EP3HTS-TC Technical Data Sheet

EP3HTS-TC Master Bond

Polymer System
One component, silver filled epoxy featuring extraordinary electrical and
thermal conductivity

Key Features
3 For bonding, sealing and coating 3 Very long open time at room temperature
3 Not premixed and frozen 3 Cures rapidly at 250 to 300°F

Product Description cycling, and a low coefficient of thermal expansion. The

temperature range is -80°F to +400°F. EP3HTS-TC also
Master Bond EP3HTS-TC is a fast curing, silver filled,
passes NASA low outgassing specifications. There are 2
one part epoxy with unparalleled electrical and thermal
scenarios where EP3HTS-TC would be a top candidate.
conductivity. It is not premixed and frozen and has an
The first is in applications where the lowest possible
unlimited working life at room temperature. It has a
volume resistivity is required. The second is when pre-
paste consistency and dispenses easily from a syringe. It
eminent thermal conductivity is necessary and the need for
cures rapidly at 250 to 300°F with minimal flow and low
electrical conductivity is not a pertinent issue.
shrinkage upon curing. This epoxy should be stored in a
refrigerator at 40 to 50°F.
Product Advantages
Although this product can be used for sealing and coating,
ƒ Single component system, no mixing needed
its main use is as an adhesive for die attach and general
bonding purposes. EP3HTS-TC bonds well to a wide variety ƒ Not premixed and frozen, unlimited working life
of substrates including metals, composites, ceramics, ƒ Ideal viscosity for die attach and general bonding
and many plastics. As a die attach adhesive, it dispenses
ƒ Spectacular electrical and thermal conductivity
smoothly and easily. It is well suited for automatic
dispensing equipment and can be applied without any ƒ NASA low outgassing
tailing. For other types of bonding, it combines remarkable
thermal and electrical conductivity. In fact, the thermal
conductivity exceeds 16 W/(m·k). Other desirable attributes
include excellent dimensional stability, resistance to thermal

Typical Properties
Tensile lap shear strength, aluminum to aluminum, 75°F 600-800 psi
Tensile strength, 75°F 2,000-3,000 psi
Tensile modulus, 75°F 150,000-200,000 psi
Die shear strength, 75°F (2 x 2 mm [80 x 80 mil]) 9-12 kg-f
Hardness, 75°F 60-70 Shore D
Glass transition temperature, (Tg) 58°C
Thermal conductivity, 75°F 110-118 BTU•in/(ft²•hr•°F) [16-17 W/(m·K)]
Coefficient of thermal expansion, 75°F 20-23 x 10-6 in/in/°C
Volume resistivity, 75°F <1x10-6 ohm-cm
Service temperature range -80°F to +400°F [-62°C to +204°C]

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 EP3HTS-TC Technical Data Sheet
Typical Properties (con’t)
Solids content 100%
Specific gravity, 75°F 4.45
Viscosity, 75°F thixotropic paste
Thixotropic index, 75°F 10
Color silver
Cure schedule options
250°F 30-40 minutes
300°F 15-20 minutes
Optimum cure schedule either option above, plus 1-2 hours at 250-300°F
Shelf life at 40-50°F in original, unopened containers minimum 3 months, maximum 6 months

Preparation of Adhesive & Application Handling and Storage

Master Bond EP3HTS-TC does not require any mixing prior
to use. EP3HTS-TC is typically syringe dispensed. The parts
are assembled, fixtured and the epoxy is then cured.
EP3HTS-TC can be used either as a conventional adhesive
or as a die attach. Whenever possible, substrates should
be mechanically roughened or chemically etched. They are
then cleaned and after cleaning, are ready to be bonded.
Cure
EP3HTS-TC requires an elevated temperature cure. Typical
recommended curing schedules are 30-40 minutes at
250°F or 15-20 minutes at 300°F. For optimal properties,
cure at one of the schedules mentioned previously, with
a post cure of 1-2 hours at 250-300°F. Remove excess
adhesive promptly before it hardens with a spatula. Then
wipe with a rag and solvent, such as acetone.
Packaging
Product is available in:
ƒ 20 grams
ƒ 50 grams
ƒ 100 grams
ƒ One pound
ƒ Multiple pounds
Packaged in either syringes or glass jars.
All epoxy resins should be used with good ventilation and
skin contact should be avoided. For safe handling details,
please consult the product SDS. Recommended storage
is in refrigeration at 40-50°F. Containers should, however,
be kept closed when not in use to avoid contamination.
Cleanup of spills and equipment is readily achieved with
aromatic or ketone solvents employing proper precautions
of ventilation and flammability
Certifications
Not to Be Used for Specification Purposes
The values contained herein are considered typical
properties only and are not intended to be used
as specification limits. For assistance in preparing
specifications, please contact Master Bond technical
support for further details.
Notice
Master Bond believes the information on the data sheets
is reliable and accurate as is technical advice provided by
the company. Master Bond makes no warranties, expressed
or implied, regarding the accuracy of the information, and
assumes no liability regarding the handling and use of this
product.

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Master Bond Inc. | Tel: +1 (201) 343-8983 | www.masterbond.com | techinfo@masterbond.com 2