Hoja de Datos deFlux

Understanding Producto
Vehicle Chemistry

Resin Rheological Additives

• Is a modified rosin with a softening point of 100° to • Effect tack, viscosity, printability, dispensability, &
125°C. overall solder paste rheology.
• Is a benign inert substance which is electrically non- • Assist in keeping the solder powder in suspension

conductive and non-hydroscopic.
• Is a favored material for soldering because it liquefies
during soldering, attracts the metal salts, and then
solidifies when cooled, entrapping and immobilizing the
contaminants.
• Protects the surface from reoxidation before soldering
occurs.
• Acts as a thermal blanket to spread heat evenly during
soldering.
• Provides paste tackiness.
APPLICATION NOTE
minimizing flux separation; solder powder and the flux/
vehicle have a natural tendency to separate due to the
large difference in densities.
• May also serve other specialized functions.
• May act as a surfactant to reduce foaming in a closed
loop cleaning system.

Solvents
• Dissolve all the constituents of the flux.
• Evaporate during the preheat portion of the reflow
profile.
• Assist in controlling viscosity and rheology
characteristics.
• Enhance stencil life & tack time when they have high
boiling points.

Activators
• Dissolve oxides & prepare the surface for wetting by
the molten solder.
• Can be one or several chemicals (referred to as an
activator package).
• Are slightly active at room temperature, but the activity
increases dramatically as the temperature rises.
• May be a combination of halides, amines, and acids.

Form No. 98042 R0