Mat Sci Reading Assign 1

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ADAMSON UNIVERSITY

COLLEGE OF ENGINEERING
MECHANICAL ENGINEERING DEPARTMENT

57009
READING ASSIGNMENT
MATERIAL SCIENCE AND ENGINEERING FOR ME LEC

CORTINA, MARK ANTHONY B.


201914060

ENGR. ARNALDO VALINO


INSTRUCTOR

DATE OF SUBMISSION:
1. METALS – ARE CHEMICAL ELEMENTS THAT IS
COMPOSED OF ONE ORE MORE METALLIC ELEMENTS.
A MATERIAL CAPABLE OF CHANGING ITS SHAPE,
RESIST FRACTURE AND ARE GOOD CONDUCTORS OF
HEAT, ELECTRICITY, AND MOST ARE MAGNETIC.
2. CERAMICS - INORGANIC MATERIAL THAT ARE
COMPOUNDS OF/BETWEEN METALLIC ELEMENTS
SIMILAR TO METALS, CERAMIC ARE STIFF AND
STRONG. CERAMICS ARE RESISTANT TO ELECTRICITY
AND HIGH TEMPERATURE COMPARED TO OTHER
MATERIALS.
3. POLYMERS – COULD BE NATURAL OR SYNTHETIC,
POLYMERS ARE COMPOUNDS COMPOSED OF
CARBON, HYDROGEN, AND OTHER NONMETALLIC
ELEMENTS. A LOW DENSE MATERIAL, BUT EXHIBIT
PLASTICITY.
4. COMPOSITES – A COMBINATION OF METALLIC,
CERAMICS, AND/OR POLYMERS TO PRODUCE A
MATERIAL WITH DIFFERENT PHYSICAL OR CHEMICAL
PROPERTY TO ACHIEVE A CERTAIN REQUIREMENT.
5. SEMICONDUCTORS – CAN BE ORGANIC OR INORGANIC
IT IS A MATERIAL WHICH IS CAPABLE OF ACTING AS A
LINK BETWEEN ELECTRICAL CONDUCTORS AND
INSULATOR. IT CONTROLS CONDUCTION DEPENDING
ON THE CHEMICAL STRUCTURE OR TEMPERATURE.
6. BIOMATERIAL – MATERIAL SPECIFICALLY MADE FOR
COMPONENTS THAT CAN BE PLACED INTO THE
HUMAN BODY. ITS ENGINEERED FOR MEDICAL
PURPOSE.
7. SMART MATERIALS – ARE NEW MATERIALS
ENGINEERED TO CHANGE OR ADAPT BASED ON ITS
ENVIRONMENT IN A PRE-DETERMINED MANNER.
8. NANOMATERIALS – A MATERIAL WITH A STRUCTURE
ON THE ORDER OF A NANOMETER OR WITHIN 100
NANOMETERS OR BELOW. IT HAS A WODE RANGE OF
APPLICATION AS IT EXHIBITS NEW AND UNIQUE
PHYSICAL, CHEMICAL, AND MECHANICAL PROPERTIES.
9. COVALENT BOND – A TYPE OF CHEMICAL BOND THAT
SHARES ELECTRON BETWEEN ADJACENT ATOMS. IT
CAN ALSO BE DEFINED AS BALANCE OF ATTRACTIVE
AND REPULSIVE FORCES BETWEEN ATOMS WHEN
THEY SHARE ELECTRONS.
10. IONIC BOND – A TYPE OF CHEMICAL BOND FORMED
BY ATTRACTION BETWEEN POSITVE AND NEGATIVE
CHARGED IONS RESULTING IN POSITIVE CHARGED
ATOMS AND NEGATIVELY CHARGED ATOMS.
11. METALLIC BOND – BOND FOUND IN METALS, IT
INVOLVES ELECTRON SHARING AND ITS VALENCE
ELECTRONS ARE DELOCALIZED FORMING AN
“ELECTRON CLOUD”.
12. HYDROGEN BOND – A TYPES OF SECONDARY
BONDING, IT IS DIRECTIONAL AND THE BOND
BETWEEN WATER MOLECULES.
13. VAN DER WAALS BOND – A RELATIVELY WEAK BOND
BETWEEN ATOMS NOR NONPOLAR MOLECULES. IT IS
WITHOUT ELECTRON TRANSFER OR SHARING.
14. PRIMARY BONDING – IT INVOLVES TRANSFER OR
SHARING OF ELECTRONS THAT PRODUCES A STRONG

BOND OF ADJACENT ATOMS. IONIC, METALIC AND


COVALENT ARE UNDER THIS CATEGORY.
15. SECONDARY BONDING – BONDS WHICH HAS
SMALLER BONDING ENERGIES, IT IS CAUSED BY
DIPOLES WITHIN THE ATOM OR MOLECULE.
16. ANELASTICITY – A PROPERTY OF MATERIALS THAT IS
TIME-DEPENDENT, SHOWING ITS BEHAVIOR WHEN
UNDER DEFORMATION.
17. DESIGN STRESS – MAXIMUM LEVEL OF ALLOWABLE
STRESS THAT IS CONSIDERED FOR A COMPONENT
UNDER CERTAIN LOAD CONDITIONS.
18. DUCTILITY – A MEASURE OF A MATERIAL’S PLASTIC
DEFORMATION BEFORE FRACTURE.
19. ELEASTIC DEFORMATION – A TEMPORARY
DEFORMATION THAT IS RESTORED WHEN THE FORCE
APPLIED IS REMOVED. IT IS PLOTTED AS STRESS
VERSUS STRAIN.
20. ELASTIC RECOVERY – OCCURS WHEN MECHANICAL
STRESS IS REMOVED FROM A SPECIMEN THAT HAS
UNDERGONE PLASTIC DEFORMATION.
21. ENGINEERING STRESS – IT IS THE LOAD ON A
MATERIAL THAT IS COMPUTED USING THE INITIAL
CROSS-SECTIONAL AREA.
22. ENGINEERING STRAIN – IT IS THE CHANGE IN
LENGTH IN THE DIRECTION OF THE FORCE APPLIED
DIVIDED BY THE ORIGINAL LENGTH.
23. HARDNESS – A MEASURE OF A MATERIALS
RESISTANCE TO DEFORMATION TO INDENTATION,
ABRASION AND WEAR.

24. MODULUS OF ELASTICITY – ALSO KNOWN AS


YOUNG’S MODULUS IS THE SLOPE OF THE STRESS-
STRAIN DIAGRAM. ITS ALSO A MEASURE OF STIFFNESS
OF A MATERIAL.
25. PLASTIC DEFORMATION – OCCURS WHEN STRESS IS
NO LONGER PROPORTIONAL TO STRAIN. IT IS
PERMANENT AFTER THE RELEASE OF THE FORCE
APPLIED.
26. POISSON’S RATIO – IS THE RELATIONSHIP BETWEEN
LATERAL STRAIN AND AXIAL STRAIN RESULTING FROM
AN APPLIED AXIAL STRESS.
27. PROPORTIONAL LIMIT – THE STRESS IN THE STRESS
VERSUS STRAIN GRAPH WHEN IT DEVIATES FROM A
STRAIGHT LINE PRESENTING THE ONSET OF PLASTIC
DEFORMATION.
28. RESILIENCE – CAPACITY OF A MATERIAL TO ABSORB
ENERGY AND RESIST SHOCK OR IMPACTS. MEASURED
BY AMOUNT OF ENERGY ABSORBED PER UNIT.
29. SAFE STRESS – STRESS UTILIZED FOR DESIGN
PURPOSES, IT IS THE RATIO OF YIELD STRENGTH AND
FACTOR OF SAFETY.
30. SHEAR – PARALLEL OR TANGENTIAL FORCE APPLIED
TO CAUSE ADJACENT PARTS OF A MATERIAL TO SLIDE
OR DEFORM.
31. TENSILE STRENGTH – THE MAXIMUM ENGINEERING
STRESS, THAT A MATERIAL CAN SUSTAIN WITHOUT
FRACTURE WHEN FORCE IS APPLIED.
32. TOUGHNESS –CHARACTHERISTIC OF A MATERIAL
REFERRING TO THE MAXIMUN ENERGY IT CAN
ABSORB BEFORE FRACTURE OCCURS.

33. TRUE STRAIN – LOAD DIVIDED BY THE


INSTANTANEOUS CROSS-SECTIONAL AREA, WHERE
DEFORMATION IS OCCURRING.
34. TRUE STRESS – STRESS CALCULATED WHEN
CALCULATED BY THE INSTANTANEOUS AREA AT ANY
INSTANT OF LOAD.
35. YIELDING – THE PHENOMENON WHERE PLASITC
DEFORMATION BEGINS ON A CERTAIN STRESS LEVEL.
36. YIELD STRESS – THE STRESS RELATING TO THE YIELD
POINT WHEREIN THE MATERIAL BEGINS TO DEFORM
WHICH IS OFFSET AT 0.002.
37. ISOTROPIC MATERIAL – MATERIALS WHICH HAS AN
INTERNAL CRYSTALOGRAPHIC STRUCTURE THAT IS
SAME IN ANY DIRECTION.
38. ANISOTROPIC MATERIAL – MATERIALS WHICH
CRYSTALOGRAPHIC STRUCTURE VARIES ACCORDING
TO DIRECTION/ANGLE.
39. MATERIAL SCIENCE – A STUDY WHICH DEALS WITH
PROPERTIES OF MATERIALS, ITS MECHANICAL
BEHAVIOUR, METTALURGY AND MATERIAL
ENGINEERING.
40. MATERIAL ENGINEERING – FOCUS ON THE
RESEARCHING AND DISCOVERING MATRIEALS.
UTILIZING METALS, CERAMICS, AND POLYMERS TO
CREATE NEW MATERIALS FOR VARIOUS PURPOSES.
REFERENCES:
Callister, W.D. and Rethwisch, D.G., (2018). “Materials
Science and Engineering: An Introduction”. Wiley.
Hutagalung, S. (Ed.). (2012). Materials Science and
Technology. InTech.
Akani, S.L. and Kakani, A., (2004) “Materials Science”.
New Age International Ltd
Raghavan, V., (2011). “Material Science and Engineering:
A First Course”. PHI Learning Pvt. Ltd.

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