Focus on Surface · Charming on

Science

Suzhou Sindin Semiconductor

Equipment Co.,LTD
Professional on Surface Treatment and Surface Measurement Solution
www.sindin.com / www.sindin.com.cn / www.dynechina.com

Focus on Surface and not only

1 | SinDin.com
Dongguan Sindin Precision Instrument Co.,LTD
2022 version
Dongguan Sindin Precision Instrument Co.,LTD

Hundreds of
280+ 40% 63 6 millions 3500+
Employee RD employee Patented Service Marketing Customers
rate technology Offices scale

Dongguan Sindin Precision Instrument Co.,LTD was founded in 2012, it is a high-tech enterprises with

innovation and independent research development. We now have 6 offices and 2 manufactures in China,

more than 280 employees. Our RD team members accounted for 40%, own 63 technical patents. Provide

products for more than 3500 customers.

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Our core products are Plasma and Contact angle tester.
Developmental Milestone

■ Suzhou semiconductor
■ SINDIN Establishment ■ Branch company ■ Create USC
company established.
■ Successful research established on East product line
■ Successful research and
and developed WCA, of China. ■ Create surface
developed microwave plasma,
atmosphere plasma, ■ Annual sals grown electrostatic
vacuum, atmosphere plasma
vacuum plasma. And 50% eliminate product
ion plating equipment.
build assembly line ■ WCA sals on top 1. line
■ Build semiconductor Lab
Company Market share Product
Enlarge fields
Established growth expansion

2012~2013 2014~2015 2 0 1 6 ~ 2 0 1 7 2018 2019 2020 2021 2022

Brand expansion Go abroad Innovation SINDIN Decade

■ Dongguan Engineer
■ Create Dyne tech ■ Atmosphere ■ Build SINDIN ■ Won the high-tech enterprise of
■ West south branch plasma sales on innovation center Guangdong Province
company top one in Chine. ■ Setup piezoelectric ■ Dongguan multiple pilot enterprise.
established. ■ India branch injection valve ■ Province innovation mid-enterprise.
company Project team ■ Microwave plasma qualified by customer.
established ■ Wafer ion degumming plasma equipment
completed.

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Close to customer for the

Chengdu Office Chongqing SINDIN Dynetech

technology CO., LTD

Kunshan SINDIN intelligent

technology Co., LTD

India office SuZhou semiconductor

equipment Co., LTD

Dongguan SINDIN precision instrument Co.,

LTD
Guangdong Dynetech intelligent technology
CO., LTD
Guangdong is the headquarter lead RD and produce, extending Suzhou as the second RD/production position.
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Local sales services of the top five divisions are available worldwide.
 02 ✓ Contact angle measurement(WCA) ✓ Plasma cleaner
✓ Ultrasonic cleaner (USC) ✓ Ionizing static eliminator

It is committed to providing global users with professional overall solutions for

PART surface treatment and measuring

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 Contact Angle measurement machine for wafer

It is specified for wafer customers for wafer surface energy

and contact angle measurement machine, it could be
measure the water size 4-12 inch.
• One button measuring 1-100 free positions as settled.
• Needle automatic liquid receiving function, automatic
judge material height, would not impact by deformation
of the wafer, intelligent insure liquid receiving height and
measuring at the same, auto avoid personal error.
• High pixel high frame rate industrial camera, resolution
accuracy is 0.01°.
• Support program with multiple data saving, one button
to start measurement.
• Extensible one key surface free energy measurement
Test table Measurement position
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setting on software
Vacuum transmission type structure
TM Chamber and Vacuum
Transfer Manipulator

Frame
Matching
Box
Equipment Components

1. Vacuum Chamber Unit

Automatic 2. RF Discharge Unit

loading Process
platform Chambe
r
3. Intake System Unit

4. Vacuum System Unit

Cassette chamber
5. Control System Unit
GAS BOX

HMI
PR remove application

Atmospheric transmission ST3100/ST3200 Vacuum transmission ST6100/ST6200

Ashing (灰化) √ √
Removal of polymers（PI、BCB、PBO） √ √

Dry removal of antireflective pattern film √ √

PR removed after ion implantation √ √

PR removal in the RF filter BAW/SAW process √ √

The hard mask layer dry cleaning √ √

Clean the surface after etching √ √

DESCUM (Pre-treatment, remove glue residue) √ √

Surface residue removal √ √

Silicon carbide etching

Silicon oxide or silicon nitride etching

PR removal between neurogen

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Process capacity——Pure oxygen process

ST-6200 Process capacity

1 PR Remove E/R (250℃） ≥65000A/min

2 PR Remove E/R (150℃） ≥7500A/min

3 PR Remove E/R (100℃） ≥1000A/min

4 Descum E/R 100-3000A/min

5 U% WIW Spec≤5%

6 U% WTW Spec≤5%

7 U% Lot to Lot Spec≤5%

8 Pa ≤30ea(0.30u)

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Automatic double chamber fast annealing furnace

Automatic double chamber design, ramp up

Compatible for 6-8inch WAFER
process capacity

Max temperature can be reach to 1250℃ Uniformed supper temperature

Meet the demand of SiC mass production

Stable temperature reproducibility
process

Items Parameters
Max wafer size 6-8 inch

CASSETTE OR SMIF 2x

Temperature range Normal temperate to 1250℃

The highest temperature increase rate ≤30℃/s（tray）

Temperature uniformity ±3℃≤600℃ ±0.5%＞600℃

Temperature ±1℃
Control repeatability
Chamber/cavity
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quantity Optional single or double
 RTP SYSTEM Fast annealing furnace

Table type fast annealing furnace Simi-auto fast annealing furnace

Items Parameters Items Parameters
Max wafer size 6 inch wafer, support Max sample size Max wafer size 4-12 inch，Max sample size 300*300m.
150*150mm. Compatible for all wafer which size
smaller than 12 inch.
Temperature range Normal temperate to 1250℃
Temperature range Normal temperate to 1250℃
The highest temperature ≤30℃/s（tray）
increase rate The highest temperature ≤30℃/s（tray）
increase rate
Temperature uniformity ±5℃≤500℃ ±1%＞500℃
Temperature uniformity ±5℃＜500℃ ±1%＞500℃
Temperature ±1℃
Control repeatability Temperature ±1℃
Control repeatability
Temperature control Fast PID temperature control
method
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Temperature control method Fast PID temperature control
Focus on surface Charming on science

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400 9600 662

www.sindin.com / www.dynechina.com
广东省东莞市虎门镇怀雅路235号
苏州市吴江区兴瑞路888号