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Is the FR4 Semiflex the Right Choice for You?

Flex-rigid PCBs offer a vast array of uses as a result of the trend toward

downsizing in the creation of consumer devices. Also, the PCB sector has

been experiencing fiercer competition, which has increased the focus on

flex-rigid Circuit Board manufacturing technology development.

Several PCB manufacturers who specialize in rigid Circuit board

fabrication are unable to match the expectations of flexible Board

fabrication due to the complicated process of flex-rigid Circuit board

manufacturing. The type of PCB is FR4 semi-flexible Circuit Board which

we will discuss in this article. It comprises bendability, flexibility, and the

ability to construct in three dimensions.

It is impossible to exaggerate the significance of flex-rigid Circuit boards in

PCB manufacture. The single driving factor behind it is the expanding

trend of product miniaturization. Also, the need for flexible-rigid Circuit

boards is increasing due to their flexibility and ability to construct in three

dimensions. Not all Circuit Board producers can, however, accommodate

the challenging flexi-rigid PCB production process. Semi-flexible PCBs

create in a way that reduces a rigid board’s thickness to 0.25mm or

0.05mm. The board can easily employ applications that call for flexing the

circuits and putting them within casings as a result. The Circuits can easily

use for both single-bend installations and setups involving several bends.

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Table of Contents

Properties Of FR4 Semiflex PLC

1. The ability to adapt to the given area and be flexible are the most

crucial qualities that make it suitable for numerous uses.

2. The reality is that flexibility doesn’t affect the transmission of signals,

which enhances its widespread use.

3. Also, it is naturally lightweight.

4. Semi-flex Circuit boards are frequently renowned for their lowest

possible prices due to the fact that their fabrication process is in line

with present production capabilities.

5. Both throughout the design process and during assembly speed

things up.

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6. They are a very trustworthy choice, especially since they prevent

several problems like welding and entangling.

PCB Fabrication Procedure of FR4 Semiflex

The following is the general process for creating FR4 Semi-Flexible PCBs.

Generally speaking, the procedure involves the following elements:

1. Substrate Cutting

2. Coating of Dry Film

3. Automatic Optical Inspection

4. Brownization

5. Process Of Lamination

6. X-Ray

7. Electroplating

8. Graphical Conversions

9. Etching

10. Printing Through Silkscreen

11. Surface Finishing

12. Depth-Control Milling

13. Electrical Evaluation

14. Quality Control Test

15. Packaging

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Issues & Solutions In The FR4 Semiflex Fabrication Process

The main challenge in manufacturing is to maintain precision and milling

tolerance for depth control. It’s crucial to check for resin fractures and oil

peeling, both of which might result in quality problems. This means

keeping an eye out for the following things while using depth-control

milling:

1. Board Thickness

2. Resin Material

3. Milling Tolerance

Depth Controlling Milling Test A

For thicknesses of 0.3 mm, 0.275 mm, and 0.25 mm, the depth milling is

carried out using the mapping approach. After this, the panel is tested to

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determine whether it can withstand the 90-degree bend.

Generally, fiberglass is considered damaged if the remaining thickness is

0.283mm. So, when performing the depth milling, it is essential to take

into account the panel thickness, the thickness of the fiberglass, and the

dielectric condition.

Depth Controlling Milling Test B

Depending on the foregoing, it must be assured that the copper thickness

between the L2 and solder mask range is 0.213mm and 0.188mm. Proper

consideration must also be given to every warpage that could happen and

affect the consistency of the overall thickness.

Depth controlling Milling Test C

When the panel has been prototyped, depth-controlled milling is crucial to

guarantee that size is fixed at 6.3′′x10.5′′. Following that, the mapping

point measurement is done to make sure the 20 mm horizontal and

vertical spacing is maintained.

A unique manufacturing technique ensures that the deep-regulated

thickness tolerance is within the limit of 20 m.

Composition Of A FR4 Semiflex Material

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The purpose and final usage of an FPC often dictate its composition. The

capacity of the material to sustain high electrical conductivity whilst

resisting warping, breaking, and damage also plays a role in how flexible it

is.

Because of this, manufacturers frequently create semi-flex PCBs by

pouring a mixture of fiberglass and epoxy glue into fiberglass materials or

FR-4.

But let’s look at some other components of a semi-flex PCB material.

1. Insulating Film

Polyethylene layers with high density are insulating films. These are

created by forcing resin using a nozzle right before putting it on the FPC

base.

Moreover, this HDPE coating prevents the substrate from being impacted

by capacitive coupling. Electrically insulating connections on the upper

layer also interfere with other circuits.

Moreover, an insulator film layer acts as a moisturizing barrier to shield

the PCB from moisture as it cures.

2. Electrostatic Adhesion Layer

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Well, after insulating the film, there is an adhesive layer to aid in holding

electrical components on the board. This board layer is often acrylic

or polyimide, allowing parts such as LEDs to connect directly to the flexible

PCBs.

The electrostatic adhesive layer significantly reduces the amount of time

and resources for assembly.

3. Conductor

Incorporating an electric conductive layer over the adhesion assists in

avoiding circuit warping. Polyamide, epoxy resin, and the panel itself can

also use as the coating.

Remember to spray the conductor with a 100C solvent to prevent warping

effectively.

4. Board Enhancement

A second adhesive improves the FPC further. Also, it lessens the possibility

of experiencing fracturing or bending issues. Manufacturers frequently

use cellulose or acrylic to create the coating.

5. Coverlay

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The last plate to shield the underside of the FPC material is the coverlay.

Because it comprises acrylic or polyamide, the coverlay can also serve as

an insulating layer.

It thus shields the FPC substance from dampness.

Moreover, the coverlay offers high-temperature tolerance, enabling the

use of FPC boards in heater and oven applications.

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Difference Between FPC And FR4 Semiflex

The most typical sort of circuit board is a PCB, although even this form is

not suitable for all purposes. FPCs, in contrast to PCBs, can flex and bend,

making them ideal for contemporary technologies.

Also, relative to their conventional counterparts, Flexible PCBs provide

greater heat dissipation, increasing the durability of the devices you create

with them.

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PCBs come in three different varieties: single-layered, double-layered, and

multilayered versions. FPCs, whereas dividing into flat flex boards and

semi-flexible boards.

Application Of FR4 Semiflex PCB

· Medical Imaging Instrument

Medical devices need a great deal of semi-flex Circuit Boards. Medi-care

equipment, including endoscopes and imaging tools, employs a

semi-flexible PCB. A flexible tube called an endoscope has a lens and a

light at both ends. It is put inside the human body to observe internal

organs or carry out treatments. These include tissue biopsies, draining

fluid clumps, removing foreign objects, and widening congested channels

like the esophagus. Low cost and superior electrical performance are two

benefits of semi-flex PCB. The semi-flexible PCB is appropriate for this use

since it can be twisted into the correct form.

Further uses for semi-flexible PCB exist in the medical industry. For

instance:

 Circuit board for protecting injection needle tips (ETC)

 PCB for temperature control in medical equipment

 Circuits for a mobilized blood pressure monitor

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· Automotive Applications

Automotive devices with vibrations and high temperatures employ

semi-flexible PCBs. The flexible architecture guarantees that the PCBs

won’t crack from vibration or mechanical shock when operating at high

temperatures. To suit the needs of the majority of applications, they are

manufactured from stiff FR-4 fiberglass epoxy composites with extra

copper layers bonded on each side of the substrate.

Due to their inherent flexibility, Semi-Flex PCBs are perfect for serving

automotive applications with high-temperature requirements, such

as Digital Control Systems or DCU, Electronic Control Units or ECM, etc.

These boards are resistant to breakage and distortion at high

temperatures of 150 °C.

· Aeronautics

With the rising demand for weight reduction and miniaturization, the

usage of rigid-flex circuits for aerospace devices has expanded. As

interconnect modules, rigid-flex Circuits are an efficient way to decrease

size, weight, and energy consumption while enhancing dependability.

Several aircraft applications, including avionics, communications,

and military systems, have employed rigid flex Circuits. Rigid-flex PCBs are

useful in aviation applications as connectors between PCBs and additional

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parts like switches, displays, or cables. They aid in reducing the number of

connections needed on Circuits, which aids in reducing system weight.

They also improve dependability by cutting down on the number of linked

components.

· Wearable Devices

The most well-known examples of wearable technology are fitness

trackers and smartwatches, which are gaining popularity. Small,

battery-operated gadgets that one wears over the body are wearables. In

wearable technology, rigid-flex circuits and semi-flex circuits are both

employable, with rigid-flex circuits being more popular in watches &

semi-flex in fitness trackers. This is due to the fact that semi-flexible

materials are more suited for wearables that must bend on the body. At

the same time, stiff flex can sustain bending pressures, which is vital for

wearables that require to endure impacts while falling.

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· Smartphones And Laptops

PCBs that can flex and not bend are frequently useful in applications that

need semi-flexible Circuits. For instance, semi-flexible boards are

frequently useful in high-end tablet and smartphone systems. With these

gadgets, the back of the screen is directed to a very thin layer of a

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semi-flex board. This enables the display to bend or fold without breaking.

When only a little amount of flexibility is required, a semi-flexible Circuit

can easily be employed. These may use, for instance, on the back of a

gadget with a stiff front panel, like many computers and tablets.

· Gaming Devices

The primary benefit of adopting rigid flex Circuit in game consoles is that it

offers superior protection against physical shock damage. They are better

able to endure powerful external pressures like collisions and drops due

to having lesser layers than conventional rigid PCBs. When compared to a

conventional rigid PCB, the layers of rigid-flex Circuits are more resilient to

bending. Therefore, if you somehow drop the gadget, it will sustain the

greater force. For instance, the stiff flex PCB may readily twist or bend

without cracking or breaking while using a gaming system, which

frequently demands bending.

Conclusion

Due to certain of its characteristics and qualities, rigid or semi-flex PCBs

will perform better than their competitors in a number of areas. They

compete fiercely with other PCBs on the market since they perform

comparable tasks and give end consumers a more affordable choice.

Some of these uses are with one another, while others do not fit well into

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any one category. Whatever one you choose to develop will depend on

your own demands and preferences.

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Application?

3. Why the Shengyi SF230 PCB Material is the Best Choice for You

4. First-Choice for Manufacturing and Production – Shenzhen PCB

https://www.raypcb.com/semi-flex/

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