‡––‹‰•ƒ”‡ ƒ””‹‡†
‘—–„›–Š‡‘’‡”ƒ–‘”
‘–‡ͳ–‘‡–”›ǣŠ‹•‹•”‡“—‹”‡†ˆ‘” Šƒ‰‡•‡Ǥ‰Ǥ‘ˆ–Š‡™‘”’‹‡ ‡ǡ–Š‡’”‘ ‡••‹‰‘˜‡‡–’ƒ–Š•‘”–Š‡’”‘ ‡••
’ƒ”ƒ‡–‡”•Ǥ —”‹‰ •‡––‹‰ ‘†‡ •ƒˆ‡‰—ƒ”†‹‰ ‡“—‹’‡– ‹• ‘’‡ǡ „—– •ƒˆ‡–› ‡ƒ•—”‡•ǡ •— Š ƒ• •‹‰‹ϐ‹ ƒ–Ž›
”‡†— ‡†•’‡‡†ǡ‘”•–‡’Ǧ‘†‡ǡ”‡†— ‡†Žƒ•‡”‘—–’—–’‘™‡”ǡƒŽŽ‘™–Š‡‘’‡”ƒ–‘”–‘‹–‡”˜‡‡‹–Š‡’”‘ ‡••Ǥ

3.15
manual intervention mode
δŽƒ•‡”’”‘ ‡••‹‰ƒ Š‹‡•ε‘’‡”ƒ–‹‰‘†‡ǡ†—”‹‰™Š‹ Š•‹‰Ž‡™‘”’‹‡ ‡• ƒ„‡Žƒ•‡”’”‘ ‡••‡†
ƒ†–Š‡’”‘ ‡•• ƒ„‡‘„•‡”˜‡†„›–Š‡‘’‡”ƒ–‘”
3.16
service mode
δŽƒ•‡” ’”‘ ‡••‹‰ ƒ Š‹‡•ε ‘’‡”ƒ–‹‰ ‘†‡ǡ ‹ ™Š‹ Š –Š‡ ƒ Š‹‡ ‹• ‘’‡”ƒ–‡†ǡ –‘ ƒ””› ‘—–
corrective actions
 ƒ—Ž–†‹ƒ‰‘•‹•ǡ‡“—‹’‡–•–”‹’Ǧ†‘™ƒ†”‡’ƒ‹”‹‰ǡ Ž‡ƒ‹‰‘ˆ‘’–‹ ƒŽ‡Ž‡‡–•‘”ƒ†Œ—•–‡–•
or alignment.

3.17
operating mode selector switch
δŽƒ•‡” ’”‘ ‡••‹‰ ƒ Š‹‡•ε •™‹– Š ‘” ƒ‘–Š‡” •‡Ž‡ –‹‘ †‡˜‹ ‡ǡ ™Š‹ Š ƒŽŽ‘™• –Š‡ —•‡ ‘ˆ –Š‡ Žƒ•‡”
’”‘ ‡••‹‰ ƒ Š‹‡ ‹ •‡˜‡”ƒŽ ‘–”‘Ž ‘” ‘’‡”ƒ–‹‰ ‘†‡•ǡ ”‡“—‹”‹‰ †‹ˆˆ‡”‡– ’”‘–‡ –‹˜‡ ‡ƒ•—”‡•
and/or work procedures and which can be locked in each position
‘–‡ͳ–‘‡–”›ǣŠ‡•‡Ž‡ –‹‘†‡˜‹ ‡‹ Ž—†‡•„—–‹•‘–Ž‹‹–‡†–‘•‘ˆ–™ƒ”‡Ǥ

3.18
‘†‹ϐ‹ ƒ–‹‘
Šƒ‰‡–‘–Š‡ƒ Š‹‡ǡ™Š‹ Šƒ‡•‹– ƒ’ƒ„Ž‡‘ˆ’”‘ ‡••‹‰ƒ–‡”‹ƒŽ•‹ƒƒ‡”™Š‹ Š†‹ˆˆ‡”•ˆ”‘
–Š‡ ‘”‹‰‹ƒŽ †‡•‹‰ǡ ‘” ™Š‹ Š ƒ‡• ‹– ƒ’ƒ„Ž‡ ‘ˆ ’”‘ ‡••‹‰ ƒ–‡”‹ƒŽ• †‹ˆˆ‡”‡–Ž› ˆ”‘ Š‘™ ‹– ™ƒ•
‡˜‹•ƒ‰‡†‹–Š‡‘”‹‰‹ƒŽ†‡•‹‰ǡ‘”™Š‹ Šƒˆˆ‡ –•–Š‡•ƒˆ‡–› Šƒ”ƒ –‡”‹•–‹ •‘ˆƒƒ Š‹‡

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3.19
subassembly
constituent part needed for proper performance of the laser processing machine
‘–‡ͳ–‘‡–”›ǣŽƒ•‡”’”‘ ‡••‹‰•—„ƒ••‡„Ž› ƒ„‡‘ˆƒ›Žƒ•‡” Žƒ••‹ƒ ‘”†ƒ ‡™‹–Š ͸ͲͺʹͷǦͳǣʹͲͳͶǤ

3.20
™‘”’‹‡ ‡
ƒ–‡”‹ƒŽ‹–‡†‡†–‘„‡’”‘ ‡••‡†„›Žƒ•‡””ƒ†‹ƒ–‹‘ǡ‹Ǥ‡Ǥ–Š‡–ƒ”‰‡–‘ˆ–Š‡Žƒ•‡”„‡ƒ
3.21
maximum permissible exposure
MPE
Ž‡˜‡Ž ‘ˆ Žƒ•‡” ”ƒ†‹ƒ–‹‘ –‘ ™Š‹ Šǡ —†‡” ‘”ƒŽ ‹” —•–ƒ ‡•ǡ ’‡”•‘• ƒ› „‡ ‡š’‘•‡† ™‹–Š‘—–
suffering adverse effects
‘–‡ͳ–‘‡–”›ǣŠ‡Ž‡˜‡Ž•”‡’”‡•‡––Š‡ƒš‹—Ž‡˜‡Ž–‘™Š‹ Š–Š‡‡›‡‘”•‹ ƒ„‡‡š’‘•‡†™‹–Š‘—–
‘•‡“—‡–‹ƒŽ‹Œ—”›‹‡†‹ƒ–‡Ž›‘”ƒˆ–‡”ƒŽ‘‰–‹‡ƒ†ƒ”‡”‡Žƒ–‡†–‘–Š‡™ƒ˜‡Ž‡‰–Š‘ˆ–Š‡Žƒ•‡””ƒ†‹ƒ–‹‘ǡ
–Š‡’—Ž•‡†—”ƒ–‹‘‘”‡š’‘•—”‡†—”ƒ–‹‘ǡ–Š‡–‹••—‡ƒ–”‹•ƒ†ǡˆ‘”˜‹•‹„Ž‡ƒ†‡ƒ”‹ˆ”ƒǦ”‡†Žƒ•‡””ƒ†‹ƒ–‹‘‹
–Š‡”ƒ‰‡ͶͲͲ–‘ͳͶͲͲǡ–Š‡•‹œ‡‘ˆ–Š‡”‡–‹ƒŽ‹ƒ‰‡Ǥƒš‹—’‡”‹••‹„Ž‡‡š’‘•—”‡Ž‡˜‡Ž•ƒ”‡ȋ‹–Š‡
‡š‹•–‹‰•–ƒ–‡‘ˆ‘™Ž‡†‰‡Ȍ•’‡ ‹ϐ‹‡†‹ ͸ͲͺʹͷǦͳǣʹͲͳͶǡ‡šǤ

‘–‡ʹ–‘‡–”›ǣŠ‡˜ƒŽ—‡•‰‹˜‡‹ ͸ͲͺʹͷǦͳǣʹͲͳͶǡ‡šƒ”‡‹ˆ‘”ƒ–‹˜‡ƒ†ƒ”‡’”‘˜‹†‡†•‘–Šƒ–
–Š‡ƒ—ˆƒ –—”‡” ƒ ƒŽ —Žƒ–‡–Š‡ ǡ’‡”ˆ‘”ƒ”‹•ƒƒŽ›•‹•ƒ†‹ˆ‘”–Š‡—•‡”ƒ„‘—–•ƒˆ‡—•ƒ‰‡‘ˆ–Š‡
’”‘†— –Ǥš’‘•—”‡Ž‹‹–•ˆ‘”–Š‡‡›‡ƒ†–Š‡•‹‘ˆ‡’Ž‘›‡‡•‹–Š‡™‘”’Žƒ ‡ƒ†–Š‡‰‡‡”ƒŽ’—„Ž‹ ƒ”‡‹
ƒ› ‘—–”‹‡••’‡ ‹ϐ‹‡†‹ƒ–‹‘ƒŽŽƒ™•ǤŠ‡•‡Ž‡‰ƒŽŽ›„‹†‹‰ƒ–‹‘ƒŽ‡š’‘•—”‡Ž‹‹–•‹‰Š–†‹ˆˆ‡”ˆ”‘–Š‡
•‰‹˜‡‹ ͸ͲͺʹͷǦͳǣʹͲͳͶǡ‡šǤ

ȏǣ  ͸ͲͺʹͷǦͳǣʹͲͳͶǡ ͵Ǥͷͻǡ ‘†‹ϐ‹‡† Ȅ ‹ ‘–‡• –‘ ‡–”›ǡ ‹ Ž—†‡†  ͸ͲͺʹͷǦͳǣʹͲͳͶ „‡ˆ‘”‡
‡š‹†‹ ƒ–‹‘ˆ‘” Žƒ”‹–›ǤȐ
3.22
nominal ocular hazard area
NOHA
ƒ”‡ƒ™‹–Š‹™Š‹ Š–Š‡„‡ƒ‹””ƒ†‹ƒ ‡‘””ƒ†‹ƒ–‡š’‘•—”‡‡š ‡‡†•–Š‡ƒ’’”‘’”‹ƒ–‡ ‘”‡ƒŽƒš‹—
’‡”‹••‹„Ž‡‡š’‘•—”‡ȋȌǡ‹ Ž—†‹‰–Š‡’‘••‹„‹Ž‹–›‘ˆƒ ‹†‡–ƒŽ‹•†‹”‡ –‹‘‘ˆ–Š‡Žƒ•‡”„‡ƒ
‘–‡ ͳ –‘ ‡–”›ǣ ˆ –Š‡   ‹ Ž—†‡• –Š‡ ’‘••‹„‹Ž‹–› ‘ˆ ˜‹‡™‹‰ –Š”‘—‰Š ‘’–‹ ƒŽ ƒ‹†•ǡ –Š‹• ‹• –‡”‡† –Š‡
̶‡š–‡†‡† ̶Ǥ

ȏǣ ͸ͲͺʹͷǦͳǣʹͲͳͶǡ͵Ǥ͸ͶȐ
3.23
foreseeable exposure limit
FEL
ƒš‹—Žƒ•‡”‡š’‘•—”‡‘–Š‡ˆ”‘–•—”ˆƒ ‡‘ˆ–Š‡Žƒ•‡”‰—ƒ”†ǡ™‹–Š‹–Š‡ƒ‹–‡ƒ ‡‹•’‡ –‹‘
‹–‡”˜ƒŽǡƒ••‡••‡†—†‡”‘”ƒŽƒ†”‡ƒ•‘ƒ„Ž›ˆ‘”‡•‡‡ƒ„Ž‡ˆƒ—Ž– ‘†‹–‹‘•
ȏǣ ͸ͲͺʹͷǦͶǣʹͲͲ͸ǡ͵ǤͶȐ

4 Hazards generated by laser radiation

4.1 General
A number of different hazards can emanate from a laser processing machine. This document is
ȋ‡š Ž—•‹˜‡Ž›Ȍƒ††”‡••‡†–‘–Š‡•’‡ ‹ϐ‹ Šƒœƒ”†•”‡•—Ž–‹‰ˆ”‘Žƒ•‡””ƒ†‹ƒ–‹‘ƒ”‹•‹‰‹Žƒ•‡”’”‘ ‡••‹‰
machines.
‡ ‘†ƒ”› Šƒœƒ”†•ǡ ™Š‹ Š ƒ”‡ ƒ—•‡† „› Žƒ•‡” „‡ƒȀƒ–‡”‹ƒŽ ‹–‡”ƒ –‹‘ǡ •— Š ƒ• –Š‡ ‰‡‡”ƒ–‹‘ ‘ˆ
Šƒœƒ”†‘—• •—„•–ƒ ‡• ȋˆ—‡•ǡ ˜ƒ’‘—”•ǡ ‰ƒ•‡•Ȍǡ ϐ‹”‡Ȁ‡š’Ž‘•‹‘ ”‹•• ‘” –Š‡ ‰‡‡”ƒ–‹‘ ‘ˆ •‡ ‘†ƒ”›
”ƒ†‹ƒ–‹‘ǡ‡Ǥ‰ǤǦ”ƒ†‹ƒ–‹‘‘”‹‘‹œ‹‰”ƒ†‹ƒ–‹‘ǡƒ”‡‘– ‘•‹†‡”‡†‹–Š‹•†‘
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Other hazards which can emanate from a laser processing machine are given in ‡š.
ƒ”–‹ —Žƒ”Šƒœƒ”†•ƒ”‡ƒŽ•‘ ‘˜‡”‡†„›Šƒ”‘‹œ‡†•–ƒ†ƒ”†•ȋ‡šƒ’Ž‡•Ȍǣ
For noise reduction and noise measurement methods for laser processing machines and hand-held
’”‘ ‡••‹‰ †‡˜‹ ‡• ƒ† ƒ••‘ ‹ƒ–‡† ƒ—š‹Ž‹ƒ”› ‡“—‹’‡– ȋƒ —”ƒ › ‰”ƒ†‡ ʹȌ •‡‡  ͳͳͷͷ͵Ǧ͵ǣʹͲͳ͵ǡ
‡šǤ
‘” ƒ••‡••‡– ƒ† ”‡†— –‹‘ ‘ˆ ”‹•• ƒ”‹•‹‰ ˆ”‘ ”ƒ†‹ƒ–‹‘ ȋŽƒ•‡” ƒ† ‹‘‹œ‹‰ ”ƒ†‹ƒ–‹‘ ‡š Ž—†‡†Ȍ
‡‹––‡†„›ƒ Š‹‡”›•‡‡ͳʹͳͻͺǦͳ–‘ͳʹͳͻͺǦ͵Ǥ
‘” –Š‡ ‡˜ƒŽ—ƒ–‹‘ ‘ˆ –Š‡ ‡‹••‹‘ ‘ˆ ƒ‹”„‘”‡ Šƒœƒ”†‘—• •—„•–ƒ ‡•ǡ ‰‡‡”ƒ–‡† †—”‹‰ Žƒ•‡”
ƒ–‡”‹ƒŽ ’”‘ ‡••‹‰ ȋ•— Š ƒ• ’ƒ”–‹ —Žƒ–‡ ƒ† ‰ƒ•‡‘—• •—„•–ƒ ‡•Ǣ ‡Ǥ‰Ǥ ˆ—‡•ǡ ˜ƒ’‘—”•ǡ ‰ƒ•‡•Ȍ •‡‡
EN 1093 (all parts).
‘” ”‡†— –‹‘ ‘ˆ ”‹•• –‘ Š‡ƒŽ–Š ”‡•—Ž–‹‰ ˆ”‘ Šƒœƒ”†‘—• •—„•–ƒ ‡• ‡‹––‡† „› ƒ Š‹‡”› •‡‡
ISO 14123-1 and ISO 14123-2.

4.2 Laser radiation hazards/sources of laser radiation emission

ƒ•‡””ƒ†‹ƒ–‹‘Šƒœƒ”†• ƒ‘”‹‰‹ƒ–‡ˆ”‘ƒ†‹”‡ –Žƒ•‡”„‡ƒ‘”ƒ”‡ϐŽ‡ –‡†Ȁ• ƒ––‡”‡†Žƒ•‡”„‡ƒǤŠ‡
‘”ƒŽ—•‡ƒ•™‡ŽŽƒ•ƒŽˆ— –‹‘•Ȁ”‡ƒ•‘ƒ„Ž›ˆ‘”‡•‡‡ƒ„Ž‡ˆƒ—Ž– ‘†‹–‹‘•Šƒ˜‡–‘„‡ ‘•‹†‡”‡†Ǥ
Possible emission sources of a direct beam are:
ƒȌ ƒ’‡”–—”‡‘ˆƒ‡„‡††‡†Žƒ•‡”•‘—” ‡ǡ
„Ȍ „‡ƒ†‡Ž‹˜‡”›•›•–‡™‹–Š‹ƒŽƒ•‡”’”‘ ‡••‹‰ƒ Š‹‡ǡ
Ȍ Žƒ•‡”„‡ƒ‡‹––‡†ˆ”‘–Š‡’”‘ ‡••‹‰Š‡ƒ†ȋ–‘–Š‡™‘”’‹‡ ‡Ȍǡ
d) laser beam emitted from a scanning unit (to the workpiece).
‘••‹„Ž‡‡‹••‹‘•‘—” ‡•‘ˆƒ”‡ϐŽ‡ –‡†„‡ƒƒ”‡ǣ
Ȅ ‡Ž‡‡–•ȋ™‹–Š”‡ϐŽ‡ –‹˜‡•—”ˆƒ ‡Ȍ™‹–Š‹–Š‡„‡ƒ†‡Ž‹˜‡”›•›•–‡‘ˆ–Š‡Žƒ•‡”’”‘ ‡••‹‰ƒ Š‹‡ǡ
Ȅ –Š‡™‘”’‹‡ ‡Š‘Ž†‡”ȋ‹ˆ–Š‡™‘”’‹‡ ‡‹•‹••‹‰Ȍǡ
Ȅ ‡Ž‡‡–•‹–Š‡’”‘ ‡••‹‰œ‘‡ǡ
Ȅ ‡Ž‡‡–•‹•‹†‡–Š‡Š‘—•‹‰‘ˆƒƒ Š‹‡ȋ‡Ǥ‰ǤŠƒ†Ž‹‰•›•–‡ǡ•— –‹‘’‹’‡•ǡ’ƒ”–•‘ˆ‰—ƒ”†•Ȍǡ
Ȅ –Š‡™‘”’‹‡ ‡ǡ’”‘ ‡••‡†„›–Š‡Žƒ•‡”’”‘ ‡••‹‰ƒ Š‹‡Ǥ
Š‡ ‘’–‹ ƒŽ ’”‘’‡”–‹‡• ȋ‡Ǥ‰Ǥ •—”ˆƒ ‡ ”‘—‰Š‡•• ƒ† ”‡ϐŽ‡ –‹˜‹–›Ȍ ‘ˆ –Š‡ ƒ–‡”‹ƒŽ ‡š’‘•‡† –‘ –Š‡ Žƒ•‡”
„‡ƒ†‡ ‹•‹˜‡Ž›†‡–‡”‹‡–Š‡‹†‘ˆ”‡ϐŽ‡ –‹‘ȋ†‹”‡ –Ȁ•’‡ —Žƒ””‡ϐŽ‡ –‹‘‘”• ƒ––‡”‡†”‡ϐŽ‡ –‹‘Ȍƒ†
–Š—•–Š‡”‹•Ž‡˜‡ŽǤŠ‹•Šƒ•‹’ƒ –‘„‘–Š–Š‡ˆ‘”‡•‡‡ƒ„Ž‡‡š’‘•—”‡Ž‹‹–ȋ Ȍƒ––Š‡‹‡”•—”ˆƒ ‡‘ˆ
ƒƒ Š‹‡‡ Ž‘•—”‡Ȁ‰—ƒ”†‘”–Š‡”‡•—Ž–‹‰‹””ƒ†‹ƒ ‡‘”–Š‡”ƒ†‹ƒ–‡š’‘•—”‡ƒ–ƒƒ Š‹‡™‘”’Žƒ ‡
or at a certain distance to the machine.
ƒ†‡“—ƒ–‡ †‡•‹‰ ‘” ƒŽˆ— –‹‘• ‘ˆ Žƒ•‡” ‘’‘‡–• ƒ† ƒ Š‹‡”› ‡“—‹’‡– ƒ ƒŽ•‘ „‡ –Š‡
reason for laser radiation hazards/emission (or a misguided laser beam):
Ȅ †ƒƒ‰‡†‘’–‹ ƒŽϐ‹„”‡ ƒ„Ž‡ǡ
Ȅ †ƒƒ‰‡†’ƒ••‹˜‡‘’–‹ ƒŽ‡Ž‡‡–•ȋ‡Ǥ‰Ǥ‹””‘”•ǡŽ‡•‡•Ȍǡ
Ȅ ‹•ƒŽ‹‰‡†„‡ƒ’ƒ–Šȋ‹ƒ†‡“—ƒ–‡‘’–‹ ƒŽ‡Ž‡‡–•ǡ‹ ‘””‡ –Ž›’‘•‹–‹‘‡†Ȍǡ
Ȅ ‘–’”‘’‡”Ž›™‘”‹‰ƒ –‹˜‡„‡ƒ‰—‹†‹‰ƒ†•Šƒ’‹‰‡Ž‡‡–•ǡ
Ȅ ‘–’”‘’‡”Ž›™‘”‹‰Šƒ†Ž‹‰•›•–‡‘””‘„‘–’‘•‹–‹‘‹‰‘ˆ–Š‡Žƒ•‡”’”‘
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Ȅ ‰ƒ’• ‹ –Š‡ ‡ Ž‘•—”‡Ȁ‰—ƒ”† ‘ˆ ƒ Žƒ•‡” ’”‘ ‡••‹‰ ƒ Š‹‡ǡ –Š”‘—‰Š ™Š‹ Š Žƒ•‡” ”ƒ†‹ƒ–‹‘ ƒ
’”‘’ƒ‰ƒ–‡ǡ
— damage of protective enclosure/guards/screens.
 ˆ‘”ƒ–‹‘ ‘ ”‡ƒ•‘ƒ„Ž› ˆ‘”‡•‡‡ƒ„Ž‡ ˆƒ—Ž– ‘†‹–‹‘• ”‡Žƒ–‡† –‘ „‡ƒ ‰—‹†ƒ ‡ ‹• ‰‹˜‡ ‹
͸ͲͺʹͷǦͶǣʹͲͲ͸ǡ‡šǤ

ƒ†‡“—ƒ–‡†‡•‹‰‘ˆ•ƒˆ‡–›ˆ— –‹‘•ǡƒ†•ƒˆ‡–›”‡Žƒ–‡†’ƒ”–•‘ˆ ‘–”‘Ž•›•–‡•ȋȀȌ”‡•’‡ –‹˜‡Ž›ǡ

ˆ‘”–Š‡•ƒˆ‡‹•‘Žƒ–‹‘‘”†‡ƒ –‹˜ƒ–‹‘‘ˆ–Š‡Žƒ•‡”„‡ƒȋ‡Ǥ‰Ǥ„›•Š—––‡”•ǡ”‡Žƒ›• ‘–”‘ŽŽ‹‰’‘™‡”•—’’Ž›–‘
–Š‡Žƒ•‡”Ȍ ƒ ƒ—•‡•‡˜‡”‡Žƒ•‡””ƒ†‹ƒ–‹‘”‹••Ǥ –Š‡ˆ‘ŽŽ‘™‹‰ǡ•ƒˆ‡–›ˆ— –‹‘•ƒ”‡‡š‡’Žƒ”‹Ž›‰‹˜‡ǣ
Ȅ ‡‡”‰‡ ›•–‘’Ǣ
— opening of maintenance covers or doors for workpiece input and output with access to laser
”ƒ†‹ƒ–‹‘Ǣ
Ȅ ‘’‡‹‰‘ˆ†‘‘”•–‘‡–‡”Žƒ•‡” ƒ„‹•™‹–Šƒ ‡••–‘–Š‡Žƒ•‡”Šƒœƒ”†ƒ”‡ƒǢ
Ȅ †‹•ƒ••‡„Ž‹‰ȋƒ—ƒŽŽ›Ȍ‘ˆϐ‹„”‡ ‘‡ –‘”•™‹–Šƒ ‡••–‘–Š‡†‹”‡ –Žƒ•‡”„‡ƒǢ
Ȅ ƒ –‹˜‡ ‘–”‘Ž‘ˆ‰—ƒ”†•ƒ†™‹†‘™•™‹–Š”‡‰ƒ”†–‘†ƒƒ‰‡„›Žƒ•‡””ƒ†‹ƒ–‹‘Ǥ

4.3 Laser radiation hazards induced by external effects (interferences)

‘™‡” ‘†‹–‹‘•ƒ†–Š‡‡˜‹”‘‡–‹™Š‹ Š–Š‡Žƒ•‡”’”‘ ‡••‹‰ƒ Š‹‡‘’‡”ƒ–‡•ƒ› ƒ—•‡–Š‡
ƒ Š‹‡ –‘ ƒŽˆ— –‹‘ǡ –Š—• ‰‹˜‹‰ ”‹•‡ –‘ Šƒœƒ”†‘—• ‘†‹–‹‘• ”‡Žƒ–‡† –‘ Žƒ•‡” ”ƒ†‹ƒ–‹‘ ƒ†Ȁ‘”
ƒ‹‰‹–‡ ‡••ƒ”›ˆ‘”•‘‡‘‡–‘‹–‡”˜‡‡™‹–Š‹Šƒœƒ”†œ‘‡•Ǥ
Environmental interferences include
Ȅ –‡’‡”ƒ–—”‡ǡ
Ȅ Š—‹†‹–›ǡ
Ȅ ‡š–‡”ƒŽ•Š‘ Ȁ˜‹„”ƒ–‹‘ǡ
Ȅ ˜ƒ’‘—”•ǡ†—•–‘”‰ƒ•‡•ˆ”‘–Š‡‡˜‹”‘‡–ǡ
Ȅ ‡Ž‡ –”‘ƒ‰‡–‹ Ȁ”ƒ†‹‘ˆ”‡“—‡ ›‹–‡”ˆ‡”‡ ‡ǡ
Ȅ •‘—” ‡˜‘Ž–ƒ‰‡‹–‡””—’–‹‘ȀϐŽ— –—ƒ–‹‘ǡƒ†
Ȅ ‹•—ˆϐ‹ ‹‡–Šƒ”†™ƒ”‡Ȁ•‘ˆ–™ƒ”‡ ‘’ƒ–‹„‹Ž‹–›ƒ†‹–‡‰”‹–›‘ˆƒ Š‹‡’ƒ”–•Ǥ
 ˜‹”‘‡–ƒŽ ‘†‹–‹‘• ƒ ƒ—•‡ ƒ†˜‡”•‡ ‹’ƒ –• ‘ –Š‡ Žƒ•‡” „‡ƒ Šƒ”ƒ –‡”‹•–‹ •ǡ ™Š‹ Š
ƒ†‡–‡”‹‘”ƒ–‡ƒ„•‘”’–‹‘‡ˆϐ‹ ‹‡ ›Ǣ•Š‘ Ȁ˜‹„”ƒ–‹‘ ƒ ƒ—•‡‹•ƒŽ‹‰‡–‘ˆ‘’–‹ ƒŽ‡Ž‡‡–•ƒ†–Š—•–Š‡
laser beam.

4.4 Characteristics of laser radiation

The hazards related to laser radiation depend on the characteristics of the radiation.
‘”ƒŠƒœƒ”†ƒƒŽ›•‹•ƒ†ƒ”‹•ƒ••‡••‡–ǡ–Š‡Žƒ•‡””ƒ†‹ƒ–‹‘‡‹––‡†ˆ”‘ƒŽƒ•‡”’”‘ ‡••‹‰ƒ Š‹‡
‹• Šƒ”ƒ –‡”‹œ‡†„›‹ Ž—†‹‰„—–‘–Ž‹‹–‡†–‘–Š‡ˆ‘ŽŽ‘™‹‰ǣ
Ȅ ™ƒ˜‡Ž‡‰–ŠǢ
Ȅ ‘’‡”ƒ–‹‰‘†‡ȋ ™ǡ’—Ž•‡†ȌǢ
Ȅ „‡ƒ’”‘ϐ‹Ž‡ȋ‘†‡ǡ‡‡”‰›†‹•–”‹„—–‹‘ȌǢ
Ȅ „‡ƒ“—ƒŽ‹–› ‘†‡•ǣǡ 2ǡǢ
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ISO 11553-1:2020(E) ILNAS-EN ISO 11553-1:2020

Ȅ ’‘Žƒ”‹œƒ–‹‘Ǣ
Ȅ ˆ‘”‡•‡‡ƒ„Ž‡‡š’‘•—”‡Ž‹‹–ȋ Ȍƒ––Š‡‹‡”•‹†‡‘ˆƒ‡ Ž‘•—”‡Ȁ‰—ƒ”†Ǣ
Ȅ ‹””ƒ†‹ƒ ‡Ȁ”ƒ†‹ƒ–‡š’‘•—”‡ƒ–ƒƒ Š‹‡™‘”’Žƒ ‡‘”•’‡ ‹ϐ‹‡††‹•–ƒ ‡–‘–Š‡Žƒ•‡”ƒ Š‹‡Ǣ
Ȅ ƒš‹—‡š’‘•—”‡–‹‡Ǥ

5 Safety requirements and measures

5.1 General requirements

Š‡‡š–‡––‘™Š‹ ŠŠƒœƒ”†•ƒ”‡ ‘˜‡”‡†‹•‹†‹ ƒ–‡†‹–Š‡ ‘’‡Ǥ
ƒ—ˆƒ –—”‡”••ŠƒŽŽ‡•—”‡–Š‡•ƒˆ‡–›‘ˆŽƒ•‡”’”‘ ‡••‹‰ƒ Š‹‡•„›
ƒȌ Šƒœƒ”†‹†‡–‹ϐ‹ ƒ–‹‘ƒ†”‹•ƒ••‡••‡–ǡ
„Ȍ ‹’Ž‡‡–ƒ–‹‘‘ˆ•ƒˆ‡–›‡ƒ•—”‡•–‘‹‹‹œ‡”‹••„›Žƒ•‡””ƒ†‹ƒ–‹‘ǡ
Ȍ ˜‡”‹ϐ‹ ƒ–‹‘‘ˆ–Š‡•ƒˆ‡–›‡ƒ•—”‡•ǡƒ†
d) provision of appropriate information for the user.
Based on the risk assessment (see 5.2Ȍǡ ƒ’’”‘’”‹ƒ–‡ •ƒˆ‡–› ‡ƒ•—”‡• ƒ‰ƒ‹•– Žƒ•‡” ”ƒ†‹ƒ–‹‘ •ŠƒŽŽ „‡
‹ ‘”’‘”ƒ–‡†‹–‘–Š‡Žƒ•‡”’”‘ ‡••‹‰ƒ Š‹‡„›†‡•‹‰ƒ†ƒ—ˆƒ –—”‡Ǥ

ͷǤʹ ‹•ƒ••‡••‡–™‹–Š”‡‰ƒ”†–‘Žƒ•‡””ƒ†‹ƒ–‹‘Šƒœƒ”†•
Š‡ ƒ ‡••‹„‹Ž‹–› –‘ Šƒœƒ”†‘—• Žƒ•‡” ”ƒ†‹ƒ–‹‘ †‡ ‹•‹˜‡Ž› †‡’‡†• ‘ –Š‡ •–ƒ–—• ‘ˆ ƒ Žƒ•‡” ƒ Š‹‡Ǥ
Š‡”‡ˆ‘”‡ǡƒ”‹•ƒ••‡••‡–™‹–Š”‡‰ƒ”†–‘Žƒ•‡””ƒ†‹ƒ–‹‘Šƒœƒ”†••ŠƒŽŽ„‡’‡”ˆ‘”‡†ǣ
Ȅ ˆ‘”–Š‡™Š‘Ž‡Ž‹ˆ‡ › Ž‡‘ˆ–Š‡ƒ Š‹‡ǡƒ•ƒ’’Ž‹ ƒ„Ž‡ǡȋˆ‘”‡šƒ’Ž‡••‡‡ ͳʹͳͲͲǣʹͲͳͲȌǢ
— for all operating modes (The operating modes described in Clause 3ƒ”‡‘Ž›‡šƒ’Ž‡•ǤŠ‡‘’‡”ƒ–‹‰
‘†‡•‘ˆ–Š‡ƒ Š‹‡‹ ŽǤ–‡”‹‘Ž‘‰›ƒ† ‘–‡–•Š‘—Ž†„‡†‡ϐ‹‡†„›–Š‡”‹•ƒ••‡••‡–‘ˆ–Š‡
ƒ—ˆƒ –—”‡”ǤȌǢ
Ȅ ƒˆ–‡” ‡ƒ Š ‘†‹ϐ‹ ƒ–‹‘ ‘ˆ –Š‡ ƒ Š‹‡ „› –Š‡ ’‡”•‘ ‘” ‘”‰ƒ‹œƒ–‹‘ ”‡•’‘•‹„Ž‡ ˆ‘” –Š‡
‘†‹ϐ‹ ƒ–‹‘Ǣƒ†
Ȅ ˆ‘”‡ƒ Š”‡ƒ•‘ƒ„Ž›ˆ‘”‡•‡‡ƒ„Ž‡‹•—•‡Ȁ‘’‡”ƒ–‹‘‘–‹ Ž—†‡†„›–Š‡‹–‡†‡†—•‡Ǥ
A risk assessment includes but is not limited to:
ƒȌ Šƒœƒ”†• ƒ—•‡†„›–Š‡†‹”‡ –‘””‡ϐŽ‡ –‡†Žƒ•‡”„‡ƒǢ
„Ȍ Šƒœƒ”†œ‘‡•ǡ’ƒ”–‹ —Žƒ”Ž›–Š‘•‡ƒ••‘ ‹ƒ–‡†™‹–Š
ͳȌ –Š‡Žƒ•‡”‘”–Š‡Žƒ•‡”•›•–‡ǡ
ʹȌ –Š‡Žƒ•‡”„‡ƒ’ƒ–ŠȀ„‡ƒ†‡Ž‹˜‡”›•›•–‡ǡ
͵Ȍ –Š‡’”‘ ‡••œ‘‡ǡ
ͶȌ –Š‡Žƒ•‡”Šƒœƒ”†ƒ”‡ƒǡƒ†
ͷȌ –Š‡ƒ”‡ƒ‹™Š‹ ŠŽƒ•‡””ƒ†‹ƒ–‹‘ ƒ†ƒœœŽ‡’‡‘’Ž‡Ǣ
c) "interferences” listed in 4.3.

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ILNAS-EN ISO 11553-1:2020 ISO 11553-1:2020(E)

Š‡”‡•—Ž–•‘ˆ–Š‡”‹•ƒ••‡••‡–•ŠƒŽŽ„‡†—Ž›†‘ —‡–‡†Ǥ‡‡ ͳʹͳͲͲǣʹͲͳͲˆ‘”’”‹ ‹’Ž‡•ˆ‘””‹•

assessment.

ͷǤ͵ ’Ž‡‡–ƒ–‹‘‘ˆ”‹•”‡†— –‹‘‡ƒ•—”‡•

5.3.1 General

ƒˆ‡–› ‡ƒ•—”‡• ƒ‰ƒ‹•– Žƒ•‡” ”ƒ†‹ƒ–‹‘ Šƒœƒ”†• •ŠƒŽŽ „‡ ‹ ‘”’‘”ƒ–‡† ‹ –Š‡ ƒ Š‹‡ „› †‡•‹‰ ƒ†
ƒ—ˆƒ –—”‡ ƒ• •’‡ ‹ϐ‹‡† ‹ 5.3.2 to 5.3.4Ǥ ƒˆ‡–› ‡ƒ•—”‡• ƒ‰ƒ‹•– Žƒ•‡” Šƒœƒ”†• •ŠƒŽŽ ˆ‘ŽŽ‘™ –Š‡
’”‹‘”‹–›’”‹ ‹’Ž‡ƒ ‘”†‹‰–‘ ͳʹͳͲͲǣʹͲͳͲǤ

5.3.2 Safety measures against laser radiation hazards in dependence of the locations
  –Š‡ ˆ‘ŽŽ‘™‹‰ǡ ”‡“—‹”‡‡–• ˆ‘” •ƒˆ‡–› ‡ƒ•—”‡• ƒ‰ƒ‹•– Žƒ•‡” ”ƒ†‹ƒ–‹‘ Šƒœƒ”†• ƒ”‡ ‰‹˜‡ ‹
†‡’‡†‡ ‡‘ˆ–Š‡Ž‘ ƒ–‹‘ǡ™Š‡”‡–Š‡Žƒ•‡”’”‘ ‡••‹‰ƒ Š‹‡‘’‡”ƒ–‡•Ǥ

5.3.2.1 Safety measures at locations with unrestricted and uncontrolled access

‘” Žƒ•‡” ’”‘ ‡••‹‰ ƒ Š‹‡• ‘’‡”ƒ–‹‰ ‹ Ž‘ ƒ–‹‘• ™‹–Š —”‡•–”‹ –‡† ƒ† — ‘–”‘ŽŽ‡† ƒ ‡••ǡ –Š‡
’‘••‹„‹Ž‹–› ‘ˆ ’‡‘’Ž‡ „‡‹‰ ‡š’‘•‡† –‘ Šƒœƒ”†‘—• Ž‡˜‡Ž• ‘ˆ Žƒ•‡” ”ƒ†‹ƒ–‹‘ ‡š ‡‡†‹‰ –Š‡ ƒ ‡••‹„Ž‡
emission limit (AEL) for Class 1 according to IEC 60825-1:2014 shall be eliminated during all operating
‘†‡•ȋ’”‘†— –‹‘ƒ†ƒ›‘–Š‡”‘’‡”ƒ–‹‰‘†‡ȌǤ
‘•ƒ–‹•ˆ›–Š‡•‡”‡“—‹”‡‡–•ǡ–Š‡ˆ‘ŽŽ‘™‹‰ ‘†‹–‹‘••ŠƒŽŽ„‡‡–ǣ
Ȅ ƒ—–Š‘”‹œ‡† Š—ƒ ƒ ‡•• –‘ ƒ Šƒœƒ”† œ‘‡ •ŠƒŽŽ „‡ ’”‡˜‡–‡† •‘Ž‡Ž› „› ‡‰‹‡‡”‹‰ •ƒˆ‡–›
measures as stipulated in IEC 60825-1:2014 and ISO 12100:2010.
Ȅ —ƒ”†‹‰•ŠƒŽŽ„‡ƒ’’Ž‹‡†–‘’”‘–‡ –ƒ‰ƒ‹•–Žƒ•‡””ƒ†‹ƒ–‹‘Ǥ
Ȅ Ȁ •ŠƒŽŽ „‡ —•‡† –‘ •ƒˆ‡Ž› ‹•‘Žƒ–‡ –Š‡ Žƒ•‡” ”ƒ†‹ƒ–‹‘ǡ –Š‡ ”‡“—‹”‡‡–• ‘ˆ  ͳ͵ͺͶͻǦͳǣʹͲͳͷ
shall be met.
 ‘•– ‘‘Ž›„›‡ƒ•‘ˆƒ‡ Ž‘•—”‡‘”‰—ƒ”†•Ȁ• ”‡‡•ƒ•†‡• ”‹„‡†‹ ͸ͲͺʹͷǦͶǣʹͲͲ͸Ǥ

 ›’‹ ƒŽŽ›ǡ–Š‡•‡ƒ Š‹‡•ƒ”‡‡šŠ‹„‹–‡†‘”†‡‘•–”ƒ–‡†‘ˆƒ‹”•ƒ†‡šŠ‹„‹–‹‘•Ǥ‹ ‡–Š‡’—„Ž‹ 

ƒŠƒ˜‡ƒ ‡••–‘–Š‡Ž‘ ƒ–‹‘ǡ‘Šƒœƒ”†•ƒ›‡ƒƒ–‡ˆ”‘–Š‡Žƒ•‡”’”‘ ‡••‹‰ƒ Š‹‡Ǥ

5.3.2.2 Safety measures at locations with restricted access

‘”Žƒ•‡”’”‘ ‡••‹‰ƒ Š‹‡•‘’‡”ƒ–‹‰‹Ž‘ ƒ–‹‘•™‹–Š”‡•–”‹ –‡†ƒ ‡••ǡ’”‡†‘‹ƒ–Ž›‡‰‹‡‡”‹‰

•ƒˆ‡–›‡ƒ•—”‡••’‡ ‹ϐ‹‡†‹ ͸ͲͺʹͷǦͳǣʹͲͳͶƒ† ͳʹͳͲͲǣʹͲͳͲ•ŠƒŽŽ„‡–ƒ‡–‘’”‡˜‡–Š—ƒ
access to a laser hazard area (NOHA).
‘•ƒ–‹•ˆ›–Š‡•‡”‡“—‹”‡‡–•ǡ–Š‡ˆ‘ŽŽ‘™‹‰ ‘†‹–‹‘••ŠƒŽŽ„‡‡–ǣ
ƒȌ ‰‹‡‡”‹‰ •ƒˆ‡–› ‡ƒ•—”‡• ˆ‘” ‰—ƒ”†‹‰ ƒ† ˆ‘” •Š‹‡Ž†‹‰ ‘ˆ Žƒ•‡” ”ƒ†‹ƒ–‹‘ •ŠƒŽŽ ”‡†— ‡ –Š‡
‹””ƒ†‹ƒ ‡„‡Ž‘™–Š‡‘ˆ‡›‡ƒ†•‹ǤȀˆ‘”–Š‡•ƒˆ‡‹•‘Žƒ–‹‘‘ˆ–Š‡Žƒ•‡””ƒ†‹ƒ–‹‘•ŠƒŽŽ
‘’Ž›™‹–Š ͳ͵ͺͶͻǦͳǣʹͲͳͷǤ
„Ȍ ƒ††‹–‹‘–‘‡‰‹‡‡”‹‰‡ƒ•—”‡•‘”‰ƒ‹œƒ–‹‘ƒŽ‡ƒ•—”‡•‹‰Š–„‡‡ ‡••ƒ”›ȋ‡Ǥ‰Ǥˆ‘”‘’‡”ƒ–‹‰
‘†‡Dz•‡”˜‹ ‡dzȌ–‘’”‡˜‡–Š—ƒƒ ‡••–‘Šƒœƒ”†‘—•Žƒ•‡””ƒ†‹ƒ–‹‘Ǥš’‘•—”‡ƒ„‘˜‡–Š‡
•ŠƒŽŽ„‡‡Ž‹‹ƒ–‡†„›ƒ††‹–‹‘ƒŽ—•‡‘ˆƒ†‹‹•–”ƒ–‹˜‡Ȁ‘”‰ƒ‹œƒ–‹‘ƒŽ•ƒˆ‡–›‡ƒ•—”‡•Ǥ
”‰ƒ‹œƒ–‹‘ƒŽ •ƒˆ‡–› ‡ƒ•—”‡• •ŠƒŽŽ „‡ ƒ””‹‡† ‘—– ™‹–Š •‡ ‘†ƒ”› ’”‹‘”‹–› ‹ ƒ ‘”†ƒ ‡ ™‹–Š
ͳʹͳͲͲǣʹͲͳͲƒ† ͸ͲͺʹͷǦͳǣʹͲͳͶǤŠ‡ƒ—ˆƒ –—”‡••ŠƒŽŽ‹ˆ‘”–Š‡—•‡”ǡŠ‘™–‘ ƒ””›‘—––Š‡
‘”‰ƒ‹œƒ–‹‘ƒŽ‡ƒ•—”‡•‹‘”†‡”–‘ƒ˜‘‹†”‹••ȋ‡š ‡‡†Ȍ„›Žƒ•‡””ƒ†‹ƒ–‹‘Ǥ

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ISO 11553-1:2020(E) ILNAS-EN ISO 11553-1:2020

ˆ–Š‡Žƒ•‡”Šƒœƒ”†ƒ”‡ƒ‹••Š‹‡Ž†‡†‘”’ƒ”–‹ƒŽŽ›•Š‹‡Ž†‡†„›Žƒ•‡”‰—ƒ”†•–Š‡ƒ—ˆƒ –—”‡”•ŠƒŽŽ‹ˆ‘”
–Š‡—•‡”Š‘™–‘†‡–‡”‹‡–Š‡ ƒ†’”‘˜‹†‡ƒ†‡“—ƒ–‡Žƒ•‡”‰—ƒ”†•ȋ™‹–Š•—ˆϐ‹ ‹‡–ƒ ‘”†‹‰–‘
IEC 60825-1:2014).
ˆ –Š‡ Žƒ•‡” •ƒˆ‡–› ‹• ’”‘˜‹†‡† „› †‹•–ƒ ‡ –Š‡ ƒ—ˆƒ –—”‡” •ŠƒŽŽ ‹ˆ‘” –Š‡ —•‡” Š‘™ –‘ †‡–‡”‹‡
–Š‡ ǤŠ‡ƒ—ˆƒ –—”‡”•ŠƒŽŽ‹ˆ‘”–Š‡—•‡”ǡŠ‘™–‘‹•–ƒŽŽ„ƒ””‹‡”•ȋ‡Ǥ‰Ǥ™‹–Š„ƒ””‹‡”–ƒ’‡•Ȍƒ–
the respective Nominal Ocular Hazard Distances. He shall provide information how to implement the
‘”‰ƒ‹•ƒ–‹‘ƒŽ‡ƒ•—”‡•‹–”ƒ‹‹‰Ȁ‡†— ƒ–‹‘ƒ†•ƒˆ‡–›‹•–”— –‹‘•Ǥ
 ‡”ˆ‘”‹‰•‡”˜‹ ‡ƒ–ƒŽƒ•‡”’”‘ ‡••‹‰ƒ Š‹‡Ž‘ ƒ–‡†‹ƒ•Š‘’ϐŽ‘‘”ǡ™Š‹ Š‹•–Š‡”‡•–”‹ –‡†
ƒ”‡ƒǤ Š‡ Žƒ•‡” Šƒœƒ”† ƒ”‡ƒ ‹• • ”‡‡‡† „› ‡ƒ• ‘ˆ ˜‡”–‹ ƒŽ ‘„‹Ž‡ Žƒ•‡” ‰—ƒ”†•Ȁ™ƒŽŽ•ǡ ™Š‹ Š ƒ”‡ Žƒ„‡ŽŽ‡†
™‹–Š •ƒˆ‡–› •‹‰• ”‡•’‡ –‹˜‡Ž›Ǥ ‡ϐŽ‡ –‡† Žƒ•‡” ”ƒ†‹ƒ–‹‘ ƒ ’”‘’ƒ‰ƒ–‡ –‘ —’’‡” ϐŽ‘‘”• ‘” • ƒˆˆ‘Ž† ’Žƒ–ˆ‘”•Ǥ
‡”•‘‡Ž Šƒ˜‹‰ ƒ ‡•• –‘ –Š‡ •Š‘’ ϐŽ‘‘” ‹• –”ƒ‹‡† ‹ ‘”‰ƒ‹œƒ–‹‘ƒŽ ‡ƒ•—”‡•ǡ –‘ ˆ‘ŽŽ‘™ –Š‡ ‘”‰ƒ‹œƒ–‹‘ƒŽ
•ƒˆ‡–› ‡ƒ•—”‡• ȋ’”‘Š‹„‹–‹‘•Ȁ™ƒ”‹‰•ȌǤ › –Š‹•ǡ –Š‡ ”‡•‹†—ƒŽ ”‹• „› Žƒ•‡” ”ƒ†‹ƒ–‹‘ ƒ „‡ ‡Ž‹‹ƒ–‡† „›
‘”‰ƒ‹œƒ–‹‘ƒŽ‡ƒ•—”‡•ǢŠ‡”‡‡Ǥ‰Ǥ’”‘Š‹„‹–‹‘‘ˆ‡–”›–‘—’’‡”ϐŽ‘‘”•Ǥ

5.3.2.3 Safety measures at locations with controlled access

‘”Žƒ•‡”’”‘ ‡••‹‰ƒ Š‹‡•‘’‡”ƒ–‹‰‹Ž‘ ƒ–‹‘•™‹–Š ‘–”‘ŽŽ‡†ƒ ‡••ǡ–Š‡’‘••‹„‹Ž‹–›‘ˆ’‡‘’Ž‡

„‡‹‰‡š’‘•‡†–‘Ž‡˜‡Ž•‘ˆŽƒ•‡””ƒ†‹ƒ–‹‘‡š ‡‡†‹‰–Š‡ƒš‹—’‡”‹••‹„Ž‡‡š’‘•—”‡ȋ‡›‡ and
MPEskin) shall be eliminated.
‘ •ƒ–‹•ˆ› –Š‹• ”‡“—‹”‡‡–ǡ –Š‡ ˆ‘ŽŽ‘™‹‰ ‘†‹–‹‘• •ŠƒŽŽ „‡ ‡– ‹ ƒ††‹–‹‘ –‘ ƒŽŽ •ƒˆ‡–› ‡ƒ•—”‡•
”‡Žƒ–‡†–‘‘’‡”ƒ–‹‰‘†‡•ǡ™Š‡”‡5.3.3.2 to 5.3.3.5ƒ’’Ž›Ǥ
ƒȌ ƒ—–Š‘”‹œ‡† Š—ƒ ƒ ‡•• –‘ –Š‡ Žƒ•‡” Šƒœƒ”† œ‘‡ •ŠƒŽŽ „‡ ’”‡˜‡–‡† ’”‡†‘‹ƒ–Ž› „›
‡‰‹‡‡”‹‰ •ƒˆ‡–› ‡ƒ•—”‡• ƒ• •’‡ ‹ϐ‹‡† ‹  ͸ͲͺʹͷǦͳǣʹͲͳͶ ƒ†  ͳʹͳͲͲǣʹͲͳͲǤ Š‡
ƒ—ˆƒ –—”‡” •ŠƒŽŽ •’‡ ‹ˆ› –Š‡ ‹† ‘ˆ ƒ—–Š‘”‹œƒ–‹‘ ‘–”‘Ž ‡ƒ„Ž‹‰Ȁ’”‡˜‡–‹‰ ƒ ‡•• –‘ –Š‡
Žƒ•‡”Šƒœƒ”†œ‘‡ȋ‡Ǥ‰Ǥ†‘‘”™‹–Š‡›ǡ’ƒ••™‘”†Ȁ–”ƒ•’‘†‡”ȌǤ
„Ȍ ˆ ƒ—–Š‘”‹œ‡† ƒ ‡•• ȋ‡Ǥ‰Ǥ „› ‡› ‘” ’ƒ••™‘”†Ȁ–”ƒ•’‘†‡”Ȍ ‹• ‡ ‡••ƒ”› ˆ‘” Žƒ•‡” ’”‘ ‡••‹‰
ƒ Š‹‡• ‘’‡”ƒ–‹‰ ‹ Ž‘ ƒ–‹‘• ™‹–Š ‘–”‘ŽŽ‡† ƒ ‡•• ȋ‡Ǥ‰Ǥ ˆ‘” •‡”˜‹ ‡ ‘†‡ǡ •‡‡ ƒŽ•‘ 5.3.3.4)
–Š‡ ƒ—ˆƒ –—”‡” •ŠƒŽŽ ’”‘˜‹†‡ ‹ˆ‘”ƒ–‹‘ ‘ Š‘™ –‘ ™‘” •ƒˆ‡Ž› ‹ ƒ Žƒ•‡” Šƒœƒ”† ƒ”‡ƒ ȋ•‡‡
IEC 60825-1:2014).
š’‘•—”‡ ƒ„‘˜‡ –Š‡  ‹ –Š‡ ‘–”‘ŽŽ‡† ƒ”‡ƒ •ŠƒŽŽ „‡ ‡Ž‹‹ƒ–‡† „› —•‡ ‘ˆ ‡‰‹‡‡”‹‰ ƒ†
ƒ†‹‹•–”ƒ–‹˜‡ ‘–”‘Ž•ǡ ‹ Ž—†‹‰ ‡”•‘ƒŽ ”‘–‡ –‹˜‡ “—‹’‡– ȋȌǤ Š‡ ƒ—ˆƒ –—”‡” •ŠƒŽŽ
provide the following information to the user:
Ȅ ‰‹‡‡”‹‰‡ƒ•—”‡•ǣ‡”‰‡ ›•–‘’‹–Š‡Žƒ•‡”Šƒœƒ”†ƒ”‡ƒǤ
Ȅ ”‰ƒ‹œƒ–‹‘ƒŽ‡ƒ•—”‡•ǣŠ‡“—ƒŽ‹ϐ‹ ƒ–‹‘‘ˆ’‡”•‘‡Žƒ—–Š‘”‹œ‡†–‘ƒ ‡••–Š‡Žƒ•‡”Šƒœƒ”†
œ‘‡ǡ™Š‹ Š‡ƒ•Ž‡˜‡Ž‘ˆ–”ƒ‹‹‰ƒ†‡†— ƒ–‹‘‘ˆ–Š‡’‡”•‘‡Žƒ†‘•ƒˆ‡–›‹•–”— –‹‘•
given to the personnel.
Ȅ ǣŠ‡”‡“—‹”‡†’‡”•‘ƒŽ’”‘–‡ –‹˜‡‡“—‹’‡–ȋ–›’‡ǡŽ‡˜‡Ž‘ˆ’”‘–‡ –‹‘ȌǤ
 ‡”˜‹ ‡ ‡‰‹‡‡”• –Šƒ– ‡‡† –‘ ™‘” ‹ ƒ ‰—ƒ”†‡† Žƒ•‡” Šƒœƒ”† ƒ”‡ƒǡ ‘” ‹ ‡š ‡•• ‘ˆ –Š‡ 
”‡•’‡ –‹˜‡Ž›Ǥ ”‘–‡ –‹˜‡ ‡ƒ•—”‡• ‹ Ž—†‡ǡ „‡•‹†‡• –‡ Š‹ ƒŽ ƒ† ƒ†‹‹•–”ƒ–‹˜‡ ‡ƒ•ǡ ƒ†‡“—ƒ–‡ ’‡”•‘ƒŽ
’”‘–‡ –‹˜‡‡“—‹’‡–ȋŽƒ•‡”’”‘–‡ –‹˜‡‡›‡™‡ƒ”ǡ’”‘–‡ –‹˜‡ Ž‘–Š‹‰ȌǤ

5.3.3 Safety measures against laser radiation hazards

 –Š‡ˆ‘ŽŽ‘™‹‰ǡ†‡•‹‰”‡“—‹”‡‡–•ˆ‘”•ƒˆ‡–›‡ƒ•—”‡•ƒ‰ƒ‹•–Žƒ•‡””ƒ†‹ƒ–‹‘Šƒœƒ”†•ƒ”‡‰‹˜‡Ǥ

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ILNAS-EN ISO 11553-1:2020 ISO 11553-1:2020(E)

5.3.3.1 Design requirements for safety measures

‘” ƒŽŽ Žƒ•‡” ’”‘ ‡••‹‰ ƒ Š‹‡•ǡ ™‹–Š‘—– ”‡‰ƒ”† –‘ ”‡•–”‹ –‡† ‘” ‘–”‘ŽŽ‡† ƒ ‡••ǡ –Š‡ ˆ‘ŽŽ‘™‹‰
•ŠƒŽŽƒ’’Ž›Ǥ
ƒȌ Š‡Žƒ•‡”ƒ Š‹‡•ŠƒŽŽ„‡‡“—‹’’‡†™‹–Š’”‘–‡ –‹˜‡†‡˜‹ ‡•–‘‡•—”‡ƒ•ƒˆ‡‹•‘Žƒ–‹‘‘ˆ–Š‡Žƒ•‡”
„‡ƒȋ‡Ǥ‰Ǥ„›ƒ•ƒˆ‡–›•Š—––‡”‘”†‡ƒ –‹˜ƒ–‹‘„›•Š—––‹‰‘ˆˆ–Š‡’‘™‡”–‘–Š‡’—’‹‰†‹‘†‡•ȌǤ
b) If human presence in a hazard zone is unavoidable while the machine is functioning (e.g. during
•‡”˜‹ ‡Ȍǡ –Š‡ ƒ Š‹‡ •ŠƒŽŽ „‡ ‡“—‹’’‡† ™‹–Š ƒ ‡ƒ„Ž‹‰ •™‹– Š ‘ˆ ƒ Š‹‡ ‘–‹‘ǡ Žƒ•‡” „‡ƒ
direction and laser beam isolation. See 5.3.3.5.
Ȍ Š‡ †‡•‹‰ ‘ˆ ’”‘–‡ –‹˜‡ †‡˜‹ ‡•ǡ •— Š ƒ• •™‹– Š‡•ǡ •Š—––‡”•ǡ „‡ƒ †‹••‹’ƒ–‹‘ †‡˜‹ ‡• ƒ†
†‡–‡””‹‰Ȁ‹’‡†‹‰ †‡˜‹ ‡•ǡ •ŠƒŽŽ ‡‡– –Š‡ ”‡“—‹”‡‡–• •’‡ ‹ϐ‹‡† ‹  ͸ͲͺʹͷǦͳǣʹͲͳͶ ƒ†
ͳʹͳͲͲǣʹͲͳͲǤ•‹‰Ž‡’”‘–‡ –‹˜‡†‡˜‹ ‡ƒ›„‡—•‡†–‘’”‘˜‹†‡•‹—Ž–ƒ‡‘—•’”‘–‡ –‹‘ƒ‰ƒ‹•–
more than one hazard.
†Ȍ ”‘–‡ –‹˜‡Š‘—•‹‰•ȋ‡ Ž‘•—”‡•Ȍƒ”‡‘–•—„Œ‡ ––‘ ͸ͲͺʹͷǦͶǣʹͲͲ͸ǡ‡šǡ„—–•ŠƒŽŽ‘–Š‡”™‹•‡
conform to IEC 60825-4:2006 or IEC 60825-1:2014. Laser guards (not part of a protective housing)
•ŠƒŽŽ ‘’Ž›™‹–Š”‡“—‹”‡‡–••’‡ ‹ϐ‹‡†‹ ͸ͲͺʹͷǦͶǣʹͲͲ͸ǡ‡šǤ
‡Ȍ ˆ ƒ –‹˜‡ ‰—ƒ”†• ȋ‡Ǥ‰Ǥ ‡“—‹’’‡† ™‹–Š •‡•‘”•Ȍ ƒ”‡ —•‡† ™‹–Š‹ –Š‡ ‡ Ž‘•—”‡ ‘” ‰—ƒ”†‹‰ –Š‡
‘’‘‡– •ŠƒŽŽ „‡ ‹–‡‰”ƒ–‡† ‹ –Š‡ •ƒˆ‡–› ‘–”‘Ž ȋȀȌ ‘ˆ –Š‡ Žƒ•‡” ’”‘ ‡••‹‰ ƒ Š‹‡Ǥ
‡“—‹”‡‡–• ‘ ƒ –‹˜‡ ‰—ƒ”†• ƒ”‡ •’‡ ‹ϐ‹‡† ‹  ͸ͲͺʹͷǦͶǣʹͲͲ͸ǡ ‡š Ǥ Š‡ ƒ—ˆƒ –—”‡”
shall indicate the achieved PL (according to ISO 13849-1:2015) or SIL (according to IEC 62061:2005)
ƒ†–Š‡•›•–‡”‡ƒ –‹‘–‹‡ˆ‘”‹•‘Žƒ–‹‰–Š‡Žƒ•‡”„‡ƒƒ†•ŠƒŽŽ‡•—”‡–Šƒ––Š‡’ƒ••‹˜‡Žƒ•‡”
”‡•‹•–ƒ ‡ȋ–‹‡Ȍ‘ˆ‰—ƒ”†Ȁ™‹†‘™•‹••—ˆϐ‹ ‹‡–ȋŽ‘‰‡”Ȍ–Šƒ–Š‡•›•–‡”‡ƒ –‹‘–‹‡Ǥ
ͳ ƒ••‹˜‡Žƒ•‡”‰—ƒ”†•ǣƒ•‡”‰—ƒ”†™Š‹ Š”‡Ž‹‡•ˆ‘”‹–•‘’‡”ƒ–‹‘‘‹–•’Š›•‹ ƒŽ’”‘’‡”–‹‡•‘Ž›Ǥ
Š‡›ƒ”‡—•‡†ǡ™Š‡–Š‡’Š›•‹ ƒŽŽƒ•‡””‡•‹•–ƒ ‡‘ˆ–Š‡ƒ–‡”‹ƒŽ‹••—ˆϐ‹ ‹‡–ˆ‘”–Š‡‰‹˜‡‹•’‡ –‹‘–‹‡
and FEL (see IEC 60825-4:2006).

NOTE 2 Active laser guards: If the FEL cannot be reduced to a value where common guarding materials
’”‘˜‹†‡ ƒ†‡“—ƒ–‡ ’”‘–‡ –‹‘ ‹ –Š‡ ˆ‘” ‘ˆ ƒ ’ƒ••‹˜‡ Žƒ•‡” ‰—ƒ”†ǡ ƒ ƒ –‹˜‡ Žƒ•‡” ‰—ƒ”† ƒ „‡ —•‡† ȋ•‡‡
IEC 60825-4:2006)

͵ ͸ͲͺʹͷǦͶǣʹͲͲ͸ǡ‡š’”‘˜‹†‡•‹ˆ‘”ƒ–‹˜‡‰—‹†‡Ž‹‡•‘–Š‡ƒ””ƒ‰‡‡–ƒ†‹•–ƒŽŽƒ–‹‘
‘ˆŽƒ•‡”‰—ƒ”†•ǡ‡š ’”‘˜‹†‡•‹ˆ‘”ƒ–‹‘ˆ‘”ƒ••‡••‹‰–Š‡•—‹–ƒ„‹Ž‹–›‘ˆŽƒ•‡”‰—ƒ”†•Ǥ

ˆȌ Š‡„‡ƒ†‡Ž‹˜‡”›•›•–‡‘”’ƒ”–•‘ˆƒ„‡ƒ†‡Ž‹˜‡”›•›•–‡•ŠƒŽŽ ‘’Ž›™‹–Š–Š‡”‡“—‹”‡‡–•

•’‡ ‹ϐ‹‡†‹ ͸ͲͺʹͷǦͶǣʹͲͲ͸ǡ‡š Ǥ
‰Ȍ Š‡‡˜‡” ƒ† ™Š‡”‡˜‡” –Š‡”‡ ƒ”‡ —Ž–‹’Ž‡ Žƒ•‡” •‘—” ‡• ȏ‡Ǥ‰Ǥ ˆ”‘ ƒ „ƒ Ǧ—’ Žƒ•‡”ǡ ‡‡”‰›
•Šƒ”‡—Ž–‹’Ž‡šȋ„‡ƒ•’Ž‹–Ȍ‘”–‹‡•Šƒ”‡—Ž–‹’Ž‡šȋ„‡ƒ•™‹– ŠȌȐ–Š‡•ƒˆ‡–› ‘–”‘Ž•ˆ‘”‡ƒ Š
”‡•’‡ –‹˜‡ ™‘” •–ƒ–‹‘ǡ ’”‘ ‡•• œ‘‡ ‘” Žƒ•‡” Šƒœƒ”† œ‘‡ •ŠƒŽŽ „‡ ƒ—–‘ƒ–‹ ƒŽŽ› ‘‡ –‡† ‘”
ƒ••‘ ‹ƒ–‡†™‹–Š‡ƒ Š”‡•’‡ –‹˜‡Žƒ•‡”•‘—” ‡ǡ•— Š–Šƒ–™Š‡–Šƒ–•–ƒ–‹‘̵•‹–‡”Ž‘ •‘”‡‡”‰‡ ›
•–‘’•‘”‘–Š‡”’”‘–‡ –‹˜‡†‡˜‹ ‡•‡•‘”•ƒ”‡ƒ –‹˜ƒ–‡†ǡ‘Šƒœƒ”†‘—•Žƒ•‡”‡‡”‰› ƒ„‡†‹”‡ –‡†
to that station or zone.
NOTE 4 The laser machine can be operated in manual intervention mode under the conditions described
—†‡”–Š‡‘†‡•ˆ‘”’”‘†— –‹‘ǡ•‡”˜‹ ‡‘”•‡––‹‰Ǥ

5.3.3.2 Protection against laser radiation hazards during production

Š‡’”‹ ‹’ƒŽŠƒœƒ”†œ‘‡‹•—•—ƒŽŽ›–Š‡’”‘ ‡••œ‘‡„—––Š‡Šƒœƒ”†œ‘‡•ŠƒŽŽ„‡†‡ϐ‹‡†ƒ•ƒ”‡•—Ž–

‘ˆ –Š‡ ”‹• ƒ••‡••‡–Ǥ Š‡ ”‹• ƒ••‡••‡– •ŠƒŽŽ ‹†‹ ƒ–‡ ™Š‹ Š –›’‡ ‘ˆ ‰—ƒ”†‹‰ ȋŽ‘ ƒŽ ’”‘–‡ –‹‘
‘”’‡”‹’Š‡”ƒŽ’”‘–‡ –‹‘Ȍ‹•–‘„‡—•‡†ǤŠ‡ƒ’’Ž‹ ƒ„Ž‡–›’‡‘ˆ‰—ƒ”†‹‰†‡’‡†•‘–Š‡†‡•‹‰‘ˆ–Š‡
ƒ Š‹‡ƒ†–Š‡‰—ƒ”†•”‡•’‡ –‹˜‡Ž›ȋ•‡‡ƒŽ•‘ ͸ͲͺʹͷǦͶǣʹͲͲ͸ǡ‡š ǣ —‹†‡Ž‹‡ˆ‘”ƒ••‡••‹‰–Š‡
•—‹–ƒ„‹Ž‹–›‘ˆŽƒ•‡”‰—ƒ”†•ȌǤ
Local protection is a method of guarding to reduce laser radiation and associated optical radiation to a
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ISO 11553-1:2020(E) ILNAS-EN ISO 11553-1:2020

ˆ‘ —•ƒ––Š‡™‘”’‹‡ ‡Ȍ™‹–Š‘—––‘–ƒŽŽ›‡ Ž‘•‹‰–Š‡™‘”’‹‡ ‡ǡ–Š‡™‘”’‹‡ ‡•—’’‘”–ƒ†Ȁ‘”ƒ Š‹‡

‘–‹‘•›•–‡Ǥ
ͳ ’’Ž‹‡† ˆ‘” Žƒ•‡” ƒ”‹‰ •›•–‡• „‡‹‰ ‹–‡‰”ƒ–‡† ‹ ƒ ‘’Ž‡š ’ƒ ƒ‰‹‰ ƒ Š‹‡ ‘”
bottling line.

Peripheral protection is a method of guarding to reduce laser radiation and associated optical radiation
–‘ ƒ •ƒˆ‡ Ž‡˜‡Ž „ƒ•‡† ‘ ƒ ”‹• ƒ••‡••‡– „› ‡ƒ• ‘ˆ ‘‡ ‘” ‘”‡ †‹•–ƒ– ‰—ƒ”†• ȋ‡Ǥ‰Ǥ ƒ ’”‘–‡ –‹˜‡
‡ Ž‘•—”‡ ‘” ƒ Žƒ•‡” ƒ„‹Ȍ –Šƒ– ‡ Ž‘•‡ –Š‡ ™‘”’‹‡ ‡ǡ ™‘”’‹‡ ‡ •—’’‘”– ƒ†ǡ —•—ƒŽŽ›ǡ ‘•– ‘ˆ –Š‡
ƒ Š‹‡‘–‹‘•›•–‡Ǥ
ʹ ’’Ž‹‡† ˆ‘” Žƒ•‡” —––‹‰ ƒ Š‹‡•ǡ ‹ ”‘ƒ Š‹‹‰ Žƒ•‡” ƒ Š‹‡•ǡ Žƒ•‡” ƒ††‹–‹˜‡
manufacturing.

Š‡ –›’‡ ‘ˆ ’”‘–‡ –‹‘ ƒ† –Š‡ ”‡“—‹”‡‡–• ‘ –Š‡ ‰—ƒ”†‹‰ ™‹ŽŽ †‡’‡† ‘ •‡˜‡”ƒŽ ˆƒ –‘”•ǡ ˆ‘”
‹•–ƒ ‡ȋ•‡‡ƒŽ•‘ ͸ͲͺʹͷǦͶǣʹͲͲ͸ǡ‡š Ȍǣ
ƒȌ –Š‡’‘™‡”†‡–‡”‹‹‰Žƒ•‡”’ƒ”ƒ‡–‡”•ǡȋ‡Ǥ‰ǤŽƒ•‡”’‘™‡”ǡ’—Ž•‡†—”ƒ–‹‘ǡ’—Ž•‡‡‡”‰›ǡ”‡’‡–‹–‹‘
”ƒ–‡ǡ™ƒ˜‡Ž‡‰–ŠȌǢ
„Ȍ –Š‡‘’–‹ ƒŽ‡Ž‡‡–•ȋˆ‘”‡šƒ’Ž‡ǡˆ‘ ƒŽŽ‡‰–ŠȌǡ”‡•—Ž–‹‰‹‹””ƒ†‹ƒ ‡‘””ƒ†‹ƒ–‡š’‘•—”‡ƒ––Š‡
™‘”’‹‡ ‡‘”‰—ƒ”†Ǣ
Ȍ –Š‡†‹”‡ –‹‘ȋϐ‹š‡†‘”˜ƒ”‹ƒ„Ž‡Ȍ‘ˆ„‡ƒ’”‘’ƒ‰ƒ–‹‘™‹–Š”‡‰ƒ”†–‘–Š‡™‘”’‹‡ ‡ǡȋ™‘”‹‰™‹–Š
•–ƒ–‹ ‘’–‹ ƒŽ‡Ž‡‡–•‘”• ƒ‡”‘’–‹ •ȌǢ
†Ȍ –Š‡ –›’‡ ‘ˆ ƒ Š‹‹‰ ‘’‡”ƒ–‹‘ –‘ „‡ ”‡ƒŽ‹œ‡† ȋ —––‹‰ǡ ™‡Ž†‹‰ǡ ‡– ǤȌǡ ȋ‡Ǥ‰Ǥ Šƒ†Ž‹‰ ‘” ”‘„‘–
•›•–‡ǣ†‹‡•‹‘•ǡ—„‡”‘ˆƒš‹•ǡŽƒ•‡”Š‡ƒ†ȌǢ
‡Ȍ –Š‡ƒ–‡”‹ƒŽƒ†•Šƒ’‡‘ˆ–Š‡™‘”’‹‡ ‡–‘„‡’”‘ ‡••‡†ǡȋ‡Ǥ‰Ǥ•‹œ‡‘ˆ–Š‡™‘”’‹‡ ‡ǡ•Šƒ’‡ȌǢ
ˆȌ –Š‡ ™‘”’‹‡ ‡ •—’’‘”–ǡ ȋ‡Ǥ‰Ǥ ƒ—ƒŽŽ›Ȁƒ—–‘ƒ–‹ ƒŽŽ›ǡ ‘–‹—‘—• •—’’‘”– ˆ‘” ‡Ǥ‰Ǥ –—„‡•ȀŠ‘•‡•ǡ
†‹• ‘–‹—‘—••—’’‘”–ȌǢ
‰Ȍ –Š‡ ˜‹•‹„‹Ž‹–› ‘ˆ –Š‡ ’”‘ ‡•• œ‘‡ ȋ‡Ǥ‰Ǥ –›’‡ ‘ˆ Žƒ•‡” ™‹†‘™ǣ ƒ –‹˜‡Ȁ’ƒ••‹˜‡ǡ ’”‘ ‡•• ˜‹‡™‹‰ „›
ƒ‡”ƒƒ†‘‹–‘”•›•–‡•ȌǤ

5.3.3.3 Protection against laser radiation hazards during setting mode (teaching, path
’”‘‰”ƒ‹‰ƒ†’”‘‰”ƒ‡˜‡”‹ϐ‹ ƒ–‹‘™‹–Š‘—–’”‘ ‡••‹‰Ȍ

—”‹‰•‡––‹‰‘†‡ǡŠ—ƒƒ ‡••–‘Žƒ•‡””ƒ†‹ƒ–‹‘‡š ‡‡†‹‰–Š‡ˆ‘”Žƒ••ͳ•ŠƒŽŽ„‡’”‡˜‡–‡†

‡š ‡’–ˆ‘”Žƒ•‡””ƒ†‹ƒ–‹‘‡‹––‡†‹–Š‡™ƒ˜‡Ž‡‰–Š”ƒ‰‡‘ˆͶͲͲ–‘͹ͲͲ™Š‡Š—ƒƒ ‡••–‘
Žƒ•‡””ƒ†‹ƒ–‹‘•ŠƒŽŽ‘–‡š ‡‡†–Š‡ˆ‘”Žƒ••͵Ǥ
 š’‘•—”‡Ž‹‹–•ˆ‘”–Š‡‡›‡ƒ†–Š‡•‹‘ˆ‡’Ž‘›‡‡•‹–Š‡™‘”’Žƒ ‡ƒ†–Š‡‰‡‡”ƒŽ’—„Ž‹ ƒ”‡‹
ƒ› ‘—–”‹‡• •’‡ ‹ϐ‹‡† ‹ ƒ–‹‘ƒŽ Žƒ™•Ǥ Š‡ Ž‡‰ƒŽŽ› „‹†‹‰ ƒ–‹‘ƒŽ ‡š’‘•—”‡ Ž‹‹–• ‹‰Š– †‹ˆˆ‡” ˆ”‘ –Š‡
•—•‡†‹–Š‹••–ƒ†ƒ”†ǤŠ‡”‡ˆ‘”‡ǡ”ƒ†‹ƒ–‹‘‡‹––‡†‹–Š‡™ƒ˜‡Ž‡‰–Š”ƒ‰‡‘ˆͶͲͲ–‘͹ͲͲ™Š‡
human access to laser radiation might be limited to the AEL for Class 2.

5.3.3.4 Protection against laser radiation hazards during service mode

—”‹‰ •‡”˜‹ ‡ ‘†‡ǡ Š—ƒ ƒ ‡•• –‘ Žƒ•‡” ”ƒ†‹ƒ–‹‘ ‡š ‡‡†‹‰ –Š‡  ˆ‘” Žƒ•• ͳ ‹• •‘‡–‹‡•
—ƒ˜‘‹†ƒ„Ž‡Ǥ ƒ Š‹‡• •ŠƒŽŽ –Š‡”‡ˆ‘”‡ „‡ †‡•‹‰‡†ǡ ƒ† ƒ’’”‘’”‹ƒ–‡ •ƒˆ‡–› ‡ƒ•—”‡• ’”‘˜‹†‡†ǡ ™‹–Š
respect to the following four situations (listed in order of preference):
ƒȌ •‡”˜‹ ‹‰ –ƒ‡• ’Žƒ ‡ ‘—–•‹†‡ –Š‡ Žƒ•‡” Šƒœƒ”† ƒ”‡ƒ ȋƒ ‘”†‹‰ –‘  ͸ͲͺʹͷǦͳǣʹͲͳͶȌǢ ‘ ˆ—”–Š‡”
’”‘–‡ –‹‘‹•‡ ‡••ƒ”›Ǥ
b) servicing takes place in a laser hazard area to which access is controlled in the same manner as
†—”‹‰’”‘†— –‹‘Ǣ’”‘–‡ –‹˜‡‡ƒ•—”‡•‹ Ȍƒ’’Ž›Ǥ
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ILNAS-EN ISO 11553-1:2020 ISO 11553-1:2020(E)

Ȍ •‡”˜‹ ‹‰–ƒ‡•’Žƒ ‡‹ƒŽƒ•‡”Šƒœƒ”†ƒ”‡ƒȋ‡Ǥ‰Ǥ™‹–Š‘’‡‰—ƒ”†•–Šƒ–ƒ”‡‘”ƒŽŽ› Ž‘•‡††—”‹‰

’”‘†— –‹‘Ȍ„—–ƒ ‡••‹„Ž‡Žƒ•‡””ƒ†‹ƒ–‹‘†‘‡•‘–‡š ‡‡†–Š‡ˆ‘”Žƒ••ͳǤ
š’‘•—”‡ƒ„‘˜‡ˆ‘” Žƒ••ͳ•ŠƒŽŽ„‡’”‡†‘‹ƒ–Ž›’”‡˜‡–‡†„›‡‰‹‡‡”‹‰•ƒˆ‡–›‡ƒ•—”‡•
†‡• ”‹„‡† ‹  ͸ͲͺʹͷǦͳǣʹͲͳͶǡ ‡Ǥ‰Ǥ ’”‘–‡ –‹˜‡ ‡“—‹’‡– –‘ †‡–‡ – –Š‡ ’”‡•‡ ‡ ‘ˆ ’‡”•‘• ‡Ǥ ‰Ǥ
‘’–‘Ǧ‡Ž‡ –”‘‹  ’”‘–‡ –‹˜‡ †‡˜‹ ‡• ȋƒ•‡”• ƒ‡”ȌǤ ˆ ’ƒ”–• ƒ”‡ ‹–‡‰”ƒ–‡† ‹ ƒ •ƒˆ‡–› ‘–”‘Žǡ
”‡“—‹”‡‡–••’‡ ‹ϐ‹‡†‹ ͳ͵ͺͶͻǦͳǣʹͲͳͷƒ†Ȁ‘” ͸ʹͲ͸ͳǣʹͲͲͷ•ŠƒŽŽ„‡‡–Ǥ
†‹‹•–”ƒ–‹˜‡ •ƒˆ‡–› ‡ƒ•—”‡• ȋŽ‘ Ǧ‘—–Ȁ–ƒ‰‘—–ǣ Ȍǡ ‡Ǥ‰Ǥ –‘ Ž‘ Ǧ‘—– ȋ‡Ǥ‰Ǥ ™‹–Š ƒ ’ƒ†Ž‘ Ȍ ƒ
Žƒ•‡” ƒ„‹†‘‘”•‘–Šƒ––Š‡†‘‘”Ȁ‹–‡”Ž‘ ‹•‘’‡ƒ†–Š‡”‡ˆ‘”‡‡š’‘•—”‡ƒ„‘˜‡ˆ‘” Žƒ••ͳ‹•
’”‡˜‡–‡†„›Ȁǡ•ŠƒŽŽ„‡—•‡†ƒ••—„‘”†‹ƒ–‡†‡ƒ•—”‡Ǥ
†Ȍ •‡”˜‹ ‹‰ –ƒ‡• ’Žƒ ‡ ‹ Šƒœƒ”† œ‘‡•ǡ ˆ‘” ‡šƒ’Ž‡ „‡ ƒ—•‡ ‘’‡‹‰ ‘ˆ ‰—ƒ”†• ȋ‘”ƒŽŽ› Ž‘•‡†
†—”‹‰’”‘†— –‹‘Ȍ‹•‡ ‡••ƒ”›Ǥ –Š‹• ƒ•‡ƒ ‡••‹„Ž‡Žƒ•‡””ƒ†‹ƒ–‹‘‡š ‡‡†•–Š‡ˆ‘”Žƒ••ͳǤ
ˆ•‡”˜‹ ‹‰–ƒ‡•’Žƒ ‡‹–Š‡Žƒ•‡”Šƒœƒ”†ƒ”‡ƒ–Š‡”‡“—‹”‡‡–•‘ˆ5.3.2.3 shall be met.
Š‡ƒ—ˆƒ –—”‡”•ŠƒŽŽ‹†‹ ƒ–‡–Š‡‡ˆˆ‡ –‹˜‡ Žƒ••‘ˆƒ ‡••‹„Ž‡Žƒ•‡””ƒ†‹ƒ–‹‘ƒ•‹†‹ ƒ–‡†„›–Š‡
™Š‡‹–Š‡•‡”˜‹ ‡‘†‡ƒ†”‡ ‘‡†‡†•ƒˆ‡–›’”‘ ‡†—”‡•ˆ‘”‡ƒ Š‘ˆ–Š‡•‡•‹–—ƒ–‹‘•Ǥ

5.3.3.5 Protection against laser radiation hazard by operating mode selector switch

Š‡‘’‡”ƒ–‹‰‘†‡•‡Ž‡ –‘”•™‹– Š‡ƒ„Ž‡•–Š‡•‡Ž‡ –‹‘‘ˆƒ Š‹‡ˆ— –‹‘• Šƒ”ƒ –‡”‹œ‡†„›†‹ˆˆ‡”‡–

”‹•Ž‡˜‡Ž•™‹–Š”‡‰ƒ”†–‘Žƒ•‡””ƒ†‹ƒ–‹‘Šƒœƒ”†•Ǣ‡Ǥ‰Ǥ‘”ƒŽ—•‡Ȁƒ—–‘ƒ–‹ ‘†‡˜•Ǥ•‡”˜‹ ‡‘†‡Ǥ
–Š‡„ƒ•‹•‘ˆ–Š‡”‹•ƒ••‡••‡––Š‡ƒ—ˆƒ –—”‡”•ŠƒŽŽ†‡ϐ‹‡”‡“—‹”‡‡–•‘–Š‡‘’‡”ƒ–‹‰‘†‡
selector switch and the authorization control for the operating mode selector switch.
ˆ–Š‡‘†‡•‡Ž‡ –‹‘ ƒ‰‹˜‡”‹•‡–‘—•ƒˆ‡‘’‡”ƒ–‹‘‘ˆ–Š‡ƒ Š‹‡ȋ‡Ǥ‰Ǥ„›—ƒ—–Š‘”‹œ‡†‘”™”‘‰
•‡Ž‡ –‹‘‘ˆ•‡”˜‹ ‡‘†‡”‡•—Ž–‹‰‹Šƒœƒ”†‘—•ƒ ‡••‹„Ž‡‡‹••‹‘Ž‡˜‡ŽȋȌ‘ˆŽƒ•‡””ƒ†‹ƒ–‹‘Ȍǡ–Š‡
‘’‡”ƒ–‹‰‘†‡•‡Ž‡ –‘”•™‹– Š•ŠƒŽŽ„‡Ž‘ ƒ„Ž‡ƒ†‹–‡‰”ƒ–‡†‹–Š‡•ƒˆ‡–› ‘–”‘Ž‘ˆ–Š‡ƒ Š‹‡Ǥ
Š‡”‡“—‹”‡‡–•‘–Š‡‘’‡”ƒ–‹‰‘†‡•‡Ž‡ –‘”•™‹– ŠȋŠ‡”‡r) shall be determined in accordance
with ISO 13849-1:2015 and ISO 12100:2010.
 ˆ ƒ’’”‘’”‹ƒ–‡ǡ ƒ ‘’‡”ƒ–‹‰ ‘†‡ •‡Ž‡ –‘” •™‹– Š ƒ „‡ ƒ’’Ž‹‡† –‘ ƒ˜‘‹† ƒ‹’—Žƒ–‹‘ ȋ•‡‡ ƒŽ•‘
ISO 14119:2013).

5.3.4 Engineering control measures

–Š‡ˆ‘ŽŽ‘™‹‰ǡ‡‰‹‡‡”‹‰ ‘–”‘Ž‡ƒ•—”‡•™‹–Š”‡‰ƒ”†–‘†‡•‹‰ƒ† ‘–”‘Ž•ƒ”‡Ž‹•–‡†ǣ

Ȅ Š‡ƒ—ˆƒ –—”‡”•ŠƒŽŽˆ‘ŽŽ‘™‰‡‡”ƒŽ’”‹ ‹’Ž‡•ˆ‘”†‡•‹‰ǡ”‹•ƒ••‡••‡–ƒ†”‹•”‡†— –‹‘ˆ‘”
Žƒ•‡”’”‘ ‡••‹‰ƒ Š‹‡•‡š’Žƒ‹‡†‹ ͳʹͳͲͲǣʹͲͳͲǤ
Ȅ Š‡‰‡‡”ƒŽ”‡“—‹”‡‡–•ˆ‘”–Š‡•ƒˆ‡–›‘ˆ–Š‡‡Ž‡ –”‹ ƒŽ‡“—‹’‡–‘ˆŽƒ•‡”’”‘ ‡••‹‰ƒ Š‹‡•
described in IEC 60204-1:2016 shall be observed.
Ȅ Š‡•–ƒ”–Ȁ•–‘’ ‘–”‘Ž•‘ˆƒŽƒ•‡”’”‘ ‡••‹‰ƒ Š‹‡•ŠƒŽŽ ‘’Ž›™‹–Š–Š‡”‡“—‹”‡‡–••’‡ ‹ϐ‹‡†
in ISO 60204-1:2016 and ISO 13849-1:2015.
Ȅ Š‡ ‡‡”‰‡ › •–‘’ ‘–”‘Ž• •ŠƒŽŽ „‡ †‡•‹‰‡† ƒ ‘”†‹‰ –‘ –Š‡ ”‡“—‹”‡‡–• •’‡ ‹ϐ‹‡† ‹
ISO 13850:2012 and IEC 60204-1:2016.
Ȅ ƒˆ‡–› ”‡Žƒ–‡† ’ƒ”–• ‘ˆ ‘–”‘Ž •›•–‡• ‘ˆ Žƒ•‡” ’”‘ ‡••‹‰ ƒ Š‹‡• •ŠƒŽŽ ‘’Ž› ™‹–Š –Š‡
”‡“—‹”‡‡–•‰‹˜‡‹ ͸ͲͺʹͷǦͳǣʹͲͳͶǡ ͸ͲʹͲͶǦͳǣʹͲͳ͸ǡ ͳ͵ͺͶͻǦͳǣʹͲͳͷǡ‘” ͸ʹͲ͸ͳǣʹͲͲͷǤ
A risk assessment shall be performed according to ISO 12100:2010.
Ȅ Š‹•”‹•‡•–‹ƒ–‹‘ˆ‘”†ƒƒ‰‡–‘•‹‰Š–Ž‡ƒ†•ƒ–Ž‡ƒ•––‘ƒ”‡“—‹”‡†‡”ˆ‘”ƒ ‡‡˜‡Ž”α ‘”‹ƒ
ƒˆ‡–› –‡‰”‹–›‡˜‡Ž αͳǤ ˆ–Š‡ƒ ‡••‹„Ž‡‹””ƒ†‹ƒ ‡‘”–Š‡”ƒ†‹ƒ–‡š’‘•—”‡‡š ‡‡†•–‡–‹‡•
–Š‡‘ˆŽƒ•‡” Žƒ••ͳƒ•†‡ϐ‹‡†‹ ͸ͲͺʹͷǦͳǣʹͲͳͶǡ–Š‡ƒ‡”ˆ‘”ƒ ‡‡˜‡Ž”ᆋ•”‡“—‹”‡†Ǥ

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ISO 11553-1:2020(E) ILNAS-EN ISO 11553-1:2020

— Provisions for the safe isolation of the laser beam shall be designed in compliance with
͸ͲͺʹͷǦͳǣʹͲͳͶǡͶǤ͵ȋ”‡ƒ•‘ƒ„Ž›ˆ‘”‡•‡‡ƒ„Ž‡•‹‰Ž‡ˆƒ—Ž– ‘†‹–‹‘ˆ‘”‘”ƒŽ‘’‡”ƒ–‹‘ȌǤ

͸ ‡”‹ϐ‹ ƒ–‹‘‘ˆ–Š‡•ƒˆ‡–›”‡“—‹”‡‡–•ƒ†”‹•”‡†— –‹‘‡ƒ•—”‡•

Š‡ƒ—ˆƒ –—”‡”•ŠƒŽŽ˜‡”‹ˆ›–Š‡ˆ‘ŽŽ‘™‹‰Ǥ
Š‡ ˜‡”‹ϐ‹ ƒ–‹‘ ‘ˆ –Š‡ •ƒˆ‡–› ”‡“—‹”‡‡–• ƒ† ”‹• ”‡†— –‹‘ ‡ƒ•—”‡• ˆ‘” –Š‡ Žƒ•‡” ’”‘ ‡••‹‰
machine and the validation of the design and the function of the laser processing machine shall be
ƒ””‹‡†‘—–‹ƒ ‘”†ƒ ‡™‹–Š”‡Ž‡˜ƒ–•–ƒ†ƒ”†•ǡ•‡‡Table 2.
Š‡”‹•ƒ••‡••‡–•ŠƒŽŽ„‡˜‡”‹ϐ‹‡†–‘‡•—”‡–Šƒ–ƒŽŽ”‡ƒ•‘ƒ„Ž›ˆ‘”‡•‡‡ƒ„Ž‡Šƒœƒ”†•ƒ†”‡ƒ•‘ƒ„Ž›
ˆ‘”‡•‡‡ƒ„Ž‡ˆƒ—Ž– ‘†‹–‹‘•ƒ”‡‹†‡–‹ϐ‹‡†ƒ†ǡ‹ˆ‡ ‡••ƒ”›ǡ ‘””‡ –‹˜‡‡ƒ•—”‡•Šƒ˜‡„‡‡–ƒ‡Ǥ
Š‡ ˜‡”‹ϐ‹ ƒ–‹‘ ƒ† ˜ƒŽ‹†ƒ–‹‘ ‘ˆ –Š‡ •ƒˆ‡–› ”‡“—‹”‡‡–• ƒ† ”‹• ”‡†— –‹‘ ‡ƒ•—”‡• ‹ Ž—†‡•
ˆ‘ŽŽ‘™‹‰‡ƒ•—”‡•ǡ„—–ƒ”‡‘–Ž‹‹–‡†–‘
ƒȌ ˜‹•—ƒŽ‹•’‡ –‹‘ǡ
„Ȍ ’”ƒ –‹ ƒŽ‹•’‡ –‹‘Ȁˆ— –‹‘ƒŽ–‡•–•ǡ
Ȍ ‡ƒ•—”‡‡–•ǡ
†Ȍ ‘„•‡”˜ƒ–‹‘†—”‹‰‘’‡”ƒ–‹‘ǡ
‡Ȍ ‡”‹ϐ‹ ƒ–‹‘‘ˆƒ’’Ž‹ ƒ–‹‘Ǧ•’‡ ‹ϐ‹ • Š‡ƒ–‹ •ǡ ‹” —‹–•Žƒ›‘—–•ƒ††‡•‹‰†‘ —‡–ǡ
ˆȌ ‡”‹ϐ‹ ƒ–‹‘ ‘ˆ •ƒˆ‡–›Ǧ”‡Žƒ–‡† ƒ’’Ž‹ ƒ–‹‘ •’‡ ‹ϐ‹  Šƒ”†™ƒ”‡ ƒ† •‘ˆ–™ƒ”‡ ‘” •‘ˆ–™ƒ”‡
†‘ —‡–ƒ–‹‘ȋȀȌǡ
‰Ȍ ‡”‹ϐ‹ ƒ–‹‘‘ˆ–Š‡”‹•ƒ••‡••‡–ǡȋ‹ ŽǤ‡˜ƒŽ—ƒ–‹‘•ǡ ƒŽ —Žƒ–‹‘•Ȍǡ
ŠȌ ‡”‹ϐ‹ ƒ–‹‘‘ˆ–Š‡†‡–ƒ‹Ž‡††‡• ”‹’–‹‘ǡ–Š‡Žƒ›‘—–†”ƒ™‹‰•ƒ†‘—–‹‰†‡• ”‹’–‹‘ǡ
‹Ȍ ‡”‹ϐ‹ ƒ–‹‘‘ˆ•’‡ ‹ϐ‹ ƒ–‹‘˜ƒŽ—‡•ƒ†‹ˆ‘”ƒ–‹‘–‘—•‡”Ǥ
NOTE See Table 2.

‡”‹ϐ‹ ƒ–‹‘‘ˆ”‹•”‡†— –‹‘‡ƒ•—”‡•ƒ‰ƒ‹•–Žƒ•‡””ƒ†‹ƒ–‹‘Šƒœƒ”†•‹•”‡Žƒ–‡†–‘†‹ˆˆ‡”‡––‡ Š‹ ƒŽ

issues. Table 2’”‘˜‹†‡•‹ˆ‘”ƒ–‹‘‘–Š‡•ƒˆ‡–›”‡“—‹”‡‡–Ȁ‡ƒ•—”‡ǡ–Š‡‡–Š‘†‘ˆ˜‡”‹ϐ‹ ƒ–‹‘Ȁ
validation and gives reference to applicable standards.

ƒ„Ž‡ʹȄ‡–Š‘†•ˆ‘”˜‡”‹ϐ‹ ƒ–‹‘‘ˆ•ƒˆ‡–›”‡“—‹”‡‡–•Ȁ‡ƒ•—”‡•
‡–Š‘†ˆ‘”‡”‹ϐ‹ ƒ–‹‘ƒ†Ȁ‘”
Validation Reference
Subclause Safety requirements and/or measures
(Standard)
a) b) c) d) e) f) g) h) i)
5.1 ƒ•‡” Žƒ••‹ϐ‹ ƒ–‹‘‘ˆƒ Š‹‡
5.3 †‹ ƒ–‹‘‘ˆ–Š‡Žƒ•‡” Žƒ••ˆ‘”‡˜‡”› š š š IEC 60825-
operating mode 1:2014
5.3.3 Realization of access control to laser š š š š IEC 60825-
hazard area 1:2014
5.3.2.3 Authorization control measures š š š š IEC 60825-
1:2014
5.3.3 Safety related performance of guards
5.3.3.2 ‘”‡•‡‡ƒ„Ž‡‡š’‘•—”‡Ž‹‹–ȋ Ȍ š IEC 60825-
4:2006
Or IEC 60825-
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Table 2 (continued)
‡–Š‘†ˆ‘”‡”‹ϐ‹ ƒ–‹‘ƒ†Ȁ‘”
Validation Reference
Subclause Safety requirements and/or measures
(Standard)
a) b) c) d) e) f) g) h) i)
5.3.3.2 ”‘–‡ –‹˜‡‡š’‘•—”‡Ž‹‹–ȋȌ š š š IEC 60825-
4:2006
Or IEC 60825-
1:2014
5.3.3.2 Design of enclosure/guards free of gaps š š š IEC 60825-
4:2006
Or IEC 60825-
1:2014
5.3.4 Safety related electrical equipment
5.3.4. ‡•‹‰‘ˆ‡Ž‡ –”‹ ‡“—‹’‡– š š š IEC 60204-
1:2016
5.3.4. Design of stop functions and indication š š š IEC 60204-
of stop categories 1:2016
5.3.4. ‡”‰‡ ›•–‘’ š š š IEC 60204-
1:2016
5.1 — Safety related performance of SRP/CS
5.3.3.5
5.3.3.2 †‹ ƒ–‹‘‘ˆ”‡“—‹”‡†’‡”ˆ‘”ƒ ‡ š š š š š IEC 60825-
level PLrƒ†ƒ Š‹‡˜‡†ȋ‡ƒ Š•ƒˆ‡–› 4:2006
function for isolation of laser radiation)
Or IEC 60825-
1:2014
ISO 13849-
2:2012
5.3.3.5 Realization of operating mode selection š š š š IEC 60825-
4:2006
Or IEC 60825-
1:2014
ISO 13849-
2:2012
Safety Labelling
8 ƒ„‡ŽŽ‹‰‘ˆƒˆ‡–›•‹‰• š š š š IEC 60825-
1:2014
ISO 3864

7 Information for use

Š‡ ƒ—ˆƒ –—”‡” •ŠƒŽŽ ˆ‘ŽŽ‘™ –Š‡ ”‡“—‹”‡‡–• ‘ˆ  ͳʹͳͲͲǣʹͲͳͲǡ ͸ǤͶǡ ’”‡’ƒ”‹‰ –Š‡ Šƒ’–‡”
“information for use”.
The manufacturer should consider IEC/IEEE 82079-1:2019.
The information for use (manual) of the laser machine shall at least include the following laser radiation
hazards related issues.
The manufacturer shall:
Ȅ †‡ϐ‹‡–Š‡‘”ƒŽ—•‡‘ˆ–Š‡ƒ Š‹‡ƒ†ƒŽŽ‘–Š‡”‘’‡”ƒ–‹‰‘†‡•‹–‡†‡†ˆ‘”–Š‡Žƒ•‡”’”‘ ‡••‹‰
machine.

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Ȅ †‡• ”‹„‡–Š‡”‡•‹†—ƒŽ”‹••‘”–Š‡Šƒœƒ”†•”‡Žƒ–‡†–‘Žƒ•‡””ƒ†‹ƒ–‹‘”‡•’‡ –‹˜‡Ž›ˆ‘”ƒŽŽ’Šƒ•‡•‘ˆ

ƒ Š‹‡Ž‹ˆ‡ƒ†ˆ‘”‡˜‡”›ƒ’’Ž‹ ƒ„Ž‡‘’‡”ƒ–‹‰‘†‡ƒ†•ŠƒŽŽ‹†‹ ƒ–‡–Š‡Ž‡˜‡Ž‘ˆƒ ‡••‹„Ž‡Žƒ•‡”
”ƒ†‹ƒ–‹‘‘”–Š‡Žƒ•‡” Žƒ••ȋƒ ‘”†‹‰–‘ ͸ͲͺʹͷǦͳǣʹͲͳͶȌ”‡•’‡ –‹˜‡Ž›Ǥ
Ȅ ƒ†˜‹•‡—•‡”•‘ˆ‘™’‘–‡–‹ƒŽŽƒ•‡””ƒ†‹ƒ–‹‘Šƒœƒ”†•„›’”‘˜‹†‹‰ƒ’”‘‹‡–Ž›’Žƒ ‡†™ƒ”‹‰
•–ƒ–‡‡–‹–Š‡—•‡”‹•–”— –‹‘•ƒ†Ȁ‘”‘’‡”ƒ–‘”̵•ƒ—ƒŽǤ
Ȅ ‹ Ž—†‡‹ˆ‘”ƒ–‹‘‘Žƒ•‡”•ƒˆ‡–›”‡“—‹”‡‡–•ˆ‘”ƒŽŽ‘’‡”ƒ–‹‰‘†‡•ǡ‹ Ž—†‹‰‹ˆƒ’’Ž‹ ƒ„Ž‡ˆ‘”
–Š‡•‡––‹‰‘†‡ǡ–Š‡ƒ—ƒŽ‹–‡”˜‡–‹‘‘†‡ƒ†•‡”˜‹ ‡‘†‡ǤŠ‹•‹ˆ‘”ƒ–‹‘•ŠƒŽŽ‹ Ž—†‡
general notes on
Ȅ –‡ Š‹ ƒŽ’”‘–‡ –‹˜‡‡ƒ•—”‡•ǡ
Ȅ ‘”‰ƒ‹œƒ–‹‘ƒŽ’”‘–‡ –‹˜‡‡ƒ•—”‡•ǡ
Ȅ ’‡”•‘ƒŽ’”‘–‡ –‹˜‡‡ƒ•—”‡•ǡ‘”’‡”•‘ƒŽ’”‘–‡ –‹˜‡‡“—‹’‡–ǡ”‡•’‡ –‹˜‡Ž›ǡ
Ȅ ‹ˆ ‡ ‡••ƒ”›ǡ •’‡ ‹ˆ› ”‡“—‹”‡‡–• ‘ –Š‡ ”‡“—‹”‡† ’”‘–‡ –‹˜‡ ‡“—‹’‡– ƒ† ”‡ˆ‡” –‘ ”‡•’‡ –‹˜‡
•–ƒ†ƒ”†•Ǣ‡Ǥ‰Ǥ
Ȅ –‡ Š‹ ƒŽƒ†‘”‰ƒ‹œƒ–‹‘ƒŽŽƒ•‡”’”‘–‡ –‹˜‡‡ƒ•—”‡•ǣ ͸ͲͺʹͷǦͳǣʹͲͳͶǡ
Ȅ Žƒ•‡”‰—ƒ”†•ǣ ͸ͲͺʹͷǦͶǣʹͲͲ͸ǡ
Ȅ Ȁˆ‘”•ƒˆ‡‹•‘Žƒ–‹‘‘ˆ–Š‡Žƒ•‡””ƒ†‹ƒ–‹‘ǣ ͳ͵ͺͶͻǦͳǣʹͲͳͷǡ ͳ͵ͺͶͻǦʹǣʹͲͳʹȋƒ†Ȁ‘”
͸ʹͲ͸ͳǣʹͲͲͷȌǡ
Ȅ Žƒ•‡”’”‘–‡ –‹˜‡‡›‡™‡ƒ”ǣʹͲ͹ǣʹͲͳ͹Ǥ
Ȅ ’”‘˜‹†‡•—ˆϐ‹ ‹‡–ƒ†ƒ†‡“—ƒ–‡‹ˆ‘”ƒ–‹‘Š‘™–‘‘’‡”ƒ–‡–Š‡Žƒ•‡”’”‘ ‡••‹‰ƒ Š‹‡‹‘–Š‡”
‘’‡”ƒ–‹‰‘†‡•–Šƒ–Š‡‘”ƒŽ—•‡™‹–Š‘—–„‡‹‰‡š’‘•‡†–‘Žƒ•‡”Šƒœƒ”†•Ǣ‡•’‡ ‹ƒŽŽ›‹ˆ•ƒˆ‡–›
‡“—‹’‡– ‹• ”‡‘˜‡† ‘” ‘˜‡””‹††‡ ‹•–”— –‹‘• ˆ‘” –Š‡ —•‡ ‘ˆ ƒ†‡“—ƒ–‡ ’”‘–‡ –‹˜‡ ‡ƒ•—”‡•
‹ Ž—†‹‰’‡”•‘ƒŽ’”‘–‡ –‹˜‡‡“—‹’‡–•ŠƒŽŽ„‡‰‹˜‡Ǥ
Ȅ †‡ϐ‹‡™Š‹ Šƒ—–Š‘”‹œƒ–‹‘‡ƒ•—”‡•ȋ–‘‡–‡”–Š‡Žƒ•‡”Šƒœƒ”†ƒ”‡ƒȌƒ”‡ ‘’”‹•‡†ƒ†Šƒ˜‡–‘„‡
followed if access to hazardous laser radiation can be possible.
Ȅ ‹ˆ‡ ‡••ƒ”›ǡ†‡ϐ‹‡–Š‡Ž‡˜‡Ž‘ˆ“—ƒŽ‹ϐ‹ ƒ–‹‘‘ˆ’‡”•‘‡Žȋ”‡Žƒ–‡†–‘Žƒ•‡”•ƒˆ‡–›Ȍǡ‰ƒ‹‡†„›–”ƒ‹‹‰
ƒ†‡†— ƒ–‹‘ƒ†‹•–”— –‹‘•ǡ™Š‹ Š‹•”‡“—‹”‡†–‘•‡Ž‡ –•’‡ ‹ϐ‹‡†‘’‡”ƒ–‹‰‘†‡•ƒ†Ȁ‘”™Š‹ Š
‹•”‡“—‹”‡†ƒ ‘”†‹‰–‘–Š‡ƒ ‡••‹„Ž‡Žƒ•‡””ƒ†‹ƒ–‹‘‘”–Š‡Ž‘ ƒ–‹‘ȋ•‡‡Table 1Ȍǡ‹™Š‹ Š–Š‡Žƒ•‡”
processing machine is operated.

8 Labelling
Laser processing machines shall be labelled regarding laser radiation hazards as following:
ƒȌ ƒ Š Žƒ•‡” ’”‘ ‡••‹‰ ƒ Š‹‡ •ŠƒŽŽ „‡ ‡“—‹’’‡† ™‹–Š Žƒ„‡ŽŽ‹‰ ‹ ƒ ‘”†ƒ ‡ ™‹–Š
ISO 3864 (all parts).
Ȅ ƒˆ‡–›•‹‰•ȋ’”‘Š‹„‹–‹‘Ȁ™ƒ”‹‰Ȁƒ†ƒ–‘”›•‹‰•ȌǢ
Ȅ ‘Ž‘—”•ǡ•‹œ‡•ƒ†’”‹–•–›Ž‡•‘ˆ–Š‡Žƒ„‡Ž••ŠƒŽŽ ‘’Ž›™‹–Š–Š‡†‡•‹‰’”‹ ‹’Ž‡•ˆ‘”’”‘†— –
•ƒˆ‡–›Žƒ„‡Ž•ƒ ‘”†‹‰–‘ ͵ͺ͸ͶȋƒŽŽ’ƒ”–•ȌǢ
— Laser radiation labels shall be as described in IEC 60825-1:2014.
„Ȍ Š‡Ž‘ ƒ–‹‘‘ˆŽƒ„‡Ž••ŠƒŽŽ•ƒ–‹•ˆ›–Š‡ˆ‘ŽŽ‘™‹‰”‡“—‹”‡‡–ǣ
— the size and location of the labels shall be such as to make the appropriate labels legible from
‘—–•‹†‡–Š‡Šƒœƒ”†œ‘‡•™‹–Š‘—–‡š’‘•‹‰ƒ›‘‡–‘ƒ›‘ˆ–Š‡Žƒ•‡”Šƒœƒ”†•Ž‹•–‡†‹Clause 4.

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Ȅ ‹ˆ†‹ˆˆ‡”‡–‘’‡”ƒ–‹‘‘†‡•ƒ‡†‹ˆˆ‡”‡–•‡–•‘ˆ•ƒˆ‡–›•‹‰•‡ ‡••ƒ”›ȋ‡Ǥ‰Ǥˆ‘”‘”ƒŽ—•‡
ƒ†•‡”˜‹ ‡Ȍǡ‹–•ŠƒŽŽ Ž‡ƒ”Ž›„‡‹†‹ ƒ–‡†ˆ‘”™Š‹ Š‘’‡”ƒ–‹‰‘†‡™Š‹ Š•‡–‘ˆ•ƒˆ‡–›•‹‰•‹•
applicable.
  ƒ††‹–‹‘ –‘ –Š‡ Žƒ„‡ŽŽ‹‰ ”‡“—‹”‡† „›  ͸ͲͺʹͷǦͳǣʹͲͳͶǡ –Š‡ Žƒ•‡” ’”‘ ‡••‹‰ ƒ Š‹‡ ƒ, if
‡ ‡••ƒ”›ƒ ‘”†‹‰–‘–Š‡”‹•ƒ••‡••‡–ǡ ƒ””›‘–Š‡”’‡”–‹‡– ƒ—–‹‘ƒ”›ƒ†™ƒ”‹‰Žƒ„‡Ž•ȋ‡Ǥ‰Ǥ™ƒ”‹‰
signs about harmful substances or incoherent radiation).

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ISO 11553-1:2020(E) ILNAS-EN ISO 11553-1:2020

Annex A
(informative)

Potential hazards

A.1 General
Š‹• ƒ‡š ‰‹˜‡• ‡šƒ’Ž‡• ‘ˆ Šƒœƒ”†• ‘–Š‡” –Šƒ Žƒ•‡”Ǧ”‡Žƒ–‡† Šƒœƒ”†•ǡ ™Š‹ Š ƒ› ™‡ŽŽ ‡‡† –‘ „‡
considered. The list is not comprehensive.
Š‡”‡“—‹”‡‡–•‘ˆ ͳʹͳͲͲǣʹͲͳͲƒ”‡ƒ’’Ž‹ ƒ„Ž‡–‘ƒŽŽ–Š‡Šƒœƒ”†•Ž‹•–‡†Ǥ

A.2 Inherent hazards emanating from a laser processing machine, but are not
subject of this standard:
ƒȌ ‡ Šƒ‹ ƒŽŠƒœƒ”†•Ǣ
„Ȍ ‡Ž‡ –”‹ ƒŽŠƒœƒ”†•Ǣ
Ȍ –Š‡”ƒŽŠƒœƒ”†•Ǣ
†Ȍ ˜‹„”ƒ–‹‘Šƒœƒ”†•Ǣ
‡Ȍ ‡Ž‡ –”‘ƒ‰‡–‹ ϐ‹‡Ž†Šƒœƒ”†•Ǣ
ˆȌ •‡ ‘†ƒ”›”ƒ†‹ƒ–‹‘Šƒœƒ”†•ǡ•— Šƒ•
ͳȌ Šƒœƒ”†•‰‡‡”ƒ–‡†„›‹‘‹œ‹‰”ƒ†‹ƒ–‹‘ȋǦ”ƒ›•Ȍǡ
ʹȌ Šƒœƒ”†• ‰‡‡”ƒ–‡† „› ‹ ‘Š‡”‡– ‘ŽŽƒ–‡”ƒŽ ȋǡ ‹ ”‘™ƒ˜‡ǡ ‡– ǤȌ ”ƒ†‹ƒ–‹‘ ’”‘†— ‡†ǡ ˆ‘”
‡šƒ’Ž‡ǡ„›ϐŽƒ•ŠŽƒ’•ǡ†‹• Šƒ”‰‡–—„‡•‘” Ǧ’‘™‡”•‘—” ‡•ǡƒ†
͵Ȍ Šƒœƒ”†•‰‡‡”ƒ–‡†„›•‡ ‘†ƒ”›”ƒ†‹ƒ–‹‘†—‡–‘„‡ƒ‡ˆˆ‡ –ȋ–Š‡™ƒ˜‡Ž‡‰–Š‘ˆ–Š‡•‡ ‘†ƒ”›
”ƒ†‹ƒ–‹‘ƒ›„‡†‹ˆˆ‡”‡–ˆ”‘–Šƒ–‘ˆ–Š‡„‡ƒȌǢ
‰Ȍ Šƒœƒ”†•‰‡‡”ƒ–‡†„›‡‰Ž‡ –‹‰‡”‰‘‘‹ ’”‹ ‹’Ž‡•‹ƒ Š‹‡†‡•‹‰Ǣ
h) noise hazards.

A.3 Examples of laser processing by-products

A.3.1 General
Š‡ ˆ‘ŽŽ‘™‹‰ ƒ”‡ ‡šƒ’Ž‡• ‘ˆ •‘‡ ‘ˆ –Š‡ ‘”‡ ‘‘ „›Ǧ’”‘†— –• ‘ˆ ƒ–‡”‹ƒŽ ’”‘ ‡••‹‰ —•‹‰
Žƒ•‡”•ǤŠ‡•‡‡šƒ’Ž‡•ƒ”‡’”‘˜‹†‡†ˆ‘”‹ˆ‘”ƒ–‹‘‘Ž›ƒ†ƒ”‡‘– ‘’”‡Š‡•‹˜‡Ǥ

A.3.2 Processing ceramics

š‹†‡•‘ˆƒŽ—‹‹—ȋƒŽ—‹ƒȌǡƒ‰‡•‹—ǡ ƒŽ ‹—ƒ†•‹Ž‹ ‘Ǥ
‡”›ŽŽ‹—‘š‹†‡ȋŠ‹‰ŠŽ›–‘š‹ ȌǤ

A.3.3 Processing silicon materials

‹”„‘”‡‹ƒ†‹†‡„”‹•ȋ”‡•’‹”ƒ„Ž‡Ǣ ƒtoƒ—•‡•‹Ž‹
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A.3.4 Processing metals

”‘–Š‡‡†‹ ƒŽ’‘‹–‘ˆ˜‹‡™ǡƒ–Ž‡ƒ•––Š‡ˆ‘ŽŽ‘™‹‰‡–ƒŽ•ƒ†–Š‡‹” ‘’‘—†•ƒ”‡”‡Ž‡˜ƒ–ǣ
ǡ”ǡ‹ǡ‘ǡŽǡǡ—ǡ‡ǡ„ǡ„Ǥ
Medical effects are as follows:
ƒȌ –‘š‹ ǣ”6+ǡǡ‘Ǣ
„Ȍ ƒŽŽ‡”‰‹‡•ǡ‡–ƒŽˆ—‡ˆ‡˜‡”ǣǡ—Ǣ
Ȍ Ž—‰ϐ‹„”‘•‹•ǣ‡Ǣ
d) carcinogenic: Cr6+ǡ‹Ǥ
‡”›ŽŽ‹— ‹• ˜‡”› †ƒ‰‡”‘—•Ǥ ‡ƒ˜› ‡–ƒŽ ˆ—‡• ƒ”‡ ”‡ƒ–‡† ™Š‡ ’”‘ ‡••‹‰ ‡Ǥ‰Ǥ ‹ǡ ” ŽŽ‘›•Ǥ Š‡
Š‡‹ ƒŽ ‘’‘•‹–‹‘ ‘ˆ –Š‡ ˆ—‡• ‘””‡Žƒ–‡• ”‘—‰ŠŽ› ™‹–Š –Š‡ ƒ–‡”‹ƒŽ ’”‘ ‡••‡†Ǥ ƒ–‡”‹ƒŽ• ȋ‡Ǥ‰Ǥ
‘ƒ–‹‰•Ȍƒ†ƒŽŽ‘›‡Ž‡‡–•™‹–ŠŽ‘™‡”‡˜ƒ’‘”ƒ–‹‘–‡’‡”ƒ–—”‡ƒ”‡‘˜‡””‡’”‡•‡–‡†Ǥ
‘” •‘Ž†‡”‹‰ ƒ† „”ƒœ‹‰ ƒ’’Ž‹ ƒ–‹‘ „‡‡ƒ–Š ‡–ƒŽ ˆ—‡• ϐŽ—š ˜ƒ’‘—”• ƒ† „›Ǧ’”‘†— –• ƒ „‡
‡š’‡ –‡†Ǥ

A.3.5 Processing plastics

 ‰”‡ƒ– ˜ƒ”‹‡–› ‘ˆ ’‘–‡–‹ƒŽŽ› Šƒœƒ”†‘—• •—„•–ƒ ‡• ƒ „‡ ‡‹––‡†Ǥ – Ž‘™ –‡’‡”ƒ–—”‡•ǡ ƒŽ‹’Šƒ–‹ 
Š›†”‘ ƒ”„‘• ƒ”‡ ’”‘†— ‡†ǡ ™Š‡”‡ƒ• Š‹‰Š‡” –‡’‡”ƒ–—”‡• ”‡•—Ž– ‹ ƒ ‹ ”‡ƒ•‡ ‘ˆ ƒ”‘ƒ–‹ 
Š›†”‘ ƒ”„‘• ȋ•— Š ƒ• „‡œ‡‡ǡ  Ȍ ƒ† ’‘Ž›ŠƒŽ‘‰‡ƒ–‡† ’‘Ž›— Ž‡ƒ” Š›†”‘ ƒ”„‘• ȋ‡Ǥ‰Ǥ †‹‘š‹•ǡ
ˆ—”ƒ‡•ȌǤƒ”–‹ —Žƒ”ƒ–‡”‹ƒŽ• ƒŽ‡ƒ†–‘‡‹••‹‘•‘ˆ ›ƒ‹†‡•ǡ‹•‘ ›ƒƒ–‡•ȋ’‘Ž›—”‡–Šƒ‡•Ȍǡƒ ”›Žƒ–‡•
ȋȌƒ†Š›†”‘‰‡ ŠŽ‘”‹†‡ȋȌǤ
Medical effects include:
ƒȌ –‘š‹ ǣ ›ƒ‹†‡•ǡǡ„‡œ‡‡†‡”‹˜ƒ–‹˜‡•Ǣ
„Ȍ ƒŽŽ‡”‰‡•Ȁ‹””‹–ƒ–•ǣ‹•‘ ›ƒƒ–‡•ǡƒ ”›Žƒ–‡•Ǣ
Ȍ ‹””‹–ƒ–‹‘‘ˆ”‡•’‹”ƒ–‘”›–”ƒ –ǣˆ‘”ƒŽ†‡Š›†‡ǡƒ ”‘Ž‡‹ǡƒ‹‡•Ǣ
†Ȍ ƒ” ‹‘‰‡‹ ǣ„‡œ‡‡ǡ•‘‡ •Ǥ

A.3.6 Processing paper and wood

–ƒ†ƒ”† ‡ŽŽ—Ž‘•‡„›Ǧ’”‘†— –•ǡ‡•–‡”•ǡƒ ‹†•ǡƒŽ ‘Š‘Ž•ƒ†„‡œ‡‡Ǥ

A.3.7 Heat treatment

‡‡”ƒŽŽ›ǡ‘•‹‰‹ϐ‹ ƒ–„›Ǧ’”‘†— –•„—–•‘‡Š‡ƒ˜›‡–ƒŽ˜ƒ’‘—”•ƒ›„‡‰‡‡”ƒ–‡†Ǥ

A.3.8 Unintentionally deteriorated materials

‡‡”ƒ–‹‘‘ˆŠƒœƒ”†‘—•„›Ǧ’”‘†— –•ˆ”‘ƒ–‡”‹ƒŽ•ƒ†•—„•–ƒ ‡•—‹–‡–‹‘ƒŽŽ›†‡–‡”‹‘”ƒ–‡†„›
the laser radiation (e.g. optics).
ǡ‡‘š‹†‡•Ǥ

A.4 Examples of secondary radiation hazards

‡ ‘†ƒ”›”ƒ†‹ƒ–‹‘Šƒœƒ”†•‹ Ž—†‡‘’–‹ ƒŽ”ƒ†‹ƒ–‹‘ˆ”‘–Š‡’”‘ ‡••‹‰œ‘‡ǡ„”‹‰‹‰ƒ„‘—–ǣ
ƒȌ †‡‰”ƒ†ƒ–‹‘‘ˆ’‘Ž›‡”•ƒ†‡‹••‹‘‘ˆ’‘‹•‘‘—•ˆ—‡•ƒ†‰ƒ•‡•ǡ’ƒ”–‹ —Žƒ”Ž›‘œ‘‡Ǣ
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„Ȍ ϐ‹”‡‘”‡š’Ž‘•‹‘Šƒœƒ”†•’‘•‡†„›ϐŽƒƒ„Ž‡ƒ–‡”‹ƒŽ•ƒ†•—„•–ƒ ‡•Ǣ

Ȍ Ǧ”ƒ›•ˆ”‘’Žƒ•ƒ•Ǣ
 †‡” ‡”–ƒ‹ ‹” —•–ƒ ‡•ǡ™Š‡‘’‡”ƒ–‹‰—Ž–”ƒ•Š‘”–’—Ž•‡Žƒ•‡”•ǡǦ”ƒ›”ƒ†‹ƒ–‹‘ ƒƒ”‹•‡ƒ–
–Š‡’”‘ ‡••‹‰’‘‹–Ǥ‡’‡†‹‰‘–Š‡ƒ–‡”‹ƒŽƒ†–Š‡Žƒ•‡”’ƒ”ƒ‡–‡”•ǡƒ„‘˜‡•’‡ ‹ϐ‹ ‹””ƒ†‹ƒ ‡Ž‹‹–•
Ǧ”ƒ›”ƒ†‹ƒ–‹‘ ƒƒ”‹•‡Ǥ‡’‡†‹‰—’‘–Š‡ƒ’’Ž‹ ƒ„Ž‡Ž‘ ƒŽ”‡‰—Žƒ–‹‘•ǡ‘„Ž‹‰ƒ–‹‘• ƒƒ”‹•‡ˆ‘”–Š‡—•‡”Ǥ

š’‘•—”‡ –‘ Ǧ”ƒ› ”ƒ†‹ƒ–‹‘ ‹ Š‹‰Š †‘•‡• ƒ Ž‡ƒ† –‘ Ž‘—†‹‰ ‘ˆ –Š‡ ‡›‡ Ž‡• ƒ† –‘ ƒ ‡”Ǥ
Recommended precautions include enclosing the processing point with materials impenetrable to
Ǧ”ƒ›ǡ—•‹‰˜‹‡™‹‰™‹†‘™•™‹–Šƒ’’”‘’”‹ƒ–‡•Š‹‡Ž†‹‰ǡƒ†ƒ˜‘‹†‹‰ƒ›ƒŽ–‡”ƒ–‹‘•–‘’”‘–‡ –‹˜‡
housings.
†Ȍ Šƒœƒ”†•–‘‡›‡•ƒ†•‹ˆ”‘–Š‡‡‹––‡†”ƒ†‹ƒ–‹‘ƒ†„”‹‰Š–˜‹•‹„Ž‡Ž‹‰Š–Ǥ

A.5 Examples of mechanical hazards

Moving machine parts can be a hazard.
‘„‘–• ƒ’— ŠƒŠ‘Ž‡‹ƒ’”‘–‡ –‹˜‡Š‘—•‹‰ǡ†ƒƒ‰‡–Š‡Žƒ•‡”‘”–Š‡„‡ƒ†‡Ž‹˜‡”›•›•–‡ǡƒ†
point the laser beam at an operator/enclosure wall/viewing window.

A.6 Examples of electrical hazards

A.6.1 Primary hazards
‹‰Š˜‘Ž–ƒ‰‡•ǡ•–‘”‡†‡‡”‰›ǡŠ‹‰Š —””‡– ƒ’ƒ„‹Ž‹–›Ǥ

A.6.2 Secondary hazards

”‘†— –‹‘‘ˆ‡Ž‡ –”‘ƒ‰‡–‹ ”ƒ†‹ƒ–‹‘ϐ‹‡Ž†•ˆ”‘—•Š‹‡Ž†‡† ‘’‘‡–•—†‡”˜‡”›Š‹‰Š˜‘Ž–ƒ‰‡Ǥ

Ǥ͹ šƒ’Ž‡•‘ˆ†‡•‹‰†‡ϐ‹ ‹‡ ‹‡•

‘‘” †‡•‹‰ ‘” ’‘•‹–‹‘‹‰ ‘ˆ ‹–‡”Ž‘  •™‹– Š‡•ǡ •™‹– Š ƒ••‡„Ž‹‡•ǡ ‹–‡”Ž‘  ‹” —‹–•ǡ ‰ƒ• Ž‹‡• ƒ†
gas valves.
ƒ†‡“—ƒ–‡•Š‹‡Ž†‹‰ˆ”‘–Š‡Žƒ•‡””ƒ†‹ƒ–‹‘‘ˆ ƒ„Ž‹‰ƒ†‰ƒ•Ž‹‡•Ǥ

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ȏͳͻȐ  ͳʹͳͻͺǦ͵ǡ Safety of machinery — Assessment and reduction of risks arising from radiation
emitted by machinery — Part 3: Reduction of radiation by attenuation or screening

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ILNAS-EN ISO 11553-1:2020

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