Abbreviation of Manufacturing

RAYMING PCB & ASSEMBLY
Abbreviation of Manufacturing
In PCB manufacturing and electronic device manufacturing, a lot of
abbreviations and acronyms are being used. Each of these abbreviations
and acronyms has its meaning and what they stand for. In most cases it is
important to know what these abbreviations and acronyms mean.
Abbreviations related to a particular industry could have different
meanings. Let’s explore some EMS acronym manufacturing list in this
article.
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Table of Contents
EMS Abbreviation Manufacturing
Abbreviations used in electronic manufacturing services (EMS) are usually
engineering and manufacturing related terms. These manufacturing
abbreviations list can make it easy to express yourself when writing or
compiling a list. Here are some EMS abbreviation manufacturing lists.
AOI
This means automated optical inspection. AOI is a type of inspection
method that uses cam data to check the size, feature, positioning, and
PCB Manufacturing & Assembly Services https://www.raypcb.com/

shape of copper. Also, this inspection can be used in discovering “open”
traces or “shorts.”
ATE
Automatic Test Equipment, popularly called ATE is a piece of
equipment that always checks for functional parameters in order to
determine if there is any low performance. It does this automatically.
Furthermore, this equipment can carry out fault isolation.
ATG
ATG is also called Automatic test generation, which is a test program. This
program functions according to the principle of circuit technology. There is
no need for any manual programming effort when making use of this
program.
ACF
The anisotropic conductive film, which is also known as ACF is simply an
adhesive interconnect system. It is commonly used in LCD manufacturing.
BOM

BOM
The Bill of Material (BOM) is a comprehensive list that offers complete
details of the materials used in the production of circuit boards and
electronic devices. These materials include components, parts, and
subassemblies. In addition, this document reveals the quantity of every
material that is required for the assembly process.
BGA
There are different packaging methods for ICs. The Ball Grid Array (BGA) is
one of those. This IC packaging method helps to attach ICs on
an electronic board.
CAM

CAM also means Computer Aided Manufacturing. It refers to the use of
computer programs and systems in different stages of a manufacturing
process in which a human operator makes decision and a computer
system offers the data manipulation functions.
CAD
Computer Aided Design (CAD) helps engineers and developers to make a
design and view it on a graphics screen. It could also be viewed in a
computer pinout. In electronics manufacturing, you can view the result in
a printed circuit layout.
CBGA
This refers to ceramic ball grid array. It comprises ceramics as its substrate.
CBGA can have solder columns or solder balls to enable connections.
CEM
Contract Electronic Manufacturing, popularly referred to as CEM entails
the manufacturing of electronic equipment or device on behalf of the
OEM (original equipment manufacturing). The OEM owns the brand name.
It usually based on the industry that supplies manufacturing and contact
design for electronics OEMs.
CSP

One of the most common packaging systems in electronics production is
the Chip Scale Package (CSP). This package has numerous benefits. Some
of which include saving of space for circuit board routing and reduced
package size. CSP enhances PCBA yields and also reduce the cost of
manufacturing circuit boards.
CCD
The Charge Coupled Device (CCD) is a popular abbreviation in EMS
manufacturing. It enables the flow of electric charge to occur from
a capacitor to another. CCD is a semiconductor device that electronic
manufacturers use in digital image capture.
DUT
Electrical testing is crucial in PCB production. The Device Under Test (DUT)
is an electronic board that is currently going through electrical testing.
DRC
This means Design Rule Check. In PCB manufacturing, there is a need to
verify some processes to ensure there are no errors. With DRC, a
manufacturer can check if there is any defect or error with the PCB layout.
Before a manufacturer commences with the final production, he needs to

check the PCB designs. The design rule check will help you verify if a PCB
design meets the required standards.
ENIG
There are several surface finish options for coating PCB surface. The
Electroless Nickel Immersion Gold (ENIG) uses electroless nickel plating
and then immersion gold for coating a circuit board surface. The
immersion gold protects the surface from oxidation and corrosion. Since
ENIG contains no lead, it is environmentally ideal.
EMI
Electromagnetic Interference EMI is a common terminology in electronics
production. It occurs when electromagnetic fields experience interference.
This usually causes distortion. EMI can make electronics devices to
function poorly. It is possible to reduce EMI levels by understanding the
cause.
EMC
Electromagnetic Compatibility (EMC) is when electronic devices operate
without interfering with one another. It defines the capability of electronic
devices to interact within their environment without experiencing any
problem.

FPGA
Field programmable array is a semiconductor device you can program
after manufacture. It works around a set of configurable logic blocks (CLBs)
which are always connected through programmable interconnects. The
FPGA comprises many programmable interconnect wiring, flip-flops, and
logic elements.
IPC
There are many organizations that cater to the PCB manufacturing
process. The Institute of Printed Circuits (IPC) is an example of such
organization. It was established to ensure PCB manufacturers strictly
adhere tostrict manufacturing standards. This organizations established
standards which help manufacturers meet their goals of producing high
quality PCBs.
ESD
Electrostatic discharge (ESD) occurs when two objects comes in contact
and discharge static electricity. This occurrence occurs in electronic
devices and could be caused by an electrostatic field or direct contact. ESD
as it is popularly called can cause severe damage electrical equipment.
There are ways to prevent ESD from occurring.

MES
MES is a Manufacturing Execution System which keeps track of the PCB
production process. In addition, this system makes sure all of the steps in
the process are carried out as expected. MES achieves this by gathering
accurate data from each production line.
ICT
ICT stands for In Circuit Test. This test uses an electrical probe to test
a populated PCB. It checks for defaults such as opens, shorts, capacitance,
missing components, and resistance. ICT is generally performed to check
the manufacturing of printed circuit boards. Also, in-circuit test detect any
manufacturing faults in PCBAs by using the bed-of-nails fixture.
IPD
The Integrated Passive Devices (IPD) are manufactured with wafer fab
technologies like photolithography and thin film processing. IPDs can be in
form of wire bondable components or flip chip mountable.
JEDEC

The Joint Electronic Device Engineering Council, popularly known as JEDEC
is a communication network and regulatory organization that represents
the microelectronics industry. This organization comprises leaders from
popular computer manufacturing companies across the world.
LDI
Laser Direct Imaging uses a computerized laser beam to project circuit
path on the circuit board. This imaging technology is capable of writing
patterns on resists that are highly sensitive. It supports digital
PCB production process and offers high resolution.
LPI
Liquid Photo Imageable is a type of ink which is manufactured by using
photographic imaging methods. This ink is a combination of two different
components which provides a coating for PCB surfaces. LPI is primarily

made for curtain coat and spray applications. It is an accurate way of
applying mask.
MOSFET
The full meaning of MOSFET is Metal Oxide Semiconductor
Field Transistor. This is a field-effect transistor that varies the width of a
channel where charge carriers flow. Charge carriers leaves through the
drain when they enter the channel at the source.
OEM
OEM is a commonly used EMS abbreviation. It stands for Original
Equipment Manufacturer. OEMs produce and supply components or
products needed by other companies. They own the brand name of a
particular product.
SPC
SPC deals with the use of statistical methods for analyzing the result of a
specific process. This checks the variation and then takes action to ensure
statistical control.
RoHS
This means Restriction of Hazardous Substances. This abbreviation is used
during EMS manufacturing. This standard is set up for regulating the

utilization of hazardous substances in manufacturing electronic
equipment. The electronic manufacturers must make use of substances
like cadmium, PBB, PDBE, lead, etc.
SiP
This also means Systems in a Package. SiP is a package that is composed
of integrated circuits which are in one module. The SiP performs most of
the functions of the electrical system. SiP can be found in phones and
music players.
PCB Manufacturing Abbreviation List
HASL
This is also called Hot Air Solder Leveling. This refers to a surface finish
whereby a solder layer covers the copper parts left exposed. This option
of surface finish is very cheap and usually utilized in the manufacturing of
PCB. HASL deposit a fair and even coating and always makes the PCB
surface rough.
SMT
SMT can be described as an assembly method which deals with the direct
placement of electronic components on the surface of the circuit boards.

This assembly method is very popular, and it deals with the utilization of
automated machines and equipment such as the reflow
soldering machines.
FR4
FR4 also means flame retardant 4. This is a material used for the
manufacturing of circuit boards. The material is made up of both epoxy
and woven fiberglass.
FPC
FPC or flexible printed circuits are made up of a layer containing different
traces, which are attached to the dielectric layer of a circuit board. The
flexible printed circuits could have just one side, two sides, or many sides.
COB
COB also means chip on board. This is a technology that deals with the
placement of interconnects as well as unpackaged semiconductor die
making use of some techniques such as wire bonding. For such a process,
the manufacturer will mount the bare chips on the printed circuit board.
After this, he or she will attach the wires and then use epoxy or plastic in
covering the chip.
DIMM

This refers to the Dual Inline Memory Module. Also, this is a printed circuit
board having at least one RAM chips having pins. The pins help in linking
the DIMM onto a computer’s motherboard. In addition, the DIMM includes
a 168-pin connector and can enable 64-bit transfer of data.
DIP
This also means dual in-line package. This is a through hole package,
which has leads attached on the package’s opposite sides.
HDI
HDI also means high density interconnect. This is a PCB which possesses a
high density for each of the units. This HDI board’s wiring density is
greater compared to the conventional printed circuit boards. This is why
the HDI boards are usually lighter and smaller and have better electrical
performance.
PCBA
PCBA means Printed Circuit Board Assembly. This is a board having all the
important electronic components attached on it. It is useful for
manufacturing different electrical and electronic equipment.
PTH

This refers to plated through hole. This is a technology for PCB mounting,
which utilizes leads. Here, these leads are placed inside the PCB holes.
These leaded components help in soldering the pads on the circuit board
PCB
PCB or printed circuit board is the basis whereby different electronic
devices are created. It offers electrical connection between the electronic
components.
OSP
This also means Organic Solderability Protective. This is a coating utilized
for PCBs. This is a water-based PCB coating that helps with bonding to
copper. The OSP coating provides some protection for the copper till
soldering is done. Benzimidazoles are the most common compounds
used in this coating.
SMD
SMD, also called surface mount device is a well-known abbreviation
utilized in both PCB and EMS manufacturing. Furthermore, SMDs are
usually mounted on the surface of the printed circuit board and achieved
through automated processes.

PLCC
PLCC is a Plastic Leaded Chip Carrier. It is an integrated circuit package
with J leads on all its four sides. The lead counts of this chip carrier is
always within the range of 20 and 84.
DFM
Design for Manufacturing (DFM) involves assessing the design of a PCB
assembly to reduce manufacturing defects. DFM helps to minimize the
cost of manufacturing a printed circuit board. A PCBA can have a poor
design as regards manufacturing. Therefore, DFM is a crucial process in
PCBA manufacturing.
Conclusion
We explained the meaning of some acronyms and abbreviations in EMS
and PCB production. The information provided above can help you
communicate effectively with your OEM.
Related Posts:
1. How Additive Manufacturing Impacts Jabil Manufacturing Process
2. American Manufacturing Vs. Chinese Manufacturing on Electronic
Devices

3. Principle and Manufacturing Applications of EDM Manufacturing
4. In House PCB Manufacturing vs. Contract Manufacturing
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RAYMING PCB & ASSEMBLY

abbreviations and acronyms are being used. Each of these abbreviations

important to know what these abbreviations and acronyms mean.

Abbreviations related to a particular industry could have different

meanings. Let’s explore some EMS acronym manufacturing list in this

Request PCB Manufacturing & Assembly Quote Now

EMS Abbreviation Manufacturing

Abbreviations used in electronic manufacturing services (EMS) are usually

engineering and manufacturing related terms. These manufacturing

abbreviations list can make it easy to express yourself when writing or

compiling a list. Here are some EMS abbreviation manufacturing lists.

This means automated optical inspection. AOI is a type of inspection

PCB Manufacturing & Assembly Services https://www.raypcb.com/

shape of copper. Also, this inspection can be used in discovering “open”

Automatic Test Equipment, popularly called ATE is a piece of

equipment that always checks for functional parameters in order to

determine if there is any low performance. It does this automatically.

Furthermore, this equipment can carry out fault isolation.

program functions according to the principle of circuit technology. There is

The anisotropic conductive film, which is also known as ACF is simply an

adhesive interconnect system. It is commonly used in LCD manufacturing.

PCB Manufacturing & Assembly Services https://www.raypcb.com/

The Bill of Material (BOM) is a comprehensive list that offers complete

details of the materials used in the production of circuit boards and

electronic devices. These materials include components, parts, and

subassemblies. In addition, this document reveals the quantity of every

material that is required for the assembly process.

one of those. This IC packaging method helps to attach ICs on

PCB Manufacturing & Assembly Services https://www.raypcb.com/

CAM also means Computer Aided Manufacturing. It refers to the use of

computer programs and systems in different stages of a manufacturing

process in which a human operator makes decision and a computer

system offers the data manipulation functions.

Computer Aided Design (CAD) helps engineers and developers to make a

design and view it on a graphics screen. It could also be viewed in a

computer pinout. In electronics manufacturing, you can view the result in

a printed circuit layout.

CBGA can have solder columns or solder balls to enable connections.

Contract Electronic Manufacturing, popularly referred to as CEM entails

the manufacturing of electronic equipment or device on behalf of the

It usually based on the industry that supplies manufacturing and contact

design for electronics OEMs.

PCB Manufacturing & Assembly Services https://www.raypcb.com/

One of the most common packaging systems in electronics production is

manufacturing circuit boards.

The Charge Coupled Device (CCD) is a popular abbreviation in EMS

manufacturing. It enables the flow of electric charge to occur from

a capacitor to another. CCD is a semiconductor device that electronic

manufacturers use in digital image capture.

is an electronic board that is currently going through electrical testing.

This means Design Rule Check. In PCB manufacturing, there is a need to

verify some processes to ensure there are no errors. With DRC, a

Before a manufacturer commences with the final production, he needs to

PCB Manufacturing & Assembly Services https://www.raypcb.com/

design meets the required standards.

Electroless Nickel Immersion Gold (ENIG) uses electroless nickel plating

ENIG contains no lead, it is environmentally ideal.

Electromagnetic Interference EMI is a common terminology in electronics

production. It occurs when electromagnetic fields experience interference.

This usually causes distortion. EMI can make electronics devices to

function poorly. It is possible to reduce EMI levels by understanding the

Electromagnetic Compatibility (EMC) is when electronic devices operate

without interfering with one another. It defines the capability of electronic